CN104909329B - 微机电系统设备及其制造方法 - Google Patents

微机电系统设备及其制造方法 Download PDF

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Publication number
CN104909329B
CN104909329B CN201510094983.4A CN201510094983A CN104909329B CN 104909329 B CN104909329 B CN 104909329B CN 201510094983 A CN201510094983 A CN 201510094983A CN 104909329 B CN104909329 B CN 104909329B
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CN
China
Prior art keywords
insulating film
cover
conductor
cavity
mems device
Prior art date
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Active
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CN201510094983.4A
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English (en)
Chinese (zh)
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CN104909329A (zh
Inventor
吉泽隆彦
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Seiko Epson Corp
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Seiko Epson Corp
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Publication of CN104909329A publication Critical patent/CN104909329A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems ; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/007—Interconnections between the MEMS and external electrical signals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/015—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being integrated on the same substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Manufacturing & Machinery (AREA)
  • Pressure Sensors (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
CN201510094983.4A 2014-03-12 2015-03-03 微机电系统设备及其制造方法 Active CN104909329B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-048448 2014-03-12
JP2014048448A JP2015171740A (ja) 2014-03-12 2014-03-12 Ｍｅｍｓデバイス及びその製造方法

Publications (2)

Publication Number Publication Date
CN104909329A CN104909329A (zh) 2015-09-16
CN104909329B true CN104909329B (zh) 2018-03-06

Family

ID=54068172

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510094983.4A Active CN104909329B (zh) 2014-03-12 2015-03-03 微机电系统设备及其制造方法

Country Status (3)

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US (1) US9499394B2 (https=)
JP (1) JP2015171740A (https=)
CN (1) CN104909329B (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6314568B2 (ja) * 2014-03-18 2018-04-25 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
JP6331552B2 (ja) * 2014-03-25 2018-05-30 セイコーエプソン株式会社 Ｍｅｍｓデバイス及びその製造方法
CN109541319B (zh) * 2018-10-10 2023-09-01 金华职业技术学院 一种液体介电常数测量方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
CN1848472A (zh) * 2005-04-06 2006-10-18 株式会社东芝 采用mems技术的半导体器件
CN103248994A (zh) * 2012-02-06 2013-08-14 苏州敏芯微电子技术有限公司 集成电路与电容式微硅麦克风单片集成的制作方法及芯片
CN103373698A (zh) * 2012-04-26 2013-10-30 张家港丽恒光微电子科技有限公司 制作mems惯性传感器的方法及mems惯性传感器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4772302B2 (ja) * 2003-09-29 2011-09-14 パナソニック株式会社 微小電気機械システムおよびその製造方法
US7585744B2 (en) * 2003-12-08 2009-09-08 Freescale Semiconductor, Inc. Method of forming a seal for a semiconductor device
JP2008188711A (ja) * 2007-02-05 2008-08-21 Oki Electric Ind Co Ltd 半導体装置製造方法
JP2009272477A (ja) * 2008-05-08 2009-11-19 Rohm Co Ltd Ｍｅｍｓセンサおよびその製造方法
WO2010052682A2 (en) * 2008-11-10 2010-05-14 Nxp B.V. Mems with poly-silicon cap layer
JP5630243B2 (ja) * 2010-11-30 2014-11-26 セイコーエプソン株式会社 電子装置、電子機器及び電子装置の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5798283A (en) * 1995-09-06 1998-08-25 Sandia Corporation Method for integrating microelectromechanical devices with electronic circuitry
US6012336A (en) * 1995-09-06 2000-01-11 Sandia Corporation Capacitance pressure sensor
CN1848472A (zh) * 2005-04-06 2006-10-18 株式会社东芝 采用mems技术的半导体器件
CN103248994A (zh) * 2012-02-06 2013-08-14 苏州敏芯微电子技术有限公司 集成电路与电容式微硅麦克风单片集成的制作方法及芯片
CN103373698A (zh) * 2012-04-26 2013-10-30 张家港丽恒光微电子科技有限公司 制作mems惯性传感器的方法及mems惯性传感器

Also Published As

Publication number Publication date
US20150259193A1 (en) 2015-09-17
CN104909329A (zh) 2015-09-16
US9499394B2 (en) 2016-11-22
JP2015171740A (ja) 2015-10-01

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