CN104851840A - Strong bonding semiconductor packaging structure - Google Patents
Strong bonding semiconductor packaging structure Download PDFInfo
- Publication number
- CN104851840A CN104851840A CN201510177187.7A CN201510177187A CN104851840A CN 104851840 A CN104851840 A CN 104851840A CN 201510177187 A CN201510177187 A CN 201510177187A CN 104851840 A CN104851840 A CN 104851840A
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- CN
- China
- Prior art keywords
- adhesion
- bonding
- face
- frame
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The invention discloses a strong bonding semiconductor packaging structure, comprising a frame and a cover. The frame and the cover are connected through bonding surfaces. The bonding surfaces are coated with bonding glue. The surface on the bonding surface, parallel with the frame, is provided with a triangular corner surface-combining structure. The surface on the bonding surface, vertical to the frame, is provided with an opposite groove structure. The technical scheme can effectively form a motion stop block, enlarging bonding area. Three-dimensional bonding can effectively enhance strength of a bonded structure, so that structural performance of a product after packaging is firmer, thereby effectively eliminating shedding phenomenon after packaging.
Description
Technical field
The present invention relates to a kind of semiconductor package, particularly relate to a kind of powerful adhesion semiconductor package.
Technical background
In existing semiconductor packaging, what adopt is the encapsulation mode only having framework (PMF) and the direct adhesion of lid (CAP) inwall, because inwall is all plane, single fixing for plane is found at operation process, can not well in conjunction with CAP and PMF, product can occur much to come off and cause product destruction.To this, some producer development snap fit is installed, but the interface arrangment of current snap fit is difficult to accomplish effective clamping veritably, the clamping encapsulation for small chip is difficult to carry out especially, is difficult to the problem that comes off solving bonding encapsulation veritably completely.
Summary of the invention
Instant invention overcomes shortcoming of the prior art, provide a kind of powerful adhesion semiconductor package.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions: a kind of powerful adhesion semiconductor package, comprise framework and lid, described framework is connected by adhesion face with lid, described adhesion face scribbles adhesion glue, described adhesion face is provided with conjunction face, triangle corner structure with the surface of frame parallel, surface vertical with framework on described adhesion face is provided with groove structure.
As preferably, conjunction face, described triangle corner structure comprises recessed structure and male structure, and described recessed structure and male structure are separately positioned on the both sides of adhesion face, describedly comprises notch to groove structure, and the opening of described notch faces the both sides being arranged on adhesion face.
As preferably, be provided with cofferdam in the described notch to groove structure and fill glue.
Compared with prior art, advantage of the present invention is: will bonding PMF and CAP be arranged to groove structure, can effectively form dynamic resistance block, the setting of conjunction face, triangle corner structure, strengthens adhesion area effectively, and changing plane adhesion is three-dimensional adhesion, the intensity of effective enhancing adhesion structure, thus realize the increase of adhesion intensity, make to encapsulate rear product structure performance more firm, effectively stopped the obscission after encapsulating.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.
As shown in Figure 1, a kind of powerful adhesion semiconductor package, comprise framework 1 and lid 2, described framework 1 is connected by adhesion face with lid 2, described adhesion face scribbles adhesion glue, surface parallel with framework 1 on described adhesion face is provided with conjunction face, triangle corner structure, conjunction face, described triangle corner structure comprises recessed structure 12 and male structure 22, described recessed structure 12 and male structure 22 are separately positioned on the both sides of adhesion face, surface vertical with framework 1 on described adhesion face is provided with groove structure, described notch 11 and notch 21 are comprised to groove structure, described notch 11 is relative with the opening of notch 21, cofferdam filling glue is scribbled in the notch 11 of described adhesion face both sides and notch 21.
The present invention arranges groove structure by bonding framework 1 and lid 2, filling glue by cofferdam is coated in notch 11 and notch 21, the dynamic resistance block that after adhesive curing, just formation is overall is filled in cofferdam, effectively can stop the structure after encapsulating again to come off, by the setting of recessed structure 12 and male structure 22, effectively strengthen adhesion area, thus realize the increase of adhesion intensity, and changing plane adhesion is three-dimensional adhesion, the intensity of effective enhancing adhesion structure, make to encapsulate rear product structure performance more firm, effectively stopped the obscission after encapsulating.
Except the above embodiments, other execution modes do not stated also should within protection scope of the present invention.Specific embodiment as herein described is only to the explanation for example of the present invention's spirit, those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.Although be described through specific term herein, but do not get rid of the possibility using other terms, use these terms to be only used to describe and explain essence of the present invention easily, the restriction that they are construed to any one additional is all contrary with spirit of the present invention.
Claims (3)
1. a powerful adhesion semiconductor package, comprise framework and lid, described framework is connected by adhesion face with lid, described adhesion face scribbles adhesion glue, it is characterized in that, described adhesion face is provided with conjunction face, triangle corner structure with the surface of frame parallel, surface vertical with framework on described adhesion face is provided with groove structure.
2. the powerful adhesion semiconductor package of the one according to claim 1, it is characterized in that, conjunction face, described triangle corner structure comprises recessed structure and male structure, described recessed structure and male structure are separately positioned on the both sides of adhesion face, describedly comprise notch to groove structure, the opening of described notch faces the both sides being arranged on adhesion face.
3. the powerful adhesion semiconductor package of the one according to claim 2, is characterized in that, is provided with cofferdam and fills glue in the described notch to groove structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510177187.7A CN104851840A (en) | 2015-04-15 | 2015-04-15 | Strong bonding semiconductor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510177187.7A CN104851840A (en) | 2015-04-15 | 2015-04-15 | Strong bonding semiconductor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104851840A true CN104851840A (en) | 2015-08-19 |
Family
ID=53851378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510177187.7A Pending CN104851840A (en) | 2015-04-15 | 2015-04-15 | Strong bonding semiconductor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104851840A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000933A (en) * | 2006-01-13 | 2007-07-18 | 崴强科技股份有限公司 | Image sensing chip packaging device |
| CN202917465U (en) * | 2012-11-29 | 2013-05-01 | 无锡万银半导体科技有限公司 | Semiconductor packaging structure |
| CN203721704U (en) * | 2014-02-26 | 2014-07-16 | 江苏钜芯集成电路技术有限公司 | Package structure for PMF and CAP of 8DIP semiconductor |
-
2015
- 2015-04-15 CN CN201510177187.7A patent/CN104851840A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101000933A (en) * | 2006-01-13 | 2007-07-18 | 崴强科技股份有限公司 | Image sensing chip packaging device |
| CN202917465U (en) * | 2012-11-29 | 2013-05-01 | 无锡万银半导体科技有限公司 | Semiconductor packaging structure |
| CN203721704U (en) * | 2014-02-26 | 2014-07-16 | 江苏钜芯集成电路技术有限公司 | Package structure for PMF and CAP of 8DIP semiconductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| EXSB | Decision made by sipo to initiate substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160602 Address after: 215300 Jiangsu province north of the city of Yushan town of Kunshan city Hanpu Road No. 998, room 3 Applicant after: Suzhou Juda senchip Microelectronics Co. Ltd. Address before: 225500 hi tech innovation center, Jiangyan District, Taizhou, Jiangsu Applicant before: Jiangsu Senchip Microelectronics Co., Ltd. |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150819 |