CN202917465U - Semiconductor packaging structure - Google Patents
Semiconductor packaging structure Download PDFInfo
- Publication number
- CN202917465U CN202917465U CN 201220643258 CN201220643258U CN202917465U CN 202917465 U CN202917465 U CN 202917465U CN 201220643258 CN201220643258 CN 201220643258 CN 201220643258 U CN201220643258 U CN 201220643258U CN 202917465 U CN202917465 U CN 202917465U
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- China
- Prior art keywords
- model
- utility
- framework
- lid
- cap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a semiconductor packaging structure, comprising a framework (PMF) and a cap (CAP) which are adhered and provided with a corresponding clamping structure. According to the utility model, the PMF and the CAP are adhered and provided with a corresponding clamping structure, which can effectively avoid shedding phenomena; in addition, the packaging process performance is more stable; advantages such as a simple and reasonable structure, a stable performance, etc. are possessed.
Description
Technical field
The utility model relates to technical field of semiconductors, especially semiconductor package.
Background technology
In existing semiconductor packaging, what adopt is the encapsulation mode of only having framework (PMF) and the direct adhesion of lid (CAP) inwall, because inwall all is the plane, fix on the plane that is used for that the operation process discovery is single, can not be well in conjunction with CAP and PMF, product can occur much to come off and cause goods to lose efficacy.
The utility model content
The utility model proposes a kind of semiconductor package for deficiency, can well in conjunction with CAP and PMF, be difficult between the two coming off.
In order to realize above-mentioned utility model purpose, the utility model provides following technical scheme: a kind of semiconductor package comprises that framework and the lid of adhesion, this framework and lid are provided with corresponding interface arrangment.
Further, this framework is provided with buckle, and this lid is provided with draw-in groove.
Further, this framework is provided with draw-in groove, and this lid is provided with buckle.
Compared with prior art, the utlity model has following advantage: with the structure of corresponding clamping is set on bonding PMF and the CAP, can effectively avoid the generation of obscission, and the encapsulation process performance is more stable, have simple in structure, rationally, steady performance.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail, the description of this part only is exemplary and explanatory, should any restriction not arranged to protection range of the present utility model.
A kind of semiconductor package as shown in Figure 1 comprises that framework 1 and the lid 2 of adhesion, this framework 1 and lid 2 are provided with corresponding interface arrangment.
Interface arrangment shown in Fig. 1 consists of: framework 1 is provided with draw-in groove 11, and lid 2 is provided with the buckle 21 with draw-in groove 11 corresponding clampings; Buckle 21 is inserted in the draw-in grooves 11, uses again the glue joint filling bonding, can effectively framework 1 and lid 2 be fixed together, can effectively avoid the generation of obscission, and the encapsulation process performance is more stable, have simple in structure, rationally, steady performance.In like manner can establish buckle at framework 1, correspondence is established draw-in groove at lid 2.
The purpose of this utility model has provided the description to the utility model preferred embodiment; can make those skilled in the art's comprehend the utility model; but limit never in any form the utility model; and anyly can make amendment or be equal to replacement the utility model, all should be encompassed in the protection range of the utility model patent.
Claims (3)
1. semiconductor package comprises framework and the lid of adhesion, and it is characterized in that: this framework and lid are provided with corresponding interface arrangment.
2. semiconductor package as claimed in claim 1, it is characterized in that: this framework is provided with buckle, and this lid is provided with draw-in groove.
3. semiconductor package as claimed in claim 1, it is characterized in that: this framework is provided with draw-in groove, and this lid is provided with buckle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220643258 CN202917465U (en) | 2012-11-29 | 2012-11-29 | Semiconductor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220643258 CN202917465U (en) | 2012-11-29 | 2012-11-29 | Semiconductor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202917465U true CN202917465U (en) | 2013-05-01 |
Family
ID=48165749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220643258 Expired - Fee Related CN202917465U (en) | 2012-11-29 | 2012-11-29 | Semiconductor packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202917465U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851840A (en) * | 2015-04-15 | 2015-08-19 | 江苏晟芯微电子有限公司 | Strong bonding semiconductor packaging structure |
-
2012
- 2012-11-29 CN CN 201220643258 patent/CN202917465U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104851840A (en) * | 2015-04-15 | 2015-08-19 | 江苏晟芯微电子有限公司 | Strong bonding semiconductor packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20151129 |