CN205150923U - Diode that can simply encapsulate - Google Patents
Diode that can simply encapsulate Download PDFInfo
- Publication number
- CN205150923U CN205150923U CN201520915627.XU CN201520915627U CN205150923U CN 205150923 U CN205150923 U CN 205150923U CN 201520915627 U CN201520915627 U CN 201520915627U CN 205150923 U CN205150923 U CN 205150923U
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- CN
- China
- Prior art keywords
- braid
- diode
- shell
- cathode leg
- plate lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a diode that can simply encapsulate, the diode include the shell, the upper and lower both ends of shell be provided with cathode lead wire and anode lead respectively, cathode lead wire and anode lead all stretch into inside the shell, anode lead's upper end be provided with the buffer layer, the buffer layer on be provided with the PN junction, the PN junction on still be provided with a semiconductor block, lower extreme and the semiconductor block of cathode lead wire pass through the wire and link to each other, anode lead's lower extreme and the upper end of cathode lead wire still be provided with the braid, the braid divide into braid and down braid, lower surface and the upper surface of down braid of last braid be provided with the recess that the position corresponds, the lower surface middle part of last braid still be provided with the buckle that can fix down the braid. The utility model discloses a set the braid to the plastic slab type to be provided with the buckle on the plate body, not only be favorable to placing of diode, it is relatively more firm in transit moreover, be difficult for scattering.
Description
Technical field
The utility model relates to a kind of electronic component, particularly relates to the diode that can carry out simple and easy encapsulation.
Background technology
Diode is a kind of electronics package with unidirectional conduction current.Existing point-contact diode technology is quite ripe; But the encapsulation of existing diode all adopts Packaging Paper to encapsulate, this encapsulating structure owing to jolting, extremely easily causes Packaging Paper to break, diode is scattered or damages, cause unnecessary loss in transportation.
Summary of the invention
Main purpose of the present utility model is for prior art Problems existing, and proposes the diode that can carry out simple and easy encapsulation.
In order to achieve the above object, the technical solution of the utility model is as follows:
Described diode involved by the utility model comprises shell, the two ends up and down of described shell are respectively arranged with cathode leg and plate lead, described cathode leg and plate lead all extend into enclosure, the upper end of described plate lead is provided with cushion layer, described cushion layer is provided with PN junction, described PN junction is also provided with semiconductor block, the lower end of described cathode leg is connected by wire with semiconductor piece, the lower end of described plate lead and the upper end of cathode leg are also provided with braid, described braid is divided into braid and lower braid, the lower surface of described upper braid and the upper surface of lower braid are provided with groove corresponding to position, the lower surface middle part of described upper braid is also provided with the buckle can fixing lower braid.
Described semiconductor piece is that silicon materials are made.
Described shell is cuboid-type or square build.
Described shell is cuboid-type.
The corner location of described shell is also provided with chamfering.
The contact position of described cathode leg and plate lead and braid is also provided with limiting stopper.
Described braid adopts rigid plastic to make.
The beneficial effects of the utility model are: the utility model by plastics template is arranged in braid, and is provided with buckle on plate body, is not only conducive to the placement of diode, and relatively more firm in transit, are not easily scattered.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is braid front elevation of the present utility model;
Wherein: 1 is plate lead, 2 is cushion layer, and 3 is PN junction, and 4 is wire, and 5 is shell, and 6 is cathode leg, and 7 is braid, and 8 is upper braid, and 9 is groove, and 10 is lower braid, and 11 is buckle.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described further:
As Fig. 1 shown in 2, described diode involved by the utility model comprises the shell 5 of cuboid-type, the two ends up and down of shell 5 are respectively arranged with cathode leg 6 and plate lead 1, it is inner that cathode leg 6 and plate lead 1 all extend into shell 5, the upper end of plate lead 1 is provided with cushion layer 2, cushion layer 2 is provided with PN junction 3, PN junction 3 is also provided with the semiconductor piece that silicon materials are made, the lower end of cathode leg 6 is connected by wire 4 with semiconductor piece, the lower end of plate lead 1 and the upper end of cathode leg 6 are also provided with the braid 7 that rigid plastic is made, braid 7 is divided into braid 8 and lower braid 10, the lower surface of described upper braid 8 and the upper surface of lower braid 10 are provided with groove corresponding to position 9, the lower surface middle part of upper braid 8 is also provided with the buckle 11 can fixing lower braid 10, cathode leg 6 and plate lead 1 are also provided with limiting stopper with the contact position of braid 7.
The present embodiment by plastics template is arranged in braid, and is provided with buckle on plate body, is not only conducive to the placement of diode, and relatively more firm in transit, is not easily scattered.
Claims (7)
1. can carry out the diode of simple and easy encapsulation, it is characterized in that: described diode comprises shell (5), the two ends up and down of described shell (5) are respectively arranged with cathode leg (6) and plate lead (1), it is inner that described cathode leg (6) and plate lead (1) all extend into shell (5), the upper end of described plate lead (1) is provided with cushion layer (2), described cushion layer (2) is provided with PN junction (3), described PN junction (3) is also provided with semiconductor block, the lower end of described cathode leg (6) is connected by wire (4) with semiconductor piece, the lower end of described plate lead (1) and the upper end of cathode leg (6) are also provided with braid (7), described braid (7) is divided into braid (8) and lower braid (10), the lower surface of described upper braid (8) and the upper surface of lower braid (10) are provided with groove corresponding to position (9), the lower surface middle part of described upper braid (8) is also provided with the buckle (11) can fixing lower braid (10).
2. the diode carrying out simple and easy encapsulation according to claim 1, is characterized in that: described semiconductor piece is that silicon materials are made.
3. the diode carrying out simple and easy encapsulation according to claim 1, is characterized in that: described shell (5) is cuboid-type or square build.
4. the diode carrying out simple and easy encapsulation according to claim 1, is characterized in that: described shell (5) is cuboid-type.
5. the diode carrying out simple and easy encapsulation according to claim 1, is characterized in that: the corner location of described shell (5) is also provided with chamfering.
6. the diode carrying out simple and easy encapsulation according to claim 1, is characterized in that: described cathode leg (6) and plate lead (1) are also provided with limiting stopper with the contact position of braid (7).
7. the diode carrying out simple and easy encapsulation according to claim 1, is characterized in that: described braid (7) adopts rigid plastic to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520915627.XU CN205150923U (en) | 2015-11-17 | 2015-11-17 | Diode that can simply encapsulate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520915627.XU CN205150923U (en) | 2015-11-17 | 2015-11-17 | Diode that can simply encapsulate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205150923U true CN205150923U (en) | 2016-04-13 |
Family
ID=55686639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520915627.XU Expired - Fee Related CN205150923U (en) | 2015-11-17 | 2015-11-17 | Diode that can simply encapsulate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205150923U (en) |
-
2015
- 2015-11-17 CN CN201520915627.XU patent/CN205150923U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160413 Termination date: 20161117 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |