CN202909890U - Glug dispensing jig for semiconductor packaging - Google Patents
Glug dispensing jig for semiconductor packaging Download PDFInfo
- Publication number
- CN202909890U CN202909890U CN2012206431572U CN201220643157U CN202909890U CN 202909890 U CN202909890 U CN 202909890U CN 2012206431572 U CN2012206431572 U CN 2012206431572U CN 201220643157 U CN201220643157 U CN 201220643157U CN 202909890 U CN202909890 U CN 202909890U
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- CN
- China
- Prior art keywords
- glue
- dispensing jig
- semiconductor packaging
- utility
- model
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
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- Coating Apparatus (AREA)
Abstract
The utility model discloses a glue dispensing jig for semiconductor packaging. The glue dispensing jig comprises a glue pipe connector, a glue body storage cavity and 16 glue overflow ports that are sequentially connected. The glue dispensing jig is characterized in that due to the 16 glue overflow ports, glue dispensing arrays are more intensive, so that undesirable phenomena are well avoided that CAP drops and gas intrudes into chips, the performance is more stable during packaging, and the rate of finished products is improved greatly during the process of manufacturing products. The glue dispensing jig for semiconductor packaging has the advantages of simple and reasonable structure, stable performance, and the like.
Description
Technical field
The utility model relates to the semiconductor packaging field, especially a kind of semiconductor packages glue-dropping tool.
Background technology
In existing semiconductor packaging, the glue-dropping tool of employing is that the Glue dripping head of single Jiao Kou (PIN) of overflowing is used for picture glue.Jiao Kou seldom cause framework (PMF) inwall colloid few, and sealing neither be very very good, lid (CAP) occurs easily and come off owing to overflow in the Glue dripping head, and gas is invaded chip and caused bad generation.
The utility model content
The utility model proposes a kind of semiconductor packages glue-dropping tool for deficiency, and the excessive glue mouth of Glue dripping head is more, so that PMF inwall colloid is many, and the while good airproof performance.
In order to realize above-mentioned utility model purpose, the utility model provides following technical scheme: a kind of semiconductor packages glue-dropping tool, comprise the sebific duct connector, colloid storage chamber and the excessive Jiao Kou that connect successively, and this excessive Jiao Kou is provided with 16.
Further, these 16 excessive Jiao Kou evenly are arranged on the colloid storage chamber.
Compared with prior art, the utlity model has following advantage: adopt 16 excessive Jiao Kou, make invocation point glue array more intensive, well avoid CAP to come off and the generation of gas intrusion chip bad phenomenon, and the encapsulation process performance is more stable, and production process yield rate improves a lot; Have simple in structure, rationally, steady performance.
Description of drawings
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the right view of Fig. 1.
The specific embodiment
Below in conjunction with accompanying drawing the utility model is described in detail, the description of this part only is exemplary and explanatory, should any restriction not arranged to protection domain of the present utility model.
A kind of semiconductor packages glue-dropping tool as depicted in figs. 1 and 2 comprises the sebific duct connector 1, colloid storage chamber 2 and the excessive glue mouth 3 that connect successively, and this excessive glue mouth 3 is provided with 16.These 16 excessive glue mouths 3 evenly are arranged on the colloid storage chamber 2.
The excessive glue mouth 3 of this Glue dripping head product has considered that encapsulation process generation CAP comes off bad and gas intrusion chip bad phenomenon design glue-dropping tool PIN pin improves when design, well avoid CAP to come off and invade the generation of chip bad phenomenon with gas.
The purpose of this utility model has provided the description to the utility model preferred embodiment; can make those skilled in the art's comprehend the utility model; but limit never in any form the utility model; and anyly can make amendment or be equal to replacement the utility model, all should be encompassed in the protection domain of the utility model patent.
Claims (2)
1. a semiconductor packages glue-dropping tool comprises the sebific duct connector, colloid storage chamber and the excessive Jiao Kou that connect successively, and it is characterized in that: this excessive Jiao Kou is provided with 16.
2. semiconductor packages glue-dropping tool as claimed in claim 1, it is characterized in that: these 16 excessive Jiao Kou evenly are arranged on the colloid storage chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206431572U CN202909890U (en) | 2012-11-29 | 2012-11-29 | Glug dispensing jig for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206431572U CN202909890U (en) | 2012-11-29 | 2012-11-29 | Glug dispensing jig for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202909890U true CN202909890U (en) | 2013-05-01 |
Family
ID=48158235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206431572U Expired - Fee Related CN202909890U (en) | 2012-11-29 | 2012-11-29 | Glug dispensing jig for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202909890U (en) |
-
2012
- 2012-11-29 CN CN2012206431572U patent/CN202909890U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130501 Termination date: 20151129 |