CN205845951U - A kind of baseplate material and chip three-dimensional electric heating attachment structure - Google Patents
A kind of baseplate material and chip three-dimensional electric heating attachment structure Download PDFInfo
- Publication number
- CN205845951U CN205845951U CN201620784041.9U CN201620784041U CN205845951U CN 205845951 U CN205845951 U CN 205845951U CN 201620784041 U CN201620784041 U CN 201620784041U CN 205845951 U CN205845951 U CN 205845951U
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- CN
- China
- Prior art keywords
- chip
- electric heating
- attachment structure
- baseplate material
- dimensional electric
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- Wire Bonding (AREA)
Abstract
The utility model discloses a kind of baseplate material and chip three-dimensional electric heating attachment structure, comprise several flip chip monomers, the two ends of flip chip monomer are equipped with stack of bumps, and flip chip monomer is an entirety by stack of bumps superposition.A kind of baseplate material of the present utility model and chip three-dimensional electric heating attachment structure, have advantage simple and reasonable, that packaging efficiency is high, easy to assembly, promoted microelectronic further development.
Description
Technical field
This utility model relates to a kind of electric heating attachment structure, is specifically related to a kind of baseplate material and is connected with chip three-dimensional electric heating
Structure, belongs to chip connecting structure technical field.
Background technology
Usually said multi-chip module is all referring to two dimension, and its all components and parts are all disposed within a plane, no
It has been three-dimensional for crossing the layout of interconnection line in its substrate, along with the further development of microelectric technique, the degree of integration of chip
Increasing substantially, the requirement to encapsulation is the strictest, and the shortcoming of two-dimensional package the most gradually comes out, and current two dimension assembles effect
Rate can reach 85%, assembles the theoretical maximum limit that can reach close to two dimension, it has also become hydrid integrated circuit sustainable development
Obstacle, in order to change this situation, three-dimensional chip assembly arises at the historic moment.
Utility model content
This utility model provides a kind of baseplate material and chip three-dimensional electric heating attachment structure, solves in prior art and asks
Topic, overall structure advantages of simple, its packaging efficiency are high, easy to assembly, promoted microelectronic further development.
For solving above-mentioned technical problem, the technical solution adopted in the utility model is:
A kind of baseplate material and chip three-dimensional electric heating attachment structure, several flip chip monomers, flip chip list
The two ends of body are equipped with stack of bumps, and flip chip monomer is an entirety by stack of bumps superposition.
Above-mentioned flip chip monomer includes chip body and carrier substrate, is provided with between chip body and carrier substrate
Salient point is also filled with resin.
The material that above-mentioned carrier substrate uses is the one in ALN, Si, diamond.
This utility model at least has the following technical effect that or advantage: by the lamination at two ends between flip chip monomer
Protruding superposition is one overall, has advantage simple and reasonable, that packaging efficiency is high, easy to assembly, promoted microelectronic enter
One step development.
Accompanying drawing explanation
In order to be illustrated more clearly that this utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the required accompanying drawing used is briefly described in description of the prior art, it should be apparent that, the accompanying drawing in describing below is only
Embodiments more of the present utility model, for those of ordinary skill in the art, in the premise not paying creative work
Under, it is also possible to other accompanying drawing is obtained according to these accompanying drawings.
Fig. 1 is the overall structure schematic diagram of the application.
In figure, 1 is flip chip monomer, and 2 is stack of bumps, and 3 is chip body, and 4 is carrier substrate, and 5 is salient point, 6
For resin.
Detailed description of the invention
In order to be better understood from technique scheme, below in conjunction with Figure of description and specific embodiment to upper
State technical scheme to be described in detail.
Embodiment 1
With reference to Fig. 1, for solving above-mentioned technical problem, the embodiment of the present application provides a kind of baseplate material and chip three-dimensional electricity
Thermally coupled structure, several flip chip monomers 1, the two ends of flip chip monomer 1 are equipped with stack of bumps 2, flip-over type
Chip monomer 1 is an entirety by stack of bumps 2 superposition, and overall structure is simple, packaging efficiency is high.
Above-mentioned flip chip monomer 1 include chip body 3 and carrier substrate 4, chip body 3 and carrier substrate 4 it
Between be provided with salient point 5 and be filled with resin 6.
The material that above-mentioned carrier substrate 4 uses is the one in ALN, Si, diamond, it is possible to keep good heat radiation.
Above-mentioned embodiment is at least had the advantage that between flip chip monomer 1 and is folded by the stack of bumps 2 at two ends
Add in one overall, simple and reasonable, its packaging efficiency is high, easy to assembly, promoted microelectronic further development.
Although having been described for preferred embodiment of the present utility model, but those skilled in the art once knowing substantially
Creative concept, then can make other change and amendment to these embodiments.So, claims are intended to be construed to bag
Include preferred embodiment and fall into all changes and the amendment of this utility model scope.
Obviously, those skilled in the art can carry out various change and modification without deviating from this practicality to this utility model
Novel spirit and scope.So, if of the present utility model these amendment and modification belong to this utility model claim and
Within the scope of its equivalent technologies, then this utility model is also intended to comprise these change and modification.
Claims (3)
1. a baseplate material and chip three-dimensional electric heating attachment structure, it is characterised in that: several flip chip monomers (1),
The two ends of flip chip monomer (1) are equipped with stack of bumps (2), and flip chip monomer (1) passes through stack of bumps (2) superposition
Overall in one.
A kind of baseplate material the most according to claim 1 and chip three-dimensional electric heating attachment structure, it is characterised in that: described
Flip chip monomer (1) includes chip body (3) and carrier substrate (4), sets between chip body (3) and carrier substrate (4)
There is salient point (5) and be filled with resin (6).
A kind of baseplate material the most according to claim 2 and chip three-dimensional electric heating attachment structure, it is characterised in that: described
The material that carrier substrate (4) uses is the one in ALN, Si, diamond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620784041.9U CN205845951U (en) | 2016-07-22 | 2016-07-22 | A kind of baseplate material and chip three-dimensional electric heating attachment structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620784041.9U CN205845951U (en) | 2016-07-22 | 2016-07-22 | A kind of baseplate material and chip three-dimensional electric heating attachment structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205845951U true CN205845951U (en) | 2016-12-28 |
Family
ID=57625588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620784041.9U Active CN205845951U (en) | 2016-07-22 | 2016-07-22 | A kind of baseplate material and chip three-dimensional electric heating attachment structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205845951U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336042A (en) * | 2017-12-26 | 2018-07-27 | 上海矽润科技有限公司 | A kind of 3-D stacks chip SiP encapsulation |
-
2016
- 2016-07-22 CN CN201620784041.9U patent/CN205845951U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108336042A (en) * | 2017-12-26 | 2018-07-27 | 上海矽润科技有限公司 | A kind of 3-D stacks chip SiP encapsulation |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 526073, Guangdong, Zhaoqing province high tech Zone Sha Lek Industrial Park, Zhaoqing health family industry Co., Ltd. 1 South workshop Patentee after: Guangdong ou dickming photoelectric Polytron Technologies Inc Address before: 526073, Guangdong province Zhaoqing high tech Zone Sha Lek Industrial Park health family company workshop 1 South Patentee before: ZHAOQING OUDIMING TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |