CN104752838A - Packaged interlayer antenna capable of seam phase calibration - Google Patents
Packaged interlayer antenna capable of seam phase calibration Download PDFInfo
- Publication number
- CN104752838A CN104752838A CN201510144123.7A CN201510144123A CN104752838A CN 104752838 A CN104752838 A CN 104752838A CN 201510144123 A CN201510144123 A CN 201510144123A CN 104752838 A CN104752838 A CN 104752838A
- Authority
- CN
- China
- Prior art keywords
- antenna
- gap
- metal plane
- feed line
- microstrip feed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Waveguide Aerials (AREA)
Abstract
The invention discloses a package interlayer antenna capable of seam phase calibration and relates to a horn antenna. The antenna comprises a micro-strip feeder line (1), a horn antenna (2) and seams (3), which are integrated on a medium substrate (4), the medium substrate (4) is arranged on an inner layer of a three-dimensional package (5), one end of the microstrip feeder line (1) is connected with an internal circuit (8) via a coplanar waveguide (7) on the side of the package, the horn antenna (2) is composed of a bottom metal plane (9), a top metal plane (10) and a metallized via hole side wall (11), a plurality of seams (3) are arranged in the bottom metal plane (9) and the top metal plane (10), and several sub-horns (16) are formed in the horn antenna (2) by the seams (3), one ends of the seams (3) face the micro-strip feeder line (1), and the other ends of the seams (3) are arranged on an antenna aperture surface (12). Electromagnetic wave energy in the antenna can reach the antenna aperture surface (12) by the same phase. By the antenna, antenna aperture efficiency and gains can be improved.
Description
Technical field
The present invention relates to a kind of horn antenna, the encapsulation interlayer antenna of especially a kind of gap phase alignment.
Background technology
Adopt monolithic three-dimensional multi-chip (3D-MCM) technology, a radio system can be integrated in a 3-D stacks encapsulation, also need antenna to be integrated in encapsulation for this reason.Normally antenna integrated on the surface of encapsulation, such as paster antenna is integrated in the top of encapsulation.But need sometimes integrated for antenna in a package between an interlayer to meet the needs of system.If integrated horn antenna just can realize above-mentioned requirements in the inner interlayer of encapsulation.But usual horn antenna is nonplanar, with incompatible, the larger physical dimension that has of planar circuit technique, thus limit its application on encapsulating structure.In recent years, substrate integration wave-guide horn antenna based on substrate integrated waveguide technology development has the advantages that size is little, lightweight, be easy to Planar integration, but the gain of traditional substrate integration wave-guide horn antenna is relatively low, its reason is because horn mouth constantly opens, Electromagnetic Wave Propagation is caused to occur that phase place is asynchronous to during horn mouth diametric plane, the PHASE DISTRIBUTION of bore electric field strength is uneven, radiation directivity and gain reduction.Existing method such as employing coated by dielectric, medium prism etc., correct the asynchronous of horn mouth diametric plane phase place, but these phase alignment structures adds the overall structure size of antenna at present, is not suitable for being integrated into the inner interlayer of encapsulation.
Summary of the invention
Technical problem: the object of the invention is the encapsulation interlayer antenna proposing a kind of gap phase alignment, on upper and lower two the parallel metal coverings of this horn antenna, there are many gaps inconsistent with electromagnetic phase place on RECTIFYING ANTENNA bore face, improve aperture efficiency and the gain of three-dimension packaging interlayer antenna.
Technical scheme: the encapsulation interlayer antenna package of a kind of gap of the present invention phase alignment draws together the microstrip feed line be arranged on medium substrate, substrate integration wave-guide horn antenna and gap, and medium substrate is at the internal layer of three-dimension packaging; Described microstrip feed line is connected with the internal circuit of three-dimension packaging by co-planar waveguide; Substrate integration wave-guide horn antenna to be connected bottom-side metal planar top surface metal flat by the bottom-side metal plane being positioned at medium substrate one side, the topside metal plane that is positioned at medium substrate another side metallization via hole trumpet side walls with through medium substrate forms; Substrate integration wave-guide horn antenna is connected in series by narrow Cross-section Waveguide Using and tubaeform waveguide and forms; One end of narrow Cross-section Waveguide Using is microstrip feed line, and bottom-side metal plane is connected with the ground plane of microstrip feed line, and the other end of narrow Cross-section Waveguide Using is connected with tubaeform waveguide, and one end of tubaeform waveguide is antenna opening diametric plane; Bottom-side metal plane in substrate integration wave-guide horn antenna and topside metal plane all have several gaps, and the length in gap is greater than a wavelength, and these gaps form multiple sub-loudspeaker in the inside of substrate integration wave-guide horn antenna; The one end in gap is towards the direction of microstrip feed line, and the other end in gap is positioned on antenna opening diametric plane;
The shape in described gap is curve, and the width in different gap can be different, and the width in every bar gap can be uneven;
In one or several described gap, adjust distance between adjacent two gaps or the distance between an adjustment gap and substrate integration wave-guide horn antenna () sidewall metallization via hole or change the length in one or more of gap, can make arrive antenna bore face on electromagnetic wave PHASE DISTRIBUTION evenly, or make arrive antenna bore face on electromagnetic wave phase place distribute as required; Regulate the width in certain gap, electromagnetic phase velocity in the sub-loudspeaker on these both sides, gap can be changed, can make arrive antenna bore face on electromagnetic wave PHASE DISTRIBUTION evenly, or make arrive antenna bore face on electromagnetic wave phase place distribute as required.
One end of described microstrip feed line is connected with horn antenna, and the other end of microstrip feed line, near package side surface, is the input/output port of antenna; Microstrip feed line is connected by antenna input/output port one end with the co-planar waveguide of package side surface, and the other end of co-planar waveguide is connected with encapsulation internal circuit.
Distance between described adjacent two gaps will ensure that electromagnetic wave can transmit and not be cut off.
In described metallization via hole trumpet side walls, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole trumpet side walls formed can be equivalent to electric wall.
Gap in the bottom-side metal plane of substrate integration wave-guide horn antenna and the gap one_to_one corresponding in topside metal plane, gap in substrate integration wave-guide horn antenna bottom-side metal plane is the same with the shape in the gap in topside metal plane, quantity is equal, and the position of the gap in bottom-side metal plane in bottom-side metal plane is the same with the position of the gap in topside metal plane in topside metal plane.
Gap in the bottom-side metal plane and topside metal plane of substrate integration wave-guide loudspeaker, is divided into several sub-loudspeaker substrate integration wave-guide loudspeaker.In sub-loudspeaker, electromagnetic wave propagation phase velocity is all relevant with the width of sub-loudspeaker, and the width of sub-loudspeaker is wider, and wherein electromagnetic wave propagation phase velocity is lower; Otherwise the width of sub-loudspeaker is narrower, electromagnetic wave propagation phase velocity is higher.The co-planar waveguide of electromagnetic wave signal through three-dimension packaging side from encapsulation internal circuit enters antenna input/output port, substrate integration wave-guide horn antenna is entered into again by microstrip feed line, after propagating a segment distance to the direction, bore face of antenna, run into one or several gaps, just be divided into two-way or multichannel, enter sub-loudspeaker to propagate, then arrive the bore face of antenna by sub-loudspeaker; Electromagnetic wave on antenna opening diametric plane, arrived by the sub-loudspeaker of difference, and the path of each road process is variant, arrive the electromagnetic wave at the edge of antenna opening diametric plane the distance of process far away, but the width of the sub-loudspeaker of process is narrower, and electromagnetic phase velocity is very fast; And the electromagnetic wave institute arriving antenna opening diametric plane immediate vicinity is comparatively near through distance, but the wider width of the sub-loudspeaker of process, electromagnetic phase velocity is slower.Arrive the electromagnetic phase place of antenna opening diametric plane by different sub-loudspeaker to be like this consistent, just reach the object improving antenna gain.In like manner also can realize specific PHASE DISTRIBUTION in the bore face of antenna as required.
Beneficial effect: the beneficial effect of the encapsulation interlayer antenna of gap of the present invention phase alignment is, specific PHASE DISTRIBUTION can be realized as required in the bore face of antenna, also can improve antenna opening diametric plane to power on the consistency of phase place of magnetic wave, thus improve aperture efficiency and the gain of three-dimension packaging interlayer antenna.
Accompanying drawing explanation
Fig. 1 is the three-dimension packaging overall structure figure of the encapsulation interlayer antenna of gap phase alignment.
Fig. 2 is the encapsulation interlayer antenna face structural representation of gap phase alignment.
Fig. 3 is the encapsulation interlayer antenna inverse layer structure schematic diagram of gap phase alignment.
Have in figure: microstrip feed line 1, substrate integration wave-guide horn antenna 2, gap 3, medium substrate 4, three-dimension packaging 5, the tubaeform waveguide 14 of the bore face 12 of antenna input/output port 6, co-planar waveguide 7, internal circuit 8, bottom-side metal plane 9, topside metal plane 10, metallization via hole trumpet side walls 11, antenna, the narrow Cross-section Waveguide Using 13 of antenna, antenna, ground plane 15 and sub-loudspeaker 16.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment of the present invention is: the encapsulation interlayer antenna package of gap phase alignment draws together the microstrip feed line 1 be arranged on medium substrate 4, substrate integration wave-guide horn antenna 2 and gap 3, and medium substrate 4 is at the internal layer of three-dimension packaging 5; Described microstrip feed line 1 is connected with the internal circuit 8 of three-dimension packaging 5 by co-planar waveguide 7; Substrate integration wave-guide horn antenna 2 to be connected bottom-side metal plane 9 topside metal plane 10 by the bottom-side metal plane 9 being positioned at medium substrate 4 one side, the topside metal plane 10 that is positioned at medium substrate 4 another side metallization via hole trumpet side walls 11 with through medium substrate 4 forms; Substrate integration wave-guide horn antenna 2 is connected in series by narrow Cross-section Waveguide Using 13 and tubaeform waveguide 14 and forms; One end of narrow Cross-section Waveguide Using 13 is microstrip feed line 1, and bottom-side metal plane 9 is connected with the ground plane 15 of microstrip feed line 1, and the other end of narrow Cross-section Waveguide Using 13 is connected with tubaeform waveguide 14, and one end of tubaeform waveguide 14 is antenna opening diametric plane 12; Bottom-side metal plane 9 in substrate integration wave-guide horn antenna 2 and topside metal plane 10 all have several gaps 3, and the length in gap 3 is greater than a wavelength, and these gaps 3 form multiple sub-loudspeaker 16 in the inside of substrate integration wave-guide horn antenna 2; The one end in gap 3 is towards the direction of microstrip feed line 1, and the other end in gap 3 is positioned on antenna opening diametric plane 12;
The shape in described gap 3 is curves, and the width in different gap 3 can be different, and the width in every bar gap 3 can be uneven;
In one or several described gap 3, adjust distance between adjacent two gaps 3 or the distance between an adjustment gap 3 and substrate integration wave-guide horn antenna (2) sidewall metallization via hole 11 or change the length in one or more of gap 3, can make arrive antenna bore face 12 on electromagnetic wave PHASE DISTRIBUTION evenly, or make arrive antenna bore face 12 on electromagnetic wave phase place distribute as required; Regulate the width in certain gap 3, electromagnetic phase velocity in the sub-loudspeaker 16 on these both sides, gap 3 can be changed, can make arrive antenna bore face 12 on electromagnetic wave PHASE DISTRIBUTION evenly, or make arrive antenna bore face 12 on electromagnetic wave phase place distribute as required.
One end of described microstrip feed line 1 is connected with horn antenna 2, and the other end of microstrip feed line 1, near package side surface, is the input/output port 6 of antenna; Microstrip feed line 1 is connected by antenna input/output port 6 one end with the co-planar waveguide 7 of package side surface, and the other end of co-planar waveguide 7 is connected with encapsulation internal circuit 8.
Distance between described adjacent two gaps 3 will ensure that electromagnetic wave can transmit and not be cut off.
In described metallization via hole trumpet side walls 11, the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole trumpet side walls 11 formed can be equivalent to electric wall.
Gap 3 in the bottom-side metal plane 9 and topside metal plane 10 of substrate integration wave-guide horn antenna 2, forms several sub-loudspeaker 16 in the inside of substrate integration wave-guide horn antenna 2.In sub-loudspeaker 16, electromagnetic wave propagation phase velocity is all relevant with the width of sub-loudspeaker 16, and the width of sub-loudspeaker 16 is wider, and wherein electromagnetic wave propagation phase velocity is lower; Otherwise the width of sub-loudspeaker 16 is narrower, and electromagnetic wave propagation phase velocity is higher.Electromagnetic wave signal from encapsulation internal circuit enters into substrate integration wave-guide horn antenna 2 from one end of metallization vertical vias feeder line 1 by the input/output port of antenna, after propagating a segment distance to the direction, bore face 12 of antenna, run into one or several gaps 3, just be divided into two-way or multichannel, enter sub-loudspeaker 16 to propagate, then arrive the bore face 12 of antenna by sub-loudspeaker 16; Electromagnetic wave on antenna opening diametric plane 12, arrived by the sub-loudspeaker 16 of difference, and the path of each road process is variant, arrive the electromagnetic wave at the edge of antenna opening diametric plane 12 the distance of process far away, but the width of the sub-loudspeaker 16 of process is narrower, and electromagnetic phase velocity is very fast; And the electromagnetic wave institute arriving antenna opening diametric plane 12 immediate vicinity is comparatively near through distance, but the wider width of the sub-loudspeaker 16 of process, electromagnetic phase velocity is slower.Arrive the electromagnetic phase place of antenna opening diametric plane 12 by different sub-loudspeaker 16 to be like this consistent, just reach the object improving antenna gain.In like manner also can realize specific PHASE DISTRIBUTION in the bore face 12 of antenna as required.
In technique, the encapsulation interlayer antenna of gap phase alignment both can adopt three-dimensional resinous packaging technology, and LTCC (LTCC) technique also can be adopted to realize.The via sidewall 11 that wherein metallizes can be hollow metal through hole also can be solid metal hole, and also can be continuous print metallization wall, the shape of metal throuth hole can be circular, also can be square or other shapes.
Structurally, according to same principle, gap 3 quantity can be increased again antenna 2 is divided into more sub-loudspeaker 16, and make to arrive antenna opening diametric plane 12 by the electromagnetic wave homophase of these a little loudspeaker 16, PHASE DISTRIBUTION on such antenna opening diametric plane 12 is more even, and the quantity increasing sub-loudspeaker 16 might not require the width increasing antenna opening diametric plane 12 simultaneously, as long as it is just passable to ensure that sub-loudspeaker 16 can transmit electromagnetic wave.Due to the metallization via sidewall 11 the closer to antenna, the distance that electromagnetic wave arrives antenna opening diametric plane 12 is far away, therefore relative to from the sub-loudspeaker 16 away from metallization via sidewall 11, from the width relative narrower of sub-loudspeaker 16 close to metallization via sidewall 11 to obtain higher electromagnetic transmission phase velocity.Gap 3 be arranged in linear can be straight line, broken line, exponential line and other curve etc.
According to the above, just the present invention can be realized.
Claims (4)
1. the encapsulation interlayer antenna of a gap phase alignment, it is characterized in that this antenna comprises the microstrip feed line (1) be arranged on medium substrate (4), substrate integration wave-guide horn antenna (2) and gap (3), medium substrate (4) internal layer in three-dimension packaging (5); Described microstrip feed line (1) is connected with the internal circuit (8) of three-dimension packaging (5) by co-planar waveguide (7); Substrate integration wave-guide horn antenna (2) to be connected bottom-side metal plane (9) topside metal plane (10) by the bottom-side metal plane (9) being positioned at medium substrate (4) one side, the topside metal plane (10) that is positioned at medium substrate (4) another side metallization via hole trumpet side walls (11) with through medium substrate (4) forms; Substrate integration wave-guide horn antenna (2) is connected in series by narrow Cross-section Waveguide Using (13) and tubaeform waveguide (14) and forms; One end of narrow Cross-section Waveguide Using (13) is microstrip feed line (1), bottom-side metal plane (9) is connected with the ground plane (15) of microstrip feed line (1), the other end of narrow Cross-section Waveguide Using (13) is connected with tubaeform waveguide (14), and one end of tubaeform waveguide (14) is antenna opening diametric plane (12); Bottom-side metal plane (9) in substrate integration wave-guide horn antenna (2) and topside metal plane (10) all have several gaps (3), the length in gap (3) is greater than a wavelength, and these gaps (3) form multiple sub-loudspeaker (16) in the inside of substrate integration wave-guide horn antenna (2); The one end in gap (3) is towards the direction of microstrip feed line (1), and the other end of gap (3) is positioned on antenna opening diametric plane (12);
The shape in described gap (3) is curve, and the width of different gap (3) is different, and the width of every bar gap (3) is uneven;
In described one or several gap (3), adjust distance between adjacent two gaps (3) or the distance between an adjustment gap (3) and substrate integration wave-guide horn antenna (2) sidewall metallization via hole (11) or change the length of one or more of gap (3), can make to arrive the upper electromagnetic wave PHASE DISTRIBUTION in bore face (12) of antenna evenly, or the upper electromagnetic wave phase place in bore face (12) arriving antenna is distributed as required; Regulate the width of certain gap (3), with electromagnetic phase velocity in the sub-loudspeaker (16) changing this gap (3) both sides, can make to arrive the upper electromagnetic wave PHASE DISTRIBUTION in bore face (12) of antenna evenly, or the upper electromagnetic wave phase place in bore face (12) arriving antenna is distributed as required.
2. the encapsulation interlayer antenna of a kind of gap according to claim 1 phase alignment, it is characterized in that one end of described microstrip feed line (1) is connected with horn antenna (2), the other end of microstrip feed line (1), near package side surface, is the input/output port (6) of antenna; Microstrip feed line (1) is connected by antenna input/output port (6) one end with the co-planar waveguide (7) of package side surface, and the other end of co-planar waveguide (7) is connected with encapsulation internal circuit (8).
3. the encapsulation interlayer antenna of a kind of gap according to claim 1 phase alignment, is characterized in that the distance between described adjacent two gaps (3) will ensure electromagnetic transmission and not be cut off.
4. the encapsulation interlayer antenna of a kind of gap according to claim 1 phase alignment, it is characterized in that in described metallization via hole trumpet side walls (11), the spacing of two adjacent metallization via holes is less than or equals 1/10th of operation wavelength, makes the metallization via hole trumpet side walls (11) formed can be equivalent to electric wall.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510144123.7A CN104752838A (en) | 2015-03-30 | 2015-03-30 | Packaged interlayer antenna capable of seam phase calibration |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510144123.7A CN104752838A (en) | 2015-03-30 | 2015-03-30 | Packaged interlayer antenna capable of seam phase calibration |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104752838A true CN104752838A (en) | 2015-07-01 |
Family
ID=53592148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510144123.7A Pending CN104752838A (en) | 2015-03-30 | 2015-03-30 | Packaged interlayer antenna capable of seam phase calibration |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104752838A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030179148A1 (en) * | 2002-03-18 | 2003-09-25 | Magnus Ohlsson | Horn antenna |
| CN103022711A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Package sandwich antenna for phase calibration |
-
2015
- 2015-03-30 CN CN201510144123.7A patent/CN104752838A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030179148A1 (en) * | 2002-03-18 | 2003-09-25 | Magnus Ohlsson | Horn antenna |
| CN103022711A (en) * | 2012-12-21 | 2013-04-03 | 东南大学 | Package sandwich antenna for phase calibration |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103022715B (en) | Planar horn antenna for phase calibration | |
| CN103022668B (en) | Packaged sandwich antenna with phase and impedance calibration functions | |
| CN104752836A (en) | Three-dimensional packaged surface antenna capable of seam phase calibration | |
| CN103022674B (en) | Phase- and amplitude-calibrated 3D-package surface antenna with embedded plated through holes | |
| CN103022709B (en) | Phase-calibrated packaged sandwich antenna with embedded plated through holes | |
| CN103022675B (en) | Three-dimensional surface antenna for phase calibration | |
| CN103022676B (en) | Amplitude impedance calibrated three-dimensional package surface antenna | |
| CN103022672B (en) | Package sandwich antenna for phase amplitude calibration | |
| CN103022712B (en) | Phase- and amplitude-calibrated packaged sandwich antenna with embedded plated through holes | |
| CN103022711B (en) | Package sandwich antenna for phase calibration | |
| CN103022671B (en) | Amplitude-calibrated packaging interlayer antenna | |
| CN103022679B (en) | Amplitude impedance calibrated package interlayer antenna | |
| CN103022718B (en) | Three-dimensional package surface antenna for phase amplitude calibration | |
| CN103022680B (en) | Phase-calibrated 3D-package surface antenna with embedded plated through holes | |
| CN104752838A (en) | Packaged interlayer antenna capable of seam phase calibration | |
| CN104733847A (en) | Three-dimensional packaging surface antenna for gap embedded phase position calibration | |
| CN103022667B (en) | Packaged sandwich antenna with impedance calibration function | |
| CN104716434A (en) | Plane horn antenna capable of achieving gap embedding phase calibration | |
| CN104733866A (en) | Packaging sandwich antenna for gap embedded phase position calibration | |
| CN103022710B (en) | Amplitude-calibrated packaged sandwich antenna with embedded plated though holes | |
| CN103022673B (en) | Package sandwich antenna for phase amplitude impedance calibration | |
| CN104779445A (en) | Three-dimensional packaging surface antenna with function of gap embedded phase amplitude calibration | |
| CN103022670B (en) | Amplitude-calibrated 3D-package surface antenna with embedded plated through holes | |
| CN104752837A (en) | Packaged interlayer antenna capable of seam phase amplitude calibration | |
| CN104779444A (en) | Packaging sandwich antenna with function of gap embedded phase amplitude calibration |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150701 |