CN104733331B - 气压式胶体平整装置及其平整方法 - Google Patents
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Abstract
本发明提供了一种气压式胶体平整装置,在气体管路上含有按顺序连接的过滤器、调节阀、流量计、吹气口;点涂了保护胶的芯片器件移动到吹气口的正下方;从吹气口吹出惰性气体,吹压尚未固化或凝固的胶液到低于芯片封装用的塑封体外壳平面。本发明的装置结构简单,吹压胶液效果好,塑封体外壳减小了对芯片产生的应力,提高了产品的品质。
Description
技术领域
本发明涉及半导体行业使用的芯片塑封技术。
背景技术
在半导体器件塑料封装工程中,有些产品在键合打线(键合丝)后需要在芯片表面点涂保护胶,以减小塑封体对芯片产生的应力,提高产品品质。然而,如果胶体高度超出塑封体表面,就形成“露胶”,造成产品气密性不良、工作可靠性严重下降,这是半导体器件的致命不良缺陷。
由于点胶工艺过程中胶体高度很难绝对保持一致,传统的办法是在产品塑封后由人工进行外观检查,挑出塑封体“露胶产品”。但是人工检查不可能全部挑出残次品,有漏检风险。
中国专利申请号为2013204322166的实用新型涉及一种把塑胶配件的进胶点压平的装置。一种进胶点压平装置,工件放置台上铺设运输带,运输带一侧设置了压平从动轴,压平从动轴的左右两侧对称地设置有压平装置;所述的压平装置包括压平从动轴高度调整螺杆、压平从动轴高度调整紧固螺母,压平从动轴两端分别与左右两侧的压平从动轴高度调整螺杆连接,压平从动轴与压平从动轴高度调整螺杆之间的相接处设置有压平从动轴高度调整紧固螺母。该技术适用于先塑封后压平的操作过程,不适合先压平胶液然后塑封的工艺步骤。
申请号为2011201621294的实用新型公开了一种胶背块状地毯翘角压平机。本实用新型的胶背块状地毯翘角压平机,包括机架、动力机、传动机构、齿轮副、压平机构、导向机构,其中,压平机构包括从下向上依次固定安装在机架上并且两端伸出机架两侧的主动辊、被动辊和压辊,在主动辊和被动辊的一端安装有齿轮副,主动辊一端通过传动机构与动力机输出轴连接,主动辊和被动辊在齿轮副的作用做同步相向转动,主动辊与被动辊之间及被动辊与压辊之间有一定间隙,导向机构为固定在机架两侧板上位于在主动辊与压辊之间的弧形挡板。该实用新型中的压平机结构比较复杂,压力偏大,不适合胶液的平整使用。
发明内容
发明目的:
提供一种结构简单、胶液压平效果好的气压式胶体平整装置及其平整方法。
技术方案:
本发明提供一种气压式胶体平整装置,除了惰性气体气源(优选用压力0.15~02Mpa、露点小于-40℃的纯N2为气源)和气体管路外,在气体管路上含有按顺序连接的过滤器(过滤气体,减少尘埃对胶体的污染)、调节阀(调节气体的流速大小)、流量计(计量气体的流量)、吹气口(对准胶液吹气的气体出口,可以一个或多个并联)。
吹气口的直径优选为0.6mm,吹气口设计在距点胶胶液正上方2~3mm。当产品在生产线上从吹气口通过时,产品上的胶体受到N2流体多次吹压而使得胶体高度下降,完成胶体整平过程。
本装置使用时采用的平整方法,具有如下工艺顺序:
1)点涂了保护胶液的芯片(芯片下方是引线框架)等器件移动到吹气口的正下方(优选垂直于芯片所在的平面);
2)从吹气口吹出惰性气体,压塌尚未固化或凝固的胶液,吹压到低于芯片封装用的塑封体外壳平面;
3)将引线框架的一个端部、芯片、键合丝和胶一起封装在塑封体外壳内部。
平整工艺的原理:
本发明所述的气压式胶体平整工艺是利用干燥的压缩N2垂直吹到胶体表面,在克服胶体表面张力后使胶体向下变形的一种工艺方法。通过胶体整平装置的结构设计,气体流量的控制,在保证键合引线不变形的情况下,使胶体高度控制在合格范围内,防止产品塑封后胶体露出塑封体表面。
本发明中,气压式胶体平整装置的平整方法中,采用的惰性气体的气压满足以下条件:气压能够压弯压低胶液的液面,又不会使得胶液有液滴飞溅出去。
本发明中,优选气压能够克服胶液的表面张力,又不会引起高分子类胶粘剂中高分子之间的氢键打开或者化学键的断裂。
有益效果:
本发明的装置结构简单,成本低廉,吹压胶液效果好,正品率高。而且,惰性气体对胶液有保护作用,胶液平整后能够塑封体外壳减小了对芯片产生的应力,提高产品的品质。
附图说明
图1是经过本发明的装置平整后的芯片塑封体;
图2是未经过本发明的装置平整后的芯片塑封体;
图3是本发明的一种装置在工作中的结构示意图。
图中:1-引线框架;2-塑封体外壳;3-键合丝;4-胶液;5-芯片;40-裸露的胶;6-吹气口;7-气体管路;8-流量计;9-调节阀;10-过滤器。
具体实施方式
如图3的气压式胶体平整装置,采用N2气源和气体管路外,在气体管路上含有按顺序连接的过滤器10、调节阀9、流量计8、多个直径为0.3-1.0mm的并联的吹气口6在需要吹压的胶液(4)的正上方距离3-5mm处。
采用的平整方法具有如下工艺顺序:
1)点涂了保护胶液4的芯片5移动到吹气口6的正下方;
2)从吹气口6吹出N2,气压能够克服胶液4的表面张力,又不会引起高分子类胶粘剂中高分子之间的化学键的断裂;压塌尚未固化或凝固的胶液4,吹压到低于芯片5封装用的塑封体外壳2平面;
3)将引线框架1的一个端部、芯片5、键合丝3和胶液4一起封装在塑封体外壳2内部。
Claims (3)
1.一种气压式胶体平整装置的平整方法,采用惰性气体气源和气体管路(7)外,在气体管路上含有按顺序连接的过滤器(10)、调节阀(9)、流量计(8)、一个或多个并联的吹气口(6);吹气口(6)的直径为0.3-1.0mm,吹气口(6)在需要吹压的胶液(4)的正上方距离2-8mm处,其特征在于:具有如下工艺顺序:
1)点涂了保护胶液(4)的芯片(5)器件移动到吹气口(6)的正下方;
2)从吹气口(6)吹出惰性气体,压塌尚未固化或凝固的胶液(4),吹压到低于芯片(5)封装用的塑封体外壳(2)平面;
3)将引线框架(1)的一个端部、芯片(5)、键合丝(3)和胶液(4)一起封装在塑封体外壳(2)内部。
2.如权利要求1所述的气压式胶体平整装置的平整方法,其特征在于:采用的惰性气体的气压满足以下条件:气压能够压弯压低胶液(4)的液面,又不会使得胶液(4)的液滴飞溅出去。
3.如权利要求1或2所述的气压式胶体平整装置的平整方法,其特征在于:所述的气压能够克服胶液(4)的表面张力,又不会引起高分子类胶粘剂中高分子之间的氢键打开或者化学键的断裂。
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Publication number | Priority date | Publication date | Assignee | Title |
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CN102169814A (zh) * | 2010-02-03 | 2011-08-31 | 志圣工业股份有限公司 | 晶圆压膜机离形膜保护机构 |
CN202116863U (zh) * | 2011-05-20 | 2012-01-18 | 郑州华德永佳地毯有限公司 | 胶背块状地毯翘角压平机 |
CN203357791U (zh) * | 2013-07-20 | 2013-12-25 | 广东小白龙动漫玩具实业有限公司 | 一种进胶点压平装置 |
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CN102169814A (zh) * | 2010-02-03 | 2011-08-31 | 志圣工业股份有限公司 | 晶圆压膜机离形膜保护机构 |
CN202116863U (zh) * | 2011-05-20 | 2012-01-18 | 郑州华德永佳地毯有限公司 | 胶背块状地毯翘角压平机 |
CN203357791U (zh) * | 2013-07-20 | 2013-12-25 | 广东小白龙动漫玩具实业有限公司 | 一种进胶点压平装置 |
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