CN104695679A - 一种表板直拼的正方形木地板及其制备方法 - Google Patents

一种表板直拼的正方形木地板及其制备方法 Download PDF

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CN104695679A
CN104695679A CN201510103990.6A CN201510103990A CN104695679A CN 104695679 A CN104695679 A CN 104695679A CN 201510103990 A CN201510103990 A CN 201510103990A CN 104695679 A CN104695679 A CN 104695679A
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dash board
veneer
wood flooring
enhancement layer
square wood
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梁兆镛
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0004—Cutting, tearing or severing, e.g. bursting; Cutter details
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
    • B32B21/10—Next to a fibrous or filamentary layer
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    • B32B21/00—Layered products comprising a layer of wood, e.g. wood board, veneer, wood particle board
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    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
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    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • B32B7/04—Interconnection of layers
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    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/02194—Flooring consisting of a number of elements carried by a non-rollable common support plate or grid
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/022—Flooring consisting of parquetry tiles on a non-rollable sub-layer of other material, e.g. board, concrete, cork
    • E—FIXED CONSTRUCTIONS
    • E04—BUILDING
    • E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F15/00—Flooring
    • E04F15/02—Flooring or floor layers composed of a number of similar elements
    • E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
    • E04F15/045—Layered panels only of wood
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
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    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/16—Drying; Softening; Cleaning
    • B32B38/164—Drying
    • B32B2038/166—Removing moisture
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B2307/00—Properties of the layers or laminate
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    • B32B2317/00—Animal or vegetable based
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    • B—PERFORMING OPERATIONS; TRANSPORTING
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  • Life Sciences & Earth Sciences (AREA)
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Abstract

本发明公开了一种表板直拼的正方形木地板，包括表板、底板和增强层，所述表板由两条以上等长等厚的单板直拼而成，并通过拼板胶与所述增强层一面粘合，所述增强层的另一面与所述底板压贴连接；所述正方形木地板的边长长度≥300mm，且所述正方形木地板的四个侧面都设有凹槽。本发明还公开了一种表板直拼的正方形木地板的制备方法。采用本发明，可提高木材的利用率，增加多层实木地板的耐候性，简化工艺步骤，减少生产成本，产品美观实用。

Description

一种表板直拼的正方形木地板及其制备方法
技术领域
本发明涉及木质建材，尤其涉及一种表板直拼的正方形木地板；还涉及所述表板直拼的正方形木地板的制备方法。
背景技术
现有的木地板通过刨切出一定长宽的表板，并与木板基材粘合形成长条状的地板。由于木材的生长特性和加工工艺的不足，表板只能做成长条状，制备出的地板常规宽度是90mm、120mm、148mm。同时，地板的表板生产过程中统一按以上几个常规的宽度统一，不足宽度要降级，超宽度的要栽掉，很多小于90mm的要扔掉。由于还需开槽，刨削加工，而刨切后表板原料在目的宽度的基础上增加10mm，加工过程便浪费很多材料。各种损耗加起来，木材的利用率非常低，成本高。
另外，由于木材具有各向异性，木材沿树干方向的裂纹(习惯叫顺纹)强度较垂直树干横向裂纹(横纹)强度要大得多，因此横向的抗拉能力未能够抵抗热涨冷缩对表板的破坏，若地板表板太宽容易开裂，从而影响地板的使用。
此外，市场有些正方形的地板，由于是拼花，其板面的拼缝很多，花工很多，铺贴后的效果反而不够理想。
发明内容
本发明所要解决的技术问题在于，提供一种成本低、出材率高、耐候性好、美观实用的表板直拼的正方形木地板。
本发明所要解决的技术问题在于，提供一种所述表板直拼的正方形木地板的制备方法，可提高木材的利用率，增加多层实木地板的耐候性，简化工艺步骤，减少生产成本，产品美观实用。
为了解决上述技术问题，本发明提供了一种 表板直拼的正方形木地板，包括表板、底板和增强层，所述表板由两条以上等长等厚的单板直拼而成，并通过拼板胶与所述增强层一面粘合，所述增强层的另一面与所述底板压贴连接；
所述正方形木地板的边长长度≥300mm，且所述正方形木地板的四个侧面都设有凹槽。
作为所述表板直拼的正方形木地板的优选方案，所述底板由若干层厚度为0.8-3mm实木板贴合而成，且所述底板的最底一层实木板与表板拼接方向相同以抵消表板应力。
作为所述表板直拼的正方形木地板的优选方案，所述增强层为无纺布。
作为所述表板直拼的正方形木地板的优选方案，所述表板的厚度为0.5-5mm。
相应地，本发明还提供了一种所述表板直拼的正方形木地板的制备方法，包括以下步骤：
（1）选取相同的木材，将木材锯切或刨切成等长等厚的长条状单板；
（2）对单板进行干燥处理至单板的含水率低于12%；
（3）将单板的长边进行修直处理；
（4）在单板的侧面和底面涂覆拼板胶使单板粘贴在增强层上，并且相邻两块单板的长边拼接形成宽幅的表板；
（5）将涂覆拼板胶的表板与增强层经过热压固化，使单板拼成的表板与增强层粘合；
（6）将固化后的表板与增强层热压贴在底板上，增强层与底板贴合；
（7）按需锯切成边长长度≥300mm的正方形木地板，开槽，涂上漆得到成品。
作为所述制备方法的优选方案，所述步骤（5）中热压温度为30-170℃，热压保温20-150s。
作为所述制备方法的优选方案，所述步骤（6）中热压温度为100-200℃，热压保温2-5min。
作为所述制备方法的优选方案，在所述正方形木地板的四个侧面都设置有凹槽。
作为所述制备方法的优选方案，所述增强层为无纺布。
作为所述制备方法的优选方案，所述步骤（3）修直单板需控制每块单板的边缘直角度≤0.2mm/m。
实施本发明实施例，具有如下有益效果：
本发明采用先将长条状的单板拼接成大片的表板，同时在表板和底板之间设置一层增强层，确保表板在使用过程中不易出现开裂，有效地克服木地板热胀冷缩的难题，即使木地板的尺寸增大，其耐候性能也表现优越。
在铺设面积相同的情况下，采用本发明制备方法制得的表板直拼的正方形木地板相对于小尺寸长条形木地板的侧边数量较少，节省侧边开槽时耗费的木料。再加上不需对锯切或刨切出来的单板筛选等级，即便小尺寸的单板也可以使用，由此，本发明所述木地板的出材率相对现有木地板提高了15%-25%。
随着出材率的提高，原材料的成本也随之减少，而且制作大尺寸的地板因边长相对较少，相应的加工成本、人力成本也减少。
附图说明
图1是本发明一种表板直拼的正方形木地板的结构示意图；
图2是本发明一种表板直拼的正方形木地板的表板拼接示意图；
图3是本发明一种表板直拼的正方形木地板制备方法的流程图。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地详细描述。
如图1所示，本发明提供一种表板直拼的正方形木地板，包括表板1、底板2和增强层3，所述表板1由两条以上等长等厚的单板11直拼而成，并通过拼板胶与所述增强层3一面粘合，所述增强层3的另一面与所述底板2压贴连接；
所述正方形木地板的边长≥300mm，且所述正方形木地板的四个侧面都设有凹槽。
需要说明的是，本发明所述正方形木地板优选采用由若干层厚度为0.8-3mm实木板贴合而成的底板2，且所述底板2的最底一层实木板与表板1拼接方向相同以抵消表板1应力。
优选地，所述表板1的厚度为0.5-5mm。
需要说明的是，本发明所述正方形木地板边长长度可为300mm、400mm、450mm、500mm、600mm、800mm、1000mm，但不限于以上列举的边长长度。
现有技术常见的木地板由于木材呈圆柱状，因此其锯切出的表板皆是长条状的，由于表板铺设在木地板的表面，制作出的木地板的宽度也受到限制。另外，地板的表板生产过程中需统一宽度，不足宽度要降级，超宽度的要栽掉，而无法到达最低标准（宽度为90mm）的不可用于表板的生产，导致现有木地板的出材率低，且生产成本高。
区别于现有木地板将单板设在木地板的表面，本发明的表板1是将等长等厚的长方形单板11先通过拼板胶拼接成大片的表板1，同时在表板1和底板2之间设置一层诸如无纺布的增强层3，弥补表板1的横向抗拉能力差的缺点，利用增强层3抗拉强度的各向同性，使得本发明所述表板1在各个方向的抗拉强度增强，特别是木纹的横向方向抗拉能力得到明显提升，确保表板1在使用过程中不易出现开裂，有效地克服木地板热胀冷缩的难题，即使木地板的尺寸增大，其耐候性能也表现优越。而且由于表板1的厚度薄，只是单层表板1拼接较为困难，若将表板1放在连续的无纺布上则能轻松解决这个问题，而且拼接更牢固。
为检测本发明所述木地板的耐候性，发明人对本发明正方形木地板与现有木地板进行耐候性测试，具体如下：
1.实验样品
实施例：本发明正方形木地板；
参考例：现有以单板为表板的长条状木地板。
2.实验方法
a.将样品放入恒温恒湿试验箱中，关紧箱门，按恒温恒湿试验箱设定的程序从-20℃（时间2h）~50℃（时间3h湿度65%）进行循环测试，共6个循环30h；
b.循环测试结束后从恒温恒湿试验箱中取出样品并放置于温度为20±2℃，相对湿度为60%~70%的环境中静置20h，然后用4倍放大镜近距离观察样品的表面。
3.实验结果
实验样品 实施例 参考例
外观 无裂纹 出现3处裂纹
通过以上的冷热循环破坏性测试发现，本发明实施例没有因为横向尺寸增大而降低抗破坏能力，反而因为设有增强层3而得到提升，耐候性能更佳。
如图2所示，采用本发明所述木地板还不需对锯切出的单板11进行等级筛选，即无论锯切出来的单板11宽度是否相同，只要单板11的长度和厚度相同即可进行拼接，解决现有单板宽度不足90mm便要舍弃的问题，提高木材的出材率。另外，现有的地板在开槽过程中，必须要裁掉木材两边10-20mm，因此木地板的尺寸越小，其边长越多，开槽裁掉的木材越多，木材利用率也越低。
例如，将一块1240mm×2480mm（面积为3.0752 m2）的地板基材开料，通过开成现有长条形木地板与本发明正方形木地板比较两者的出材率：
现有木地板（1200mm×120mm）最多可切成17块，其中每块木板的长宽各预留20mm用于制作企口；
可铺设的面积：1200mm×120mm×17= 2.448㎡；
出材率：2.448m2÷3.0752m2=79.6%。
本发明所述正方形木地板（600mm×600mm）最多可切成8块，其中每块木板的长宽不需预留长度用于制作企口；
可铺设的面积：600mm×600mm×8= 2.88 m2；
出材率：2.88m2÷3.0752m2=93.6%。
由此可计算得出，将一块1240mm×2480mm的地板基材开料，开成正方形木地板相对于长条形木地板出材率高出约14%，通过减少裁出地板的块数，减少侧边的数量，从而节省侧边开槽时耗费的木料。再加上本发明的表板1先拼接，后切割，拼接用的单板11无需筛选等级，对于小尺寸的单板11也可以使用，由此也极大地提高木材的出材率，使木材的出材率整体提高了15%-25%。
需要说明的是，切成不同尺寸的本发明正方形地板选用相应尺寸的地板基材，如上例600mm×600mm尺寸的木地板选用1200mm×2400mm的地板基材，以使出材率最大化。
本发明所述正方形地板铺设时，在两块地板相接侧壁的其中两个个凹槽内插入一木条以使两块地板结合。
随着出材率的提高，原材料的成本也随之减少，而且制作大尺寸的地板因边长相对较少，相应的加工成本、人力成本也减少。
如图3所示，本发明相应提供一种表板直拼的正方形木地板的制备方法，包括以下步骤：
S100，选取相同的木材，将木材锯切或刨切成等长等厚的长条状单板。
本发明所采用的原木来源广泛，如杉木、松木、杨木、水曲柳、泡桐、桦木、椴木等。本发明锯切或刨切的单板无需按板材的宽度进行选级，只要确保等长等厚即可用于表板的制备。
S101，对单板进行干燥处理至单板的含水率低于12%。
需要说明的是，如单板的含水率过低，在后续热压工序容易开裂；如含水率过高，被压缩后则易出现变形。因此，优选方案是控制单板的含水率为6-12%。
S102，将单板的长边进行修直处理。
表板的外观是否平整，无缝的关键工序之一是修直工序，因为两两单板间的拼缝是否紧密取决于每块单板的直边能否修直，本发明所述制备方法需要控制每块单板的边缘直角度≤0.2mm/m。
S103，在单板的侧面和底面涂覆拼板胶使单板粘贴在增强层上，并且相邻两块单板的长边拼接形成宽幅的表板。
修直后单板首先选择宽度较大的进行拼接，最后拼接的单板根据要求制备的表板宽度进行选择。拼接时一方面需要在单板的侧边涂上拼板胶以使两块单板之间拼接牢固，另一反面也需要在单板的底面涂上拼板胶使单板增强层上。本发明在拼接时要求拼装离缝值为0.10mm±0.05mm，由此制得的表板在直观上看不出有接缝，保证表板的外观质感。
S104，将涂覆拼板胶的表板与增强层经过热压固化，使单板拼成的表板与增强层粘合。
将涂覆拼板胶的表板与增强层放入热压机中，在热压温度30-170℃的条件下，保温20-150s后，置于相对湿度为75%的控制室内自然冷却，固化，以使压缩率控制在15%-20%。
S105，将固化后的表板与增强层热压贴在底板上，增强层与底板贴合。
在增强层的另一面涂上拼板胶与底板粘合，并一起放入热压机中，在热压温度100-200℃的条件下，保温2-5min后，置于相对湿度为75%的控制室内自然冷却，固化，最后得到一大块地板基材。
S106，按需锯切成边长≥300mm的正方形木地板，开槽，涂上漆得到成品。
将S105步骤中的地板基材按照木地板的尺寸要求进行切割，在四个侧面开槽，表面刨光、表面涂漆后制得本发明所述正方形木地板。
最后所应当说明的是，以上实施例仅用以说明本发明的技术方案而非对本发明保护范围的限制，尽管参照较佳实施例对本发明作了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或者等同替换，而不脱离本发明技术方案的实质和范围。

Claims (10)

1.一种表板直拼的正方形木地板，其特征在于，包括表板、底板和增强层，所述表板由两条以上等长等厚的单板直拼而成，并通过拼板胶与所述增强层一面粘合，所述增强层的另一面与所述底板压贴连接；
所述正方形木地板的边长长度≥300mm，且所述正方形木地板的四个侧面都设有凹槽。
2.如权利要求1所述大尺寸方块木地板，其特征在于，所述底板由若干层厚度为0.8-3mm实木板贴合而成，且所述底板的最底一层实木板与表板拼接方向相同以抵消表板应力。
3.如权利要求1所述大尺寸方块木地板，其特征在于，所述增强层为无纺布。
4.如权利要求1所述大尺寸方块木地板，其特征在于，所述表板的厚度为0.5-5mm。
5.一种如权利要求1所述表板直拼的正方形木地板的制备方法，其特征在于，包括以下步骤：
（1）选取相同的木材，将木材锯切或刨切成等长等厚的长条状单板；
（2）对单板进行干燥处理至单板的含水率低于12%；
（3）将单板的长边进行修直处理；
（4）在单板的侧面和底面涂覆拼板胶使单板粘贴在增强层上，并且相邻两块单板的长边拼接形成宽幅的表板；
（5）将涂覆拼板胶的表板与增强层经过热压固化，使单板拼成的表板与增强层粘合；
（6）将固化后的表板与增强层热压贴在底板上，增强层与底板贴合；
（7）按需锯切成边长长度≥300mm的正方形木地板，开槽，涂上漆得到成品。
6.如权利要求5所述制备方法，其特征在于，所述步骤（5）中热压温度为30-170℃，热压保温20-150s。
7.如权利要求5所述制备方法，其特征在于，所述步骤（6）中热压温度为100-200℃，热压保温2-5min。
8.如权利要求5所述制备方法，其特征在于，在所述正方形木地板的四个侧面都设置有凹槽。
9.如权利要求5所述制备方法，其特征在于，所述增强层为无纺布。
10.如权利要求5所述制备方法，其特征在于，所述步骤（3）修直单板需控制每块单板的边缘直角度≤0.2mm/m。
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