CN104659197B - 发光二极管封装体 - Google Patents
发光二极管封装体 Download PDFInfo
- Publication number
- CN104659197B CN104659197B CN201310602006.1A CN201310602006A CN104659197B CN 104659197 B CN104659197 B CN 104659197B CN 201310602006 A CN201310602006 A CN 201310602006A CN 104659197 B CN104659197 B CN 104659197B
- Authority
- CN
- China
- Prior art keywords
- electrode
- adjutage
- main part
- led encapsulation
- encapsulation body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 27
- 238000009413 insulation Methods 0.000 claims abstract description 22
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000012780 transparent material Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 7
- 230000005611 electricity Effects 0.000 description 3
- 238000010008 shearing Methods 0.000 description 3
- 239000003677 Sheet moulding compound Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Led Device Packages (AREA)
Abstract
Description
底座 | 10 |
第一电极 | 11 |
第二电极 | 13 |
绝缘基板 | 15 |
发光二极管 | 30 |
导线 | 31 |
封装层 | 50 |
第一主体部 | 112 |
第一延伸臂 | 114 |
第二主体部 | 132 |
第二延伸臂 | 134 |
第一绝缘部 | 151 |
第二绝缘部 | 153 |
连接臂 | 1512 |
第一凸起 | 1514 |
第二凸起 | 1516 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310602006.1A CN104659197B (zh) | 2013-11-26 | 2013-11-26 | 发光二极管封装体 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310602006.1A CN104659197B (zh) | 2013-11-26 | 2013-11-26 | 发光二极管封装体 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104659197A CN104659197A (zh) | 2015-05-27 |
CN104659197B true CN104659197B (zh) | 2017-11-07 |
Family
ID=53250097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310602006.1A Active CN104659197B (zh) | 2013-11-26 | 2013-11-26 | 发光二极管封装体 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104659197B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019219177A1 (en) * | 2018-05-15 | 2019-11-21 | Osram Opto Semiconductors Gmbh | Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105938866A (zh) * | 2016-06-13 | 2016-09-14 | 开发晶照明(厦门)有限公司 | Led支架和led封装结构 |
CN108281537A (zh) * | 2018-03-20 | 2018-07-13 | 木林森股份有限公司 | 一种led灯珠的封装结构 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103378262A (zh) * | 2012-04-26 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管及其封装方法 |
CN103427007A (zh) * | 2012-05-18 | 2013-12-04 | 展晶科技(深圳)有限公司 | 发光二极管及其封装方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7683463B2 (en) * | 2007-04-19 | 2010-03-23 | Fairchild Semiconductor Corporation | Etched leadframe structure including recesses |
JP5710128B2 (ja) * | 2010-01-19 | 2015-04-30 | 大日本印刷株式会社 | 樹脂付リードフレームの製造方法 |
KR101831283B1 (ko) * | 2011-10-04 | 2018-02-22 | 엘지이노텍 주식회사 | 발광소자 패키지 |
-
2013
- 2013-11-26 CN CN201310602006.1A patent/CN104659197B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103378262A (zh) * | 2012-04-26 | 2013-10-30 | 展晶科技(深圳)有限公司 | 发光二极管及其封装方法 |
CN103427007A (zh) * | 2012-05-18 | 2013-12-04 | 展晶科技(深圳)有限公司 | 发光二极管及其封装方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019219177A1 (en) * | 2018-05-15 | 2019-11-21 | Osram Opto Semiconductors Gmbh | Carrier for an optoelectronic device, method for producing a carrier for an optoelectronic device |
Also Published As
Publication number | Publication date |
---|---|
CN104659197A (zh) | 2015-05-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201202 Address after: 215000 No. 8 Jinfeng Road, hi tech Zone, Suzhou, Jiangsu, Suzhou Patentee after: Suzhou science and Technology City Biomedical Technology Development Co.,Ltd. Address before: 518109, Shenzhen, Guangdong, Baoan District province Longhua Street tenth Pine Industrial Zone, No. two, East Ring Road, No. two Patentee before: ZHANJING Technology (Shenzhen) Co.,Ltd. Patentee before: Advanced Optoelectronic Technology Inc. |
|
TR01 | Transfer of patent right | ||
CP01 | Change in the name or title of a patent holder |
Address after: 215000 No.8, Jinfeng Road, science and Technology City, Suzhou high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Medical Device Industry Development Co.,Ltd. Address before: 215000 No.8, Jinfeng Road, science and Technology City, Suzhou high tech Zone, Suzhou City, Jiangsu Province Patentee before: Suzhou science and Technology City Biomedical Technology Development Co.,Ltd. Address after: 215000 No.8, Jinfeng Road, science and Technology City, Suzhou high tech Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Medical Device Industry Development Group Co.,Ltd. Address before: 215000 No.8, Jinfeng Road, science and Technology City, Suzhou high tech Zone, Suzhou City, Jiangsu Province Patentee before: Suzhou Medical Device Industry Development Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder |