CN104640431B - 支撑装置、用来支撑待用元件装配的基底的方法及装配机 - Google Patents

支撑装置、用来支撑待用元件装配的基底的方法及装配机 Download PDF

Info

Publication number
CN104640431B
CN104640431B CN201410584661.3A CN201410584661A CN104640431B CN 104640431 B CN104640431 B CN 104640431B CN 201410584661 A CN201410584661 A CN 201410584661A CN 104640431 B CN104640431 B CN 104640431B
Authority
CN
China
Prior art keywords
support meanss
substrate
piston
fluid
fluid cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410584661.3A
Other languages
English (en)
Chinese (zh)
Other versions
CN104640431A (zh
Inventor
特里贾尼·米歇尔
罗斯曼·托马斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASMPT GmbH and Co KG
Original Assignee
ASM Assembly Systems GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASM Assembly Systems GmbH and Co KG filed Critical ASM Assembly Systems GmbH and Co KG
Publication of CN104640431A publication Critical patent/CN104640431A/zh
Application granted granted Critical
Publication of CN104640431B publication Critical patent/CN104640431B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201410584661.3A 2013-11-08 2014-10-27 支撑装置、用来支撑待用元件装配的基底的方法及装配机 Active CN104640431B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013112292.2 2013-11-08
DE102013112292.2A DE102013112292B4 (de) 2013-11-08 2013-11-08 Stützvorrichtung und Verfahren zum Abstützen eines mit Bauelementen zu bestückenden Substrates und Bestückungsautomat

Publications (2)

Publication Number Publication Date
CN104640431A CN104640431A (zh) 2015-05-20
CN104640431B true CN104640431B (zh) 2017-10-03

Family

ID=52990798

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410584661.3A Active CN104640431B (zh) 2013-11-08 2014-10-27 支撑装置、用来支撑待用元件装配的基底的方法及装配机

Country Status (2)

Country Link
CN (1) CN104640431B (de)
DE (1) DE102013112292B4 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7264653B2 (ja) * 2019-01-30 2023-04-25 株式会社Fuji 基板処理装置
TWI707740B (zh) 2019-11-26 2020-10-21 財團法人工業技術研究院 可調式工件支撐系統及方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04293300A (ja) * 1991-03-22 1992-10-16 Fuji Mach Mfg Co Ltd プリント基板支持装置
US5984293A (en) * 1997-06-25 1999-11-16 Mcms, Inc. Apparatus for holding printed circuit board assemblies in manufacturing processes
CN101480117A (zh) * 2006-06-26 2009-07-08 松下电器产业株式会社 部件支撑方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7028391B2 (en) * 2002-06-19 2006-04-18 Speedline Technologies, Inc. Method and apparatus for supporting a substrate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04293300A (ja) * 1991-03-22 1992-10-16 Fuji Mach Mfg Co Ltd プリント基板支持装置
US5984293A (en) * 1997-06-25 1999-11-16 Mcms, Inc. Apparatus for holding printed circuit board assemblies in manufacturing processes
CN101480117A (zh) * 2006-06-26 2009-07-08 松下电器产业株式会社 部件支撑方法

Also Published As

Publication number Publication date
DE102013112292B4 (de) 2016-05-04
DE102013112292A1 (de) 2015-05-13
CN104640431A (zh) 2015-05-20

Similar Documents

Publication Publication Date Title
CN104203579B (zh) 模板印刷机的印刷头
CN104640431B (zh) 支撑装置、用来支撑待用元件装配的基底的方法及装配机
CN105008872B (zh) 将黏性材料分配至基板上的方法及设备
KR102059738B1 (ko) 성형 다이, 수지 성형 장치, 수지 성형 방법 및 수지 성형품의 제조 방법
US4572103A (en) Solder paste dispenser for SMD circuit boards
CN100563921C (zh) 定位治具固定装置
US9162820B2 (en) Conveyor device with improved adhesive properties
Nassar et al. Multi-material 3D printed bendable smart sensing structures
CN101026105A (zh) 树脂密封电子部件的方法
DE60016542T2 (de) Verfahren und Geräte für die Unterfüllung von Halbleitersbauelementen
CN101190429A (zh) 一种高粘度流体微量喷射点胶装置
JP2019501039A (ja) 少なくとも2つの個別制御可能なアクチュエータを有する電子部品封止用のプレス機、アクチュエータセットおよび方法
JP6713194B2 (ja) 包装装置
CN112208054A (zh) 树脂成型装置及树脂成型品的制造方法
CN106040537B (zh) 一种点胶机针头、点胶机及点胶方法
US20150342060A1 (en) Systems for encapsulating a hybrid assembly of electronic components and associated methods
KR20200087291A (ko) 3d 프린터의 노즐 장치 및 이를 이용한 3d 프린터
CN109513574A (zh) 一种点胶机的点胶方法
CN205570695U (zh) 一种四胶头高精度点胶装置
CN109383877A (zh) 抓取设备及其使用方法
CN108760168A (zh) 气密性测试装置
JP2006168256A (ja) 樹脂成形型及び樹脂成形方法
JP2745207B2 (ja) 樹脂封止装置
CN110065191A (zh) 成型模、树脂成型装置及树脂成型品的制造方法
CN211941892U (zh) 一种用于浇口封胶的新型阀针结构

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant