CN104633509A - LED light bar based on glass substrate and production process thereof - Google Patents
LED light bar based on glass substrate and production process thereof Download PDFInfo
- Publication number
- CN104633509A CN104633509A CN201510049117.3A CN201510049117A CN104633509A CN 104633509 A CN104633509 A CN 104633509A CN 201510049117 A CN201510049117 A CN 201510049117A CN 104633509 A CN104633509 A CN 104633509A
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- led lamp
- lamp bar
- glue
- glass substrate
- led
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides an LED light bar based on a glass substrate and a production method of the LED light bar. Silver colloid layers are cured at the two ends of the LED light bar respectively to form two welding areas, and electrode slices made of metal materials are welded to the welding areas. Silver colloid has a conductive effect, so LED wafers can be directly welded to the welding areas composed of the silver colloid through jumpers. On the other hand, the connecting faces of the electrode slices and the welding areas are plated with paste layers, so the electrode slices can be effectively welded to the welding areas. In addition, the width of each electrode slice is larger than that of each welding area, and therefore the electrode slices can be electrically connected with the silver colloid layers after being welded. Accordingly, compared with the prior art, the LED light bar based on the glass substrate has the advantages that the metal electrode slices are adopted to serve as conductive electrodes, so the conductive rate is effectively improved; meanwhile, the LED wafers can be directly welded to the welding areas through the jumpers so that the LED wafers can be electrically connected with the electrode slices, and the silver colloid does not need to be dispensed on the LED wafers, so waste of the LED wafers is avoided, and the cost is effectively saved.
Description
Technical field
The invention relates to LED lamp bar technical field, particularly a kind of LED lamp bar based on glass substrate and production technology thereof.
Background technology
Along with the development of electronic semi-conductor's technology, increasing illumination occasion adopts LED lamp to replace traditional lighting light fixture.Because illumination occasion is varied, the structure of LED lamp is also varied.But basic structure still adopts fixing, packaged LED wafer on substrate, power to make LED wafer luminescence to realize illumination to LED wafer by substrate.The immediate problem that this structure is brought is exactly the restriction that the light that sends of LED wafer can be subject to substrate, and lighting angle is little.But in many illumination occasions, larger light emitting anger is all required to light-emitting component, even require 360 degree of luminescences.Such as publication number is the LED stem stem disclosed in CN 302478047S patent document, its be namely by many small-sized LED lamp tube as wick, formed the ray structure of a class incandescent lamp by these wicks, namely substitute traditional tungsten filament by LED lamp tube.Self-explantory, LED lamp tube must 360 degree of luminous illumination effects that can reach similar tungsten filament, otherwise the luminescence of final whole lamp will be extremely uneven.
To this, the solution adopted in the industry at present substitutes traditional nontransparent substrate with glass substrate, but, traditional electrode (using for carrying out between lamp bar and power supply being energized) is made up of sheet metal, and between sheet metal with glass substrate, be difficult to effective welding, therefore, how arranging electrode is on the glass substrate technological difficulties, and that commonly uses at present has two kinds of technical schemes:
The first on the glass substrate direct plating establishes conductive layer, then LED wafer is welded on conductive layer by wire jumper, although this scheme is comparatively simple, but, all on glass, plating establishes the scheme works of conductive layer all not good at present, be on the one hand can plate at present to be located on glass and the conductive effect of the ideal conductive material of cost and all relatively more general in conjunction with effect, thus cause electrode easily to peel off, and the overall losses of lamp bar is larger.
Its two be in glass surface region plating establish a weld layer, then weld metal electrode slice on weld layer, the conductance of this scheme can significantly improve, but, because weld layer generally adopts nickel dam in this scheme, based on the metallic character of nickel, cannot directly be soldered on nickel dam current general wire jumper (as silver-colored line), namely LED wafer cannot be soldered to weld layer with wire jumper, therefore be merely able to be electrically connected by applying and sintering elargol to realize between LED wafer with metal electrode film, but, because silver slurry has mobility, cause when applying elargol, elargol being also coated with covered with LED wafer (LED wafer is small-sized), thus cause LED wafer because short circuit and cannot be luminous, namely there is LED wafer only to use as conduction, general production business all can by the two LEDs wafer dead shorts at lamp bar two ends to use as conduction, avoid the quality of product uneven, therefore existing structure &processes serious waste LED wafer, product cost is higher.
Summary of the invention
The object of the invention is avoid above-mentioned weak point of the prior art and provide a kind of LED lamp bar based on glass substrate that have employed the electrode slice of metal, make the LED wafer at lamp bar two ends directly can be connected to weld layer by wire jumper by the fixed structure improving its electrode slice, thus avoid on the one hand, to LED wafer waste, guaranteeing that electrode structure can have good conductance on the other hand.The production technology of this LED lamp bar is provided in addition.
The object of the invention is achieved through the following technical solutions:
Provide a kind of LED lamp bar based on glass substrate, comprise the glass substrate of strip, described glass substrate is provided with at least two LEDs wafers, described LED wafer arranged in rows, the two ends of described glass substrate are solidified with elargol layer respectively to form two weld zones, described weld zone is welded with the electrode slice of metal material, the joint face of described electrode slice and weld zone plates to be provided with and helps layer, is all connected by wire jumper between LED wafer with LED wafer, between LED wafer with weld zone.
Wherein, layer is helped to be nickel dam described in.
Wherein, the length of described weld zone is 20-50mm, and width is consistent with the width of described glass substrate.
Wherein, described electrode slice is soldered to described weld zone through tin cream.
Wherein, described glass substrate is provided with the fluorescent adhesive layer covering all LED wafer and wire jumper, described electrode slice is exposed to outside fluorescent adhesive layer.
Wherein, the width of described electrode slice is slightly larger than the width of described weld zone.
A kind of technique for the production of above-mentioned LED lamp bar is also provided, comprises:
Swabbing step: brush a bullion slurry band at the two ends of face glass in blocks respectively, then high-temperature heating is to make silver slurry band sintering with on face glass;
Cutting step: by face glass along starching with described silver the glass substrate being with vertical direction to cut into many strips, described silver slurry band is assigned on every bar glass substrate and forms weld zone;
Welding step: the electrode slice being provided with nickel dam at plated surface applies tin cream, to fit in the weld zone of described glass substrate on described electrode slice and to fix with tool, then welding to make electrode slice be fixed to weld zone by Reflow Soldering;
Die bond step: LED wafer is in a row fixed on the glass substrate;
Bonding wire step: be together in series with wire jumper form lamp string by often arranging LED wafer, with wire jumper, the LED wafer at the two ends of this lamp string is connected to weld zone.
Wherein, in described welding step, described electrode slice be one by the protuberance on the die-cut metallic support of sheet metal.
Wherein, in described cutting step, every bar glass substrate is cut into the wide glass substrate of 0.8-10mm.
Wherein, this technique also comprises a glue step: make facing up of the LED lamp bar treating a glue, the middle part of Glue dripping head is positioned at the top in the front of the LED lamp bar treating a glue, the wing portion of Glue dripping head departs from LED lamp bar with the side making part glue flow to LED lamp bar, Glue dripping head with the LED lamp bar treating a glue along some glue direction relative movement with cloth glue; Toast the glue in LED lamp bar is dried to the LED lamp bar that front cloth glue completes; Make facing up of the LED lamp bar treating a glue, the middle part of Glue dripping head is positioned at the top of the reverse side of the LED lamp bar treating a glue, the wing portion of Glue dripping head departs from LED lamp bar with the side making part glue flow to LED lamp bar, Glue dripping head with the LED lamp bar treating a glue along some glue direction relative movement with cloth glue; Toast the glue in LED lamp bar is dried to the LED lamp bar that reverse side cloth glue completes.
The beneficial effect of the invention: the invention provides a kind of based on the LED lamp bar of glass substrate and the production method of this LED lamp bar, this LED lamp bar is solidified with elargol layer respectively to form two weld zones at two ends, weld zone is welded with the electrode slice of metal material, because elargol can be directly used in welding wire jumper, therefore can LED wafer be directly soldered to by the weld zone that elargol is formed by wire jumper, on the other hand, joint face due to electrode slice and weld zone plates to be provided with and helps layer, therefore, it is possible to effectively electrode slice is welded on weld zone to form electrical connection, therefore, compared with prior art, the invention have employed metal electrode film as conductive electrode, conductance effectively improves, simultaneously, LED wafer with can be soldered to weld zone to realize being electrically connected with electrode slice by wire jumper, without the need to putting elargol in LED wafer, avoid the waste to LED wafer, effectively save cost.
Accompanying drawing explanation
Accompanying drawing is utilized to be described further the invention, but the embodiment in accompanying drawing does not form any restriction to the invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to the following drawings.
Fig. 1 is the structural representation of a kind of LED lamp bar based on glass substrate of the invention.
Fig. 2 is the glass panel structure schematic diagram of swabbing step in production technology.
Fig. 3 is the structural representation of the metallic support of welding step in production technology.
Include in Fig. 1 to Fig. 3:
1---glass substrate, 11---weld zone, 2---electrode slice, 3---LED wafer, 4---face glass, 5---silver slurry band.
Detailed description of the invention
With the following Examples the invention is further described.
The detailed description of the invention of a kind of LED lamp bar based on glass substrate 1 of the invention, as shown in Figure 1, comprise the glass substrate 1 of strip, described glass substrate 1 is provided with row's LED wafer 3, the two ends of described glass substrate 1 are solidified with elargol layer respectively to form two weld zones 11, described weld zone 11 is welded with the electrode slice 2 of metal material, electrode slice 2 and weld zone 11 are through soldering, the width of described electrode slice 2 slightly larger than the width of weld zone 11 so that electrode slice 2 soldering is in weld zone 11, and electrode slice 2 plates with the joint face of weld zone 11 nickel dam established as helping layer, between LED wafer 3 and LED wafer 3, all be connected by wire jumper between LED wafer 3 with weld zone 11, described glass substrate 1 is provided with the fluorescent adhesive layer covering all LED wafer 3 and wire jumper, described electrode slice 2 is exposed to outside fluorescent adhesive layer.
Wherein, the length of described weld zone 11 is 20-50mm, and width is consistent with the width of described glass substrate 1.
The production technology of above-mentioned LED lamp bar is as follows:
Swabbing step: as shown in Figure 2, brushes a bullion slurry band 5 respectively at the two ends of face glass 4 in blocks, then high-temperature heating is sintered on face glass 4 to make silver slurry band 5;
Cutting step: face glass 4 is starched along with described silver the glass substrate 1 that the vertical direction of band 5 cuts into many wide strips of 0.8-10mm, described silver slurry band 5 is assigned to the elargol layer every bar glass substrate 1 formed on weld zone 11;
Welding step: as shown in Figure 3, on the metallic support die-cut by sheet metal, shaping protuberance is to form electrode slice 2, electrode slice 2 plated surface is provided with nickel dam, electrode slice 2 applies tin cream, described glass substrate 1 is conformed on metallic support one by one, make glass substrate weld zone 11 fit on described electrode slice 2, with tool fixing glass substrate 1 and metallic support, then by Reflow Soldering welding make electrode slice 2 be fixed to weld zone 11;
Die bond step: LED wafer 3 is in a row fixed on glass substrate 1;
Bonding wire step: be together in series with wire jumper form lamp string by often arranging LED wafer 3, with wire jumper, the LED wafer 3 at the two ends of this lamp string is connected to weld zone 11.
Point glue step: employing viscosity is that the glue of 30000-45000mP.s carries out a glue, make facing up of the LED lamp bar treating a glue, the middle part of Glue dripping head is positioned at the top in the front of the LED lamp bar treating a glue, the wing portion of Glue dripping head departs from LED lamp bar with the side making part glue flow to LED lamp bar, Glue dripping head with the LED lamp bar treating a glue along some glue direction relative movement with cloth glue; Toast the glue in LED lamp bar is dried to the LED lamp bar that front cloth glue completes; Make facing up of the LED lamp bar treating a glue, the middle part of Glue dripping head is positioned at the top of the reverse side of the LED lamp bar treating a glue, the wing portion of Glue dripping head departs from LED lamp bar with the side making part glue flow to LED lamp bar, Glue dripping head with the LED lamp bar treating a glue along some glue direction relative movement with cloth glue; Toast the glue in LED lamp bar is dried to the LED lamp bar that reverse side cloth glue completes.The viscosity of this method Reasonable adjustment glue, make glue can hang over the side of LED lamp bar until dried within the regular hour, therefore, adopt this dispensing method, after to the obverse and reverse point glue of LED lamp bar, also nature is coated by glue in the side of LED lamp bar, without the need to independent again, a glue is carried out to side, effectively decrease the technological process of a glue, improve a glue efficiency, reduce some glue cost.
This technology is solidified with elargol layer respectively to form two weld zones 11 at two ends, weld zone 11 is welded with the electrode slice 2 of metal material, compared to nickel dam, elargol can directly weld with wire jumper, therefore LED wafer 3 directly can be soldered to by wire jumper on the weld zone 11 be made up of elargol, on the other hand, layer is helped because electrode slice 2 plates to be provided with the joint face of weld zone 11, therefore, it is possible to effective, electrode slice 2 is welded to be formed on weld zone 11 and with elargol layer and is electrically connected, compared with prior art, the invention have employed metal electrode film 2 as conductive electrode, conductance effectively improves, simultaneously, LED wafer 3 with can be soldered to weld zone 11 to realize being electrically connected with electrode slice 2 by wire jumper, without the need to putting elargol in LED wafer 3, avoid the waste to LED wafer 3, effectively save cost.
Finally should be noted that; above embodiment is only in order to illustrate the technical scheme of the invention; but not the restriction to the invention protection domain; although done to explain to the invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to the technical scheme of the invention or equivalent replacement, and not depart from essence and the scope of the invention technical scheme.
Claims (10)
1. the LED lamp bar based on glass substrate, comprise the glass substrate of strip, described glass substrate is provided with at least two LEDs wafers, described LED wafer arranged in rows, it is characterized in that: the two ends of described glass substrate are solidified with elargol layer respectively to form two weld zones, described weld zone is welded with the electrode slice of metal material, the joint face of described electrode slice and weld zone plates to be provided with and helps layer, the width of described electrode slice, slightly larger than the width of described weld zone, is all connected by wire jumper between LED wafer with LED wafer, between LED wafer with weld zone.
2. a kind of LED lamp bar based on glass substrate as claimed in claim 1, is characterized in that: described in help layer to be nickel dam.
3. a kind of LED lamp bar based on glass substrate as claimed in claim 1, is characterized in that: the length of described weld zone is 20-50mm, and width is consistent with the width of described glass substrate.
4. a kind of LED lamp bar based on glass substrate as claimed in claim 1, is characterized in that: described electrode slice is soldered to described weld zone through tin cream.
5. a kind of LED lamp bar based on glass substrate as claimed in claim 1, is characterized in that: described glass substrate is provided with the fluorescent adhesive layer covering all LED wafer and wire jumper, described electrode slice completely/partial denudation is outside fluorescent adhesive layer.
6. a kind of LED lamp bar based on glass substrate as claimed in claim 1, is characterized in that: the width of described electrode slice is slightly larger than the width of described weld zone.
7., for the production of a technique for the such as LED lamp bar of claim 1-6 any one, it is characterized in that comprising:
Swabbing step: brush a bullion slurry band at the two ends of face glass in blocks respectively, then high-temperature heating is to make silver slurry band sintering with on face glass;
Cutting step: by face glass along starching with described silver the glass substrate being with vertical direction to cut into many strips, described silver slurry band is assigned on every bar glass substrate and forms weld zone;
Welding step: the electrode slice being provided with nickel dam at plated surface applies tin cream, to fit in the weld zone of described glass substrate on described electrode slice and to fix with tool, then welding to make electrode slice be fixed to weld zone by Reflow Soldering;
Die bond step: LED wafer is in a row fixed on the glass substrate;
Bonding wire step: be together in series with wire jumper form lamp string by often arranging LED wafer, with wire jumper, the LED wafer at the two ends of this lamp string is connected to weld zone.
8. a kind of LED lamp bar production technology as claimed in claim 7, is characterized in that: in described welding step, described electrode slice be one by the protuberance on the die-cut metallic support of sheet metal.
9. a kind of LED lamp bar production technology as claimed in claim 7, is characterized in that: in described cutting step, every bar glass substrate is cut into the wide glass substrate of 0.8-10mm.
10. a kind of LED lamp bar production technology as claimed in claim 7, characterized by further comprising a glue step: make facing up of the LED lamp bar treating a glue, the middle part of Glue dripping head is positioned at the top in the front of the LED lamp bar treating a glue, the wing portion of Glue dripping head departs from LED lamp bar with the side making part glue flow to LED lamp bar, Glue dripping head with the LED lamp bar treating a glue along some glue direction relative movement with cloth glue; Toast the glue in LED lamp bar is dried to the LED lamp bar that front cloth glue completes; Make facing up of the LED lamp bar treating a glue, the middle part of Glue dripping head is positioned at the top of the reverse side of the LED lamp bar treating a glue, the wing portion of Glue dripping head departs from LED lamp bar with the side making part glue flow to LED lamp bar, Glue dripping head with the LED lamp bar treating a glue along some glue direction relative movement with cloth glue; Toast the glue in LED lamp bar is dried to the LED lamp bar that reverse side cloth glue completes.
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| CN201510049117.3A CN104633509B (en) | 2015-01-30 | 2015-01-30 | A kind of LED light bar and its production technology based on glass substrate |
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| CN201510049117.3A CN104633509B (en) | 2015-01-30 | 2015-01-30 | A kind of LED light bar and its production technology based on glass substrate |
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| CN104633509A true CN104633509A (en) | 2015-05-20 |
| CN104633509B CN104633509B (en) | 2017-07-18 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244431A (en) * | 2015-10-30 | 2016-01-13 | 木林森股份有限公司 | Convenient-to-manufacture LED filament, manufacturing process of LED filament, and device |
| CN108735876A (en) * | 2018-08-17 | 2018-11-02 | 深圳市致竑光电有限公司 | The production method and fluorescent glass of fluorescent glass |
| CN116772131A (en) * | 2023-06-26 | 2023-09-19 | 惠科股份有限公司 | Lamp panel, manufacturing method of lamp panel and display device |
| CN118167980A (en) * | 2024-04-12 | 2024-06-11 | 重庆惠科金渝光电科技有限公司 | Light-emitting substrate, forming method of lamp strip and display device |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201196404Y (en) * | 2008-04-08 | 2009-02-18 | 山巨科技股份有限公司 | Radiating structure of LED |
| US20100110679A1 (en) * | 2008-11-04 | 2010-05-06 | Advanced Optoelectronic Technology Inc. | Light emitting diode light module and optical engine thereof |
| CN102109115A (en) * | 2010-12-29 | 2011-06-29 | 葛世潮 | P-N junction 4pi light emitting high-voltage light emitting diode (LED) and LED lamp bulb |
| CN201944605U (en) * | 2010-12-29 | 2011-08-24 | 葛世潮 | LED (light-emitting diode) bulb formed by P-N junction 4 pai light extraction high-voltage LED |
| US20120194068A1 (en) * | 2011-01-31 | 2012-08-02 | Lite-On Technology Corp. | Lamp having light sensor |
| CN203757475U (en) * | 2014-01-22 | 2014-08-06 | 江苏宏力光电科技有限公司 | 3D lighting based colorful LED (Light Emitting Diode) light bar |
| CN203757474U (en) * | 2014-01-22 | 2014-08-06 | 江苏宏力光电科技有限公司 | 3D lighting based white-light LED (Light Emitting Diode) light bar |
| CN204403893U (en) * | 2015-01-30 | 2015-06-17 | 木林森股份有限公司 | A kind of LED lamp bar based on glass substrate |
-
2015
- 2015-01-30 CN CN201510049117.3A patent/CN104633509B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201196404Y (en) * | 2008-04-08 | 2009-02-18 | 山巨科技股份有限公司 | Radiating structure of LED |
| US20100110679A1 (en) * | 2008-11-04 | 2010-05-06 | Advanced Optoelectronic Technology Inc. | Light emitting diode light module and optical engine thereof |
| CN102109115A (en) * | 2010-12-29 | 2011-06-29 | 葛世潮 | P-N junction 4pi light emitting high-voltage light emitting diode (LED) and LED lamp bulb |
| CN201944605U (en) * | 2010-12-29 | 2011-08-24 | 葛世潮 | LED (light-emitting diode) bulb formed by P-N junction 4 pai light extraction high-voltage LED |
| US20120194068A1 (en) * | 2011-01-31 | 2012-08-02 | Lite-On Technology Corp. | Lamp having light sensor |
| CN203757475U (en) * | 2014-01-22 | 2014-08-06 | 江苏宏力光电科技有限公司 | 3D lighting based colorful LED (Light Emitting Diode) light bar |
| CN203757474U (en) * | 2014-01-22 | 2014-08-06 | 江苏宏力光电科技有限公司 | 3D lighting based white-light LED (Light Emitting Diode) light bar |
| CN204403893U (en) * | 2015-01-30 | 2015-06-17 | 木林森股份有限公司 | A kind of LED lamp bar based on glass substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105244431A (en) * | 2015-10-30 | 2016-01-13 | 木林森股份有限公司 | Convenient-to-manufacture LED filament, manufacturing process of LED filament, and device |
| CN108735876A (en) * | 2018-08-17 | 2018-11-02 | 深圳市致竑光电有限公司 | The production method and fluorescent glass of fluorescent glass |
| CN116772131A (en) * | 2023-06-26 | 2023-09-19 | 惠科股份有限公司 | Lamp panel, manufacturing method of lamp panel and display device |
| CN116772131B (en) * | 2023-06-26 | 2024-08-23 | 惠科股份有限公司 | Lamp panel, manufacturing method of lamp panel and display device |
| CN118167980A (en) * | 2024-04-12 | 2024-06-11 | 重庆惠科金渝光电科技有限公司 | Light-emitting substrate, forming method of lamp strip and display device |
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| CN104633509B (en) | 2017-07-18 |
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