CN108735876A - The production method and fluorescent glass of fluorescent glass - Google Patents
The production method and fluorescent glass of fluorescent glass Download PDFInfo
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- CN108735876A CN108735876A CN201810940237.6A CN201810940237A CN108735876A CN 108735876 A CN108735876 A CN 108735876A CN 201810940237 A CN201810940237 A CN 201810940237A CN 108735876 A CN108735876 A CN 108735876A
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- fluorescent
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- adhesive layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a kind of production method of fluorescent glass and fluorescent glasses, wherein fluorescent glass includes electro-conductive glass, LED wafer and fluorescent adhesive layer, light transmitting electro-conductive circuit is etched on an at least surface for electro-conductive glass, LED wafer is arranged in the die bond position of light transmitting electro-conductive circuit, the positive and negative anodes of LED wafer are electrically connected with the positive and negative anodes of light transmitting electro-conductive circuit respectively by metal leg, and fluorescent adhesive layer is arranged on the surface of electro-conductive glass and covers LED wafer.The present invention will be directly arranged without the LED light of frame and bottom on electro-conductive glass, and the prior art is will to be directly arranged on electro-conductive glass with the LED light of frame and bottom, production method and structure are different, The present invention reduces the structures of LED light, keep its simple in structure, and frame and bottom will not block light, increase light transmittance；LED wafer shines around in the present invention, increases the light emitting region of LED wafer, has many advantages, such as that simple in structure, at low cost, light transmittance is high, illumination effect is more preferable and improves aesthetics.
Description
Technical field
The present invention relates to luminescent glass technique fields, the production method more particularly, to a kind of fluorescent glass and luminous glass
Glass.
Background technology
LED fluorescent glasses are exactly the organic combination of luminous energy, electric energy and glass, are to tie LED light source and the perfect of glass
Product is closed, and breaks through the traditional concept of building and ornament materials.Can be in advance in inside glass layout, and the later stage is complete by DMX
Digital intelligent technology realizes controllable variations, freely controls light and shade and the variation of LED light source.And it is internal then use it is fully transparent
Conducting wire, difference and common wire can't see any circuit in glass surface, therefore and be widely used in showing application etc.
Aspect.
LED fluorescent glasses include electro-conductive glass, light transmitting electro-conductive circuit and LED lamp bead, and light transmitting electro-conductive circuit and LED lamp bead are set
It sets on electro-conductive glass, LED lamp bead has frame and bottom.Since its frame and bottom are lighttight, LED is resulted in this way
Although lamp bead can shine, LED lamp bead is opaque.When LED fluorescent glasses are provided with several LED lamp beads, can be sent out in LED
Several lighttight points are formed on light glass, reduce the light transmittance of LED fluorescent glasses, also further affect the luminous glass of LED
The beauty of glass.
Invention content
In order to overcome the above problem, the present invention to provide a kind of production method and fluorescent glass of fluorescent glass, it is intended to solve
The low problem with aesthetics deficiency of LED fluorescent glasses light transmittance in the prior art.
The present invention a kind of technical solution be：A kind of production method of fluorescent glass is provided, is included the following steps：
Light transmitting electro-conductive circuit is etched on an at least surface for electro-conductive glass；
LED wafer is arranged in the die bond position of the light transmitting electro-conductive circuit, the positive and negative anodes of the LED wafer pass through metal leg
It is electrically connected respectively with the positive and negative anodes of the light transmitting electro-conductive circuit；
Coating covers the fluorescent adhesive layer of the LED wafer and is allowed to cure on the surface of the electro-conductive glass.
As improvement of the present invention, when coating the fluorescent adhesive layer, the surface of the electro-conductive glass is all coated
There is the fluorescent adhesive layer, or surface of the fluorescent adhesive layer coated in the electro-conductive glass is provided with the LED wafer
On position.
As improvement of the present invention, will encapsulate on the fluorescent adhesive layer of transparent configuration setting after hardening；Or it will
After the encapsulation transparent configuration is arranged on the fluorescent adhesive layer, then the fluorescent adhesive layer is cured.
As improvement of the present invention, the LED wafer is LED formal dress chips, using gold thread by the LED formal dress chip
Positive and negative anodes be electrically connected respectively with the corresponding metal leg.
As improvement of the present invention, recessed portion is provided on the die bond position, the LED formal dress chip setting exists
In the recessed portion.
As improvement of the present invention, the LED wafer is LED overlay crystal chips, will be located at LED overlay crystal chips bottom
Positive and negative anodes be electrically connected respectively with the corresponding metal leg.
The present invention another technical solution be：A kind of fluorescent glass, including electro-conductive glass, LED wafer and fluorescence are provided
Glue-line, etches light transmitting electro-conductive circuit on an at least surface for the electro-conductive glass, and the LED wafer setting is led in the light transmission
The positive and negative anodes of the die bond position of electric line, the LED wafer are positive and negative with the light transmitting electro-conductive circuit respectively by metal leg
Pole is electrically connected, and the fluorescent adhesive layer is arranged on the surface of the electro-conductive glass and covers the LED wafer.
As improvement of the present invention, the surface of the electro-conductive glass is all covered with the fluorescent adhesive layer, or by institute
It states fluorescent adhesive layer and is covered in the surface of the electro-conductive glass and be provided on the position of the LED wafer.
As improvement of the present invention, the LED wafer is LED formal dress chips, and the positive and negative anodes of the LED formal dress chip are logical
Gold thread is crossed to be electrically connected with the corresponding metal leg respectively.
As improvement of the present invention, the LED wafer is LED overlay crystal chips, LED overlay crystal chips bottom it is positive and negative
Pole is electrically connected with the corresponding metal leg respectively.
For the present invention since directly LED wafer being arranged in the die bond position of light transmitting electro-conductive circuit, the positive and negative anodes of LED wafer are logical
It crosses metal leg to be electrically connected with the positive and negative anodes of light transmitting electro-conductive circuit respectively, is covered LED wafer using fluorescent adhesive layer；Namely
Say, directly will without the LED light of frame and bottom be arranged on electro-conductive glass, and the prior art be directly will have frame and
The LED light of bottom is arranged on electro-conductive glass, and production method and structure are different, and The present invention reduces the structures of LED light, make it
It is simple in structure, and frame and bottom will not block light, increase light transmittance；In the prior art, the light-emitting surface of LED light is solid
Determine direction, LED wafer shines around in the present invention, increases the light emitting region of LED wafer, has simple in structure, cost
It is low, light transmittance is high, illumination effect is more preferable, easy to use and the advantages that improve aesthetics.
Description of the drawings
Fig. 1 is a kind of flow diagram of production method of fluorescent glass in the present invention.
Fig. 2 is the structural schematic diagram for etching light transmitting electro-conductive circuit in the present invention on electro-conductive glass.
Fig. 3 is that LED wafer is placed on the structural schematic diagram on die bond position in the present invention.
Fig. 4 is that the structural schematic diagram on light transmitting electro-conductive circuit is arranged in metal leg in the present invention.
Fig. 5 is the structural schematic diagram that LED wafer and metal leg are electrically connected by gold thread in the present invention.
Fig. 6 is a kind of structural schematic diagram of embodiment of fluorescent glass in the present invention.
Fig. 7 is the structural schematic diagram of another embodiment of fluorescent glass in the present invention.
Fig. 8 is the structural schematic diagram of the third embodiment of fluorescent glass in the present invention.
Fig. 9 is the structural schematic diagram of the 4th kind of embodiment of fluorescent glass in the present invention.
Figure 10 is the structural schematic diagram of the 5th kind of embodiment of fluorescent glass in the present invention.
Figure 11 is the structural schematic diagram of the 6th kind of embodiment of fluorescent glass in the present invention.
Wherein：1, electro-conductive glass；2, light transmitting electro-conductive circuit；3, LED wafer；4, metal leg；41, stage portion；5, gold thread；
6, fluorescent adhesive layer；7, transparent configuration is encapsulated；8, die bond position；9, transparent adhesive-layer.
Specific implementation mode
In the description of the present invention, it is to be understood that, "center" in term, "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of instructions such as " right sides " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of describing this hair
Bright and simplified description, does not indicate or imply the indicated device or component must have a particular orientation, with specific orientation
Construction and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only,
It is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " connects
Connect ", " connected " shall be understood in a broad sense, can also be dismantling connection, or be integrally connected for example, it may be being fixedly connected；It can be with
It is mechanical connection, can also be electrical connection；It can be directly connected, can also be Ke Yishi indirectly connected through an intermediary
The connection of two component internals.For the ordinary skill in the art, above-mentioned term can be understood at this with concrete condition
The concrete meaning of invention.
Refer to Fig. 1, it is a kind of production method of fluorescent glass that Fig. 1 is revealed, is mainly included the following steps：In conduction
Light transmitting electro-conductive circuit is etched on an at least surface for glass；LED wafer is arranged in the die bond position of the light transmitting electro-conductive circuit,
The positive and negative anodes of the LED wafer are electrically connected with the positive and negative anodes of the light transmitting electro-conductive circuit respectively by metal leg；Described
Coating covers the fluorescent adhesive layer of the LED wafer and is allowed to cure on the surface of electro-conductive glass.
One surface of the electro-conductive glass is fabricated to the fluorescent glass to be as follows：
In the method, including step S100, on a surface of electro-conductive glass etch light transmitting electro-conductive circuit.
Further include following steps in above-mentioned steps S100：
S101, the cleaning electro-conductive glass are simultaneously dried, and drying time is preferably 4 to 8 minutes.When it is implemented, described lead
The cleaning of electric glass is carried out by cleaning machine, and the cleaning machine is provided with the nylon brush thread of silk a diameter of 0.05mm to 0.12mm,
Cleaning efficiency for improving the electro-conductive glass while preventing its surface from generating scratch.Because brush filament flexibility is good, elasticity is strong,
Acid and alkali-resistance, heatproof can easily remove the dust on glass surface, and will not cause scratch to surface.
S102, the electro-conductive glass after drying is put into laser etching machine.
The type of S103, as needed processing light transmitting electro-conductive circuit, imports etching program to laser etching machine.
S104, the laser etching machine that etching program is imported by operation etch required saturating in conductive glass surface
Light guide electric line.
Shown in Figure 2, in fig. 2, the light transmitting electro-conductive circuit 2 is arranged on the upper surface of the electro-conductive glass 1,
And the light transmitting electro-conductive circuit 2 is provided with several die bond positions 8, the anode and cathode of the light transmitting electro-conductive circuit 2 are located at
The both sides of the die bond position 8.
In the method, including step S200, LED wafer is arranged on the die bond position of the light transmitting electro-conductive circuit,
The positive and negative anodes of the LED wafer are electrically connected with the positive and negative anodes of the light transmitting electro-conductive circuit respectively by metal leg.It is described solid
The size of brilliant position is greater than or equal to the size of the LED wafer, it should be noted that the LED wafer is that LED formal dress is brilliant
Piece.Further include following steps when specific implementation：
S201, viscose glue will be coated on the die bond position by the first dispenser, is put the LED wafer by automation equipment
It sets on the viscose glue of the die bond position；Alternatively, viscose glue need not be coated on the die bond position, directly set using automation
It is standby that the LED wafer is placed on the die bond position.
When being provided with recessed portion on the die bond position, the LED formal dress chip is arranged in the recessed portion.Tool
Body is implemented as follows：Viscose glue will be coated in the recessed portion by the first dispenser, is put the LED wafer by automation equipment
It sets on the viscose glue in the recessed portion；Alternatively, viscose glue need not be coated on the die bond position, directly set using automation
It is standby that the LED wafer is placed in the recessed portion.
S202, conductive silver glue is coated to the anode and cathode of the light transmitting electro-conductive circuit by the second dispenser.
S203, metal leg is placed on by automation equipment the light transmitting electro-conductive circuit anode and cathode conduction
On elargol predeterminated position.
S204, it will be respectively coated on metal leg, the anode of the LED wafer and cathode position by the second dispenser
Conductive silver glue.
S205, by automation equipment by the both ends of gold thread respectively on metal leg and the anode of the LED wafer
Conductive silver glue connect, by automation equipment by the both ends of gold thread respectively on metal leg and the cathode of the LED wafer
Conductive silver glue connects.
S206, the electro-conductive glass for being equipped with the LED wafer is put into oven or continuous tunnel furnace, and passes through oven or continuous tunnel furnace
Hot setting conductive silver glue, the temperature range of high temperature described herein is between 100 to 180 degrees Celsius.
Fig. 3 to Fig. 5 is referred to, shown in Fig. 3 is that the LED wafer 3 is placed on the die bond position 8, the LED
The both sides of chip 3 and the both sides of the die bond position 8 are spaced a predetermined distance, that is to say, that the LED wafer 3 and the die bond
There are gaps between position 8.Shown in Fig. 4 is that the metal leg 4 is passed through conductive silver glue（It does not draw）It is arranged described
On the anode and cathode of light guide electric line 2, in Figure 5, the LED wafer 3 is LED formal dress chips, will be described using gold thread 5
The anode and cathode of LED wafer 3 distinguish the corresponding metal leg 4 connection.
In the method, including step S300, coating covers the LED wafer on a surface of the electro-conductive glass
Fluorescent adhesive layer simultaneously is allowed to cure.After conductive silver glue solidification, fluorescent glue is fully coated on a surface of the electro-conductive glass
Layer, the thickness of the fluorescent adhesive layer are greater than or equal to the thickness of the LED wafer, and the benefit designed in this way is the fluorescent glue
Layer covers the LED wafer so that the LED wafer, the gold thread and the metal leg are located at the fluorescent adhesive layer
In, it is protected by the fluorescent adhesive layer.Further include following steps when specific implementation：
S301, the one cofferdam jig of periphery setting in the electro-conductive glass, the cofferdam jig are formed on the electro-conductive glass
Temporary space, the LED wafer are arranged in the temporary space.If the quantity of the LED wafer is several, several
The LED wafer is all disposed in the temporary space.
Fluorescent glue is filled in S302, the temporary space in the jig of cofferdam to surround the LED wafer, and makes fluorescence
The surface of glue-line is higher than the light-emitting surface with the LED chips.
S303, the solidification fluorescent adhesive layer, remove the cofferdam jig.For example, by fluorescence by way of being heating and curing
Curable adhesive layer forms protective layer.
Fig. 6 is referred to, in figure 6, coats and is covered described in the LED wafer 3 on a surface of the electro-conductive glass 1
Fluorescent adhesive layer 6, the thickness of the fluorescent adhesive layer 6 are equal to or more than the thickness of the LED chips 3.Coating the fluorescent adhesive layer
When 6, a surface of the electro-conductive glass 1 is fully coated with the fluorescent adhesive layer 6.The LED wafer 3, the gold thread 5 and institute
It states metal leg 4 to be located in the fluorescent adhesive layer 6, be protected by the fluorescent adhesive layer 6.
In the method, it including step S400, will encapsulate on the transparent configuration setting fluorescent adhesive layer after hardening.Institute
It is glass, light-passing plastic or light transmission film to state encapsulation transparent configuration.Since a surface of the electro-conductive glass is fully coated with
The fluorescent adhesive layer, therefore, it may not be necessary to use the encapsulation transparent configuration.When need use the encapsulation transparent configuration
When, it is provided with viscose glue on the surface of the fluorescent adhesive layer, by the encapsulation transparent configuration by paste adhesive in the fluorescence
On the surface of glue-line.Then, pass through the viscose glue that is heating and curing.
Fig. 7 is referred to, in the figure 7, on the fluorescent adhesive layer 6 of encapsulation transparent configuration 7 setting after hardening, is needed
The encapsulation transparent configuration 7 is pasted onto on the surface of the fluorescent adhesive layer 6 using transparent adhesive-layer 9.
The present invention also provides another production method of fluorescent glass, this production method and the production method in Fig. 1 are basic
Identical, identical content refers to Fig. 1 and the above-mentioned explanation content to Fig. 1.Difference is：
Above-mentioned steps S300, S310, the coating covering LED crystalline substances on a surface of the electro-conductive glass are replaced with step S310
The fluorescent adhesive layer of piece simultaneously is allowed to cure.After conductive silver glue solidification, the fluorescent adhesive layer is coated in the one of the electro-conductive glass
Surface is provided on the position of the LED wafer.That is, the fluorescent adhesive layer has only been correspondingly arranged at the LED crystalline substances
The position of piece, and in the other positions for being not provided with the LED wafer, it is not provided with the fluorescent adhesive layer.The fluorescent glue
The thickness of layer is more than the thickness of the LED wafer, and the benefit designed in this way is that the fluorescent adhesive layer covers the LED wafer
Firmly so that the LED wafer, the gold thread and the metal leg are located in the fluorescent adhesive layer, are protected by the fluorescent adhesive layer
It protects.Further include following steps when specific implementation：
Above-mentioned steps S301, S311 are replaced with step S311, in the one chip cofferdam jig of periphery setting of the LED wafer, institute
It states chip cofferdam jig and forms chip temporary space on the electro-conductive glass, the LED wafer, the metal leg and described
Gold thread is arranged in the chip temporary space.If the quantity of the LED wafer is several, on the electro-conductive glass
It is provided with several chip cofferdam jigs, several LED wafers, several metal legs and several gold thread settings
In several chip temporary spaces that several chip cofferdam jigs are formed.
It replaces filling in above-mentioned steps S302, S312, the chip temporary space in the jig of cofferdam with step S312
Fluorescent glue makes the surface of fluorescent adhesive layer higher than the light-emitting surface of the LED chips to surround the LED wafer.That is,
The LED wafer, the metal leg and the gold thread are located in the fluorescent adhesive layer.
Above-mentioned steps S303, S313, the solidification fluorescent adhesive layer are replaced with step S313, removes the cofferdam jig.Example
Such as, fluorescent adhesive layer is formed by curing protective layer by way of being heating and curing, if being provided on the surface of the electro-conductive glass
Do the fluorescent adhesive layer.
In the method, with step S410 replace above-mentioned steps S400, S410, two adjacent fluorescent adhesive layers it
Between space in be coated with transparent adhesive-layer, will encapsulation transparent configuration be arranged on the surface of the fluorescent adhesive layer, it is described transparent
Then the surface mount of adhesive-layer and the encapsulation transparent configuration passes through the transparent adhesive-layer that is heating and curing.The transparent knot of encapsulation
Structure is glass, light-passing plastic or light transmission film, does not introduce how to coat transparent adhesive-layer specifically herein, is coated transparent viscous
Glue-line is a kind of common method, and the present invention does not make improvements, therefore omits here.
The present invention also provides the third production method of fluorescent glass, this production method and above two production method are basic
It is identical, identical content is no longer explained herein, refers to the above.Difference is：The LED is brilliant
Piece is LED overlay crystal chips, will be electrical with the corresponding metal leg respectively positioned at the positive and negative anodes of LED overlay crystal chips bottom
Connection.That is, the gold thread is omitted in the LED overlay crystal chips.It should be noted that the metal leg includes metal
Foot and Gold plated Layer, the Gold plated Layer are plated on the surface of metal leg；Or the metal leg is Gold plated Layer, the Gold plated Layer plating
On the anode and cathode of the light transmitting electro-conductive circuit.The top in the die bond position is arranged in the LED overlay crystal chips, described
The both ends of LED overlay crystal chips are respectively erected on two metal legs.
With step S2051 replace above-mentioned steps S205, S2051, by automation equipment by the LED wafer bottom just
Pole and cathode are connected with the conductive silver glue on the corresponding metal leg respectively.
When using a kind of above-mentioned method making, in step S300, the fluorescent adhesive layer covers the LED wafer,
So that the LED wafer and the metal leg are located in the fluorescent adhesive layer, protected by the fluorescent adhesive layer.
In step s 302, in the temporary space in the jig of cofferdam fill fluorescent glue to surround the LED wafer,
And the surface of fluorescent glue is made at least to be flushed with the light-emitting surface of the LED chips.
When being made using above-mentioned another method, in step S310, the fluorescent adhesive layer covers the LED wafer
Firmly so that the LED wafer and the metal leg are located in the fluorescent adhesive layer, are protected by the fluorescent glue.
In step S311, in the one chip cofferdam jig of periphery setting of the LED wafer, chip cofferdam jig exists
Chip temporary space is formed on the electro-conductive glass, the LED wafer and metal leg setting are temporarily empty in the chip
Between in.If the quantity of the LED wafer is several, it is provided with several chip cofferdam on the electro-conductive glass and controls
Tool, several crystalline substances formed in several chip cofferdam jigs are arranged in several LED wafers, several metal legs
In piece temporary space.
The present invention also provides the 4th kind of production method of fluorescent glass, this production method and above-mentioned three kinds of production methods are basic
It is identical, identical content is no longer explained herein, refers to the above.Difference is：
After the encapsulation transparent configuration is arranged on the fluorescent adhesive layer, then the fluorescent adhesive layer is cured.
Above-mentioned steps S300, S320 are replaced with step S320, are coated described in covering on a surface of the electro-conductive glass
The fluorescent adhesive layer of LED wafer encapsulation transparent configuration is arranged on the fluorescent adhesive layer after uncured, then to described glimmering
Optical cement layer is cured.Further include following steps when specific implementation：
Above-mentioned steps S301, S321 are replaced with step S321, in the periphery of the electro-conductive glass, one cofferdam jig is set, it is described to enclose
Weir jig forms temporary space on the electro-conductive glass, and the LED wafer is arranged in the temporary space.If described
The quantity of LED wafer is several, then several LED wafers are all disposed in the temporary space.
It is replaced filling fluorescence in above-mentioned steps S302, S322, the temporary space in the jig of cofferdam with step S322
Glue makes the surface of fluorescent adhesive layer at least be flushed with the light-emitting surface of the LED chips to surround the LED wafer.
With step S323 replace above-mentioned steps S303, S323, will encapsulation transparent configuration be arranged after uncured it is described glimmering
On optical cement layer, then the fluorescent adhesive layer is cured, removes the cofferdam jig.For example, will be glimmering by way of being heating and curing
Optical cement layer is formed by curing protective layer.
In the present invention, another surface of the electro-conductive glass can be also fabricated to the fluorescent glass, that is to say, that
So that two surfaces of the electro-conductive glass all shine, i.e., two surfaces of the described fluorescent glass all have lighting function.It is described
The production method on another surface of electro-conductive glass is identical as the production method on a surface of the electro-conductive glass, can use above-mentioned
Four kinds of methods are made on another surface of the electro-conductive glass, and another surface of the electro-conductive glass made can also be into
Row shines.No longer it is carried out herein to repeat introduction, detailed content refers to above-mentioned four kinds of production methods.
It should be noted that the LED wafer on two surfaces of the electro-conductive glass shifts to install, i.e., it is described to shine
Two surface dislocation of glass shine.Since the LED wafer on two surfaces of the electro-conductive glass is translucent construction, because
This, the difference that the fluorescent glass of the double-side made in this way shines there is no front and reverse side shines, no matter from described
Which surface observation of fluorescent glass, effect are the same, and illumination effect is good, has been truly realized all-transparent.
The invention also discloses the specific embodiment of fluorescent glass, the specific embodiment of the fluorescent glass is by above-mentioned
Made of four kinds of production methods.
Refer to Fig. 6, it is a kind of embodiment of fluorescent glass that Fig. 6 is revealed, and the fluorescent glass includes electro-conductive glass
1, LED wafer 3 and fluorescent adhesive layer 6 etch light transmitting electro-conductive circuit 2, the LED on an at least surface for the electro-conductive glass 1
Chip 3 is arranged in the die bond position 8 of the light transmitting electro-conductive circuit 2, and the positive and negative anodes of the LED wafer 3 are distinguished by metal leg 4
It is electrically connected with the positive and negative anodes of the light transmitting electro-conductive circuit 2, the fluorescent adhesive layer 6 is arranged on the surface of the electro-conductive glass 1
And cover the LED wafer 3.
In the present embodiment, the shape of the electro-conductive glass 1 can be rectangle, triangle, circle, ellipse, pentagon, six
The geometries such as side shape can also be non-geometrically, and above-mentioned to be merely illustrative, the invention is not limited thereto.The light transmission is led
Electric line 2 is formed by laser ablation on the surface of the electro-conductive glass 1, herein no longer to the light transmitting electro-conductive line
The manufacturing process on road 2 carries out detailed explanation, and detailed content refers to above-mentioned production method.
In the present embodiment, the light transmitting electro-conductive circuit 2 is provided with several die bond positions 8, the light transmitting electro-conductive circuit 2
Anode and cathode are located at the both sides of the die bond position 8.The LED wafer 3 is arranged on the die bond position 8, the die bond
The size of position 8 is more than the size of the LED wafer 3.That is, the both sides of the LED wafer 3 and the die bond position 8
Both sides between be provided with gap.The size of the die bond position 8 is equal to the size of the LED wafer 3, the i.e. LED wafer 3
Both sides and the both sides of the die bond position 8 between it is very close to each other.
In the present embodiment, the metal leg 4 is arranged on the top of the light transmitting electro-conductive circuit 2, and the metal leg 4 exists
The size of the projection size of projection size and the light transmitting electro-conductive circuit 2 on the electro-conductive glass 1 on the electro-conductive glass 1
It is identical.Alternatively, projection size of the metal leg 4 on the electro-conductive glass 1 is more than the light transmitting electro-conductive circuit 2 described
Projection size on electro-conductive glass 1（It does not draw）, i.e. the metal leg 4 protrudes from the light transmitting electro-conductive circuit 2.
In the present embodiment, the LED wafer 3 is LED formal dress chips, and the positive and negative anodes of the LED formal dress chip pass through gold thread 5
Be electrically connected respectively with the corresponding metal leg 4, i.e., described 3 anode of LED wafer and cathode by gold thread 5 respectively with it is corresponding
The metal leg 4 be electrically connected.
In the present embodiment, the surface of the electro-conductive glass 1 is all covered with the fluorescent adhesive layer 6, the fluorescent adhesive layer 6
Thickness is more than the thickness of the LED wafer 3, that is to say, that the surface of the fluorescent adhesive layer 6 is higher than the light extraction of the LED chips
Face.The fluorescent adhesive layer 6 covers the LED wafer 3 so that the LED wafer 3, the gold thread 5 and the metal leg
4 are located in the fluorescent adhesive layer 6, are protected by the fluorescent adhesive layer 6.The size of the fluorescent adhesive layer 6 and the electro-conductive glass 1
Substantially identical big, shape is also essentially identical.
In the present embodiment, a surface of the electro-conductive glass 1 is fabricated to the fluorescent glass, it can also be by the conduction
Another surface of glass 1 is fabricated to the fluorescent glass（It does not draw, this structure may or may not be present）, that is to say, that make
Two surfaces for obtaining the electro-conductive glass 1 all shine, i.e., two surfaces of the described fluorescent glass all have lighting function.It is described to lead
The structure on another surface of electric glass 1 is identical as the structure on a surface of the electro-conductive glass 1, and production method is also identical.
It should be noted that the LED wafer 3 on two surfaces of the electro-conductive glass 1 shifts to install, i.e. the fluorescent glass two
A surface dislocation shines.Since the LED wafer 3 on 1 two surfaces of the electro-conductive glass is translucent construction,
The difference that the fluorescent glass of the double-side made in this way shines there is no front and reverse side shines, no matter it shines from described
Which surface observation of glass, effect are the same, and illumination effect is good, has been truly realized all-transparent.
Refer to Fig. 7, it is another embodiment of fluorescent glass that Fig. 7 is revealed, structure shown in structure and Fig. 6
It is essentially identical, detailed explanation no longer carried out to identical structure herein, particular content refers to Fig. 6 and above-mentioned right
The explanation content of Fig. 6.Different structures is as follows：
Further include encapsulation transparent configuration 7, the encapsulation transparent configuration 7 is arranged on the fluorescent adhesive layer 6.The transparent knot of encapsulation
Structure 7 by transparent adhesive-layer 9 be arranged on the fluorescent adhesive layer 6, the encapsulation transparent configuration 7 be glass, light-passing plastic or
Light transmission film.It should be noted that the encapsulation transparent configuration 7 can be positioned only in 1 one surface of the electro-conductive glass
The fluorescent adhesive layer 6 on；If being also provided with the fluorescent adhesive layer, basis on another surface of the electro-conductive glass 1
It needs, the encapsulation transparent configuration can be provided on the fluorescent adhesive layer on 1 another surface of the electro-conductive glass.Namely
It says, the encapsulation transparent configuration can be provided on the fluorescent adhesive layer on 1 another surface of the electro-conductive glass, it can not also
With the setting encapsulation transparent configuration.
Refer to Fig. 8, it is the third embodiment of fluorescent glass that Fig. 8 is revealed, structure shown in structure and Fig. 6
It is essentially identical, detailed explanation no longer carried out to identical structure herein, particular content refers to Fig. 6 and above-mentioned right
The explanation content of Fig. 6.Different structures is as follows：
In the present embodiment, the metal leg 4 is arranged on the electro-conductive glass 1, the lower surface in described 4 one end of metal leg
On be provided with stage portion 41, the stage portion 41 is arranged on the light transmitting electro-conductive circuit 2.That is, the metal leg 4
It is arranged between the light transmitting electro-conductive circuit 2 and the LED wafer 3, and is electrically connected with the light transmitting electro-conductive circuit 2.
It should be noted that a table of the structure setting of the metal leg 4 in the present embodiment in the electro-conductive glass 1
On face., can be as needed if being also equipped with the metal leg on another surface of the electro-conductive glass 1, it uses
The structure of the metal leg 4 in the present embodiment replaces the structure of already existing conventional metals leg.
Can also include encapsulation transparent configuration in the present embodiment（It does not draw, this structure may or may not be present）, institute
Encapsulation transparent configuration is stated to be arranged on the fluorescent adhesive layer 6.The encapsulation transparent configuration is arranged by transparent adhesive-layer described
On fluorescent adhesive layer 6, the encapsulation transparent configuration is glass, light-passing plastic or light transmission film.It should be noted that the encapsulation
Transparent configuration can be positioned only on the fluorescent adhesive layer 6 on 1 one surface of the electro-conductive glass；If in the conduction
It is also provided with the fluorescent adhesive layer on another surface of glass 1, then as needed, it can be on 1 another surface of the electro-conductive glass
The fluorescent adhesive layer on be provided with the encapsulation transparent configuration.That is, described in 1 another surface of the electro-conductive glass
It can be provided with the encapsulation transparent configuration on fluorescent adhesive layer, can not also use and the encapsulation transparent configuration is set.
Refer to Fig. 9, it is the 4th kind of embodiment of fluorescent glass that Fig. 9 is revealed, structure shown in structure and Fig. 6
It is essentially identical, detailed explanation no longer carried out to identical structure herein, particular content refers to Fig. 6 and above-mentioned right
The explanation content of Fig. 6.Different structures is as follows：
It is provided with recessed portion on the die bond position 8（It does not identify）, the LED wafer 3 is the LED formal dress chip, described
LED formal dress chips are arranged in the recessed portion, and the depth of the recessed portion is less than, greater than or equal to the LED formal dress chip
Thickness.
It should be noted that the recessed portion in the present embodiment is arranged on a surface of the electro-conductive glass 1.If
The LED formal dress chip is also equipped on another surface of the electro-conductive glass 1, then can be as needed, it is led described
It is also equipped with the recessed portion on another surface of electric glass 1.
Further include encapsulation transparent configuration 7 in the present embodiment（This structure may or may not be present）, it is described encapsulation it is transparent
Structure 7 is arranged on the fluorescent adhesive layer 6.The encapsulation transparent configuration 7 is arranged by transparent adhesive-layer 9 in the fluorescent adhesive layer
On 6, the encapsulation transparent configuration 7 is glass, light-passing plastic or light transmission film.It should be noted that the transparent knot of encapsulation
Structure 7 can be positioned only on the fluorescent adhesive layer 6 on 1 one surface of the electro-conductive glass；If in the electro-conductive glass 1
Another surface on be also provided with the fluorescent adhesive layer, can be described in 1 another surface of the electro-conductive glass then as needed
The encapsulation transparent configuration is provided on fluorescent adhesive layer.That is, the fluorescent glue on 1 another surface of the electro-conductive glass
It can be provided with the encapsulation transparent configuration on layer, can not also use and the encapsulation transparent configuration is set.
Refer to Figure 10, it is the 5th kind of embodiment of fluorescent glass that Figure 10 is revealed, is tied shown in structure and Fig. 6
Structure is essentially identical, no longer carries out detailed explanation to identical structure herein, and particular content refers to Fig. 6 and above-mentioned
To the explanation content of Fig. 6.Different structures is as follows：
The LED wafer 3 is LED overlay crystal chips, the positive and negative anodes of LED overlay crystal chips bottom respectively with the corresponding metal
Leg 4 is electrically connected.That is, the gold thread 5 is omitted in the LED overlay crystal chips.It should be noted that the metal welding
Foot 4 includes metal leg（It does not draw）And Gold plated Layer（It does not draw）, the Gold plated Layer is plated on the surface of metal leg；Or the gold
It is Gold plated Layer to belong to leg 4（It does not draw）, the Gold plated Layer be plated in the light transmitting electro-conductive circuit 2 anode and cathode on.And institute
It states LED overlay crystal chips to be arranged in the top of the die bond position 8, the both ends of the LED overlay crystal chips are respectively erected in two institutes
It states on metal leg 4.
In the present embodiment, the LED overlay crystal chips are arranged on a surface of the electro-conductive glass 1.If led described
The LED overlay crystal chips or the LED formal dress chip, the structure being specifically arranged are provided on another surface of electric glass 1 to join
See shown in above-mentioned Fig. 6 to Figure 10.
In the present embodiment, the surface of the fluorescent adhesive layer 6 can flush or described with the light-emitting surface of the LED chips
The surface of fluorescent adhesive layer 6 is higher than the light-emitting surface of the LED chips.
Can also include encapsulation transparent configuration in the present embodiment（It does not draw, this structure may or may not be present）, institute
Encapsulation transparent configuration is stated to be arranged on the fluorescent adhesive layer 6.The encapsulation transparent configuration is arranged by transparent adhesive-layer described
On fluorescent adhesive layer 6, the encapsulation transparent configuration is glass, light-passing plastic or light transmission film.It should be noted that the encapsulation
Transparent configuration can be positioned only on the fluorescent adhesive layer 6 on 1 one surface of the electro-conductive glass；If in the conduction
It is also provided with the fluorescent adhesive layer on another surface of glass 1, then as needed, it can be on 1 another surface of the electro-conductive glass
The fluorescent adhesive layer on be provided with the encapsulation transparent configuration.That is, described in 1 another surface of the electro-conductive glass
It can be provided with the encapsulation transparent configuration on fluorescent adhesive layer, can not also use and the encapsulation transparent configuration is set.
Refer to Figure 11, it is the 6th kind of embodiment of fluorescent glass that Figure 11 is revealed, shown in structure and Figure 10
Structure is essentially identical, no longer carries out detailed explanation to identical structure herein, particular content refer to Figure 10 and
The above-mentioned explanation content to Figure 10.Different structures is as follows：
The surface that the fluorescent adhesive layer 6 is covered in the electro-conductive glass 1 is provided on the position of the LED wafer 3, that is,
It says, the fluorescent adhesive layer 6 is only correspondingly arranged at the position of the LED wafer 3, and is being not provided with the LED wafer 3
In other positions, it is not provided with the fluorescent adhesive layer 6, and transparent adhesive-layer 9 is set.The LED wafer 3 is LED overlay crystal chips,
The thickness of the fluorescent adhesive layer 6 is equal to the thickness of the LED wafer 3, and the thickness of the fluorescent adhesive layer 6 can also be more than described
The thickness of LED wafer 3（It does not draw）.The benefit designed in this way is that the fluorescent adhesive layer 6 covers the LED wafer 3, makes
It obtains the LED wafer 3 and the metal leg 4 is located in the fluorescent adhesive layer 6, protected by the fluorescent adhesive layer 6.
Can also include encapsulation transparent configuration in the present embodiment（It does not draw, this structure may or may not be present）, institute
Encapsulation transparent configuration is stated to be arranged on the fluorescent adhesive layer 6 and the transparent adhesive-layer 9.The encapsulation transparent configuration passes through transparent
Adhesive-layer 9 is arranged on the fluorescent adhesive layer 6, and the encapsulation transparent configuration is glass, light-passing plastic or light transmission film.It needs
Illustrate, the encapsulation transparent configuration can be positioned only in the fluorescent adhesive layer 6 on 1 one surface of the electro-conductive glass
On；It, as needed, can be described if being also provided with the fluorescent adhesive layer on another surface of the electro-conductive glass 1
It is provided with the encapsulation transparent configuration on the fluorescent adhesive layer on 1 another surface of electro-conductive glass.That is, in the conductive glass
It can be provided with the encapsulation transparent configuration on the fluorescent adhesive layer on 1 another surface of glass, can not also use and the encapsulation is set
Transparent configuration.
For the present invention since directly the LED wafer being arranged in the die bond position of the light transmitting electro-conductive circuit, the LED is brilliant
The positive and negative anodes of piece are electrically connected with the positive and negative anodes of the light transmitting electro-conductive circuit respectively by metal leg, use the fluorescent adhesive layer
The LED wafer is covered；That is, will directly be arranged on the electro-conductive glass without the LED light of frame and bottom,
And the prior art is will to be directly arranged on the electro-conductive glass with the LED light of frame and bottom, production method and structure are not
Equally, The present invention reduces the structure of LED light, keep its simple in structure, and frame and bottom will not block light, increase
Light rate；In the prior art, the light-emitting surface of LED light is fixed-direction, and heretofore described LED wafer shines around, is increased
The light emitting region of the LED wafer, have simple in structure, at low cost, light transmittance is high, illumination effect is more preferable, it is easy to use and
The advantages that improving aesthetics.
It should be noted that explaining in detail for the respective embodiments described above, purpose, which is only that, solves the present invention
Release, in order to be able to preferably explain the present invention, still, these description cannot with any explanation at be to the present invention limit
System, in particular, each feature described in various embodiments mutually can also be combined arbitrarily, to form other implementations
Mode, in addition to there is clearly opposite description, these features should be understood to can be applied in any one embodiment, and simultaneously
It is not only limited to described embodiment.
Claims (10)
1. a kind of production method of fluorescent glass, which is characterized in that include the following steps：
Light transmitting electro-conductive circuit is etched on an at least surface for electro-conductive glass；
LED wafer is arranged in the die bond position of the light transmitting electro-conductive circuit, the positive and negative anodes of the LED wafer pass through metal leg
It is electrically connected respectively with the positive and negative anodes of the light transmitting electro-conductive circuit；
Coating covers the fluorescent adhesive layer of the LED wafer and is allowed to cure on the surface of the electro-conductive glass.
2. the production method of fluorescent glass according to claim 1, it is characterised in that：When coating the fluorescent adhesive layer,
The surface of the electro-conductive glass is fully coated with the fluorescent adhesive layer, or the fluorescent adhesive layer is coated in the conductive glass
The surface of glass is provided on the position of the LED wafer.
3. the production method of fluorescent glass according to claim 1 or 2, it is characterised in that：It will encapsulation transparent configuration setting
On the fluorescent adhesive layer after hardening；Or after the encapsulation transparent configuration is arranged on the fluorescent adhesive layer, then to institute
Fluorescent adhesive layer is stated to be cured.
4. the production method of fluorescent glass according to claim 1 or 2, it is characterised in that：The LED wafer be LED just
Chip is filled, is electrically connected the positive and negative anodes of the LED formal dress chip with the corresponding metal leg respectively using gold thread.
5. the production method of fluorescent glass according to claim 4, it is characterised in that：It is provided on the die bond position
Recessed portion, the LED formal dress chip are arranged in the recessed portion.
6. the production method of fluorescent glass according to claim 1 or 2, it is characterised in that：The LED wafer is that LED covers
Jingjing piece will be electrically connected with the corresponding metal leg respectively positioned at the positive and negative anodes of LED overlay crystal chips bottom.
7. a kind of fluorescent glass, which is characterized in that including electro-conductive glass, LED wafer and fluorescent adhesive layer, in the electro-conductive glass
Light transmitting electro-conductive circuit is etched on an at least surface, the LED wafer is arranged in the die bond position of the light transmitting electro-conductive circuit, described
The positive and negative anodes of LED wafer are electrically connected with the positive and negative anodes of the light transmitting electro-conductive circuit respectively by metal leg, the fluorescent glue
Layer is arranged on the surface of the electro-conductive glass and covers the LED wafer.
8. fluorescent glass according to claim 7, it is characterised in that：The surface of the electro-conductive glass is all covered with described
Fluorescent adhesive layer, or the fluorescent adhesive layer is covered in the surface of the electro-conductive glass and is provided on the position of the LED wafer.
9. fluorescent glass according to claim 7 or 8, it is characterised in that：The LED wafer is LED formal dress chips, described
The positive and negative anodes of LED formal dress chips are electrically connected with the corresponding metal leg respectively by gold thread.
10. fluorescent glass according to claim 7 or 8, it is characterised in that：The LED wafer is LED overlay crystal chips, institute
The positive and negative anodes for stating LED overlay crystal chips bottom are electrically connected with the corresponding metal leg respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810940237.6A CN108735876A (en) | 2018-08-17 | 2018-08-17 | The production method and fluorescent glass of fluorescent glass |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810940237.6A CN108735876A (en) | 2018-08-17 | 2018-08-17 | The production method and fluorescent glass of fluorescent glass |
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Cited By (1)
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