CN104604340B - 用于制造柔性电路的方法 - Google Patents

用于制造柔性电路的方法 Download PDF

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Publication number
CN104604340B
CN104604340B CN201280075644.6A CN201280075644A CN104604340B CN 104604340 B CN104604340 B CN 104604340B CN 201280075644 A CN201280075644 A CN 201280075644A CN 104604340 B CN104604340 B CN 104604340B
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CN
China
Prior art keywords
fabric
single line
metal
laser
laser beam
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CN201280075644.6A
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English (en)
Chinese (zh)
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CN104604340A (zh
Inventor
保罗·卡诺尼卡
卡尔米内·卢奇尼亚诺
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SAATI SpA
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SAATI SpA
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Classifications

    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06Q—DECORATING TEXTILES
    • D06Q1/00—Decorating textiles
    • D06Q1/04—Decorating textiles by metallising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
    • D06M10/005—Laser beam treatment
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
    • D06M23/16—Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Decoration Of Textiles (AREA)
  • Knitting Of Fabric (AREA)
CN201280075644.6A 2012-09-06 2012-09-06 用于制造柔性电路的方法 Active CN104604340B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2012/001724 WO2014037755A1 (en) 2012-09-06 2012-09-06 Method for making flexible circuits

Publications (2)

Publication Number Publication Date
CN104604340A CN104604340A (zh) 2015-05-06
CN104604340B true CN104604340B (zh) 2018-04-10

Family

ID=47146448

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280075644.6A Active CN104604340B (zh) 2012-09-06 2012-09-06 用于制造柔性电路的方法

Country Status (12)

Country Link
US (1) US10173284B2 (pl)
EP (1) EP2893781B1 (pl)
JP (1) JP6179046B2 (pl)
KR (1) KR102030224B1 (pl)
CN (1) CN104604340B (pl)
DK (1) DK2893781T3 (pl)
ES (1) ES2881275T3 (pl)
HK (1) HK1209563A1 (pl)
IN (1) IN2015DN01413A (pl)
PL (1) PL2893781T3 (pl)
PT (1) PT2893781T (pl)
WO (1) WO2014037755A1 (pl)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9773711B2 (en) 2014-12-01 2017-09-26 Industrial Technology Research Institute Picking-up and placing process for electronic devices and electronic module
US9883583B2 (en) * 2015-09-02 2018-01-30 Apple Inc. Fabric signal path structures for flexible devices
US9997305B2 (en) 2015-09-03 2018-06-12 Apple Inc. Laser processing of fabric for electronic devices
CN105611725B (zh) * 2016-02-02 2019-07-26 中特银佳盟科技有限公司 智能超轻超薄可揉折电子元器件及其制备方法
TWI565382B (zh) * 2016-02-05 2017-01-01 財團法人工業技術研究院 電子元件的轉移方法、電子模組及光電裝置
DE102017108580A1 (de) * 2017-04-21 2018-10-25 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauteil und Gewebe
PL3662676T3 (pl) 2017-08-01 2024-03-18 Saati S.P.A. Komponent do odprowadzania wody z głośników wodoszczelnego urządzenia elektronicznego
CN108517696B (zh) * 2018-05-14 2020-05-05 东南大学 一种图案化柔性导电石墨烯布的制备方法
TWI684491B (zh) * 2019-05-02 2020-02-11 雷科股份有限公司 雷射蝕薄銅線圈的方法
CN111968854B (zh) * 2019-05-20 2022-07-01 雷科股份有限公司 激光蚀薄铜线圈的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102245827A (zh) * 2008-11-13 2011-11-16 赛法股份公司 织物，含织物的设备和织物制造方法

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DE3116348A1 (de) * 1980-04-28 1982-09-09 Deutsche Itt Industries Gmbh, 7800 Freiburg "elektrische verbindungseinrichtung"
AU597290B2 (en) * 1985-11-14 1990-05-31 Deutsches Textilforschungszentrum Nord-West E.V. Microstructured fibre, filament and yarn
JPH09285883A (ja) * 1996-04-23 1997-11-04 Nec Tohoku Ltd オンラインでの接点洗浄工法
JPH11350350A (ja) * 1998-06-02 1999-12-21 Teijin Ltd ポリエステル繊維布帛の模様付与方法
JP2000273762A (ja) * 1999-03-26 2000-10-03 Teijin Ltd 電磁波シールド材料用基布及びそれを用いた電磁波シールド材料
JP2007184457A (ja) * 2006-01-10 2007-07-19 Murata Mfg Co Ltd 回路構成用の基板およびそれを用いた電子部品
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
US20090061112A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by subtractive deposition
US8007904B2 (en) 2008-01-11 2011-08-30 Fiber Innovation Technology, Inc. Metal-coated fiber
US20100118243A1 (en) * 2008-11-12 2010-05-13 Debasis Majumdar Polymeric conductive donor and transfer method
CH700111B1 (fr) * 2009-09-25 2010-06-30 Agie Sa Machine d'usinage par laser.
JP5550878B2 (ja) * 2009-10-01 2014-07-16 セーレン株式会社 レーザー照射による加工方法
EP2461658A1 (en) * 2010-12-03 2012-06-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102245827A (zh) * 2008-11-13 2011-11-16 赛法股份公司 织物，含织物的设备和织物制造方法

Also Published As

Publication number Publication date
EP2893781B1 (en) 2021-05-12
CN104604340A (zh) 2015-05-06
US10173284B2 (en) 2019-01-08
KR102030224B1 (ko) 2019-10-08
DK2893781T3 (da) 2021-07-26
PL2893781T3 (pl) 2021-10-04
JP6179046B2 (ja) 2017-08-16
EP2893781A1 (en) 2015-07-15
PT2893781T (pt) 2021-07-09
JP2015536038A (ja) 2015-12-17
KR20150052034A (ko) 2015-05-13
HK1209563A1 (en) 2016-04-01
WO2014037755A1 (en) 2014-03-13
ES2881275T3 (es) 2021-11-29
US20150217406A1 (en) 2015-08-06
IN2015DN01413A (pl) 2015-07-03

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