PL2893781T3 - Sposób wykonywania giętkich obwodów - Google Patents

Sposób wykonywania giętkich obwodów

Info

Publication number
PL2893781T3
PL2893781T3 PL12783655T PL12783655T PL2893781T3 PL 2893781 T3 PL2893781 T3 PL 2893781T3 PL 12783655 T PL12783655 T PL 12783655T PL 12783655 T PL12783655 T PL 12783655T PL 2893781 T3 PL2893781 T3 PL 2893781T3
Authority
PL
Poland
Prior art keywords
flexible circuits
making flexible
making
circuits
flexible
Prior art date
Application number
PL12783655T
Other languages
English (en)
Inventor
Paolo Canonico
Carmine LUCIGNANO
Original Assignee
Saati S.P.A.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saati S.P.A. filed Critical Saati S.P.A.
Publication of PL2893781T3 publication Critical patent/PL2893781T3/pl

Links

Classifications

    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06Q—DECORATING TEXTILES
    • D06Q1/00—Decorating textiles
    • D06Q1/04—Decorating textiles by metallising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
    • D06M10/005—Laser beam treatment
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
    • D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
    • D—TEXTILES; PAPER
    • D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
    • D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
    • D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
    • D06M23/16—Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/038—Textiles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/029—Woven fibrous reinforcement or textile
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Or Physical Treatment Of Fibers (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Knitting Of Fabric (AREA)
  • Decoration Of Textiles (AREA)
  • Laser Beam Processing (AREA)
  • Physical Vapour Deposition (AREA)
PL12783655T 2012-09-06 2012-09-06 Sposób wykonywania giętkich obwodów PL2893781T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/IB2012/001724 WO2014037755A1 (en) 2012-09-06 2012-09-06 Method for making flexible circuits
EP12783655.9A EP2893781B1 (en) 2012-09-06 2012-09-06 Method for making flexible circuits

Publications (1)

Publication Number Publication Date
PL2893781T3 true PL2893781T3 (pl) 2021-10-04

Family

ID=47146448

Family Applications (1)

Application Number Title Priority Date Filing Date
PL12783655T PL2893781T3 (pl) 2012-09-06 2012-09-06 Sposób wykonywania giętkich obwodów

Country Status (12)

Country Link
US (1) US10173284B2 (pl)
EP (1) EP2893781B1 (pl)
JP (1) JP6179046B2 (pl)
KR (1) KR102030224B1 (pl)
CN (1) CN104604340B (pl)
DK (1) DK2893781T3 (pl)
ES (1) ES2881275T3 (pl)
HK (1) HK1209563A1 (pl)
IN (1) IN2015DN01413A (pl)
PL (1) PL2893781T3 (pl)
PT (1) PT2893781T (pl)
WO (1) WO2014037755A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9773711B2 (en) 2014-12-01 2017-09-26 Industrial Technology Research Institute Picking-up and placing process for electronic devices and electronic module
US9883583B2 (en) 2015-09-02 2018-01-30 Apple Inc. Fabric signal path structures for flexible devices
US9997305B2 (en) * 2015-09-03 2018-06-12 Apple Inc. Laser processing of fabric for electronic devices
CN105611725B (zh) * 2016-02-02 2019-07-26 中特银佳盟科技有限公司 智能超轻超薄可揉折电子元器件及其制备方法
TWI565382B (zh) * 2016-02-05 2017-01-01 財團法人工業技術研究院 電子元件的轉移方法、電子模組及光電裝置
DE102017108580A1 (de) * 2017-04-21 2018-10-25 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauteil und Gewebe
KR102379867B1 (ko) * 2017-08-01 2022-03-28 사아티 에스.피.에이. 방수형 전자 장치의 스피커로부터 물을 배출시키기 위한 컴포넌트
CN108517696B (zh) * 2018-05-14 2020-05-05 东南大学 一种图案化柔性导电石墨烯布的制备方法
TWI684491B (zh) * 2019-05-02 2020-02-11 雷科股份有限公司 雷射蝕薄銅線圈的方法
CN111968854B (zh) * 2019-05-20 2022-07-01 雷科股份有限公司 激光蚀薄铜线圈的方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3116348A1 (de) * 1980-04-28 1982-09-09 Deutsche Itt Industries Gmbh, 7800 Freiburg "elektrische verbindungseinrichtung"
EP0245320B1 (de) * 1985-11-14 1991-05-15 Deutsches Textilforschungszentrum Nord-West E.V. Faser, filament, garn und/oder diese bzw. dieses aufweisende flächengebilde und/oder haufwerk sowie verfahren zur herstellung derselben bzw. desselben
JPH09285883A (ja) * 1996-04-23 1997-11-04 Nec Tohoku Ltd オンラインでの接点洗浄工法
JPH11350350A (ja) * 1998-06-02 1999-12-21 Teijin Ltd ポリエステル繊維布帛の模様付与方法
JP2000273762A (ja) * 1999-03-26 2000-10-03 Teijin Ltd 電磁波シールド材料用基布及びそれを用いた電磁波シールド材料
JP2007184457A (ja) * 2006-01-10 2007-07-19 Murata Mfg Co Ltd 回路構成用の基板およびそれを用いた電子部品
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
US20090061112A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by subtractive deposition
US8007904B2 (en) * 2008-01-11 2011-08-30 Fiber Innovation Technology, Inc. Metal-coated fiber
US20100118243A1 (en) * 2008-11-12 2010-05-13 Debasis Majumdar Polymeric conductive donor and transfer method
DE202008017480U1 (de) * 2008-11-13 2010-04-22 Sefar Ag Elektrisch leitend beschichtetes Siebdruckgewebe sowie Siebdruckanordnung
CH700111B1 (fr) * 2009-09-25 2010-06-30 Agie Sa Machine d'usinage par laser.
JP5550878B2 (ja) * 2009-10-01 2014-07-16 セーレン株式会社 レーザー照射による加工方法
EP2461658A1 (en) * 2010-12-03 2012-06-06 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate

Also Published As

Publication number Publication date
CN104604340B (zh) 2018-04-10
US10173284B2 (en) 2019-01-08
DK2893781T3 (da) 2021-07-26
US20150217406A1 (en) 2015-08-06
JP6179046B2 (ja) 2017-08-16
WO2014037755A1 (en) 2014-03-13
EP2893781B1 (en) 2021-05-12
KR102030224B1 (ko) 2019-10-08
ES2881275T3 (es) 2021-11-29
IN2015DN01413A (pl) 2015-07-03
PT2893781T (pt) 2021-07-09
JP2015536038A (ja) 2015-12-17
HK1209563A1 (en) 2016-04-01
CN104604340A (zh) 2015-05-06
KR20150052034A (ko) 2015-05-13
EP2893781A1 (en) 2015-07-15

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