HK1209563A1 - Method for making flexible circuits - Google Patents
Method for making flexible circuitsInfo
- Publication number
- HK1209563A1 HK1209563A1 HK15110132.1A HK15110132A HK1209563A1 HK 1209563 A1 HK1209563 A1 HK 1209563A1 HK 15110132 A HK15110132 A HK 15110132A HK 1209563 A1 HK1209563 A1 HK 1209563A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- flexible circuits
- making flexible
- making
- circuits
- flexible
- Prior art date
Links
Classifications
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06Q—DECORATING TEXTILES
- D06Q1/00—Decorating textiles
- D06Q1/04—Decorating textiles by metallising
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M10/00—Physical treatment of fibres, threads, yarns, fabrics, or fibrous goods made from such materials, e.g. ultrasonic, corona discharge, irradiation, electric currents, or magnetic fields; Physical treatment combined with treatment with chemical compounds or elements
- D06M10/005—Laser beam treatment
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M11/00—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising
- D06M11/83—Treating fibres, threads, yarns, fabrics or fibrous goods made from such materials, with inorganic substances or complexes thereof; Such treatment combined with mechanical treatment, e.g. mercerising with metals; with metal-generating compounds, e.g. metal carbonyls; Reduction of metal compounds on textiles
-
- D—TEXTILES; PAPER
- D06—TREATMENT OF TEXTILES OR THE LIKE; LAUNDERING; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR
- D06M—TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS, FABRICS, FEATHERS OR FIBROUS GOODS MADE FROM SUCH MATERIALS
- D06M23/00—Treatment of fibres, threads, yarns, fabrics or fibrous goods made from such materials, characterised by the process
- D06M23/16—Processes for the non-uniform application of treating agents, e.g. one-sided treatment; Differential treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/038—Textiles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
- Knitting Of Fabric (AREA)
- Decoration Of Textiles (AREA)
- Physical Vapour Deposition (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/IB2012/001724 WO2014037755A1 (en) | 2012-09-06 | 2012-09-06 | Method for making flexible circuits |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1209563A1 true HK1209563A1 (en) | 2016-04-01 |
Family
ID=47146448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15110132.1A HK1209563A1 (en) | 2012-09-06 | 2015-10-15 | Method for making flexible circuits |
Country Status (12)
Country | Link |
---|---|
US (1) | US10173284B2 (xx) |
EP (1) | EP2893781B1 (xx) |
JP (1) | JP6179046B2 (xx) |
KR (1) | KR102030224B1 (xx) |
CN (1) | CN104604340B (xx) |
DK (1) | DK2893781T3 (xx) |
ES (1) | ES2881275T3 (xx) |
HK (1) | HK1209563A1 (xx) |
IN (1) | IN2015DN01413A (xx) |
PL (1) | PL2893781T3 (xx) |
PT (1) | PT2893781T (xx) |
WO (1) | WO2014037755A1 (xx) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9773711B2 (en) | 2014-12-01 | 2017-09-26 | Industrial Technology Research Institute | Picking-up and placing process for electronic devices and electronic module |
US9883583B2 (en) * | 2015-09-02 | 2018-01-30 | Apple Inc. | Fabric signal path structures for flexible devices |
US9997305B2 (en) | 2015-09-03 | 2018-06-12 | Apple Inc. | Laser processing of fabric for electronic devices |
CN105611725B (zh) * | 2016-02-02 | 2019-07-26 | 中特银佳盟科技有限公司 | 智能超轻超薄可揉折电子元器件及其制备方法 |
CN107046004B (zh) * | 2016-02-05 | 2020-04-21 | 财团法人工业技术研究院 | 电子元件的转移方法及电子模块 |
DE102017108580A1 (de) * | 2017-04-21 | 2018-10-25 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauteil und Gewebe |
FI3662676T3 (fi) | 2017-08-01 | 2024-01-16 | Saati Spa | Komponentti veden poistamiseen vesitiiviin elektroniikkalaitteen kaiuttimista |
CN108517696B (zh) * | 2018-05-14 | 2020-05-05 | 东南大学 | 一种图案化柔性导电石墨烯布的制备方法 |
TWI684491B (zh) * | 2019-05-02 | 2020-02-11 | 雷科股份有限公司 | 雷射蝕薄銅線圈的方法 |
CN111968854B (zh) * | 2019-05-20 | 2022-07-01 | 雷科股份有限公司 | 激光蚀薄铜线圈的方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3116348A1 (de) * | 1980-04-28 | 1982-09-09 | Deutsche Itt Industries Gmbh, 7800 Freiburg | "elektrische verbindungseinrichtung" |
AU597290B2 (en) * | 1985-11-14 | 1990-05-31 | Deutsches Textilforschungszentrum Nord-West E.V. | Microstructured fibre, filament and yarn |
JPH09285883A (ja) * | 1996-04-23 | 1997-11-04 | Nec Tohoku Ltd | オンラインでの接点洗浄工法 |
JPH11350350A (ja) * | 1998-06-02 | 1999-12-21 | Teijin Ltd | ポリエステル繊維布帛の模様付与方法 |
JP2000273762A (ja) * | 1999-03-26 | 2000-10-03 | Teijin Ltd | 電磁波シールド材料用基布及びそれを用いた電磁波シールド材料 |
JP2007184457A (ja) * | 2006-01-10 | 2007-07-19 | Murata Mfg Co Ltd | 回路構成用の基板およびそれを用いた電子部品 |
US20080083706A1 (en) * | 2006-10-05 | 2008-04-10 | Mu-Gahat Enterprises, Llc | Reverse side film laser circuit etching |
US20090061112A1 (en) * | 2007-08-27 | 2009-03-05 | Mu-Gahat Enterprises, Llc | Laser circuit etching by subtractive deposition |
US8007904B2 (en) * | 2008-01-11 | 2011-08-30 | Fiber Innovation Technology, Inc. | Metal-coated fiber |
US20100118243A1 (en) * | 2008-11-12 | 2010-05-13 | Debasis Majumdar | Polymeric conductive donor and transfer method |
DE102008057303A1 (de) * | 2008-11-13 | 2010-05-20 | Sefar Ag | Elektrisch leitend beschichtetes Siebdruckgewebe sowie Siebdruckanordnung |
CH700111B1 (fr) * | 2009-09-25 | 2010-06-30 | Agie Sa | Machine d'usinage par laser. |
JP5550878B2 (ja) * | 2009-10-01 | 2014-07-16 | セーレン株式会社 | レーザー照射による加工方法 |
EP2461658A1 (en) * | 2010-12-03 | 2012-06-06 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate |
-
2012
- 2012-09-06 US US14/426,241 patent/US10173284B2/en active Active
- 2012-09-06 KR KR1020157004994A patent/KR102030224B1/ko active IP Right Grant
- 2012-09-06 EP EP12783655.9A patent/EP2893781B1/en active Active
- 2012-09-06 PT PT127836559T patent/PT2893781T/pt unknown
- 2012-09-06 ES ES12783655T patent/ES2881275T3/es active Active
- 2012-09-06 IN IN1413DEN2015 patent/IN2015DN01413A/en unknown
- 2012-09-06 WO PCT/IB2012/001724 patent/WO2014037755A1/en active Application Filing
- 2012-09-06 PL PL12783655T patent/PL2893781T3/pl unknown
- 2012-09-06 DK DK12783655.9T patent/DK2893781T3/da active
- 2012-09-06 CN CN201280075644.6A patent/CN104604340B/zh active Active
- 2012-09-06 JP JP2015530499A patent/JP6179046B2/ja active Active
-
2015
- 2015-10-15 HK HK15110132.1A patent/HK1209563A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP2893781A1 (en) | 2015-07-15 |
DK2893781T3 (da) | 2021-07-26 |
PT2893781T (pt) | 2021-07-09 |
PL2893781T3 (pl) | 2021-10-04 |
JP6179046B2 (ja) | 2017-08-16 |
ES2881275T3 (es) | 2021-11-29 |
IN2015DN01413A (xx) | 2015-07-03 |
KR102030224B1 (ko) | 2019-10-08 |
JP2015536038A (ja) | 2015-12-17 |
CN104604340A (zh) | 2015-05-06 |
WO2014037755A1 (en) | 2014-03-13 |
CN104604340B (zh) | 2018-04-10 |
US10173284B2 (en) | 2019-01-08 |
EP2893781B1 (en) | 2021-05-12 |
KR20150052034A (ko) | 2015-05-13 |
US20150217406A1 (en) | 2015-08-06 |
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