CN104600020A - 晶圆承载器、热处理装置及热处理方法 - Google Patents
晶圆承载器、热处理装置及热处理方法 Download PDFInfo
- Publication number
- CN104600020A CN104600020A CN201510055590.2A CN201510055590A CN104600020A CN 104600020 A CN104600020 A CN 104600020A CN 201510055590 A CN201510055590 A CN 201510055590A CN 104600020 A CN104600020 A CN 104600020A
- Authority
- CN
- China
- Prior art keywords
- wafer
- recess step
- wafer carrier
- horizontal stand
- stand terrace
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510055590.2A CN104600020B (zh) | 2015-02-03 | 2015-02-03 | 晶圆承载器、热处理装置及热处理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510055590.2A CN104600020B (zh) | 2015-02-03 | 2015-02-03 | 晶圆承载器、热处理装置及热处理方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104600020A true CN104600020A (zh) | 2015-05-06 |
CN104600020B CN104600020B (zh) | 2018-01-26 |
Family
ID=53125706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510055590.2A Active CN104600020B (zh) | 2015-02-03 | 2015-02-03 | 晶圆承载器、热处理装置及热处理方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104600020B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105552006A (zh) * | 2016-01-28 | 2016-05-04 | 北京七星华创电子股份有限公司 | 一种立式热处理装置 |
CN109360799A (zh) * | 2018-11-07 | 2019-02-19 | 长江存储科技有限责任公司 | 用于晶圆干燥装置的推梢以及晶圆干燥装置 |
CN110246784A (zh) * | 2019-06-19 | 2019-09-17 | 西安奕斯伟硅片技术有限公司 | 一种支撑结构和具有其的热处理装置 |
CN112635353A (zh) * | 2019-10-08 | 2021-04-09 | 系统科技公司 | 基板处理装置 |
CN113345822A (zh) * | 2021-07-16 | 2021-09-03 | 江苏天芯微半导体设备有限公司 | 批处理用晶圆支撑架和加载互锁真空室 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05291166A (ja) * | 1992-04-14 | 1993-11-05 | Tokyo Electron Tohoku Ltd | 異径被処理体用ボート及びそれを用いた被処理体の移し換え方法 |
US5577621A (en) * | 1994-05-31 | 1996-11-26 | Electronics & Telecommunications Research Institute | Wafer installing cassette for semiconductor manufacturing apparatus |
US20040099219A1 (en) * | 2002-11-26 | 2004-05-27 | Seung-Kap Park | Semiconductor manufacturing system |
TW200941633A (en) * | 2007-12-19 | 2009-10-01 | Shinetsu Handotai Kk | Semiconductor substrate supporting jig and method for manufacturing the same |
JP2009272386A (ja) * | 2008-05-01 | 2009-11-19 | Sumco Corp | ウェーハ支持治具へのウェーハ支持方法 |
CN204481014U (zh) * | 2015-02-03 | 2015-07-15 | 北京七星华创电子股份有限公司 | 晶圆承载器及热处理装置 |
-
2015
- 2015-02-03 CN CN201510055590.2A patent/CN104600020B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05291166A (ja) * | 1992-04-14 | 1993-11-05 | Tokyo Electron Tohoku Ltd | 異径被処理体用ボート及びそれを用いた被処理体の移し換え方法 |
US5577621A (en) * | 1994-05-31 | 1996-11-26 | Electronics & Telecommunications Research Institute | Wafer installing cassette for semiconductor manufacturing apparatus |
US20040099219A1 (en) * | 2002-11-26 | 2004-05-27 | Seung-Kap Park | Semiconductor manufacturing system |
TW200941633A (en) * | 2007-12-19 | 2009-10-01 | Shinetsu Handotai Kk | Semiconductor substrate supporting jig and method for manufacturing the same |
JP2009272386A (ja) * | 2008-05-01 | 2009-11-19 | Sumco Corp | ウェーハ支持治具へのウェーハ支持方法 |
CN204481014U (zh) * | 2015-02-03 | 2015-07-15 | 北京七星华创电子股份有限公司 | 晶圆承载器及热处理装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105552006A (zh) * | 2016-01-28 | 2016-05-04 | 北京七星华创电子股份有限公司 | 一种立式热处理装置 |
CN105552006B (zh) * | 2016-01-28 | 2018-06-22 | 北京北方华创微电子装备有限公司 | 一种立式热处理装置 |
CN109360799A (zh) * | 2018-11-07 | 2019-02-19 | 长江存储科技有限责任公司 | 用于晶圆干燥装置的推梢以及晶圆干燥装置 |
CN110246784A (zh) * | 2019-06-19 | 2019-09-17 | 西安奕斯伟硅片技术有限公司 | 一种支撑结构和具有其的热处理装置 |
CN110246784B (zh) * | 2019-06-19 | 2021-05-07 | 西安奕斯伟硅片技术有限公司 | 一种支撑结构和具有其的热处理装置 |
CN112635353A (zh) * | 2019-10-08 | 2021-04-09 | 系统科技公司 | 基板处理装置 |
CN113345822A (zh) * | 2021-07-16 | 2021-09-03 | 江苏天芯微半导体设备有限公司 | 批处理用晶圆支撑架和加载互锁真空室 |
CN113345822B (zh) * | 2021-07-16 | 2023-12-01 | 江苏天芯微半导体设备有限公司 | 批处理用晶圆支撑架和加载互锁真空室 |
Also Published As
Publication number | Publication date |
---|---|
CN104600020B (zh) | 2018-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102147174B1 (ko) | 기판 처리 장치, 반응관 구조 및 반도체 장치의 제조 방법 | |
JP6208588B2 (ja) | 支持機構及び基板処理装置 | |
CN104600020A (zh) | 晶圆承载器、热处理装置及热处理方法 | |
TWI658529B (zh) | 提高溫度均勻性之基座加熱器局部溫度控制 | |
EP2355133A2 (en) | Substrate heating apparatus, substrate heating method and substrate processing system | |
JP2004179600A (ja) | 半導体製造装置 | |
CN204481014U (zh) | 晶圆承载器及热处理装置 | |
KR20180082574A (ko) | 웨이퍼 지지 기구, 화학 기상 성장 장치 및 에피택셜 웨이퍼의 제조 방법 | |
JP2003037075A (ja) | 移載装置の制御方法および熱処理方法並びに熱処理装置 | |
CN111668134B (zh) | 半导体器件的制造方法、衬底处理装置及程序 | |
CN113140493A (zh) | 铅直晶圆容器系统 | |
JP2011222653A (ja) | 基板保持具、縦型熱処理装置および熱処理方法 | |
KR101420285B1 (ko) | 반도체 제조설비 그의 웨이퍼 로딩/언로딩 방법 | |
TWI777146B (zh) | 基板處理裝置、反應管及半導體裝置之製造方法 | |
JPS6317521A (ja) | ウエ−ハボ−トの搬送方法 | |
TWI761758B (zh) | 半導體裝置的製造方法、基板處理裝置及記錄媒體 | |
JP7058239B2 (ja) | 半導体装置の製造方法、基板処理装置およびプログラム | |
JP2000269137A (ja) | 半導体製造装置及びウェハ取扱方法 | |
KR101436059B1 (ko) | 반도체 제조 장치 및 방법 | |
JP2011035103A (ja) | 搬送装置及び処理システム | |
JP6233712B2 (ja) | 気相成長装置及び被処理基板の支持構造 | |
KR101496674B1 (ko) | 반도체 제조 장치 및 방법 | |
KR102411118B1 (ko) | 기판처리방법, 기판처리장치 및 그를 가지는 기판처리시스템 | |
WO2022196063A1 (ja) | 基板処理装置、半導体装置の製造方法及びプログラム | |
JPH09326365A (ja) | 縦型加熱処理装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180208 Address after: 100176 No. 8, Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |