CN104582316B - 高密度丝印产品塞孔方法 - Google Patents
高密度丝印产品塞孔方法 Download PDFInfo
- Publication number
- CN104582316B CN104582316B CN201410857453.6A CN201410857453A CN104582316B CN 104582316 B CN104582316 B CN 104582316B CN 201410857453 A CN201410857453 A CN 201410857453A CN 104582316 B CN104582316 B CN 104582316B
- Authority
- CN
- China
- Prior art keywords
- area
- screen
- silk
- consent
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Printing Methods (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410857453.6A CN104582316B (zh) | 2014-12-31 | 2014-12-31 | 高密度丝印产品塞孔方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410857453.6A CN104582316B (zh) | 2014-12-31 | 2014-12-31 | 高密度丝印产品塞孔方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104582316A CN104582316A (zh) | 2015-04-29 |
CN104582316B true CN104582316B (zh) | 2018-04-20 |
Family
ID=53097206
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410857453.6A Active CN104582316B (zh) | 2014-12-31 | 2014-12-31 | 高密度丝印产品塞孔方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104582316B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115643683B (zh) * | 2022-12-23 | 2023-03-10 | 惠州市金百泽电路科技有限公司 | 一种异形树脂孔的填镀方法及印制线路板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101772280A (zh) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | 一种丝网塞孔的工艺方法 |
CN102348336A (zh) * | 2011-09-23 | 2012-02-08 | 深南电路有限公司 | 一种对电路板导电孔进行树脂塞孔的方法 |
CN103763871A (zh) * | 2014-02-18 | 2014-04-30 | 无锡江南计算技术研究所 | 印制板开孔油墨填充方法以及塞孔透气板 |
-
2014
- 2014-12-31 CN CN201410857453.6A patent/CN104582316B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101772280A (zh) * | 2009-12-23 | 2010-07-07 | 深南电路有限公司 | 一种丝网塞孔的工艺方法 |
CN102348336A (zh) * | 2011-09-23 | 2012-02-08 | 深南电路有限公司 | 一种对电路板导电孔进行树脂塞孔的方法 |
CN103763871A (zh) * | 2014-02-18 | 2014-04-30 | 无锡江南计算技术研究所 | 印制板开孔油墨填充方法以及塞孔透气板 |
Also Published As
Publication number | Publication date |
---|---|
CN104582316A (zh) | 2015-04-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108882566A (zh) | 一种pcb的制作方法 | |
CN102917542A (zh) | 铜pcb板线路制作方法 | |
CN104684257A (zh) | 一种厚铜电路板加工方法 | |
CN104540338B (zh) | 高对准度hdi产品制作方法 | |
CN106132089B (zh) | 一种印制线路板埋铜块方法 | |
CN104918416B (zh) | 电路板阻焊加工方法和外层超厚铜电路板 | |
CN103079350A (zh) | 印制板的盲槽内图形的加工方法 | |
CN102917554B (zh) | 双铜芯多层板制作方法 | |
CN104602452B (zh) | 一种电路板的制作方法 | |
CN105188278A (zh) | 树脂塞孔压合板结构及树脂塞孔工艺 | |
CN102036510A (zh) | Pcb板的控深塞孔方法 | |
CN105578799B (zh) | 一种印刷电路板及印刷电路板制作方法 | |
CN105934094B (zh) | 一种内埋电容线路板及其制作方法 | |
CN104902683B (zh) | 台阶槽电路板及其加工方法 | |
CN106231801A (zh) | 用于制作陶瓷板料hdi板的工艺 | |
CN104582316B (zh) | 高密度丝印产品塞孔方法 | |
CN102227959B (zh) | 配线板及其制造方法 | |
CN102946691B (zh) | 含局部金属化的台阶开槽的pcb板制作方法 | |
CN109068490B (zh) | 一种hdi基板加工工艺 | |
CN103052267A (zh) | 盲埋孔线路板的加工方法 | |
CN104902675B (zh) | 一种台阶槽电路板及其加工方法 | |
CN105472909B (zh) | 一种阶梯槽电路板的加工方法 | |
CN104981113B (zh) | 电路板金手指的加工方法和金手指电路板 | |
CN104735900A (zh) | 具有侧面金属结构的电路板及其制作方法 | |
CN104902698B (zh) | 电路板金手指的加工方法和具有金手指的电路板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Plug hole method of high density screen printing products Effective date of registration: 20200729 Granted publication date: 20180420 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2020440000215 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20211221 Granted publication date: 20180420 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2020440000215 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right |