CN104582276A - 一种印刷电路板pcb的加工方法 - Google Patents
一种印刷电路板pcb的加工方法 Download PDFInfo
- Publication number
- CN104582276A CN104582276A CN201310491774.4A CN201310491774A CN104582276A CN 104582276 A CN104582276 A CN 104582276A CN 201310491774 A CN201310491774 A CN 201310491774A CN 104582276 A CN104582276 A CN 104582276A
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- milling
- board pcb
- copper sheet
- printing board
- processing method
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310491774.4A CN104582276B (zh) | 2013-10-18 | 2013-10-18 | 一种印刷电路板pcb的加工方法 |
Applications Claiming Priority (1)
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CN201310491774.4A CN104582276B (zh) | 2013-10-18 | 2013-10-18 | 一种印刷电路板pcb的加工方法 |
Publications (2)
Publication Number | Publication Date |
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CN104582276A true CN104582276A (zh) | 2015-04-29 |
CN104582276B CN104582276B (zh) | 2017-08-29 |
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CN201310491774.4A Active CN104582276B (zh) | 2013-10-18 | 2013-10-18 | 一种印刷电路板pcb的加工方法 |
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CN (1) | CN104582276B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106341947A (zh) * | 2016-03-31 | 2017-01-18 | 东莞生益电子有限公司 | 电路板的制作方法 |
CN106686892A (zh) * | 2015-11-09 | 2017-05-17 | 深圳市华祥电路科技有限公司 | 电路板的制造方法及Gerber文件的设计方法 |
CN109332773A (zh) * | 2018-10-13 | 2019-02-15 | 奥士康科技股份有限公司 | 一种pth走槽正反锣的方法及装置 |
CN110969343A (zh) * | 2019-11-15 | 2020-04-07 | 广州兴森快捷电路科技有限公司 | 线路板加工流程生成方法、系统、设备及存储介质 |
CN114245575A (zh) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | 一种pcb阻焊锯齿形电路板的设计方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201860514U (zh) * | 2010-10-22 | 2011-06-08 | 春焱电子科技(苏州)有限公司 | 具有pth半孔的pcb板 |
CN103068167A (zh) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | 一种解决金属基厚铜板独立pad钻孔铜皮起翘的方法 |
-
2013
- 2013-10-18 CN CN201310491774.4A patent/CN104582276B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201860514U (zh) * | 2010-10-22 | 2011-06-08 | 春焱电子科技(苏州)有限公司 | 具有pth半孔的pcb板 |
CN103068167A (zh) * | 2012-12-20 | 2013-04-24 | 景旺电子科技(龙川)有限公司 | 一种解决金属基厚铜板独立pad钻孔铜皮起翘的方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106686892A (zh) * | 2015-11-09 | 2017-05-17 | 深圳市华祥电路科技有限公司 | 电路板的制造方法及Gerber文件的设计方法 |
CN106341947A (zh) * | 2016-03-31 | 2017-01-18 | 东莞生益电子有限公司 | 电路板的制作方法 |
CN106341947B (zh) * | 2016-03-31 | 2019-01-18 | 东莞生益电子有限公司 | 电路板的制作方法 |
CN109332773A (zh) * | 2018-10-13 | 2019-02-15 | 奥士康科技股份有限公司 | 一种pth走槽正反锣的方法及装置 |
CN109332773B (zh) * | 2018-10-13 | 2024-03-22 | 奥士康科技股份有限公司 | 一种pth走槽正反锣的方法及装置 |
CN110969343A (zh) * | 2019-11-15 | 2020-04-07 | 广州兴森快捷电路科技有限公司 | 线路板加工流程生成方法、系统、设备及存储介质 |
CN110969343B (zh) * | 2019-11-15 | 2024-05-17 | 广州兴森快捷电路科技有限公司 | 线路板加工流程生成方法、系统、设备及存储介质 |
CN114245575A (zh) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | 一种pcb阻焊锯齿形电路板的设计方法 |
Also Published As
Publication number | Publication date |
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CN104582276B (zh) | 2017-08-29 |
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Address after: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871 room 808, founder building, Zhongguancun, 298 Chengfu Road, Haidian District, Beijing Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220916 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |