CN104582265A - 一种埋入电容的实现方法及电路板 - Google Patents
一种埋入电容的实现方法及电路板 Download PDFInfo
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- CN104582265A CN104582265A CN201310479185.4A CN201310479185A CN104582265A CN 104582265 A CN104582265 A CN 104582265A CN 201310479185 A CN201310479185 A CN 201310479185A CN 104582265 A CN104582265 A CN 104582265A
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- cream
- insulating barrier
- electric capacity
- embedded capacitance
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
Abstract
Description
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310479185.4A CN104582265B (zh) | 2013-10-14 | 2013-10-14 | 一种埋入电容的实现方法及电路板 |
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CN201310479185.4A CN104582265B (zh) | 2013-10-14 | 2013-10-14 | 一种埋入电容的实现方法及电路板 |
Publications (2)
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CN104582265A true CN104582265A (zh) | 2015-04-29 |
CN104582265B CN104582265B (zh) | 2018-10-19 |
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CN201310479185.4A Active CN104582265B (zh) | 2013-10-14 | 2013-10-14 | 一种埋入电容的实现方法及电路板 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106129036A (zh) * | 2016-08-08 | 2016-11-16 | 江阴芯智联电子科技有限公司 | 一种可塑型埋容金属框架结构及其工艺方法 |
CN106515133B (zh) * | 2015-08-24 | 2018-07-31 | 浙江展邦电子科技有限公司 | 一种led灯具用的双面铝基覆铜板的制造方法 |
CN114585157A (zh) * | 2020-12-01 | 2022-06-03 | 深南电路股份有限公司 | 埋容线路板的制作方法及埋容线路板 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1741707A (zh) * | 2004-08-26 | 2006-03-01 | 三星电机株式会社 | 包括具有高介电常数的嵌入式电容器的印刷电路板及其制造方法 |
US20070063243A1 (en) * | 2004-11-26 | 2007-03-22 | Wei-Chun Yang | Structure Of Embedded Capacitors And Fabrication Method Thereof |
US20090325105A1 (en) * | 2002-12-23 | 2009-12-31 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
KR20120058861A (ko) * | 2010-11-30 | 2012-06-08 | 주식회사 케피코 | 비아 홀을 이용한 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
CN102651278A (zh) * | 2012-05-24 | 2012-08-29 | 北京科技大学 | 一种埋入式电容器及其制备方法 |
CN103298274A (zh) * | 2012-02-24 | 2013-09-11 | 北大方正集团有限公司 | 一种埋容印制电路板的制作方法以及埋容印制电路板 |
-
2013
- 2013-10-14 CN CN201310479185.4A patent/CN104582265B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090325105A1 (en) * | 2002-12-23 | 2009-12-31 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board with embedded capacitors therein, and process for manufacturing the same |
CN1741707A (zh) * | 2004-08-26 | 2006-03-01 | 三星电机株式会社 | 包括具有高介电常数的嵌入式电容器的印刷电路板及其制造方法 |
US20070063243A1 (en) * | 2004-11-26 | 2007-03-22 | Wei-Chun Yang | Structure Of Embedded Capacitors And Fabrication Method Thereof |
KR20120058861A (ko) * | 2010-11-30 | 2012-06-08 | 주식회사 케피코 | 비아 홀을 이용한 커패시터 내장형 인쇄회로기판 및 그 제조 방법 |
CN103298274A (zh) * | 2012-02-24 | 2013-09-11 | 北大方正集团有限公司 | 一种埋容印制电路板的制作方法以及埋容印制电路板 |
CN102651278A (zh) * | 2012-05-24 | 2012-08-29 | 北京科技大学 | 一种埋入式电容器及其制备方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106515133B (zh) * | 2015-08-24 | 2018-07-31 | 浙江展邦电子科技有限公司 | 一种led灯具用的双面铝基覆铜板的制造方法 |
CN106129036A (zh) * | 2016-08-08 | 2016-11-16 | 江阴芯智联电子科技有限公司 | 一种可塑型埋容金属框架结构及其工艺方法 |
CN114585157A (zh) * | 2020-12-01 | 2022-06-03 | 深南电路股份有限公司 | 埋容线路板的制作方法及埋容线路板 |
Also Published As
Publication number | Publication date |
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CN104582265B (zh) | 2018-10-19 |
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Address after: 519175 founder PCB Industrial Park, Fushan Industrial Zone, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 519175 founder PCB Industrial Park, Fushan Industrial Zone, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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Effective date of registration: 20220916 Address after: 519175 HDI plant, HDI expansion plant and QTA plant in founder PCB Industrial Park, Hushan village, Fushan Industrial Zone, Zhuhai City, Guangdong Province Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 519175 founder PCB Industrial Park, Fushan Industrial Zone, Qianwu Town, Doumen District, Zhuhai City, Guangdong Province Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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