CN104575684A - 一种含有金铜粉的复合导电银浆 - Google Patents
一种含有金铜粉的复合导电银浆 Download PDFInfo
- Publication number
- CN104575684A CN104575684A CN201510008181.7A CN201510008181A CN104575684A CN 104575684 A CN104575684 A CN 104575684A CN 201510008181 A CN201510008181 A CN 201510008181A CN 104575684 A CN104575684 A CN 104575684A
- Authority
- CN
- China
- Prior art keywords
- powder
- parts
- copper powder
- sodium
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000843 powder Substances 0.000 title claims abstract description 33
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 14
- 239000004332 silver Substances 0.000 title claims abstract description 14
- 239000002131 composite material Substances 0.000 title claims abstract description 12
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 25
- 239000002994 raw material Substances 0.000 claims abstract description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- QMMJWQMCMRUYTG-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(trifluoromethyl)benzene Chemical compound FC(F)(F)C1=C(Cl)C(Cl)=CC(Cl)=C1Cl QMMJWQMCMRUYTG-UHFFFAOYSA-N 0.000 claims abstract description 7
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 7
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 7
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 claims abstract description 7
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 claims abstract description 7
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 7
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 7
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000004952 Polyamide Substances 0.000 claims abstract description 4
- 229920002647 polyamide Polymers 0.000 claims abstract description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 21
- 239000002002 slurry Substances 0.000 claims description 19
- 238000003756 stirring Methods 0.000 claims description 15
- 239000011734 sodium Substances 0.000 claims description 9
- 239000000428 dust Substances 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 229910000906 Bronze Inorganic materials 0.000 claims description 7
- 238000000498 ball milling Methods 0.000 claims description 7
- 239000010974 bronze Substances 0.000 claims description 7
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims description 7
- 230000004048 modification Effects 0.000 claims description 7
- 238000012986 modification Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- WUZHAYOFKQITLN-UHFFFAOYSA-N 1-ethyl-4-hydroxyimidazolidin-2-one Chemical compound CCN1CC(O)NC1=O WUZHAYOFKQITLN-UHFFFAOYSA-N 0.000 claims description 6
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 claims description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 6
- 239000004115 Sodium Silicate Substances 0.000 claims description 6
- DWAQJAXMDSEUJJ-UHFFFAOYSA-M Sodium bisulfite Chemical compound [Na+].OS([O-])=O DWAQJAXMDSEUJJ-UHFFFAOYSA-M 0.000 claims description 6
- RGCKGOZRHPZPFP-UHFFFAOYSA-N alizarin Chemical compound C1=CC=C2C(=O)C3=C(O)C(O)=CC=C3C(=O)C2=C1 RGCKGOZRHPZPFP-UHFFFAOYSA-N 0.000 claims description 6
- ANBBXQWFNXMHLD-UHFFFAOYSA-N aluminum;sodium;oxygen(2-) Chemical compound [O-2].[O-2].[Na+].[Al+3] ANBBXQWFNXMHLD-UHFFFAOYSA-N 0.000 claims description 6
- 229940077388 benzenesulfonate Drugs 0.000 claims description 6
- ROPXFXOUUANXRR-YPKPFQOOSA-N bis(2-ethylhexyl) (z)-but-2-enedioate Chemical compound CCCCC(CC)COC(=O)\C=C/C(=O)OCC(CC)CCCC ROPXFXOUUANXRR-YPKPFQOOSA-N 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 6
- 229910021641 deionized water Inorganic materials 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 6
- 229940067606 lecithin Drugs 0.000 claims description 6
- 235000010445 lecithin Nutrition 0.000 claims description 6
- 239000000787 lecithin Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 6
- 239000012188 paraffin wax Substances 0.000 claims description 6
- 229910000077 silane Inorganic materials 0.000 claims description 6
- 229910052708 sodium Inorganic materials 0.000 claims description 6
- -1 sodium alkyl benzene Chemical class 0.000 claims description 6
- 229910001388 sodium aluminate Inorganic materials 0.000 claims description 6
- 229940079827 sodium hydrogen sulfite Drugs 0.000 claims description 6
- 235000010267 sodium hydrogen sulphite Nutrition 0.000 claims description 6
- 235000019795 sodium metasilicate Nutrition 0.000 claims description 6
- 229910052911 sodium silicate Inorganic materials 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 4
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims description 4
- 229910006404 SnO 2 Inorganic materials 0.000 claims description 3
- 239000000156 glass melt Substances 0.000 claims description 3
- 238000007578 melt-quenching technique Methods 0.000 claims description 3
- 229940060184 oil ingredients Drugs 0.000 claims description 3
- 235000019198 oils Nutrition 0.000 claims description 3
- 238000000967 suction filtration Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 239000002699 waste material Substances 0.000 claims description 3
- 239000001993 wax Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- GOHZKUSWWGUUNR-UHFFFAOYSA-N 2-(4,5-dihydroimidazol-1-yl)ethanol Chemical compound OCCN1CCN=C1 GOHZKUSWWGUUNR-UHFFFAOYSA-N 0.000 abstract 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 abstract 1
- 239000006087 Silane Coupling Agent Substances 0.000 abstract 1
- 239000004359 castor oil Substances 0.000 abstract 1
- 235000019438 castor oil Nutrition 0.000 abstract 1
- TVWTZAGVNBPXHU-FOCLMDBBSA-N dioctyl (e)-but-2-enedioate Chemical compound CCCCCCCCOC(=O)\C=C\C(=O)OCCCCCCCC TVWTZAGVNBPXHU-FOCLMDBBSA-N 0.000 abstract 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 abstract 1
- 229960002415 trichloroethylene Drugs 0.000 abstract 1
- 238000000034 method Methods 0.000 description 4
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000007791 liquid phase Substances 0.000 description 2
- 229910001961 silver nitrate Inorganic materials 0.000 description 2
- NWZSZGALRFJKBT-KNIFDHDWSA-N (2s)-2,6-diaminohexanoic acid;(2s)-2-hydroxybutanedioic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O.NCCCC[C@H](N)C(O)=O NWZSZGALRFJKBT-KNIFDHDWSA-N 0.000 description 1
- 206010013786 Dry skin Diseases 0.000 description 1
- 238000000889 atomisation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- IKDUDTNKRLTJSI-UHFFFAOYSA-N hydrazine monohydrate Substances O.NN IKDUDTNKRLTJSI-UHFFFAOYSA-N 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- GGCZERPQGJTIQP-UHFFFAOYSA-N sodium;9,10-dioxoanthracene-2-sulfonic acid Chemical compound [Na+].C1=CC=C2C(=O)C3=CC(S(=O)(=O)O)=CC=C3C(=O)C2=C1 GGCZERPQGJTIQP-UHFFFAOYSA-N 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
本发明公开了一种含有金铜粉的复合导电银浆,其是由下述重量份的原料制得:聚酰胺蜡1-2、20-25μm银粉40-50、6-10μm金粉5-8、30-60nm铜粉3-5、改性玻璃粉14-20、氢化蓖麻油0.8-1.4、马来酸二辛酯?0.5-1、聚氨酯树脂2-4、松香4-8、三氯乙烯18-30、醋酸甲酯4-7、硬酯酸丁酯0.2-0.5、二羟乙基咪唑啉0.7-1.2、二乙二醇乙醚醋酸酯0.4-0.6、硅烷偶联剂kh540?0.5-0.8。本发明将金粉、铜粉以及改性处理后的玻璃粉添加到原料中,通过不同粒径的原料复配,使得附着力强,耐温湿性能好。
Description
技术领域
本发明属导电银浆领域,尤其涉及一种含有金铜粉的复合导电银浆。
背景技术
烧结型银导电浆料需要烧结成膜,烧结温度>500℃,玻璃粉或氧化物作为粘接相。银粉按照粒径分类,平均粒径<0.1μm(100nm)为纳米银粉; 0.1μm< Dav(平均粒径) <10.0μm为银微粉;Dav(平均粒径)> 10.0μm为粗银粉。粉末的制备方法有很多,就银而言,可一次采用物理法(等离子、雾化法),化学法(硝酸银热分解法、液相还原)。由于银是贵金属,易被还原而回到单质状态,因此液相还原法是目前制备银粉的最主要的方法。即将银盐(硝酸银等)溶于水中,加入化学还原剂(如水合肼等),沉积出银粉,经过洗涤、烘干而得到银还原粉,平均粒径在0.1-10.0μm之间,还原剂的选择、反应条件的控制、界面活性剂的使用,可以制备不同物理化学特性的银微粉(颗粒形态、分散程度、平均粒径以及粒径分布、比表面积、松装密度、振实密度、晶粒大小、结晶性等),对还原粉进行机械加工(球磨等)可得光亮银粉(polished silver powder),片状银粉(silver flake)。
发明内容
本发明的目的是提供一种含有金铜粉的复合导电银浆。
为了实现上述目的本发明采用如下技术方案:
一种含有金铜粉的复合导电银浆,其是由下述重量份的原料制得:
聚酰胺蜡1-2、20-25μm银粉40-50、6-10μm金粉5-8、30-60nm铜粉3-5、改性玻璃粉14-20、氢化蓖麻油0.8-1.4、马来酸二辛酯 0.5-1、聚氨酯树脂2-4、松香4-8、三氯乙烯18-30、醋酸甲酯4-7、硬酯酸丁酯0.2-0.5、二羟乙基咪唑啉0.7-1.2、二乙二醇乙醚醋酸酯0.4-0.6、硅烷偶联剂kh540 0.5-0.8;
改性玻璃粉由下述重量份的原料制得:废玻璃粉10-20、Na2O2-4、Bi2O3 5-8,ZnO 5-7,V2O5 4-6, SnO2 5-7、铝酸钠1-2、聚乙烯蜡2-4、氯化石蜡1-2、烷基苯磺酸钠2-4、偏硅酸钠3-5、土耳其红油 0.1-0.2,亚硫酸氢钠1-2、卵磷脂1-2、去离子水100-150;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,300-400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至130-150℃,200-500rpm下搅拌均匀,得改性液;
(2)其余原料混匀烧结,烧结温度为1200-1400℃,时间为0.5-2小时,得玻璃熔融体淬火、球磨、干燥,过筛得30-50μm玻璃粉;
(3)将玻璃粉与改性液混匀,于30-50℃下搅拌1-2小时,静置5-8小时,抽滤干燥,即得。
所述的一种含有金铜粉的复合导电银浆,制备方法包括以下步骤:
(1)将氢化蓖麻油、马来酸二辛酯、聚氨酯树脂、松香、三氯乙烯、醋酸甲酯、硬酯酸丁酯、二羟乙基咪唑啉、二乙二醇乙醚醋酸酯、硅烷偶联剂kh540于35-45℃下搅拌30-40分钟,得有机载体备用;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入6-10μm金粉混匀,再加入30-60nm铜粉混和均匀,再加入剩余原料,搅拌均匀得浆料;
(3)浆料球磨,研磨至浆料细度小于10μm,即得。
本发明的有益效果:
本发明将金粉、铜粉以及改性处理后的玻璃粉添加到原料中,通过不同粒径的原料复配,使得附着力强,耐温湿性能好。
具体实施方式
一种含有金铜粉的复合导电银浆,其是由下述重量(kg)的原料制得:
聚酰胺蜡1、20-25μm银粉40、6-10μm金粉8、30-60nm铜粉5、改性玻璃粉20、氢化蓖麻油0.8、马来酸二辛酯 1、聚氨酯树脂4、松香8、三氯乙烯30、醋酸甲酯4、硬酯酸丁酯0.2、二羟乙基咪唑啉0.7、二乙二醇乙醚醋酸酯0.6、硅烷偶联剂kh540 0.5;
改性玻璃粉由下述重量(kg)的原料制得:废玻璃粉20、Na2O4、Bi2O3 5,ZnO 7,V2O5 5, SnO2 5、铝酸钠2、聚乙烯蜡4、氯化石蜡2、烷基苯磺酸钠2、偏硅酸钠3、土耳其红油 0.2,亚硫酸氢钠1、卵磷脂1、去离子水130;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至130℃,300rpm下搅拌均匀,得改性液;
(2)其余原料混匀烧结,烧结温度为1300℃,时间为0.8小时,得玻璃熔融体淬火、球磨、干燥,过筛得30-50μm玻璃粉;
(3)将玻璃粉与改性液混匀,于40℃下搅拌2小时,静置6小时,抽滤干燥,即得。
所述的一种含有金铜粉的复合导电银浆,制备方法包括以下步骤:
(1)将氢化蓖麻油、马来酸二辛酯、聚氨酯树脂、松香、三氯乙烯、醋酸甲酯、硬酯酸丁酯、二羟乙基咪唑啉、二乙二醇乙醚醋酸酯、硅烷偶联剂kh540于45℃下搅拌40分钟,得有机载体备用;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入6-10μm金粉混匀,再加入30-60nm铜粉混和均匀,再加入剩余原料,搅拌均匀得浆料;
(3)浆料球磨,研磨至浆料细度小于10μm,即得。
采用丝网印刷机将银浆印刷于125mm×125mm Si基板上,然后在180℃干燥,再在880℃进行快速烧制电极引线,高温烧结后制成的电极引线表面银白,光滑无缺陷,剥离强度12.2N/cm,锡焊性能良好,方阻<10 Siements/sq,制备的太阳能电池光电转化效率为18.9%,拉力测试结果为附着力>13.5N/mm2。
Claims (2)
1.一种含有金铜粉的复合导电银浆,其特征在于,其是由下述重量份的原料制得:
聚酰胺蜡1-2、20-25μm银粉40-50、6-10μm金粉5-8、30-60nm铜粉3-5、改性玻璃粉14-20、氢化蓖麻油0.8-1.4、马来酸二辛酯 0.5-1、聚氨酯树脂2-4、松香4-8、三氯乙烯18-30、醋酸甲酯4-7、硬酯酸丁酯0.2-0.5、二羟乙基咪唑啉0.7-1.2、二乙二醇乙醚醋酸酯0.4-0.6、硅烷偶联剂kh540 0.5-0.8;
改性玻璃粉由下述重量份的原料制得:废玻璃粉10-20、Na2O2-4、Bi2O3 5-8,ZnO 5-7,V2O5 4-6, SnO2 5-7、铝酸钠1-2、聚乙烯蜡2-4、氯化石蜡1-2、烷基苯磺酸钠2-4、偏硅酸钠3-5、土耳其红油 0.1-0.2,亚硫酸氢钠1-2、卵磷脂1-2、去离子水100-150;
所述的改性玻璃粉的制备方法为:
(1)将铝酸钠、聚乙烯蜡、氯化石蜡、以及去离子水加入反应釜中,300-400转/分搅拌均匀,再加入烷基苯磺酸钠、偏硅酸钠、土耳其红油 、亚硫酸氢钠、卵磷脂、升温至130-150℃,200-500rpm下搅拌均匀,得改性液;
(2)其余原料混匀烧结,烧结温度为1200-1400℃,时间为0.5-2小时,得玻璃熔融体淬火、球磨、干燥,过筛得30-50μm玻璃粉;
(3)将玻璃粉与改性液混匀,于30-50℃下搅拌1-2小时,静置5-8小时,抽滤干燥,即得。
2.根据权利要求1所述的一种含有金铜粉的复合导电银浆,其特征在于:制备方法包括以下步骤:
(1)将氢化蓖麻油、马来酸二辛酯、聚氨酯树脂、松香、三氯乙烯、醋酸甲酯、硬酯酸丁酯、二羟乙基咪唑啉、二乙二醇乙醚醋酸酯、硅烷偶联剂kh540于35-45℃下搅拌30-40分钟,得有机载体备用;
(2)将改性玻璃粉加入到有机载体中,搅拌混和,再加入6-10μm金粉混匀,再加入30-60nm铜粉混和均匀,再加入剩余原料,搅拌均匀得浆料;
(3)浆料球磨,研磨至浆料细度小于10μm,即得。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510008181.7A CN104575684B (zh) | 2015-01-08 | 2015-01-08 | 一种含有金铜粉的复合导电银浆 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510008181.7A CN104575684B (zh) | 2015-01-08 | 2015-01-08 | 一种含有金铜粉的复合导电银浆 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104575684A true CN104575684A (zh) | 2015-04-29 |
CN104575684B CN104575684B (zh) | 2017-01-04 |
Family
ID=53091547
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510008181.7A Expired - Fee Related CN104575684B (zh) | 2015-01-08 | 2015-01-08 | 一种含有金铜粉的复合导电银浆 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104575684B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0855720A2 (en) * | 1997-01-28 | 1998-07-29 | Sumitomo Bakelite Company Limited | Electroconductive copper paste composition |
JP2006183110A (ja) * | 2004-12-28 | 2006-07-13 | Mitsui Mining & Smelting Co Ltd | 銀銅複合粉及び銀銅複合粉の製造方法 |
WO2011005026A2 (ko) * | 2009-07-09 | 2011-01-13 | 주식회사 동진쎄미켐 | 도전성 전극형성용 조성물 |
CN101950596A (zh) * | 2010-09-27 | 2011-01-19 | 彩虹集团公司 | 一种无卤型低温固化银浆及其制备方法 |
CN104143377A (zh) * | 2014-06-30 | 2014-11-12 | 永利电子铜陵有限公司 | 一种pcb电路板导电银浆及其制备方法 |
-
2015
- 2015-01-08 CN CN201510008181.7A patent/CN104575684B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0855720A2 (en) * | 1997-01-28 | 1998-07-29 | Sumitomo Bakelite Company Limited | Electroconductive copper paste composition |
JP2006183110A (ja) * | 2004-12-28 | 2006-07-13 | Mitsui Mining & Smelting Co Ltd | 銀銅複合粉及び銀銅複合粉の製造方法 |
WO2011005026A2 (ko) * | 2009-07-09 | 2011-01-13 | 주식회사 동진쎄미켐 | 도전성 전극형성용 조성물 |
CN101950596A (zh) * | 2010-09-27 | 2011-01-19 | 彩虹集团公司 | 一种无卤型低温固化银浆及其制备方法 |
CN104143377A (zh) * | 2014-06-30 | 2014-11-12 | 永利电子铜陵有限公司 | 一种pcb电路板导电银浆及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104575684B (zh) | 2017-01-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104538085A (zh) | 一种环保导电银浆 | |
KR101301634B1 (ko) | 미립 은입자부착 은동 복합 분말 및 그 미립 은입자부착은동 복합 분말의 제조 방법 | |
CN102354545B (zh) | 一种硅太阳能电池背电场用银电极浆料及制备方法 | |
CN105895192B (zh) | 低温导电银浆及其制备方法 | |
CN112768110B (zh) | 一种铜浆及片式多层陶瓷电容器 | |
CN104801709B (zh) | 一种镍包覆铜金属粉体及其制备方法和应用 | |
CN101306468A (zh) | 导电聚吡咯包裹铜银复合纳米粒子的制备方法 | |
CN102324263A (zh) | 一种用于太阳能电池的银浆及其制备方法 | |
CN109352206A (zh) | 一种合金纳米颗粒焊膏及其制备方法 | |
CN104538084A (zh) | 一种耐高温导电银浆 | |
CN102831949A (zh) | 高效无铅太阳能电池背银浆料及其制备方法 | |
CN110706842B (zh) | 一种正面银浆及其制备方法 | |
CN104575668B (zh) | 一种耐磨纳米导电银浆 | |
CN104616721B (zh) | 一种高附着力导电银浆 | |
TWI528385B (zh) | 銀導電膠及其製造方法 | |
CN104599740A (zh) | 一种含有纳米碳的导电银浆 | |
WO2017012177A1 (zh) | 一种伽伐尼反应制备的贵金属-硅复合粉末及其应用 | |
CN104575684A (zh) | 一种含有金铜粉的复合导电银浆 | |
CN104575683B (zh) | 一种使用寿命长的导电银浆 | |
CN104505145B (zh) | 一种含镍微粉的导电银浆 | |
JP5410850B2 (ja) | 銅複合粒子の製造方法、複合金属銅粒子の製造方法、銅ペーストおよび金属銅導体の製造方法 | |
CN104575681A (zh) | 一种含有钴粉的导电银浆料 | |
CN106251929A (zh) | 用于晶硅太阳电池正面导电层电极的铜浆及其制备方法 | |
CN112435772A (zh) | 一种用于ptc表面可焊接的欧姆银电极浆料及制备方法 | |
CN104575682A (zh) | 一种高效导电银浆 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200924 Address after: Wujiang District of Suzhou City, Jiangsu province 215200 Lili town Yuexiu Road No. 888 Patentee after: JIANGSU YONGDING COMMUNICATIONS Co.,Ltd. Address before: 233122 Anhui city of Chuzhou province Fengyang County town south of Fuxi Patentee before: ANHUI FENGYANG DECHENG TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170104 |
|
CF01 | Termination of patent right due to non-payment of annual fee |