CN104551397A - 一种ic芯片自动焊接设备 - Google Patents

一种ic芯片自动焊接设备 Download PDF

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Publication number
CN104551397A
CN104551397A CN201510007072.3A CN201510007072A CN104551397A CN 104551397 A CN104551397 A CN 104551397A CN 201510007072 A CN201510007072 A CN 201510007072A CN 104551397 A CN104551397 A CN 104551397A
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screw thread
chip
mount pad
automatic welding
holder
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陈友兵
宋越
徐和平
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CHIZHU RUICHENG MICROELECTRONICS Co Ltd
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CHIZHU RUICHENG MICROELECTRONICS Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto

Abstract

本发明公开了一种IC芯片自动焊接设备，包括机架、IC芯片，包括固定座，服电机、丝杆、移动安装座、激光焊接头、气动真空吸、定位座、输送器、与现有技术相比，先将待加工的芯片放置在输送器中的储料框中，伺服电机驱动移动安装座，使得气动中空吸运动到输送器上端中心处，气动真空心向下运动，真空吸头将待加工芯片吸起，伺服电机再次带动移动安装座往回运动，气动真空吸将待加工芯片放置在定位模中，通过激光焊接头发出高能量电子束，从而完成芯片焊接加工，电子束焊接性能稳定，保证焊接质量，避免产品报废。

Description

一种IC芯片自动焊接设备
技术领域
本发明涉及一种焊接设备，尤其涉及一种IC芯片自动焊接设备。
背景技术
随着科技的发展，电子产品越来越先进，体积越来越小，而电子产品发展的根本在于IC芯片的大量使用，目前的IC芯片是需要通过与其他的线路焊接形成，而现有的焊接设备是通过火焰焊接，而火焰焊接温度不好控制，导致产品报废，鉴于上述缺陷，实有必要设计一种IC芯片自动焊接设备。
发明内容
本发明所要解决的技术问题在于：提供一种IC芯片自动焊接设备，来解决产品报废的问题。
为解决上述技术问题，本发明的技术方案是：一种IC芯片自动焊接设备，包括机架、IC芯片，包括固定座，服电机、丝杆、移动安装座、激光焊接头、气动真空吸、定位座、输送器、所述的固定座位于机架顶部中心右端，二者螺纹相连，所述的伺服电机位于固定座右端中心处，二者螺纹相连，所述的丝杆位于伺服电机左端中心处，其与固定座活动相连，与伺服电机螺纹相连，所述的移动安装座位于固定座顶部，二者活动相连，所述的激光焊接头位于移动安装座左侧底部中心处，二者螺纹相连，所述的气动真空吸位于移动安装座顶部左端，二者螺纹相连，所述的定位座位于机架底板中心左侧，二者活动相连。所述的输送器位于定位座中心左侧，其与机架螺纹相连。
进一步，所述的固定座顶部还设有导轨，其与移动安装座活动相连，与固定座螺纹相连。
进一步，所述的移动安装座右端底部中心处还设进给螺母，其与丝杆活动相连，与移动安装座螺纹相连。
进一步，所述的气动真空吸底部中心处还设有真空吸头，二者螺纹相连。
进一步，所述的定位座顶部中心处还设有定位模，二者螺纹相连。
进一步，所述的输送器顶部还设有储料框，二者螺纹相连。
与现有技术相比，先将待加工的芯片放置在输送器中的储料框中，伺服电机驱动移动安装座，使得气动中空吸运动到输送器上端中心处，气动真空心向下运动，真空吸头将待加工芯片吸起，伺服电机再次带动移动安装座往回运动，气动真空吸将待加工芯片放置在定位模中，通过激光焊接头发出高能量电子束，从而完成芯片焊接加工，电子束焊接性能稳定，保证焊接质量，避免产品报废。
附图说明
图1是装置的主视图
机架               1      固定座            2
伺服电机           3      丝杆              4
移动安装座         5      激光焊接头        6
气动真空吸         7      定位座            8
输送器             9      IC芯片            10
导轨               201    进给螺母          501
真空吸头           701    定位模            801
储料框             901
如下具体实施方式将结合上述附图进一步说明。
具体实施方式
在下文中，阐述了多种特定细节，以便提供对构成所描述实施例基础的概念的透彻理解。然而，对本领域的技术人员来说，很显然所描述的实施例可以在没有这些特定细节中的一些或者全部的情况下来实践。在其他情况下，没有具体描述众所周知的处理步骤。
如图1所示，包括机架1、包括固定座2，伺服电机3、丝杆4、移动安装座5、激光焊接头6、气动真空吸7、定位座8、输送器9，所述的固定,2位于机架1顶部中心右端，二者螺纹相连，所述的伺服电机3位于固定座2右端中心处，二者螺纹相连，所述的丝杆4位于伺服电机3左端中心处，其与固定座2活动相连，与伺服电机3螺纹相连，所述的移动安装座5位于固定座2顶部，二者活动相连，所述的激光焊接头6位于移动安装座5左端底部中心处，二者螺纹相连。所述的气动真空吸7位于移动安装座5顶部左端，二者螺纹相连。所述的定位座8位于移动座7顶部中心处，二者螺纹相连，所述的输送器位于定位座中心左侧，其与机架螺纹相连，所述的固定座2顶部还设有导轨201，其与移动安装5座活动相连，与固定座2螺纹相连，所述的移动安装座5右端底部中心处还设进给螺母501，其与丝杆4活动相连，与移动安装座5螺纹相连。所述的气动真空吸7底部中心处还设有真空吸头701，二者螺纹相连。所述的定位座8顶部中心处还设有定位模801，二者螺纹相连。所述的输送器9顶部还设有储料框901，二者螺纹相连，其中机架1、固定座2、移动安装座5、定位座7是组成装置的支撑固定机构。先将待加工的芯片放置在输送器9中的储料框901中，伺服电机3通过丝杆4驱动移动安装座5，使得气动真空吸7运动到输送器9上端中心处，气动真空心7向下运动，真空吸头701将待加工IC芯片10吸起，伺服电机3再次带动移动安装座5往回运动，气动真空吸7将待加工IC芯片10放置在定位模801中，通过激光焊接头6发出高能量电子束，从而完IC成芯片10焊接加工，电子束焊接性能稳定，保证焊接质量，避免产品报废。
本发明不局限于上述具体的实施方式，本领域的普通技术人员从上述构思出发，不经过创造性的劳动，所做出的种种变换，均落在本发明的保护范围之内。

Claims (6)

1.一种IC芯片自动焊接设备，包括机架、IC芯片，其特征在于包括固定座，伺服电机、丝杆、移动安装座、激光焊接头、气动真空吸、定位座、输送器、所述的固定座位于机架顶部中心右端，二者螺纹相连。所述的伺服电机位于固定座右端中心处，二者螺纹相连，所述的丝杆位于伺服电机左端中心处，其与固定座活动相连，与伺服电机螺纹相连，所述的移动安装座位于固定座顶部，二者活动相连，所述的激光焊接头位于移动安装座左侧底部中心处，二者螺纹相连。所述的气动真空吸位于移动安装座顶部左端，二者螺纹相连。所述的定位座位于机架底板中心左侧，二者活动相连。所述的输送器位于定位座中心左侧，其与机架螺纹相连。
2.如权利要求1所述的一种IC芯片自动焊接设备，其特征在于所述的固定座顶部还设有导轨，其与移动安装座活动相连，与固定座螺纹相连。
3.如权利要求2所述的一种IC芯片自动焊接设备，其特征在于所述的移动安装座右端底部中心处还设进给螺母，其与丝杆活动相连，与移动安装座螺纹相连。
4.如权利要求3所述的一种IC芯片自动焊接设备，其特征在于所述的气动真空吸底部中心处还设有真空吸头，二者螺纹相连。
5.如权利要求4所述的一种IC芯片自动焊接设备，其特征在于所述的定位座顶部中心处还设有定位模，二者螺纹相连。
6.如权利要求5所述的一种IC芯片自动焊接设备，其特征在于所述的输送器顶部还设有储料框，二者螺纹相连。
CN201510007072.3A 2015-01-07 2015-01-07 一种ic芯片自动焊接设备 Pending CN104551397A (zh)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202411601U (zh) * 2011-12-20 2012-09-05 奥特力合自动化技术(北京)有限公司 一体化芯片点焊和搬运装置
CN202780148U (zh) * 2012-08-22 2013-03-13 弘益泰克自动化设备（惠州）有限公司 一种使用两个烙铁焊接的焊接机
CN202861569U (zh) * 2012-04-18 2013-04-10 深圳市恒毅兴实业有限公司 基于电路板焊接的焊接系统
CN203566033U (zh) * 2013-10-21 2014-04-30 武汉市楚源光电有限公司 一种自动激光焊锡机
CN104084697A (zh) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 不锈钢芯片激光切割设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202411601U (zh) * 2011-12-20 2012-09-05 奥特力合自动化技术(北京)有限公司 一体化芯片点焊和搬运装置
CN202861569U (zh) * 2012-04-18 2013-04-10 深圳市恒毅兴实业有限公司 基于电路板焊接的焊接系统
CN202780148U (zh) * 2012-08-22 2013-03-13 弘益泰克自动化设备（惠州）有限公司 一种使用两个烙铁焊接的焊接机
CN203566033U (zh) * 2013-10-21 2014-04-30 武汉市楚源光电有限公司 一种自动激光焊锡机
CN104084697A (zh) * 2014-06-26 2014-10-08 长春光华微电子设备工程中心有限公司 不锈钢芯片激光切割设备

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Application publication date: 20150429