CN104540328B - PCB graphic makings device and PCB pattern-producing methods - Google Patents
PCB graphic makings device and PCB pattern-producing methods Download PDFInfo
- Publication number
- CN104540328B CN104540328B CN201410857698.9A CN201410857698A CN104540328B CN 104540328 B CN104540328 B CN 104540328B CN 201410857698 A CN201410857698 A CN 201410857698A CN 104540328 B CN104540328 B CN 104540328B
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- CN
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- Prior art keywords
- idler wheel
- pcb board
- pcb
- wet film
- film ink
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 title abstract description 23
- 238000007711 solidification Methods 0.000 claims abstract description 34
- 230000008023 solidification Effects 0.000 claims abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 230000005540 biological transmission Effects 0.000 claims description 28
- 238000013007 heat curing Methods 0.000 claims description 9
- 230000003068 static effect Effects 0.000 claims description 3
- 230000000630 rising effect Effects 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 9
- 238000011161 development Methods 0.000 abstract description 7
- 230000008901 benefit Effects 0.000 abstract description 3
- 230000009467 reduction Effects 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 5
- 239000002699 waste material Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000002351 wastewater Substances 0.000 description 3
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 230000009194 climbing Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000643 oven drying Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 108010022579 ATP dependent 26S protease Proteins 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Landscapes
- Printing Methods (AREA)
Abstract
A kind of PCB graphic makings device, including：Printing equipment, heating drier and solidification equipment.Printing equipment is used to that wet film ink to be printed onto pcb board using the web plate shone after netting；Heating drier includes the first idler wheel, the second idler wheel and baking oven, and the pcb board is transported by first idler wheel to the oven interior, so that the pcb board for being printed with the wet film ink is dry in the baking oven；Solidification equipment, including rotary electric machine and solidification case, the rotary electric machine drives first idler wheel and second idler wheel to rotate, and the rotary electric machine drives second idler wheel to transmit the pcb board to the solidification case, and the pcb board is cured in the solidification case.Above-mentioned PCB pattern-producing methods have skipped the development flow that traditional subtractive process has to pass through, and have the benefits such as cost-effective, reduction pollution.In addition, additionally provide a kind of PCB pattern-producing methods.
Description
Technical field
The present invention relates to PCB (printed circuit board, printed circuit board) manufacture technology fields, particularly relate to
And a kind of PCB graphic makings device and PCB pattern-producing methods.
Background technology
With printed wiring board manufacturing process Fast Growth, PCB manufacturing industry tends to the directions such as quick, efficient, automation hair
Exhibition, the requirement of cost and environmental protection aspect are higher and higher.Pad pasting → film making → exposure can all be passed through in traditional light imaging method
The flow of light → development → etching, the quantity of the exposure machine used is more, and cost is very high with maintenance cost.And developing
Film can react in journey, expend many film raw materials, also need additionally to consume developer and antifoaming agent, and generate many film slags, give up
Liquid the like waste, while need to safeguard developing line, ensure development side etching quantity.
PCB graphic makings include addition process, subtractive process.Since addition process makes the poor reliability of the copper sheet in figure and adds
Work technical maturity degree is not high, using the very small of situation in the pcb.Subtractive process is still the manufacture craft of mainstream, existing
Subtractive process using light be imaged transition diagram, then by after development further in pattern transfer to copper sheet.Either internal layer DES
(developing etching stripping, development etching striping) etchant flow, the negative film flow of outer layer and positive flow
It is required for being not required the copper in region through overetch.Since the features such as subtractive process machinability is strong, reliability is high, is by PCB manufacturing industry heat
Inner feelings.But subtractive process wastes raw material serious and generates the pollutions such as various wastewater, waste residue, also causes most of PCB plant layouts separate
Urban district.
The content of the invention
Based on this, it is necessary to which offer is a kind of at low cost, pollutes small PCB graphic making devices.
A kind of PCB pattern-producing methods are provided in addition, there is a need to.
A kind of PCB graphic makings device, including：
Printing equipment, for wet film ink to be printed onto pcb board using the web plate shone after netting；
Heating drier, including the first idler wheel, the second idler wheel and baking oven, the pcb board is transported by first idler wheel
To the oven interior, so that the pcb board for being printed with the wet film ink is dry in the baking oven；
Solidification equipment, including rotary electric machine and solidification case, the rotary electric machine drives first idler wheel and described second
Idler wheel rotates, and second idler wheel transmits the pcb board to the solidification case, and the pcb board is cured in the solidification case.
In one of which embodiment, multilayer transmission idler wheel is equipped in the baking oven, when the pcb board is into described more
After layer conveying roller, in addition to that layer flushed with the horizontal transport idler wheel on the right side of the multilayer transmission idler wheel, the multilayer
Other layers of conveying roller are static in the horizontal direction.
In one of which embodiment, the PCB on the lowest level conveying roller in the multilayer transmission idler wheel
After plate sends out the baking oven, the multilayer transmission idler wheel is under rotary electric machine drive, back to initial extreme lower position.
In one of which embodiment, second idler wheel includes climb idler wheel and the horizontal transport idler wheel, works as institute
Stating the idler wheel that climbs drives the pcb board to climb to after default height, and the horizontal transport idler wheel is by the pcb board horizontal transport
To the solidification case.
In one of which embodiment, the wet film ink is the photosensitive wet film ink of UV.
In one of which embodiment, the solidification case is equipped with UV lamp, and the UV lamp is photosensitive for curing the UV
Wet film ink.
In one of which embodiment, the wet film ink is heat cure wet film ink.
In one of which embodiment, the solidification case is equipped with heater, and the heater is used to cure the thermosetting
Dampness elimination film ink.
A kind of PCB pattern-producing methods, include the following steps：
Solarization net is carried out to web plate, in default pattern transfer to the web plate；
Wet film ink is printed onto on pcb board by the web plate；
The pcb board is transported to oven interior by the first idler wheel, so that the pcb board for being printed with wet film ink exists
The oven drying；
Rotary electric machine drives first idler wheel and the second idler wheel to rotate, and second idler wheel transmits the pcb board to institute
Solidification case is stated, the pcb board is cured in the solidification case.
In one of which embodiment, the wet film ink is the photosensitive wet film ink of UV or heat cure wet film ink.
Above-mentioned PCB graphic makings device and PCB pattern-producing methods on pcb board by printing wet film ink logo, so
The PCB is dried, cured and etched afterwards, the development flow that traditional subtractive process has to pass through has been skipped, has avoided developing
The problems such as pollution of journey generation and consumption developer, and organic film ink usage amount is reduced, there is cost-effective, reduction pollution
Etc. benefits.
Description of the drawings
It in order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention, for those of ordinary skill in the art, without creative efforts, can be with
The attached drawing of other embodiment is obtained according to these attached drawings.
Fig. 1 is the structure diagram of the PCB graphic making devices in an embodiment；
Fig. 2 is the flow chart of the PCB pattern-producing methods in an embodiment.
Specific embodiment
Following description provides the spies for understanding each embodiment completely and implementing for those skilled in the art
Determine details.However, it should be appreciated by those skilled in the art without such details, also the present invention may be practiced.In some examples
In, in order to avoid unnecessarily obscuring the description to embodiment, it is not shown or described in detail well known 26S Proteasome Structure and Function.
As shown in Figure 1, the PCB graphic makings device 100 in an embodiment includes printing equipment 110, heating drier 120
With solidification equipment 130.
Printing equipment 110 includes wire mark pedestal 2.Printing equipment 110 is used to that web plate 3 to be carried out shining net and carries out pcb board 1
Printing.Specifically, pcb board 1 and web plate 3 are arranged on wire mark pedestal 2 first.Solarization net is carried out to web plate 3, default figure
4 are transferred to web plate 3.Then wet film ink is placed on web plate 3, pcb board is aligned, printing wet film ink to pcb board 1
On.
Heating drier 120 includes the first idler wheel 5, operation tie 7, air-heater 8, runner 9, multilayer transmission idler wheel 11, the
Second wheel 12 and baking oven 13.
After wet film ink is imaged on pcb board 1, pcb board 1 is transported to heating drier by the first horizontal idler wheel 5
120.Specifically, by the first idler wheel 5 by 1 horizontal transport of pcb board to baking oven 13.When pcb board 1 reaches 13 inside of baking oven, PCB
Plate does not continue to forward, so that the pcb board 1 for being printed with wet film ink is dry in baking oven 13.Specifically, when pcb board 1 into
It is more in addition to that layer flushed with the horizontal transport idler wheel 16 on 11 right side of multilayer transmission idler wheel after entering multilayer transmission idler wheel 11
Other layers of layer conveying roller 11 are static in the horizontal direction, the drying in baking oven 13 of pcb board 1.The hot wind generated by air-heater 8
Pcb board 1 in baking oven 13 is dried.By using air-heater 8, can ensure on each layer of multilayer transmission idler wheel 11
Pcb board 1 can flash baking.
Solidification equipment 130 includes rotary electric machine 6, curing source 10 and solidification case 14.
After pcb board 1 enters multilayer transmission idler wheel 11, except neat with the horizontal transport idler wheel 16 on 11 right side of multilayer transmission idler wheel
Flat that layer is outer, and the movement of pcb board 1 in the horizontal direction will stop.Rotary electric machine 6 drives the first idler wheel 5 and the second idler wheel
12 rotate, and the second idler wheel 12 transmits pcb board 1 to solidification case 14.Pcb board 1 is cured in solidification case 14.
In a specific embodiment, the second idler wheel 12 includes climb idler wheel 15 and horizontal transport idler wheel 16.When climbing
Idler wheel 12 drives pcb board 1 to climb to after default height, and horizontal transport idler wheel 16 is by pcb board horizontal transport to solidification case 14.
Rotary electric machine 6 is connected by operation tie 7 by runner 9 with multilayer transmission idler wheel 11.When in multilayer transmission idler wheel 11
Lowest level conveying roller on pcb board 1 send out baking oven 13 after, multilayer transmission idler wheel 11 rotary electric machine 6 drive under, return to
Initial extreme lower position.
In one embodiment, wet film ink is the photosensitive wet film ink of UV.Curing source 10 is UV lamp, and UV lamp is arranged on curing
In case 14, UV lamp is used for the photosensitive wet film ink of UV curing.In use, without to UV lamp energy grade, be highly adjusted.
In one embodiment, wet film ink is heat cure wet film ink.Curing source 10 is heater, and heater is arranged on
In solidification case 14, heater is used to cure heat cure wet film ink.In use, heater is opened in solidification case 14.
As shown in Fig. 2, the PCB pattern-producing methods in an embodiment, include the following steps：
Step S110 carries out solarization net, in default pattern transfer to web plate to web plate.
As shown in Figure 1, specifically, pcb board 1 and web plate 3 are arranged on wire mark pedestal 2.Solarization net is carried out to web plate 3,
Default figure 4 is transferred to web plate 3.
Wet film ink is placed on web plate, pcb board is aligned by step S120, on printing wet film ink to pcb board.
Figure 4 is printed onto after pcb board 1, it is necessary to which pcb board 1 is dried and cured.
Step S130 is transported pcb board to oven interior by the first idler wheel, so as to be printed with the pcb board of wet film ink
In oven drying.
Specifically, after wet film ink is imaged on pcb board 1, by the first idler wheel 5 by 1 horizontal transport of pcb board to baking oven
13.When pcb board 1 reaches 13 inside of baking oven, pcb board 1 does not continue to forward, so as to be printed with the pcb board 1 of wet film ink
It is dry in baking oven 13.Specifically, after pcb board 1 is into multilayer transmission idler wheel 11, except with the right side of multilayer transmission idler wheel 11
Outside that layer that horizontal transport idler wheel 16 flushes, other layers of multilayer transmission idler wheel 11 do not roll in the horizontal direction, and pcb board 1 exists
Drying in baking oven 13.The pcb board 1 in baking oven 13 is dried by the hot wind that air-heater 8 generates.By using air-heater 8,
It can ensure that the pcb board 1 on each layer of multilayer transmission idler wheel 11 can flash baking.
Step S140, rotary electric machine drive the first idler wheel and the second idler wheel to rotate, the second idler wheel transmission pcb board to curing
Case, pcb board are cured in solidification case.
After pcb board 1 enters multilayer transmission idler wheel 11, except neat with the horizontal transport idler wheel 16 on 11 right side of multilayer transmission idler wheel
Flat that layer is outer, and the movement of pcb board 1 in the horizontal direction will stop.Rotary electric machine 6 drives the first idler wheel 5 and the second idler wheel
11 rotate, and the second idler wheel 12 transmits pcb board 1 to solidification case 14.Pcb board 1 is cured in solidification case 14.
In a specific embodiment, the second idler wheel 12 includes climb idler wheel 15 and horizontal transport idler wheel 16.When climbing
Idler wheel 12 drives pcb board 1 to climb to after default height, and horizontal transport idler wheel 16 is by pcb board horizontal transport to solidification case 14.
Rotary electric machine 6 is connected by operation tie 7 by runner 9 with multilayer transmission idler wheel 11.When in multilayer transmission idler wheel 11
Lowest level conveying roller on pcb board 1 send out baking oven 13 after, multilayer transmission idler wheel 11 rotary electric machine 6 drive under, return to
Initial extreme lower position.
In one embodiment, wet film ink is the photosensitive wet film ink of UV.Curing source 10 is UV lamp, and UV lamp is arranged on curing
In case 14, UV lamp is used for the photosensitive wet film ink of UV curing.In use, without to UV lamp energy grade, be highly adjusted.
In one embodiment, wet film ink is heat cure wet film ink.Curing source 10 is heater, and heater is arranged on
In solidification case 14, heater is used to cure heat cure wet film ink.In use, heater is opened in solidification case 14.
Above-mentioned PCB pattern-producing methods and device mainly print one layer of wet film using the method for shining wire mark brush on pcb board 1
Ink.The wet film ink is covered on the copper sheet graphics field for needing to retain pcb board 1 and avoids being etched, which has
Anti-etching effect.After then pcb board 1 is dried, cured, pcb board 1 is directly etched, avoids traditional light Irnaging procedures
In developing procedure, can not only save cost of material, also reduce dry film ink usage and waste water, the pollution of waste residue.
Above-mentioned PCB image production method and device have the advantage that for：
(1) pad pasting dosage is reduced, reduces cost of material.
(2) without the use of developer and developing line, the waste residue for avoiding development generation, waste water.
(3) pcb board after imaging transfer can be directly connected to Etaching device and realize flow line production, reduce manpower.
(4) photocuring wet film ink can be not only used, can also use heat cure wet film ink.
(5) cure the light source used or heat source is simple, it is only necessary to using a ultraviolet lamp or heater, without considering
Whether directional light and exposure capability, the exposure machine for avoiding buying expensive.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (5)
1. a kind of PCB graphic makings device, which is characterized in that including：
Printing equipment for wet film ink to be placed in web plate, aligns pcb board, to print the wet film ink to institute
It states on pcb board；
Heating drier, including the first idler wheel, the second idler wheel and baking oven, the pcb board is transported by first idler wheel to institute
Oven interior is stated, so that the pcb board for being printed with the wet film ink is dry in the baking oven；It is equipped in the baking oven more
Layer conveying roller, when the pcb board enter the multilayer transmission idler wheel after, except with the level on the right side of the multilayer transmission idler wheel
Outside that layer that conveying roller flushes, other layers of the multilayer transmission idler wheel are static in the horizontal direction；When the multilayer transmission
After the pcb board on lowest level conveying roller in idler wheel sends out the baking oven, the multilayer transmission idler wheel is in rotary electric machine
Under drive, back to initial extreme lower position；Second idler wheel includes climb idler wheel and the horizontal transport idler wheel, is climbed when described
Rising idler wheel drives the pcb board to climb to after default height, and the horizontal transport idler wheel is by the pcb board horizontal transport to admittedly
Change case；
Solidification equipment, including the rotary electric machine and the solidification case, the rotary electric machine drives first idler wheel and described
Second idler wheel rotates, and second idler wheel transmits the pcb board to the solidification case, pcb board quilt in the solidification case
Cure.
2. PCB graphic makings device as described in claim 1, which is characterized in that the wet film ink is the photosensitive wet film oil of UV
Ink.
3. PCB graphic makings device as claimed in claim 2, which is characterized in that the solidification case is equipped with UV lamp, the UV
Lamp is used to cure the photosensitive wet film ink of the UV.
4. PCB graphic makings device as described in claim 1, which is characterized in that the wet film ink is heat cure wet film oil
Ink.
5. PCB graphic makings device as claimed in claim 4, which is characterized in that the solidification case is equipped with heater, described to add
Hot device is used to cure the heat cure wet film ink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857698.9A CN104540328B (en) | 2014-12-31 | 2014-12-31 | PCB graphic makings device and PCB pattern-producing methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410857698.9A CN104540328B (en) | 2014-12-31 | 2014-12-31 | PCB graphic makings device and PCB pattern-producing methods |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104540328A CN104540328A (en) | 2015-04-22 |
| CN104540328B true CN104540328B (en) | 2018-05-25 |
Family
ID=52855742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410857698.9A Active CN104540328B (en) | 2014-12-31 | 2014-12-31 | PCB graphic makings device and PCB pattern-producing methods |
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| Country | Link |
|---|---|
| CN (1) | CN104540328B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108732864B (en) * | 2018-07-24 | 2022-02-11 | 杭州萧山华达邮政器材有限公司 | Screen printing process and production line of express item box door |
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2014
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|---|---|---|---|---|
| CN201214300Y (en) * | 2008-04-23 | 2009-04-01 | 深圳市三井木科技有限公司 | Automatic silk screen printing apparatus |
| CN201619285U (en) * | 2010-02-10 | 2010-11-03 | 杨国辉 | Wire mesh printer |
| CN102328504A (en) * | 2011-06-03 | 2012-01-25 | 珠海紫翔电子科技有限公司 | Device and method for solidifying ink on flexible circuit board |
| CN202727570U (en) * | 2012-06-29 | 2013-02-13 | 苏州优尔嘉电子有限公司 | Conveying-drying line for screen printing |
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| Publication number | Publication date |
|---|---|
| CN104540328A (en) | 2015-04-22 |
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| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20150422 Assignee: Guangzhou Kaide Finance Leasing Co.,Ltd. Assignor: SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Contract record no.: 2019990000235 Denomination of invention: PCB image manufacturing device and PCB image manufacturing method Granted publication date: 20180525 License type: Exclusive License Record date: 20190716 |
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Denomination of invention: PCB image manufacturing device and PCB image manufacturing method Effective date of registration: 20190807 Granted publication date: 20180525 Pledgee: Guangzhou Kaide Finance Leasing Co.,Ltd. Pledgor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd. Registration number: Y2019990000032 |
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Assignee: Guangzhou Kaide Finance Leasing Co.,Ltd. Assignor: GUANGZHOU FASTPRINT CIRCUIT TECH Co.,Ltd.|SHENZHEN FASTPRINT CIRCUIT TECH Co.,Ltd.|YIXING SILICON VALLEY ELECTRONICS TECH Co.,Ltd.|GUANGZHOU XINGSEN ELECTRONIC Co.,Ltd. Contract record no.: 2019990000235 Date of cancellation: 20220922 |
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