CN104523285B - 一种电子皮肤及其制备方法 - Google Patents
一种电子皮肤及其制备方法 Download PDFInfo
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- CN104523285B CN104523285B CN201410770984.1A CN201410770984A CN104523285B CN 104523285 B CN104523285 B CN 104523285B CN 201410770984 A CN201410770984 A CN 201410770984A CN 104523285 B CN104523285 B CN 104523285B
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- film transistor
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- H01L29/7869—Thin film transistors, i.e. transistors with a channel being at least partly a thin film having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
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- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2560/00—Constructional details of operational features of apparatus; Accessories for medical measuring apparatus
- A61B2560/04—Constructional details of apparatus
- A61B2560/0462—Apparatus with built-in sensors
- A61B2560/0468—Built-in electrodes
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- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
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- A61B2562/0247—Pressure sensors
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- A61B2562/0271—Thermal or temperature sensors
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
- A61B2562/06—Arrangements of multiple sensors of different types
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- A—HUMAN NECESSITIES
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- A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
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- A—HUMAN NECESSITIES
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- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/024—Detecting, measuring or recording pulse rate or heart rate
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B7/00—Instruments for auscultation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/124—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or layout of the wiring layers specially adapted to the circuit arrangement, e.g. scanning lines in LCD pixel circuits
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Abstract
Description
Claims (8)
Priority Applications (3)
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CN201410770984.1A CN104523285B (zh) | 2014-12-12 | 2014-12-12 | 一种电子皮肤及其制备方法 |
PCT/CN2015/095549 WO2016091070A1 (zh) | 2014-12-12 | 2015-11-25 | 一种电子皮肤及其制备方法 |
US15/618,976 US10624582B2 (en) | 2014-12-12 | 2017-06-09 | Electronic skin and manufacturing method therefor |
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CN201410770984.1A CN104523285B (zh) | 2014-12-12 | 2014-12-12 | 一种电子皮肤及其制备方法 |
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CN104523285A CN104523285A (zh) | 2015-04-22 |
CN104523285B true CN104523285B (zh) | 2016-09-21 |
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CN201410770984.1A Active CN104523285B (zh) | 2014-12-12 | 2014-12-12 | 一种电子皮肤及其制备方法 |
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CN (1) | CN104523285B (zh) |
WO (1) | WO2016091070A1 (zh) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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US8332053B1 (en) * | 2009-04-28 | 2012-12-11 | Hrl Laboratories, Llc | Method for fabrication of a stretchable electronic skin |
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US20130294617A1 (en) * | 2012-05-03 | 2013-11-07 | Motorola Mobility Llc | Coupling an Electronic Skin Tattoo to a Mobile Communication Device |
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-
2014
- 2014-12-12 CN CN201410770984.1A patent/CN104523285B/zh active Active
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2015
- 2015-11-25 WO PCT/CN2015/095549 patent/WO2016091070A1/zh active Application Filing
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2017
- 2017-06-09 US US15/618,976 patent/US10624582B2/en not_active Expired - Fee Related
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20170172490A1 (en) * | 2015-12-22 | 2017-06-22 | Sharp Laboratories of America (SLA), Inc. | Matrix Multi-Sensor Array |
US10194856B2 (en) * | 2015-12-22 | 2019-02-05 | Sharp Laboratories Of America, Inc. | Matrix multi-sensor array |
CN107300392A (zh) * | 2017-07-12 | 2017-10-27 | 广东顺德中山大学卡内基梅隆大学国际联合研究院 | 一种基于双栅薄膜晶体管的多功能传感器及其制备方法 |
CN109374024A (zh) * | 2018-11-05 | 2019-02-22 | 四川大学 | 一种具有凹坑结构的压阻式电子皮肤及其制备方法 |
CN111811703A (zh) * | 2020-07-21 | 2020-10-23 | 京东方科技集团股份有限公司 | 压力传感器和电子装置 |
CN111811703B (zh) * | 2020-07-21 | 2022-04-08 | 京东方科技集团股份有限公司 | 压力传感器和电子装置 |
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US20170273624A1 (en) | 2017-09-28 |
US10624582B2 (en) | 2020-04-21 |
WO2016091070A1 (zh) | 2016-06-16 |
CN104523285A (zh) | 2015-04-22 |
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