CN104521338A - 无线电模块和相关制造方法 - Google Patents

无线电模块和相关制造方法 Download PDF

Info

Publication number
CN104521338A
CN104521338A CN201280075091.4A CN201280075091A CN104521338A CN 104521338 A CN104521338 A CN 104521338A CN 201280075091 A CN201280075091 A CN 201280075091A CN 104521338 A CN104521338 A CN 104521338A
Authority
CN
China
Prior art keywords
plate
radio module
top board
base plate
front surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280075091.4A
Other languages
English (en)
Chinese (zh)
Inventor
廖纪昌
孙宁
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ericsson China Communications Co Ltd
Original Assignee
Ericsson China Communications Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson China Communications Co Ltd filed Critical Ericsson China Communications Co Ltd
Publication of CN104521338A publication Critical patent/CN104521338A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)
CN201280075091.4A 2012-08-10 2012-08-10 无线电模块和相关制造方法 Pending CN104521338A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/079979 WO2014023029A1 (en) 2012-08-10 2012-08-10 Radio module and relavent manufacturing method

Publications (1)

Publication Number Publication Date
CN104521338A true CN104521338A (zh) 2015-04-15

Family

ID=50067409

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280075091.4A Pending CN104521338A (zh) 2012-08-10 2012-08-10 无线电模块和相关制造方法

Country Status (5)

Country Link
US (1) US20150201496A1 (https=)
EP (1) EP2883432A4 (https=)
CN (1) CN104521338A (https=)
IN (1) IN2014DN10875A (https=)
WO (1) WO2014023029A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104777458A (zh) * 2015-04-22 2015-07-15 四川正冠科技有限公司 一体化雷达射频微波组件及其制作方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9363892B2 (en) * 2013-07-19 2016-06-07 Google Technology Holdings LLC Circuit assembly and corresponding methods
US20150022978A1 (en) * 2013-07-19 2015-01-22 Motorola Mobility Llc Circuit Assembly and Corresponding Methods
US10548248B2 (en) * 2016-02-10 2020-01-28 Dell Products, Lp System and method of unified cooling solution in an IOT device
JP2020512688A (ja) * 2017-03-09 2020-04-23 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． 消費者向け電子製品のメインボードおよび端末

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339628A (en) * 1980-08-20 1982-07-13 Northern Telecom Limited RF Shielding support for stacked electrical circuit boards
TW212261B (en) * 1992-03-09 1993-09-01 Matsushita Electric Industrial Co Ltd Electronic circuit device and manufacturing method
JP2630241B2 (ja) * 1993-06-17 1997-07-16 日本電気株式会社 電子機器
JP2692619B2 (ja) * 1994-11-24 1997-12-17 日本電気株式会社 無線送受信装置
US5777856A (en) * 1996-08-06 1998-07-07 Motorola, Inc. Integrated shielding and mechanical support
JP2001111232A (ja) * 1999-10-06 2001-04-20 Sony Corp 電子部品実装多層基板及びその製造方法
US6385055B1 (en) * 2000-12-08 2002-05-07 Scientific-Atlanta, Inc. Hinged electrical shielding for communication device
JP4037810B2 (ja) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 小型無線装置及びその実装方法
KR100617153B1 (ko) * 2004-08-25 2006-08-31 엘지전자 주식회사 이동통신 단말기
JP4844883B2 (ja) * 2006-07-20 2011-12-28 日本電気株式会社 電子機器及びプリント基板のｇｎｄ接続方法
CN201349392Y (zh) * 2008-12-05 2009-11-18 鸿富锦精密工业（深圳）有限公司 屏蔽装置及应用所述屏蔽装置的通信设备
US20100182765A1 (en) * 2009-01-21 2010-07-22 Delphi Technologies, Inc. Rf/emi shield

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104777458A (zh) * 2015-04-22 2015-07-15 四川正冠科技有限公司 一体化雷达射频微波组件及其制作方法

Also Published As

Publication number Publication date
US20150201496A1 (en) 2015-07-16
EP2883432A4 (en) 2016-05-11
WO2014023029A1 (en) 2014-02-13
IN2014DN10875A (https=) 2015-09-11
EP2883432A1 (en) 2015-06-17

Similar Documents

Publication Publication Date Title
US8147255B2 (en) Electrical connector assembly wth compact configuration
US7997927B2 (en) Dual socket connector
US9538652B2 (en) Electrical plug connector assembly
CN101924283B (zh) 具有安装至电路板的连接器的电连接器组件
CN104521338A (zh) 无线电模块和相关制造方法
US20110250766A1 (en) Connector assembly
EP3489858B1 (en) Mobile terminal and manufacturing method thereof
KR101317897B1 (ko) 브리지 공법을 이용한 루프안테나 양면 회로 형성 방법
US9485880B2 (en) Electric device for electric vehicle
US9207415B2 (en) Cable connector assembly with two printed circuit boards
CN102185195A (zh) 具有可分离的配合接口的互连组件
US20140213078A1 (en) Electronic device and circuit board module of the same
CN103889149B (zh) 电子装置和栅格阵列模块
US9516757B2 (en) Electric connector, plug-in module thereof and method for manufacturing plug-in module
CN217062469U (zh) 传输线路以及电路基板
US9466932B2 (en) Electrical connector and plug-in module for the same
CN104639693A (zh) 柔性连接件及移动终端
CN204681417U (zh) 柔性连接件及移动终端
US20230022850A1 (en) High performance modular die-cast enclosure system
US8884164B2 (en) Circuit board assembly with flexible printed circuit board and reinforcing plate
CN103247370A (zh) 柔性线缆组件
CN201478492U (zh) 电连接器
CN202395155U (zh) 一种连接杆及移动多媒体广播装置
CN110213888A (zh) 电路板组件及电路板加工方法
CN202817397U (zh) 电连接器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
ASS Succession or assignment of patent right

Owner name: ERICSSON (CHINA) COMMUNICATIONS CO., LTD.

Free format text: FORMER OWNER: TELEFON AB L.M. ERICSSON (SE)

Effective date: 20150420

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; TO: 100102 CHAOYANG, BEIJING

TA01 Transfer of patent application right

Effective date of registration: 20150420

Address after: Ericsson No. 5 building, 100102 Beijing city Chaoyang District Lize Street

Applicant after: Ericsson (China) Communications Co., Ltd.

Address before: Stockholm

Applicant before: Telefon AB L.M. Ericsson [SE]

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20150415