IN2014DN10875A - - Google Patents

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Info

Publication number
IN2014DN10875A
IN2014DN10875A IN10875DEN2014A IN2014DN10875A IN 2014DN10875 A IN2014DN10875 A IN 2014DN10875A IN 10875DEN2014 A IN10875DEN2014 A IN 10875DEN2014A IN 2014DN10875 A IN2014DN10875 A IN 2014DN10875A
Authority
IN
India
Prior art keywords
board
front surface
bottom board
top board
metal substrate
Prior art date
Application number
Inventor
Jichang Liao
Ning Sun
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Publication of IN2014DN10875A publication Critical patent/IN2014DN10875A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

A radio module comprises a top board (110) with all components mounted on a front surface (111) and a metal substrate on a back surface (112); a bottom board (120) with all components mounted on a front surface (121) and a metal substrate on a back surface (122) wherein the bottom board (120) is arranged so that the front surface (121) of the bottom board (120) is opposite to the front surface (111) of the top board (110); and at least one shielding board (130) provided between the top board (110) and the bottom board (120) with certain vertical spacing. The top board (110) the bottom board (120) and the at least one shielding board (130) are arranged to be substantially in alignment in a vertical direction and be fastened with one another. A board board electrical connection (140-1,140-2) is established at least between the top board (110) and the bottom board (120).
IN10875DEN2014 2012-08-10 2012-08-10 IN2014DN10875A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2012/079979 WO2014023029A1 (en) 2012-08-10 2012-08-10 Radio module and relavent manufacturing method

Publications (1)

Publication Number Publication Date
IN2014DN10875A true IN2014DN10875A (en) 2015-09-11

Family

ID=50067409

Family Applications (1)

Application Number Title Priority Date Filing Date
IN10875DEN2014 IN2014DN10875A (en) 2012-08-10 2012-08-10

Country Status (5)

Country Link
US (1) US20150201496A1 (en)
EP (1) EP2883432A4 (en)
CN (1) CN104521338A (en)
IN (1) IN2014DN10875A (en)
WO (1) WO2014023029A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150022978A1 (en) * 2013-07-19 2015-01-22 Motorola Mobility Llc Circuit Assembly and Corresponding Methods
US9363892B2 (en) * 2013-07-19 2016-06-07 Google Technology Holdings LLC Circuit assembly and corresponding methods
CN104777458A (en) * 2015-04-22 2015-07-15 四川正冠科技有限公司 Integrated radar radio-frequency microwave module and manufacturing method thereof
US10548248B2 (en) * 2016-02-10 2020-01-28 Dell Products, Lp System and method of unified cooling solution in an IOT device
KR20190124280A (en) * 2017-03-09 2019-11-04 후아웨이 테크놀러지 컴퍼니 리미티드 Motherboards and Terminals for Consumer Electronics

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4339628A (en) * 1980-08-20 1982-07-13 Northern Telecom Limited RF Shielding support for stacked electrical circuit boards
TW212261B (en) * 1992-03-09 1993-09-01 Matsushita Electric Ind Co Ltd Electronic circuit device and manufacturing method
JP2630241B2 (en) * 1993-06-17 1997-07-16 日本電気株式会社 Electronics
JP2692619B2 (en) * 1994-11-24 1997-12-17 日本電気株式会社 Wireless transceiver
US5777856A (en) * 1996-08-06 1998-07-07 Motorola, Inc. Integrated shielding and mechanical support
JP2001111232A (en) * 1999-10-06 2001-04-20 Sony Corp Electronic component mounting multilayer board and manufacturing method thereof
US6385055B1 (en) * 2000-12-08 2002-05-07 Scientific-Atlanta, Inc. Hinged electrical shielding for communication device
JP4037810B2 (en) * 2003-09-05 2008-01-23 Ｎｅｃアクセステクニカ株式会社 Small wireless device and mounting method thereof
KR100617153B1 (en) * 2004-08-25 2006-08-31 엘지전자 주식회사 Mobile Phone
JP4844883B2 (en) * 2006-07-20 2011-12-28 日本電気株式会社 Electronic device and printed circuit board GND connection method
CN201349392Y (en) * 2008-12-05 2009-11-18 鸿富锦精密工业（深圳）有限公司 Shielding device and communication apparatus using the shielding device
US20100182765A1 (en) * 2009-01-21 2010-07-22 Delphi Technologies, Inc. Rf/emi shield

Also Published As

Publication number Publication date
EP2883432A4 (en) 2016-05-11
WO2014023029A1 (en) 2014-02-13
US20150201496A1 (en) 2015-07-16
CN104521338A (en) 2015-04-15
EP2883432A1 (en) 2015-06-17

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