CN104505455B - Led灯丝及其成型方法 - Google Patents

Led灯丝及其成型方法 Download PDF

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CN104505455B
CN104505455B CN201410799647.5A CN201410799647A CN104505455B CN 104505455 B CN104505455 B CN 104505455B CN 201410799647 A CN201410799647 A CN 201410799647A CN 104505455 B CN104505455 B CN 104505455B
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led
support
led filament
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bracket
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门洪达
董拥刚
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Suzhou Jian micro Industry Technology Co., Ltd.
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SUZHOU TIANWEI INDUSTRY TECHNOLOGY Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Abstract

本发明公开了一种LED灯丝成型方法，包括：成型模条、支架、安装于支架的LED芯片、金属线及封装胶；LED灯丝成型包括以下步骤：1)将支架一侧裁切呈水平阵列的若干托盘，所述托盘之间设有间隙；2)将LED芯片通过胶固定于所述托盘的中心位置；3)相邻的LED芯片通过金属线串联在一起；4)将支架向下放入成型模条内并在成型模条内注入封装胶，放入烘箱内直至封装胶固化；5)将支架取出并将灯丝自支架裁切下来，所述托盘被所述封装胶包覆。所述LED灯丝于所述支架的一侧成型且在成型模条内成型后再从支架裁切下来，经过裁切即可分离为单个LED灯丝，成型方式简单，可实现全自动化大批量生产，并有效降低LED灯丝的成本。

Description

LED灯丝及其成型方法
技术领域
本发明涉及一种LED照明技术领域，特别涉及一种LED灯丝。
背景技术
由于LED灯丝采用LED作为光源，具有较好的发光效率，其应用越来越广泛。
现有LED灯泡主要成本集中于LED灯丝，通常LED灯丝主要以蓝宝石、硼化玻璃为基板，大多数公司都是使用模塑(molding)设备，虽然能封装出光色均匀的灯丝，但产量低，成本高，效益低，有些通过在基板上下点胶，能小批量产，但由于侧面没有荧光胶覆盖，出光不够均匀，存在色差。
因此，鉴于以上问题，有必要提出一种LED灯丝的制造方法，以实现大批量生产且出光效果均匀。
发明内容
本发明的目地在于提供一种可实现批量生产的LED灯丝。
为实现上述目地，本发明采用如下技术方案：一种LED灯丝成型方法，包括：成型模条、支架、安装于支架的LED芯片、将相邻的LED芯片连接的金属线及封装胶；所述LED灯丝成型包括以下步骤：
1)将支架一侧裁切呈水平阵列的若干托盘，所述托盘之间设有间隙；
2)将LED芯片通过胶固定于所述托盘的中心位置；
3)相邻的LED芯片通过金属线串联在一起；
4)将支架向下放入成型模条内并在成型模条内注入封装胶，再放入烘箱内直至封装胶固化；
5)将支架取出并将灯丝自支架裁切下来，所述托盘被所述封装胶包覆。
在优选的实施方式中，所述支架采用金属材料制成。
在优选的实施方式中，所述金属线为金线或铜线。
在优选的实施方式中，成型模条包括向内凹陷的成型卡槽及自成型卡槽向上延伸的夹持臂，所述封装胶位于所述成型卡槽内，所述夹持臂用以固定支架。
在优选的实施方式中，所述封装胶由液态环氧树脂与荧光粉混合而成。
在优选的实施方式中，所述LED灯丝包括延伸至外侧的一对引脚，所述引脚自LED灯丝的两端向外延伸暴露于外侧。
在优选的实施方式中，一种LED灯丝，包括：呈水平阵列的若干托盘、固定于所述托盘中心的LED芯片、将相邻的LED芯片连接的金属线及封装胶，所述托盘之间设有间隙，所述托盘位于一支架的一侧。
在优选的实施方式中，所述支架采用金属材料制成，所述金属线为金线或铜线。
在优选的实施方式中，所述LED灯丝在一成型模条内成型，所述成型模条包括向内凹陷的成型卡槽及自成型卡槽向上延伸的夹持臂，所述封装胶位于所述成型卡槽内，所述夹持臂用以固定支架。
在优选的实施方式中，所述封装胶由液态环氧树脂与荧光粉混合而成。
与现有技术相比，所述LED灯丝于所述支架的一侧成型且在成型模条内成型后再从支架裁切下来，经过裁切即可分离为单个LED灯丝，成型方式简单，可实现全自动化大批量生产，并有效降低LED灯丝的成本。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本发明支架的立体图。
图2与本发明成型模条的立体图。
图3为支架放入成型模条的立体图。
图4为LED灯丝的立体图。
图5为沿图4中A-A线的剖视图。
具体实施方式
请参阅图1至5，本发明为一种LED灯丝100的成型方法，所述LED灯丝100位于支架1的一侧且在成型模条200内成型后再从支架1裁切下来，经过裁切即可分离为单个LED灯丝100，成型方式简单，可实现全自动化大批量生产，并有效降低LED灯丝100的成本。
所述支架1分为连续的若干段可一次性成型若干个灯丝100，以实现大批量生产，以下就支架1的其中一段加以描述，支架1包括基板11、自基板11一侧延伸用于安装LED芯片2的若干托盘12及连接托盘12与基板的引脚13，所述LED灯丝100包括托盘12、安装于托盘12的LED芯片2及封装胶3，所述托盘12呈阵列方式水平排布；单个阵列内的托盘12数量可根据灯丝的长度需求设置，其数量越多LED灯丝100的长度越长。所述支架1采用金属材料制成，使支架1具有很好的强度，且易于加工，散热性好，并有效增长灯丝100的使用寿命，在本发明中，金属材料可为铜材或铁材，但不仅限于上述两种材料；所述支架1可通过冲压工艺一体成型。
所述托盘12之间存在间隙，以保证托盘12之间具有足够的透光间隙，从而避免互相遮挡而在LED灯丝100中出现暗区。
LED芯片2安装于所述支架1的托盘12上，所述LED芯片2安装于所述托盘12的同一侧，所述LED芯片2通过胶5固定于所述托盘12的中心位置，各LED芯片2之间通过金属线21串联在一起，位于托盘12两侧的LED芯片2与引脚13连接，在本发明中，所述金属线21为金线或铜线。
成型模条200包括向内凹陷的成型卡槽210及自成型卡槽210向上延伸的夹持臂220，所述LED芯片2安装完成后，将支架1整体向下放入所述成型模条200内，所述托盘12延伸入所述成型模条200的成型卡槽210内，所述基板11夹持于所述夹持臂220之间固定，最后向所述成型卡槽210内注入封装胶3成型，所述封装胶3由固定比例的液态环氧树脂与荧光粉的混合物混合而成，该封装胶3流动性好，方便灌封成型，且价格较低。随后放入烘箱内，待封装胶3固定后，将支架1从成型模条200内取出，即可得到成型的LED灯丝100。
所述LED灯丝100成型后，通过裁切将所述LED灯丝100自所述支架1上裁切下来，所述LED灯丝100的引脚13自LED灯丝100的两端暴露于外侧，同时，可根据使用者的不同需求将引脚13裁切至不同的位置及形状。
本发明所述LED灯丝100于所述支架1的一侧成型且在成型模条200内成型后再从支架1裁切下来，经过裁切即可分离为单个LED灯丝100，成型方式简单，可实现全自动化大批量生产，并有效降低LED灯丝100的成本。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下，在其它实施例中实现。因此，本发明将不会被限制于本文所示的这些实施例，而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。

Claims (6)

1.一种LED灯丝成型方法，其特征在于，包括：成型模条、支架、安装于支架的LED芯片、将相邻的LED芯片连接的金属线及封装胶；所述LED灯丝成型包括以下步骤：
1)将支架一侧裁切呈水平阵列的若干托盘，所述托盘之间设有间隙；
2)将LED芯片通过胶固定于所述托盘的中心位置；
3)相邻的LED芯片通过金属线串联在一起；
4)将支架向下放入成型模条内并在成型模条内注入封装胶，再放入烘箱内直至封装胶固化；
5)将支架取出并将灯丝自支架裁切下来，所述托盘被所述封装胶包覆。
2.如权利要求1所述的LED灯丝成型方法，其特征在于：所述支架采用金属材料制成。
3.如权利要求1所述的LED灯丝成型方法，其特征在于：所述金属线为金线或铜线。
4.如权利要求1所述的LED灯丝成型方法，其特征在于：所述成型模条包括向内凹陷的成型卡槽及自成型卡槽向上延伸的夹持臂，所述封装胶位于所述成型卡槽内，所述夹持臂用以固定支架。
5.如权利要求1所述的LED灯丝成型方法，其特征在于：所述封装胶由液态环氧树脂与荧光粉混合而成。
6.如权利要求1所述的LED灯丝成型方法，其特征在于：所述LED灯丝包括延伸至外侧的一对引脚，所述引脚自LED灯丝的两端向外延伸暴露于外侧。
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TW201705557A (zh) * 2016-10-26 2017-02-01 Liquidleds Lighting Corp 具有散熱結構的led燈絲及應用該led燈絲的led燈泡
CN108735874B (zh) * 2018-08-09 2024-02-13 东莞市欧思科光电科技有限公司 热固型封装支架与嵌入式通讯ic集成封装的led及其工艺

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CN204348760U (zh) * 2014-12-19 2015-05-20 苏州天微工业技术有限公司 Led灯丝

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CN202884530U (zh) * 2012-07-28 2013-04-17 王定锋 Led电路模组
CN203733835U (zh) * 2014-01-06 2014-07-23 深圳市瑞丰光电子股份有限公司 Led灯丝及发光装置
CN204348760U (zh) * 2014-12-19 2015-05-20 苏州天微工业技术有限公司 Led灯丝

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