CN104505355A - Method and mold for rapidly finishing chip edge sheet buckling operation, mold manufacturing method and mold storing device - Google Patents
Method and mold for rapidly finishing chip edge sheet buckling operation, mold manufacturing method and mold storing device Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 53
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 34
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 60
- 229910052742 iron Inorganic materials 0.000 claims description 30
- 238000005520 cutting process Methods 0.000 claims description 20
- 239000012528 membrane Substances 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000000428 dust Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 12
- 238000002360 preparation method Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000013461 design Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 229920006267 polyester film Polymers 0.000 description 15
- 238000003860 storage Methods 0.000 description 15
- 210000004276 hyalin Anatomy 0.000 description 9
- 238000005266 casting Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 6
- 239000007779 soft material Substances 0.000 description 4
- -1 polybutylene terephthalate Polymers 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 208000003464 asthenopia Diseases 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention discloses a method and a mold for rapidly finishing chip edge sheet buckling operation, a mold manufacturing method and a mold storing device, and belongs to the field of semiconductor devices. The mold is a wafer of which the diameter D=78-[x]/2mm ([x] is an integer between 6 and 20); a blue film and planar release paper are taken as manufacturing materials; the edge of the mold is provided with a notch. The mold disclosed by the invention is simple in structure, is reasonable in design, is easy to manufacture, and has an unexpected use effect. By adopting the mold, the batch edge buckling operation of a chip can be realized. Compared with the conventional complex edge-buckling method, the method disclosed by the invention has the advantages that the efficiency is increased by 70-80 percent, a good edge-buckling effect is achieved, the edge of the edge-buckled chip is flush, the chip is free from damage, and the cost is low.
Description
Technical field
The invention belongs to field of manufacturing semiconductor devices, more particularly, relate to a kind of complete the sheet operation of chip button limit fast method and mould and mould making method and mold storage device.
Background technology
Along with light-emitting diode (LED) is in the appearance of nineteen sixty, LED starts to apply widely in our surrounding environment, play very important role in daily life, become one of the most valued light source technology, as various indicator light, display light source and lighting apparatus etc. can see the application of LED.Compared to traditional lighting source as fluorescent lamp, incandescent osram lamp etc., the advantages such as LED has high brightness, low-power consumption, the life-span is long, startup is fast, volume is little, environmental protection and energy saving, not easily generation visual fatigue, there is vast potential for future development, be subject to people's extensive concern.The manufacture craft of LED chip mainly comprises epitaxial growth, technique before chip, grinding and cutting, point survey and sorting etc., the important means of inspection LED photovoltaic performance is LED photovoltaic test, after treating the photo electric parameter testing of LED chip, the difference of contrast photo electric parameter need process chip, the poor chip part of photo electric parameter will be separated as limit sheet and the good chip of photo electric parameter, the operational method that deduction limit sheet is conventional first carries out pour mask operation to chip, then the limit sheet part of the mould fixed chip in the cavity of multiple embedded different-diameter size is adopted, limit sheet part is deducted after using heater heating.Owing to adopting the method not only consuming time but also consumptive material, have a strong impact on the production efficiency of LED chip, thus be badly in need of one more easily method button limit sheet carried out to chip operate, avoid the triviality of operation.
Through retrieval, China Patent Publication No. CN 103633198A discloses a kind of LED chip manufacture method and LED chip, and this manufacture method comprises the patterned substrate adopting wafer fabrication with cutting passageway; At the described patterned substrate growing epitaxial layers with cutting passageway; The wafer of the complete epitaxial loayer of described growth is etched, make LED chip, wherein, not etching at least partially of region corresponding to described cutting passageway is retained in etching process, the LED chip manufacture method that this invention provides and LED chip, can improve the luminous efficiency of LED chip further, but the manufacture method in this invention does not improve the button limit sheet method of operation in LED chip production process.China Patent Publication No. CN 103612015A discloses a kind of LED wafer cutting method, the cutting method of this invention is when cutting, first formed on wafer with the common cutting laser of low-power and cut trace together, and then cutting trace cut in common laser with stealthy cutting laser carries out stealth cutting, this cutting method can fundamentally in conjunction with wafer and the stealthy technique of cutting of the various rete of evaporation, avoid the fragmentation when cut channel formed due to cutting causes evaporation rete, but this cutting method cost is high, efficiency is low, be not suitable for the deduction of LED chip limit sheet, therefore need research one more easily method button limit sheet carried out to chip operate, avoid the triviality of operation.
Summary of the invention
1. the problem that will solve
For consuming time, the problem such as complex operation, production efficiency are low that sheet operation in existing LED chip button limit exists, the invention provides a kind of complete the sheet operation of chip button limit fast method and mould and mould making method and mold storage device, mould of the present invention is used to carry out chip when buckleing limit sheet operation, without the need to being heated by heater, can fast limit sheet be poured in finished film by means of only blue film above simple pressing sheet position, chip limit, complete the button limit operation of chip.
2. technical scheme
In order to solve the problem, the technical solution adopted in the present invention is as follows:
A kind of mould completing the sheet operation of chip button limit fast, mould is disc-shaped, and making material is blue film and plane release liners, and described die edge has a kerf, the distance of described otch distance mold center is the 1/7-1/8 of mould diameter, and the thickness of mould is 1-2mm.
Preferably, diameter D=78-[the x]/2mm of described mould, wherein x is the percent value of limit sheet in chip photo Parameter Map, and [x] expression is rounded to units according to the principle that rounds up to x.
Preferably, described [x] is the integer between 6-20.
Above-mentioned a kind of manufacture method completing the mould of chip button limit sheet operation fast, the steps include:
A () prepares material: prepare blue film, plane release liners, ruler, pen, cutter and rope;
B blue film and plane release liners are heated to 30-35 DEG C by () on heating station, then the adhesive faces of blue film and plane release liners exasperate are fitted, drive the bubble between blue film and plane release liners away, obtain mould material;
C (), after the mould material obtained in step (b) is cooled to room temperature, utilizes ruler, pen and rope to draw the shape of mould according to claim 1 at the release paper of the plane of mould material;
D () obtains mould with cutter according to the mold shape cutting drawn in step (c).
Complete a method for chip button limit sheet operation fast, the steps include:
(1) material is prepared: transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation;
(2) by finished film tiling on the table, finished film is the composite membrane that blue film and release liners are formed, and iron hoop, is then placed in the middle part of finished film upward by blue film, to be fastened by iron hoop iron hoop with the blue film of iron hoop periphery;
(3) be placed on by the above-mentioned mould prepared in the finished film in the middle of iron hoop, the light face of mould contacts with the blue film of finished film, will wait that the chip detaining limit sheet is placed on mould;
(4) middle transferring film sticked on the chip waiting to detain limit sheet, then will wait that the black and white ring detaining limit sheet chip surrounding takes out, wherein, the size of transferring film is greater than the size of waiting to detain limit sheet chip;
(5) non-dust cloth is made the ball that diameter is 2-3cm, then press mould outer edge chip in step (4) with ball, chip is disconnected at die edge place;
(6) after pressing terminates, middle transferring film opened from edge, the chip having detained limit sheet is uncovered together along with middle transferring film, and the limit sheet of chip is stayed in finished film.
Preferably, described middle transferring film is the blue film of individual layer.
Preferably, the blue film viscosity in described step (2) in finished film is greater than the viscosity of middle transferring film.
Preferably, be 5-25N with ball by the size of the power of compression mould outer edge chip in described step (5).
Above-mentioned a kind of storing unit completing the mould of chip button limit sheet operation fast, comprise storing unit main body (1) and mold storing box (2), described storing unit main body (1) comprises the first mainboard (101) and the second mainboard (102), and the first mainboard (101) and the second mainboard (102) connect into triangle; Described mold storing box (2) is positioned on the first mainboard (101) and the second mainboard (102), and the bottom of mold storing box (2) is semicircle, and size is mated with above-mentioned mould.
Preferably, the angle between described the first mainboard (101) and the second mainboard (102) is 30-150 °; The first pole (103) and the second pole (104) is provided with between described the first mainboard (101) and the second mainboard (102); Described the first mainboard (101) and the second mainboard (102) are respectively equipped with 1-20 mold storing box (2); The top of described mold storing box (2) is rectangle.
3. beneficial effect
Compared to prior art, beneficial effect of the present invention is:
(1) mould completing the sheet operation of chip button limit fast of the present invention, can realize the batch button limit operation to chip, and compared with existing loaded down with trivial details button limit method, efficiency improves 70-80%, and button limit is effective;
(2) die edge of the present invention has a kerf, facilitate mold use, diameter D=78-[the x]/2mm of mould, determines the size of mould according to the BIN figure of the chip of each batch, control the removal amount of chip limit sheet to the full extent, high financial profit;
(3) mould making method of the present invention, blue film is sticked to plane release liners surface under 30-35 DEG C of condition, the adhesive faces of blue film and the plane release liners exasperate effect of fitting is best with this understanding, number of bubbles is between the two minimum, finally prepd mould material surface smoothness is high, avoids the damage to chip in the sheet operating process of chip button limit;
(4) be 300-500 μm for making the blue film thickness of mould in the present invention, basic weight is 90-100g/cm
2extension rate is 80-100%, 180 ° of peel adhesion are 0.5-1.5N/mm, hardness is moderate, it is most suitable that the mould that the blue film of this specification is made buckles limit sheet for chip, is unlikely to too hard, causes the damage to chip, also be unlikely to too soft pressing yielding, the button limit sheet operation to chip cannot be completed;
(5) a kind of method completing the sheet operation of chip button limit fast provided by the invention, using with non-dust cloth is that the ball that material is made presses chip limit sheet part, the limit sheet part of chip is disconnected at die edge place, in ingenious utilization, transferring film is different with the viscosity of finished film separates chip and limit sheet, efficiency is high, and compared with traditional button limit sheet method, every sheet chip saves a middle transferring film, and without the need to heating, save production cost;
(6) a kind of chip button limit sheet method in the present invention, the power of the non-dust cloth ball pressing chip that diameter is 2-3cm is used to control between 5-25N, the effect of carrying out detaining limit sheet under this scope dynamics is best, and detained the chip edge after the sheet of limit neat, the fragment rate of chip is low;
(7) mould structure of the present invention is simple, but reasonable in design, is easy to manufacture, and has beyond thought result of use, and the production efficiency making chip production enterprise detain limit sheet improves greatly;
(8) mold storage device of the present invention is for depositing the mould of button limit sheet operation, and convenient and practical, mold storage device is also furnished with the clip fetching chip, and the front end of clip is that soft material is made, and can not damage mould; Mold storing box on mold storage device is the groove in storing unit main body, and be semicircle bottom it, for depositing mould, top is rectangle, conveniently fetches.
Accompanying drawing explanation
Fig. 1 is the structural representation of mould in the present invention;
Fig. 2 is the structural representation of mold storage device in the present invention;
Fig. 3 is the front view of mold storage device in the present invention;
Fig. 4 is the structural representation of clip supporting with mold storage device in the present invention.
In figure: 1, storing unit main body; 101, the first mainboard; 102, the second mainboard; 103, the first pole; 104, the second pole; 2, mold storing box; 3, clip.
Embodiment
Below in conjunction with specific embodiment, the present invention is described further.
Embodiment 1
As shown in Figure 1, a kind of mould completing the sheet operation of chip button limit fast, mould is disc-shaped, diameter D=78-[x]/2mm, wherein x is the percent value of limit sheet in chip photo Parameter Map, [x] represents and is rounded to units according to the principle that rounds up to x (the limit sheet part of chip is the poor chip of photo electric parameter, for guaranteeing that the chip of core does not mix the poor chip of photo electric parameter, ratio can be relaxed in right amount during button limit sheet, thus improve the quality of center dies.Therefore in enterprise practical production process, when [x] is for being 13 to make the mould of corresponding size by [x] during 6-10, when [x] is for being 18 to make the mould of corresponding size by [x] during 11-15, [x] is 16-20 by [x] is 23 to make the mould of corresponding size, the mould of preparation 3 sizes.), in the present embodiment, [x] is 6, be 13 to make the mould of corresponding size by [x] in actual production process, the making material of mould is blue film and plane release liners, and die edge has a kerf, the distance of otch distance mold center is 1/7 of mould diameter, and the thickness of mould is 1mm.
The preparation process of the blue film in the present embodiment is: melted by polybutylene terephthalate (polyester) heating raw materials, then with PET hyaline membrane (thickness is 150 μm) for basic unit, a polyester film layer is scraped its surface (being designated as A face) by flat membrane casting equipment, knifing speed is 10mm/s, the thickness of polyester film is 80 μm, after polyester film cooling film forming, a polyester film layer (thickness is 150 μm) is scraped on another surface (B face) of PET hyaline membrane by flat membrane casting equipment, after the polyester film cooling film forming in PET hyaline membrane B face, one deck acrylic pressure-sensitive adhesive is smeared at its surface uniform, obtain in the present embodiment, making the blue film detained limit die and use.
In order to obtain above-mentioned mould, a kind of manufacture method completing the mould of chip button limit sheet operation fast, the steps include:
A () prepares material: prepare blue film, plane release liners, ruler, pen, cutter and rope;
B blue film and plane release liners are heated to 30 DEG C by () on heating station, then the adhesive faces of blue film and plane release liners exasperate are fitted, drive the bubble between blue film and plane release liners away, obtain mould material;
C (), after the mould material obtained in step (b) is cooled to room temperature, utilizes ruler, pen and rope to draw the shape of mould according to claim 1 at the release paper of the plane of mould material;
D () obtains mould with cutter according to the mold shape cutting drawn in step (c).
The surface smoothness of mould prepared by the present embodiment is high, bubble-free between blue film and plane release liners, and the thickness of blue film is 380 μm, and basic weight is 93g/cm
2, extension rate is 88%, 180 ° of peel adhesion is 0.9N/mm, and hardness is moderate, to the damage that can not cause during chip button limit sheet chip, can be detained from chip by limit sheet easily simultaneously, easy to use, economic and practical.
Complete a method for chip button limit sheet operation fast, the steps include:
(1) prepare material: transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation, wherein, middle transferring film is the blue film of individual layer, and finished film is the composite membrane that blue film and release liners are formed, and the blue film viscosity in finished film is greater than the viscosity of middle transferring film;
(2) by finished film tiling on the table, iron hoop, is then placed in the middle part of finished film upward by blue film, to be fastened by iron hoop iron hoop with the blue film of iron hoop periphery;
(3) the above-mentioned mould prepared is placed in the finished film in the middle of iron hoop, the light face of mould contacts with the blue film of finished film, to wait that the chip detaining limit sheet is placed on mould, wait that the chip surrounding of detaining limit sheet has black and white ring, the effect of black and white ring be conveniently fetch chip and make chip fetch in process not easily damaged;
(4) middle transferring film sticked on the chip waiting to detain limit sheet, then will wait that the black and white ring detaining limit sheet chip surrounding takes out, wherein, the size of transferring film is greater than the size of waiting to detain limit sheet chip;
(5) non-dust cloth is made the ball that diameter is 3cm, then press mould outer edge chip in step (4) with ball with the power of 25N size, chip is disconnected at die edge place;
(6) after pressing terminates, middle transferring film opened from edge, the chip having detained limit sheet is uncovered together along with middle transferring film, and the limit sheet of chip is stayed in finished film.
Limit sheet method is detained in the present embodiment, the button limit sheet operation to a slice chip within average 20 seconds, can be completed, and traditional button limit sheet method needs first pour mask, then at the condition lower buckle side sheet of heating, complete and 80 seconds are on average needed to the button limit sheet operation of a slice chip, in the present embodiment, mould makes the efficiency of buckleing limit sheet improve 75%, has very high using value.
In order to deposit the above-mentioned mould for detaining limit sheet operation, a kind of mold storage device, as shown in Figures 2 and 3, comprise storing unit main body 1 and mold storing box 2, storing unit main body 1 comprises the first mainboard 101 and the second mainboard 102, first mainboard 101 and the second mainboard 102 connect into triangle, and the angle between the first mainboard 101 and the second mainboard 102 is 30 °, are provided with the first pole 103 and the second pole 104 between the first mainboard 101 and the second mainboard 102; Mold storing box 2 is positioned on the first mainboard 101 and the second mainboard 102, first mainboard 101 and the second mainboard 102 are respectively equipped with 1 mold storing box 2, the bottom of mold storing box 2 is semicircle, size is mated with the mould described in claim 1, the top of mold storing box 2 is rectangle, facilitates fetching of mould.The mold storage device of the present embodiment also comprises clip, and as shown in Figure 4, the front end of clip is that soft material is made, and can not damage mould, and is conveniently taken out from storing unit by mould.
Embodiment 2
A kind of mould completing the sheet operation of chip button limit fast, mould is disc-shaped, diameter D=78-[x]/2mm, wherein x is the percent value of limit sheet in chip photo Parameter Map, [x] expression is rounded to units according to the principle that rounds up to x, in the present embodiment, [x] is 13, be 18 to make the mould of corresponding size by [x] in actual production process, the making material of mould is blue film and plane release liners, described die edge has a kerf, the distance of otch distance mold center is 2/15 of mould diameter, and the thickness of mould is 2mm.
The preparation process of the blue film in the present embodiment is: melted by polybutylene terephthalate (polyester) heating raw materials, then with PET hyaline membrane (thickness is 100 μm) for basic unit, a polyester film layer is scraped its surface (being designated as A face) by flat membrane casting equipment, knifing speed is 10mm/s, the thickness of polyester film is 80 μm, after polyester film cooling film forming, a polyester film layer (thickness is 120 μm) is scraped on another surface (B face) of PET hyaline membrane by flat membrane casting equipment, after the polyester film cooling film forming in PET hyaline membrane B face, one deck water-borne acrylic resin is smeared at its surface uniform, obtain in the present embodiment, making the blue film detained limit die and use.
In order to obtain above-mentioned mould, a kind of manufacture method completing the mould of chip button limit sheet operation fast, the steps include:
A () prepares material: prepare blue film, plane release liners, ruler, pen, cutter and rope;
B blue film and plane release liners are heated to 35 DEG C by () on heating station, then the adhesive faces of blue film and plane release liners exasperate are fitted, drive the bubble between blue film and plane release liners away, obtain mould material;
C (), after the mould material obtained in step (b) is cooled to room temperature, utilizes ruler, pen and rope to draw the shape of mould according to claim 1 at the release paper of the plane of mould material;
D () obtains mould with cutter according to the mold shape cutting drawn in step (c).
The surface smoothness of mould prepared by the present embodiment is high, bubble-free between blue film and plane release liners, and the thickness of blue film is 300 μm, and basic weight is 90g/cm
2, extension rate is 100%, 180 ° of peel adhesion is 0.5N/mm, and hardness is moderate, to the damage that can not cause during chip button limit sheet chip, can be detained from chip by limit sheet easily simultaneously, easy to use, economic and practical.
Complete a method for chip button limit sheet operation fast, the steps include:
(1) prepare material: transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation, wherein, middle transferring film is the blue film of individual layer, and finished film is the composite membrane that blue film and release liners are formed, and the blue film viscosity in finished film is greater than the viscosity of middle transferring film;
(2) by finished film tiling on the table, iron hoop, is then placed in the middle part of finished film upward by blue film, to be fastened by iron hoop iron hoop with the blue film of iron hoop periphery;
(3) be placed on by the above-mentioned mould prepared in the finished film in the middle of iron hoop, the light face of mould contacts with the blue film of finished film, will wait that the chip detaining limit sheet is placed on mould;
(4) middle transferring film sticked on the chip waiting to detain limit sheet, then will wait that the black and white ring detaining limit sheet chip surrounding takes out, wherein, the size of transferring film is greater than the size of waiting to detain limit sheet chip;
(5) non-dust cloth is made the ball that diameter is 2cm, then press mould outer edge chip in step (4) with ball with the power of 18N size, chip is disconnected at die edge place;
(6) after pressing terminates, middle transferring film opened from edge, the chip having detained limit sheet is uncovered together along with middle transferring film, and the limit sheet of chip is stayed in finished film.
Limit sheet method is detained in the present embodiment, the button limit sheet operation to a slice chip within average 18 seconds, can be completed, and traditional button limit sheet method needs first pour mask, then at the condition lower buckle side sheet of heating, complete and 80 seconds are on average needed to the button limit sheet operation of a slice chip, in the present embodiment, mould makes the efficiency of buckleing limit sheet improve 85%, has very high using value.
In order to deposit the above-mentioned mould for detaining limit sheet operation, a kind of mold storage device, as shown in Figures 2 and 3, comprise storing unit main body 1 and mold storing box 2, storing unit main body 1 comprises the first mainboard 101 and the second mainboard 102, first mainboard 101 and the second mainboard 102 connect into triangle, and the angle between the first mainboard 101 and the second mainboard 102 is 150 °, are provided with the first pole 103 and the second pole 104 between the first mainboard 101 and the second mainboard 102; Mold storing box 2 is positioned on the first mainboard 101 and the second mainboard 102, first mainboard 101 and the second mainboard 102 are respectively equipped with 10 mold storing boxes 2, the bottom of mold storing box 2 is semicircle, size is mated with the mould described in claim 1, the top of mold storing box 2 is rectangle, facilitates fetching of mould.The mold storage device of the present embodiment also comprises clip, and as shown in Figure 4, the front end of clip is that soft material is made, and can not damage mould, and is conveniently taken out from storing unit by mould.
Embodiment 3
A kind of mould completing the sheet operation of chip button limit fast, mould is disc-shaped, diameter D=78-[x]/2mm, wherein x is the percent value of limit sheet in chip photo Parameter Map, [x] expression is rounded to units according to the principle that rounds up to x, in the present embodiment, [x] is 20, be 23 to make the mould of corresponding size by [x] in actual production process, the making material of mould is blue film and plane release liners, described die edge has a kerf, the distance of otch distance mold center is 1/8 of mould diameter, and the thickness of mould is 1.5mm.
The preparation process of the blue film in the present embodiment is: melted by polybutylene terephthalate (polyester) heating raw materials, then with PET hyaline membrane (thickness is 300 μm) for basic unit, a polyester film layer is scraped its surface (being designated as A face) by flat membrane casting equipment, knifing speed is 10mm/s, the thickness of polyester film is 90 μm, after polyester film cooling film forming, a polyester film layer (thickness is 110 μm) is scraped on another surface (B face) of PET hyaline membrane by flat membrane casting equipment, after the polyester film cooling film forming in PET hyaline membrane B face, one deck acrylic pressure-sensitive adhesive is smeared at its surface uniform, obtain in the present embodiment, making the blue film detained limit die and use.
In order to obtain above-mentioned mould, a kind of manufacture method completing the mould of chip button limit sheet operation fast, the steps include:
A () prepares material: prepare blue film, plane release liners, ruler, pen, cutter and rope;
B blue film and plane release liners are heated to 33 DEG C by () on heating station, then the adhesive faces of blue film and plane release liners exasperate are fitted, drive the bubble between blue film and plane release liners away, obtain mould material;
C (), after the mould material obtained in step (b) is cooled to room temperature, utilizes ruler, pen and rope to draw the shape of mould according to claim 1 at the release paper of the plane of mould material;
D () obtains mould with cutter according to the mold shape cutting drawn in step (c).
The surface smoothness of mould prepared by the present embodiment is high, bubble-free between blue film and plane release liners, and the thickness of blue film is 500 μm, and basic weight is 100g/cm
2, extension rate is 80%, 180 ° of peel adhesion is 1.5N/mm, and hardness is moderate, to the damage that can not cause during chip button limit sheet chip, can be detained from chip by limit sheet easily simultaneously, easy to use, economic and practical.
Complete a method for chip button limit sheet operation fast, the steps include:
(1) material is prepared: transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation;
(2) by finished film tiling on the table, finished film is the composite membrane that blue film and release liners are formed, and iron hoop, is then placed in the middle part of finished film upward by blue film, to be fastened by iron hoop iron hoop with the blue film of iron hoop periphery;
(3) be placed on by the above-mentioned mould prepared in the finished film in the middle of iron hoop, the light face of mould contacts with the blue film of finished film, will wait that the chip detaining limit sheet is placed on mould;
(4) middle transferring film sticked on the chip waiting to detain limit sheet, then will wait that the black and white ring detaining limit sheet chip surrounding takes out, wherein, the size of transferring film is greater than the size of waiting to detain limit sheet chip;
(5) non-dust cloth is made the ball that diameter is 2cm, then press mould outer edge chip in step (4) with ball with the power of 5N size, chip is disconnected at die edge place;
(6) after pressing terminates, middle transferring film opened from edge, the chip having detained limit sheet is uncovered together along with middle transferring film, and the limit sheet of chip is stayed in finished film.
Limit sheet method is detained in the present embodiment, the button limit sheet operation to a slice chip within average 25 seconds, can be completed, and traditional button limit sheet method needs first pour mask, then at the condition lower buckle side sheet of heating, complete and 80 seconds are on average needed to the button limit sheet operation of a slice chip, in the present embodiment, mould makes the efficiency of buckleing limit sheet improve 69%, has very high using value.
In order to deposit the above-mentioned mould for detaining limit sheet operation, a kind of mold storage device, as shown in Figures 2 and 3, comprise storing unit main body 1 and mold storing box 2, storing unit main body 1 comprises the first mainboard 101 and the second mainboard 102, first mainboard 101 and the second mainboard 102 connect into triangle, and the angle between the first mainboard 101 and the second mainboard 102 is 90 °, are provided with the first pole 103 and the second pole 104 between the first mainboard 101 and the second mainboard 102; Mold storing box 2 is positioned on the first mainboard 101 and the second mainboard 102, first mainboard 101 and the second mainboard 102 are respectively equipped with 20 mold storing boxes 2, the bottom of mold storing box 2 is semicircle, size is mated with the mould described in claim 1, the top of mold storing box 2 is rectangle, facilitates fetching of mould.The mold storage device of the present embodiment also comprises clip, and as shown in Figure 4, the front end of clip is that soft material is made, and can not damage mould, and is conveniently taken out from storing unit by mould.
Claims (10)
1. one kind completes the mould of chip button limit sheet operation fast, it is characterized in that: mould is disc-shaped, making material is blue film and plane release liners, and described die edge has a kerf, the distance of described otch distance mold center is the 1/7-1/8 of mould diameter, and the thickness of mould is 1-2mm.
2. a kind of mould completing the sheet operation of chip button limit fast according to claim 1, it is characterized in that: diameter D=78-[the x]/2mm of described mould, wherein x is the percent value of limit sheet in chip photo Parameter Map, and [x] expression is rounded to units according to the principle that rounds up to x.
3. a kind of mould completing the sheet operation of chip button limit fast according to claim 2, is characterized in that: described [x] is the integer between 6-20.
4. a kind of manufacture method completing the mould of chip button limit sheet operation fast according to claim 1, the steps include:
A () prepares material: prepare blue film, plane release liners, ruler, pen, cutter and rope;
B blue film and plane release liners are heated to 30-35 DEG C by () on heating station, then the adhesive faces of blue film and plane release liners exasperate are fitted, drive the bubble between blue film and plane release liners away, obtain mould material;
C (), after the mould material obtained in step (b) is cooled to room temperature, utilizes ruler, pen and rope to draw the shape of mould according to claim 1 at the release paper of the plane of mould material;
D () obtains mould with cutter according to the mold shape cutting drawn in step (c).
5. complete a method for chip button limit sheet operation fast, the steps include:
(1) material is prepared: the mould described in transferring film, finished film, non-dust cloth, iron hoop and claim 1 in preparation;
(2) by finished film tiling on the table, finished film is the composite membrane that blue film and release liners are formed, and iron hoop, is then placed in the middle part of finished film upward by blue film, to be fastened by iron hoop iron hoop with the blue film of iron hoop periphery;
(3) be placed on by the mould prepared in claim 4 in the finished film in the middle of iron hoop, the light face of mould contacts with the blue film of finished film, will wait that the chip detaining limit sheet is placed on mould;
(4) middle transferring film sticked on the chip waiting to detain limit sheet, then will wait that the black and white ring detaining limit sheet chip surrounding takes out, wherein, the size of transferring film is greater than the size of waiting to detain limit sheet chip;
(5) non-dust cloth is made the ball that diameter is 2-3cm, then press mould outer edge chip in step (4) with ball, chip is disconnected at die edge place;
(6) after pressing terminates, middle transferring film opened from edge, the chip having detained limit sheet is uncovered together along with middle transferring film, and the limit sheet of chip is stayed in finished film.
6. a kind of method completing the sheet operation of chip button limit fast according to claim 5, is characterized in that: described middle transferring film is the blue film of individual layer.
7. a kind of method completing the sheet operation of chip button limit fast according to claim 6, is characterized in that: the blue film viscosity in described step (2) finished film is greater than the viscosity of middle transferring film.
8. a kind of method completing the sheet operation of chip button limit fast according to claim 5, is characterized in that: be 5-25N with ball by the size of the power of compression mould outer edge chip in described step (5).
9. a kind of storing unit completing the mould of chip button limit sheet operation fast described in claim 1, it is characterized in that: comprise storing unit main body (1) and mold storing box (2), described storing unit main body (1) comprises the first mainboard (101) and the second mainboard (102), and the first mainboard (101) and the second mainboard (102) connect into triangle; Described mold storing box (2) is positioned on the first mainboard (101) and the second mainboard (102), and the bottom of mold storing box (2) is semicircle, and size is mated with the mould described in claim 1.
10. a kind of storing unit completing the mould of chip button limit sheet operation fast according to claim 9, is characterized in that: the angle between described the first mainboard (101) and the second mainboard (102) is 30-150 °; The first pole (103) and the second pole (104) is provided with between described the first mainboard (101) and the second mainboard (102); Described the first mainboard (101) and the second mainboard (102) are respectively equipped with 1-20 mold storing box (2); The top of described mold storing box (2) is rectangle.
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| CN201410782191.1A CN104505355B (en) | 2014-12-16 | 2014-12-16 | A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side |
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| CN201410782191.1A CN104505355B (en) | 2014-12-16 | 2014-12-16 | A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111509107A (en) * | 2020-04-24 | 2020-08-07 | 湘能华磊光电股份有限公司 | Method for separating L ED wafer into N pieces of reverse films |
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| CN1359144A (en) * | 2000-12-11 | 2002-07-17 | 株式会社东芝 | Picking up device for semiconductor chip and picking up method |
| KR100885273B1 (en) * | 2008-07-24 | 2009-02-25 | 주식회사 성진하이메크 | Apparatus and method of punching and extracting tab ic from tab ic tape |
| CN204230215U (en) * | 2014-12-16 | 2015-03-25 | 马鞍山太时芯光科技有限公司 | A kind of mould and mold storage device completing the sheet operation of chip button limit fast |
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2014
- 2014-12-16 CN CN201410782191.1A patent/CN104505355B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359144A (en) * | 2000-12-11 | 2002-07-17 | 株式会社东芝 | Picking up device for semiconductor chip and picking up method |
| KR100885273B1 (en) * | 2008-07-24 | 2009-02-25 | 주식회사 성진하이메크 | Apparatus and method of punching and extracting tab ic from tab ic tape |
| CN204230215U (en) * | 2014-12-16 | 2015-03-25 | 马鞍山太时芯光科技有限公司 | A kind of mould and mold storage device completing the sheet operation of chip button limit fast |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111509107A (en) * | 2020-04-24 | 2020-08-07 | 湘能华磊光电股份有限公司 | Method for separating L ED wafer into N pieces of reverse films |
| CN111509107B (en) * | 2020-04-24 | 2021-06-04 | 湘能华磊光电股份有限公司 | Method for separating N parts of reverse films from LED wafer |
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| CN104505355B (en) | 2017-07-07 |
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