CN104505355B - A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side - Google Patents
A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side Download PDFInfo
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- CN104505355B CN104505355B CN201410782191.1A CN201410782191A CN104505355B CN 104505355 B CN104505355 B CN 104505355B CN 201410782191 A CN201410782191 A CN 201410782191A CN 104505355 B CN104505355 B CN 104505355B
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000003860 storage Methods 0.000 title abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 33
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 60
- 229910052742 iron Inorganic materials 0.000 claims description 30
- 238000002360 preparation method Methods 0.000 claims description 19
- 239000012528 membrane Substances 0.000 claims description 17
- 239000000428 dust Substances 0.000 claims description 12
- 239000004744 fabric Substances 0.000 claims description 12
- 238000003825 pressing Methods 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 5
- 241001062009 Indigofera Species 0.000 claims description 2
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 230000000694 effects Effects 0.000 abstract description 7
- 238000013461 design Methods 0.000 abstract description 2
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 15
- 229920006267 polyester film Polymers 0.000 description 15
- 238000005266 casting Methods 0.000 description 6
- 210000004276 hyalin Anatomy 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 239000007779 soft material Substances 0.000 description 4
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004438 eyesight Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 230000005622 photoelectricity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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Abstract
The invention discloses a kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side, belong to field of manufacturing semiconductor devices.Mould of the invention is disc-shaped, diameter D=78 [x]/2mm ([x] is the integer between 6 20), its making material is blue film and plane release liners, die edge has a kerf, mould structure of the invention is simple, but it is reasonable in design, it is easily fabricated, with unexpected using effect, can realize buckleing the batch of chip side operation using mould of the invention, compared with existing cumbersome button side method, efficiency improves 70 80%, and button side effect is good, and the chip edge detained after the piece of side is neat, chip without any damage is hindered, low cost.
Description
Technical field
The invention belongs to field of manufacturing semiconductor devices, it is rapidly completed chip button side piece more specifically to one kind and makees
The method and mould and mould making method and mold storage device of industry.
Background technology
As light emitting diode (LED) is in the appearance of nineteen sixty, LED starts widely should in our surrounding environment
With, very important role is play in daily life, as one of most valued light source technology, such as various indicator lamps,
Display light source and lighting apparatus etc. are it can be seen that the application of LED.Compared to traditional lighting source such as：It is fluorescent lamp, white
Vehement osram lamp etc., LED possesses high brightness, low-power consumption, long lifespan, the fast, small volume that starts, environmental protection and energy saving, is not likely to produce vision
The advantages such as fatigue, there is vast potential for future development, by people's extensive concern.The manufacture craft of LED chip mainly includes extension
Technique, grinding and cutting, point survey and sorting etc. before growth, chip, the important means for checking LED light electrical property is LED light electrical measurement
Examination, after the photo electric parameter testing of LED chip is finished, the difference for compareing photo electric parameter need to be processed chip, photoelectricity
Property the poor chip part of parameter will be separated as side piece and the preferable chip of photo electric parameter, deduct the conventional operator of side piece
Method is that pour mask operation is first carried out to chip, then using the empty mould fixed chip of multiple embedded different-diameter sizes
Side piece part, use heater heat after deduct side piece part.Due to not only having been taken but also consumptive material using the method, have a strong impact on
The production efficiency of LED chip, therefore being badly in need of a kind of more easily method carries out button side piece operation to chip, it is to avoid operation it is cumbersome
Property.
Through retrieval, the A of China Patent Publication No. CN 103633198 disclose a kind of LED chip preparation method and LED core
Piece, the preparation method is included using patterned substrate of the wafer fabrication with cutting passageway；In the figure with cutting passageway
Shape Grown epitaxial layer；The chip for having grown epitaxial layer is performed etching, LED chip is made, wherein, it is etched
At least a portion for retaining the corresponding region in the cutting passageway in journey is not performed etching, and the LED chip that the invention is provided makes
Method and LED chip, can further improve the luminous efficiency of LED chip, but the preparation method in the invention does not have
Improve the button side piece operating method in LED chip production process.The A of China Patent Publication No. CN 103612015 disclose one kind
LED wafer cutting method, the cutting method of the invention is first commonly cut laser with low-power and one is formed on chip in cutting
Road cuts trace, and stealthy cutting, this cutting are then carried out on the cutting trace that common laser cuts through with stealth cutting laser again
Method can fundamentally combine the chip of the various film layers of evaporation and the technique of stealthy cutting, it is to avoid cutting for being formed due to cutting
Fragmentation when trace causes to be deposited with film layer, but this cutting method high cost, efficiency are low, are not suitable for the button of LED chip side piece
Remove, it is therefore desirable to which a kind of more easily method of research carries out button side piece operation to chip, it is to avoid the triviality of operation.
The content of the invention
1. the problem to be solved
The problems such as the time-consuming, cumbersome of existing LED chip button side piece operation presence, low production efficiency, the present invention
A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side is provided, using this
The mould of invention carries out chip when buckleing side piece operation, without being heated by heater, only by simple pressing chip side piece portion
The blue film in position top quickly can be poured into finished film side piece, complete the button side operation of chip.
2. technical scheme
In order to solve the above problems, the technical solution adopted in the present invention is as follows：
A kind of mould for being rapidly completed the piece operation of chip button side, mould is disc-shaped, making material be blue film and plane from
Type paper, described die edge has a kerf, and described otch is the 1/7-1/8 of mould diameter apart from the distance of mold center,
The thickness of mould is 1-2mm.
Preferably, diameter D=78- [the x]/2mm of described mould, wherein x are side piece in chip photo Parameter Map
Percent value, [x] is represented to carry out being rounded to units according to the principle that rounds up to x.
Preferably, described [x] is the integer between 6-20.
A kind of preparation method of above-mentioned mould for being rapidly completed the piece operation of chip button side, its step is：
A () prepares material：Prepare blue film, plane release liners, ruler, pen, cutter and rope；
B blue film and plane release liners are heated to 30-35 DEG C by () on warm table, then by the adhesive faces and plane of blue film
Release liners matte fits, and drives the bubble between blue film and plane release liners away, obtains mould material；
(c) after the mould material obtained in step (b) is cooled to room temperature, using ruler, pen and rope in mould material
The release paper of plane draw the shape of above-mentioned mould；
D () is cut according to the mold shape drawn in step (c) with cutter and obtains mould.
A kind of method for being rapidly completed the piece operation of chip button side, its step is：
(1) material is prepared：Transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation；
(2) by finished film tiling on the table, finished film is the composite membrane that blue film and release liners are constituted, blue film upward,
Then iron hoop is placed on finished film middle part, iron hoop is fastened iron hoop with the blue film of iron hoop periphery；
(3) the above-mentioned mould for preparing is placed in the finished film in the middle of iron hoop, smooth surface and the finished film of mould
Blue film contact, the chip of side piece to be detained is placed on mould；
(4) middle transferring film is sticked on the chip of side piece to be detained, then takes out the black and white ring of piece chip surrounding in side to be detained,
Size of the size of wherein middle transferring film more than piece chip in side to be detained；
(5) non-dust cloth is made the ball of a diameter of 2-3cm, then with mould outer edge in ball pressing step (4)
Chip, makes chip be disconnected in die edge；
(6) after pressing terminates, middle transferring film is opened from edge, has detained the chip of side piece as middle transferring film is taken off together
Rise, the side piece of chip is stayed in finished film.
Preferably, described middle transferring film is individual layer indigo plant film.
Preferably, viscosity of the blue film viscosity more than middle transferring film in described step (2) in finished film.
Preferably, with ball by the size of the power of compression mould outer edge chip it is 5-25N in described step (5).
A kind of storing unit of above-mentioned mould for being rapidly completed the piece operation of chip button side, including storing unit main body (1)
With mold storing box (2), described storing unit main body (1) includes the first mainboard (101) and the second mainboard (102), the first master
Plate (101) is connected triangularity with the second mainboard (102)；Described mold storing box (2) is positioned at the first mainboard (101) and second
On mainboard (102), the bottom of mold storing box (2) is semicircle, and size is matched with above-mentioned mould.
Preferably, the angle between described the first mainboard (101) and the second mainboard (102) is 30-150 °；Described
The first pole (103) and the second pole (104) are provided between one mainboard (101) and the second mainboard (102)；The first described mainboard
(101) and on the second mainboard (102) it is respectively equipped with 1-20 mold storing box (2)；The top of described mold storing box (2) is
Rectangle.
3. beneficial effect
Compared to prior art, beneficial effects of the present invention are：
(1) mould for being rapidly completed the piece operation of chip button side of the invention, can realize the batch button side operation to chip, with
Existing cumbersome button side method is compared, and efficiency improves 70-80%, and button side effect is good；
(2) die edge of the invention has a kerf, facilitates mold use, the diameter D=78- [x] of mould/2mm, root
The size of mould is determined according to the BIN figures per a batch of chip, the removal amount of chip side piece is controlled to the full extent, it is economical
High efficiency；
(3) mould making method of the invention, plane release liners surface is sticked under the conditions of 30-35 DEG C by blue film,
Preferably, number of bubbles between the two is minimum, finally for the effect that adhesive faces of blue film are fitted with plane release liners matte under the conditions of this
The mould material surface smoothness of preparation is high, it is to avoid damage in the piece operating process of chip button side to chip；
(4) the blue film thickness for being used to make mould in the present invention is 300-500 μm, and base weight is 90-100g/cm2, extension rate
It is 80-100%, 180 ° of peel adhesions are 0.5-1.5N/mm, and hardness is moderate, and the mould that the blue film of this specification is made is used for
Chip button side piece is most suitable, is unlikely to too hard, causes the damage to chip, is also unlikely to too soft pressing yielding, it is impossible to complete
Button side piece operation to chip；
(5) a kind of method for being rapidly completed the piece operation of chip button side that the present invention is provided, uses with non-dust cloth as material system
Into ball chip side piece part is pressed, the side piece part of chip is disconnected in die edge, ingenious utilization transfer
The viscosity difference of film and finished film separates chip with side piece, efficiency high, compared with traditional button side piece method, per label segment
About middle transferring film, and without heating, save production cost；
(6) a kind of chip button side piece method in the present invention, chip is pressed using the non-dust cloth ball of a diameter of 2-3cm
Power is controlled between 5-25N, and the effect for carrying out detaining side piece under this scope dynamics is best, and the chip edge detained after the piece of side is whole
Together, the fragment rate of chip is low；
(7) mould structure of the invention is simple, but reasonable in design, it is easy to manufactures, with unexpected using effect, makes
The production efficiency of chip production enterprise button side piece is greatly improved；
(8) mold storage device of the invention is used to deposit the mould of button side piece operation, convenient and practical, mold storage device
It is also equipped with fetching the clip of chip, the front end of clip is made for soft material, will not damage mould；On mold storage device
Mold storing box be the groove in storing unit main body, its bottom is semicircle, and for depositing mould, top is rectangle,
Conveniently fetch.
Brief description of the drawings
Fig. 1 is the structural representation of mould in the present invention；
Fig. 2 is the structural representation of mold storage device in the present invention；
Fig. 3 is the front view of mold storage device in the present invention；
Fig. 4 is the structural representation of supporting with mold storage device clip in the present invention.
In figure：1st, storing unit main body；101st, the first mainboard；102nd, the second mainboard；103rd, the first pole；104th, second
Bar；2nd, mold storing box；3rd, clip.
Specific embodiment
The present invention is further described below with reference to specific embodiment.
Embodiment 1
As shown in figure 1, a kind of mould for being rapidly completed the piece operation of chip button side, mould is disc-shaped, diameter D=78-
[x]/2mm, wherein x are the percent value of side piece in chip photo Parameter Map, and [x] is represented x is entered according to the principle that rounds up
Row is rounded to units, and (the side piece part of chip is the poor chip of photo electric parameter, for the chip for ensuring core is not joined
The poor chip of veiling glare electrical parameter, can in right amount relax ratio, so as to improve the quality of center dies during button side piece.Therefore enterprise's reality
By [x] it is 13 to make the mould of corresponding size when [x] is 6-10 in the production process of border, when [x] is 11-15 is by [x]
18 make the mould of corresponding size, and [x] is 23 to make the mould of corresponding size by [x] for 16-20, prepares 3 sizes
Mould.), [x] is 6 in the present embodiment, by [x] is 13 to make the mould of corresponding size, mould in actual production process
The making material of tool is blue film and plane release liners, and die edge has a kerf, and otch is mould apart from the distance of mold center
The 1/7 of diameter, the thickness of mould is 1mm.
The preparation process of the blue film in the present embodiment is：Polybutylene terephthalate (polyester) raw material is heated and is melted,
Then with PET hyaline membranes (thickness is 150 μm) as basic unit, a polyester film layer is scraped on its surface (being designated as A faces) with flat membrane casting equipment,
Knifing speed is 10mm/s, and the thickness of polyester film is 80 μm, transparent in PET with flat membrane casting equipment after waiting polyester film to cool down film forming
A polyester film layer (thickness is 150 μm) is scraped on another surface (B faces) of film, after the polyester film in PET hyaline membrane B faces cools down film forming,
In one layer of acrylic pressure-sensitive adhesive of its surface uniform application, obtain making the blue film that button side die is used in the present embodiment.
In order to obtain above-mentioned mould, a kind of preparation method of the mould for being rapidly completed the piece operation of chip button side, its step
For：
A () prepares material：Prepare blue film, plane release liners, ruler, pen, cutter and rope；
B blue film and plane release liners are heated to 30 DEG C by () on warm table, then by the adhesive faces of blue film and plane from
Type paper matte fits, and drives the bubble between blue film and plane release liners away, obtains mould material；
(c) after the mould material obtained in step (b) is cooled to room temperature, using ruler, pen and rope in mould material
The release paper of plane draw the shape of above-mentioned mould；
D () is cut according to the mold shape drawn in step (c) with cutter and obtains mould.
The surface smoothness of mould manufactured in the present embodiment is high, bubble-free between blue film and plane release liners, the thickness of blue film
It is 380 μm to spend, and base weight is 93g/cm2, extension rate is 88%, and 180 ° of peel adhesions are 0.9N/mm, and hardness is moderate, to chip
The damage to chip is not resulted in during button side piece, while easily can detain to come from chip by side piece, it is easy to use, it is economical
It is applicable.
A kind of method for being rapidly completed the piece operation of chip button side, its step is：
(1) material is prepared：Transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation, wherein, middle transferring film is single
The blue film of layer, finished film is the composite membrane that blue film and release liners are constituted, and viscosity of the blue film viscosity more than middle transferring film in finished film；
(2) by finished film tiling on the table, iron hoop upward, is then placed on finished film middle part by blue film, uses iron hoop
Be fastened iron hoop iron hoop by the blue film of periphery；
(3) the above-mentioned mould for preparing is placed in the finished film in the middle of iron hoop, smooth surface and the finished film of mould
Blue film contact, the chip of side piece to be detained is placed on mould, and the chip surrounding of side piece to be detained has black and white ring, the effect of black and white ring
It is conveniently to fetch chip and make chip not easily damaged during fetching；
(4) middle transferring film is sticked on the chip of side piece to be detained, then takes out the black and white ring of piece chip surrounding in side to be detained,
Size of the size of wherein middle transferring film more than piece chip in side to be detained；
(5) non-dust cloth is made the ball of a diameter of 3cm, then with ball with mould in power pressing step (4) of 25N sizes
Tool outer edge chip, makes chip be disconnected in die edge；
(6) after pressing terminates, middle transferring film is opened from edge, has detained the chip of side piece as middle transferring film is taken off together
Rise, the side piece of chip is stayed in finished film.
The button side piece operation to a piece of chip is completed by side piece method, average 20 seconds are detained in the present embodiment, and it is traditional
Button side piece method needs first pour mask, and side piece is then detained under conditions of heating, completes average to the button side piece operation of a piece of chip
80 seconds are needed, mould makes the efficiency for buckleing side piece improve 75% in the present embodiment, with application value very high.
In order to deposit the above-mentioned mould for detaining side piece operation, a kind of mold storage device, as shown in Figures 2 and 3, including
Storing unit main body 1 and mold storing box 2, storing unit main body 1 include the first mainboard 101 and the second mainboard 102, the first mainboard
101 are connected triangularity with the second mainboard 102, and the angle between the first mainboard 101 and the second mainboard 102 is 30 °, the first mainboard
101 and second are provided with the first pole 103 and the second pole 104 between mainboard 102；Mold storing box 2 is located at the He of the first mainboard 101
On second mainboard 102,1 mold storing box 2 is respectively equipped with the first mainboard 101 and the second mainboard 102, mold storing box 2
Bottom is semicircle, and size is matched with above-mentioned mould, and the top of mold storing box 2 is rectangle, facilitates fetching for mould.This
The mold storage device of embodiment also includes clip, as shown in figure 4, the front end of clip is made for soft material, will not damage
Hinder mould, and conveniently mould is taken out from storing unit.
Embodiment 2
A kind of mould for being rapidly completed the piece operation of chip button side, mould is disc-shaped, diameter D=78- [x]/2mm, wherein x
It is the percent value of side piece in chip photo Parameter Map, [x] is represented to carry out being rounded to a position according to the principle that rounds up to x
Number, [x] is 13 in the present embodiment, by [x] is 18 to make the mould of corresponding size, the making material of mould in actual production process
Expect to be blue film and plane release liners, described die edge has a kerf, and otch is mould diameter apart from the distance of mold center
2/15, the thickness of mould is 2mm.
The preparation process of the blue film in the present embodiment is：Polybutylene terephthalate (polyester) raw material is heated and is melted,
Then with PET hyaline membranes (thickness is 100 μm) as basic unit, a polyester film layer is scraped on its surface (being designated as A faces) with flat membrane casting equipment,
Knifing speed is 10mm/s, and the thickness of polyester film is 80 μm, transparent in PET with flat membrane casting equipment after waiting polyester film to cool down film forming
A polyester film layer (thickness is 120 μm) is scraped on another surface (B faces) of film, after the polyester film in PET hyaline membrane B faces cools down film forming,
In one layer of water-based acrylic resin of its surface uniform application, obtain making the blue film that button side die is used in the present embodiment.
In order to obtain above-mentioned mould, a kind of preparation method of the mould for being rapidly completed the piece operation of chip button side, its step
For：
A () prepares material：Prepare blue film, plane release liners, ruler, pen, cutter and rope；
B blue film and plane release liners are heated to 35 DEG C by () on warm table, then by the adhesive faces of blue film and plane from
Type paper matte fits, and drives the bubble between blue film and plane release liners away, obtains mould material；
(c) after the mould material obtained in step (b) is cooled to room temperature, using ruler, pen and rope in mould material
The release paper of plane draw the shape of above-mentioned mould；
D () is cut according to the mold shape drawn in step (c) with cutter and obtains mould.
The surface smoothness of mould manufactured in the present embodiment is high, bubble-free between blue film and plane release liners, the thickness of blue film
It is 300 μm to spend, and base weight is 90g/cm2, extension rate is 100%, and 180 ° of peel adhesions are 0.5N/mm, and hardness is moderate, to chip
The damage to chip is not resulted in during button side piece, while easily can detain to come from chip by side piece, it is easy to use, it is economical
It is applicable.
A kind of method for being rapidly completed the piece operation of chip button side, its step is：
(1) material is prepared：Transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation, wherein, middle transferring film is single
The blue film of layer, finished film is the composite membrane that blue film and release liners are constituted, and viscosity of the blue film viscosity more than middle transferring film in finished film；
(2) by finished film tiling on the table, iron hoop upward, is then placed on finished film middle part by blue film, uses iron hoop
Be fastened iron hoop iron hoop by the blue film of periphery；
(3) the above-mentioned mould for preparing is placed in the finished film in the middle of iron hoop, smooth surface and the finished film of mould
Blue film contact, the chip of side piece to be detained is placed on mould；
(4) middle transferring film is sticked on the chip of side piece to be detained, then takes out the black and white ring of piece chip surrounding in side to be detained,
Size of the size of wherein middle transferring film more than piece chip in side to be detained；
(5) non-dust cloth is made the ball of a diameter of 2cm, then with ball with mould in power pressing step (4) of 18N sizes
Tool outer edge chip, makes chip be disconnected in die edge；
(6) after pressing terminates, middle transferring film is opened from edge, has detained the chip of side piece as middle transferring film is taken off together
Rise, the side piece of chip is stayed in finished film.
The button side piece operation to a piece of chip is completed by side piece method, average 18 seconds are detained in the present embodiment, and it is traditional
Button side piece method needs first pour mask, and side piece is then detained under conditions of heating, completes average to the button side piece operation of a piece of chip
80 seconds are needed, mould makes the efficiency for buckleing side piece improve 85% in the present embodiment, with application value very high.
In order to deposit the above-mentioned mould for detaining side piece operation, a kind of mold storage device, as shown in Figures 2 and 3, including
Storing unit main body 1 and mold storing box 2, storing unit main body 1 include the first mainboard 101 and the second mainboard 102, the first mainboard
101 are connected triangularity with the second mainboard 102, and the angle between the first mainboard 101 and the second mainboard 102 is 150 °, the first master
The first pole 103 and the second pole 104 are provided between the mainboard 102 of plate 101 and second；Mold storing box 2 is located at the first mainboard 101
On the second mainboard 102,10 mold storing boxes 2, mold storing box 2 are respectively equipped with the first mainboard 101 and the second mainboard 102
Bottom be semicircle, size match with above-mentioned mould, and the top of mold storing box 2 is rectangle, facilitates fetching for mould.
The mold storage device of the present embodiment also includes clip, as shown in figure 4, the front end of clip is made for soft material, will not
Mould is damaged, and conveniently mould is taken out from storing unit.
Embodiment 3
A kind of mould for being rapidly completed the piece operation of chip button side, mould is disc-shaped, diameter D=78- [x]/2mm, wherein x
It is the percent value of side piece in chip photo Parameter Map, [x] is represented to carry out being rounded to a position according to the principle that rounds up to x
Number, [x] is 20 in the present embodiment, by [x] is 23 to make the mould of corresponding size, the making material of mould in actual production process
Expect to be blue film and plane release liners, described die edge has a kerf, and otch is mould diameter apart from the distance of mold center
1/8, the thickness of mould is 1.5mm.
The preparation process of the blue film in the present embodiment is：Polybutylene terephthalate (polyester) raw material is heated and is melted,
Then with PET hyaline membranes (thickness is 300 μm) as basic unit, a polyester film layer is scraped on its surface (being designated as A faces) with flat membrane casting equipment,
Knifing speed is 10mm/s, and the thickness of polyester film is 90 μm, transparent in PET with flat membrane casting equipment after waiting polyester film to cool down film forming
A polyester film layer (thickness is 110 μm) is scraped on another surface (B faces) of film, after the polyester film in PET hyaline membrane B faces cools down film forming,
In one layer of acrylic pressure-sensitive adhesive of its surface uniform application, obtain making the blue film that button side die is used in the present embodiment.
In order to obtain above-mentioned mould, a kind of preparation method of the mould for being rapidly completed the piece operation of chip button side, its step
For：
A () prepares material：Prepare blue film, plane release liners, ruler, pen, cutter and rope；
B blue film and plane release liners are heated to 33 DEG C by () on warm table, then by the adhesive faces of blue film and plane from
Type paper matte fits, and drives the bubble between blue film and plane release liners away, obtains mould material；
(c) after the mould material obtained in step (b) is cooled to room temperature, using ruler, pen and rope in mould material
The release paper of plane draw the shape of above-mentioned mould；
D () is cut according to the mold shape drawn in step (c) with cutter and obtains mould.
The surface smoothness of mould manufactured in the present embodiment is high, bubble-free between blue film and plane release liners, the thickness of blue film
It is 500 μm to spend, and base weight is 100g/cm2, extension rate is 80%, and 180 ° of peel adhesions are 1.5N/mm, and hardness is moderate, to chip
The damage to chip is not resulted in during button side piece, while easily can detain to come from chip by side piece, it is easy to use, it is economical
It is applicable.
A kind of method for being rapidly completed the piece operation of chip button side, its step is：
(1) material is prepared：Transferring film, finished film, non-dust cloth, iron hoop and above-mentioned mould in preparation；
(2) by finished film tiling on the table, finished film is the composite membrane that blue film and release liners are constituted, blue film upward,
Then iron hoop is placed on finished film middle part, iron hoop is fastened iron hoop with the blue film of iron hoop periphery；
(3) the above-mentioned mould for preparing is placed in the finished film in the middle of iron hoop, smooth surface and the finished film of mould
Blue film contact, the chip of side piece to be detained is placed on mould；
(4) middle transferring film is sticked on the chip of side piece to be detained, then takes out the black and white ring of piece chip surrounding in side to be detained,
Size of the size of wherein middle transferring film more than piece chip in side to be detained；
(5) non-dust cloth is made the ball of a diameter of 2cm, then with ball with mould in power pressing step (4) of 5N sizes
Tool outer edge chip, makes chip be disconnected in die edge；
(6) after pressing terminates, middle transferring film is opened from edge, has detained the chip of side piece as middle transferring film is taken off together
Rise, the side piece of chip is stayed in finished film.
The button side piece operation to a piece of chip is completed by side piece method, average 25 seconds are detained in the present embodiment, and it is traditional
Button side piece method needs first pour mask, and side piece is then detained under conditions of heating, completes average to the button side piece operation of a piece of chip
80 seconds are needed, mould makes the efficiency for buckleing side piece improve 69% in the present embodiment, with application value very high.
In order to deposit the above-mentioned mould for detaining side piece operation, a kind of mold storage device, as shown in Figures 2 and 3, including
Storing unit main body 1 and mold storing box 2, storing unit main body 1 include the first mainboard 101 and the second mainboard 102, the first mainboard
101 are connected triangularity with the second mainboard 102, and the angle between the first mainboard 101 and the second mainboard 102 is 90 °, the first mainboard
101 and second are provided with the first pole 103 and the second pole 104 between mainboard 102；Mold storing box 2 is located at the He of the first mainboard 101
On second mainboard 102,20 mold storing boxes 2 are respectively equipped with the first mainboard 101 and the second mainboard 102, mold storing box 2
Bottom is semicircle, and size is matched with above-mentioned mould, and the top of mold storing box 2 is rectangle, facilitates fetching for mould.This
The mold storage device of embodiment also includes clip, as shown in figure 4, the front end of clip is made for soft material, will not damage
Hinder mould, and conveniently mould is taken out from storing unit.
Claims (8)
1. a kind of preparation method of the mould for being rapidly completed the piece operation of chip button side, its step is：
A () prepares material：Prepare blue film, plane release liners, ruler, pen, cutter and rope；
B blue film and plane release liners are heated to 30-35 DEG C by () on warm table, then that the adhesive faces of blue film and plane is release
Paper matte fits, and drives the bubble between blue film and plane release liners away, obtains mould material；
(c) after the mould material obtained in step (b) is cooled to room temperature, using ruler, pen and rope in the flat of mould material
The release paper in face draws the shape of mould, and described mould is disc-shaped, and die edge has a kerf, and described otch is apart from mould
The distance at tool center is the 1/7-1/8 of mould diameter, and the thickness of mould is 1-2mm；
D () is cut according to the mold shape drawn in step (c) with cutter and obtains mould.
2. a kind of preparation method of mould for being rapidly completed the piece operation of chip button side according to claim 1, its feature exists
In：Diameter D=78- [the x]/2mm of described mould, wherein x are the percent value of side piece in chip photo Parameter Map, [x]
Represent carries out being rounded to units according to the principle that rounds up to x.
3. a kind of preparation method of mould for being rapidly completed the piece operation of chip button side according to claim 2, its feature exists
In：Described [x] is the integer between 6-20.
4. a kind of method for being rapidly completed the piece operation of chip button side, its step is：
(1) material is prepared：The mould obtained in (d) the step of transferring film, finished film, non-dust cloth, iron hoop and claim 1 in preparation
Tool；
(2) by finished film tiling on the table, finished film is the composite membrane that blue film and release liners are constituted, blue film upward, then
Iron hoop is placed on finished film middle part, iron hoop is fastened iron hoop with the blue film of iron hoop periphery；
(3) the above-mentioned mould for preparing is placed in the finished film in the middle of iron hoop, the smooth surface of mould and the blue film of finished film
Contact, the chip of side piece to be detained is placed on mould；
(4) middle transferring film is sticked on the chip of side piece to be detained, then takes out the black and white ring of piece chip surrounding in side to be detained, wherein
Size of the size of middle transferring film more than piece chip in side to be detained；
(5) non-dust cloth is made the ball of a diameter of 2-3cm, then with mould outer edge chip in ball pressing step (4),
Chip is set to be disconnected in die edge；
(6) after pressing terminates, middle transferring film is opened from edge, has detained the chip of side piece as middle transferring film is uncovered together, core
The side piece of piece is stayed in finished film.
5. a kind of method for being rapidly completed the piece operation of chip button side according to claim 4, it is characterised in that：In described
Transferring film is individual layer indigo plant film.
6. a kind of method for being rapidly completed the piece operation of chip button side according to claim 5, it is characterised in that：Described step
Suddenly the blue film viscosity in (2) finished film is more than the viscosity of middle transferring film.
7. a kind of method for being rapidly completed the piece operation of chip button side according to claim 4, it is characterised in that：Described step
Suddenly with ball by the size of the power of compression mould outer edge chip it is 5-25N in (5).
8. the storing unit of a kind of mould for being rapidly completed the piece operation of chip button side described in claim 1 step (c), it is special
Levy and be：Including storing unit main body (1) and mold storing box (2), described storing unit main body (1) includes the first mainboard
(101) and the second mainboard (102), the first mainboard (101) is connected triangularity with the second mainboard (102)；Described mold storing
On the first mainboard (101) and the second mainboard (102), the bottom of mold storing box (2) is semicircle, size and power to box (2)
Profit requires the mould matching described in 1 step (c)；Angle between described the first mainboard (101) and the second mainboard (102) is
30-150°；The first pole (103) and the second pole are provided between described the first mainboard (101) and the second mainboard (102)
(104)；1-20 mold storing box (2) is respectively equipped with described the first mainboard (101) and the second mainboard (102)；Described
The top of mold storing box (2) is rectangle.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410782191.1A CN104505355B (en) | 2014-12-16 | 2014-12-16 | A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side |
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| CN201410782191.1A CN104505355B (en) | 2014-12-16 | 2014-12-16 | A kind of method and mould and mould making method and mold storage device for being rapidly completed the piece operation of chip button side |
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| CN104505355B true CN104505355B (en) | 2017-07-07 |
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| CN111509107B (en) * | 2020-04-24 | 2021-06-04 | 湘能华磊光电股份有限公司 | Method for separating N parts of reverse films from LED wafer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359144A (en) * | 2000-12-11 | 2002-07-17 | 株式会社东芝 | Picking up device for semiconductor chip and picking up method |
| CN204230215U (en) * | 2014-12-16 | 2015-03-25 | 马鞍山太时芯光科技有限公司 | A kind of mould and mold storage device completing the sheet operation of chip button limit fast |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100885273B1 (en) * | 2008-07-24 | 2009-02-25 | 주식회사 성진하이메크 | Apparatus and method of punching and extracting tab ic from tab ic tape |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1359144A (en) * | 2000-12-11 | 2002-07-17 | 株式会社东芝 | Picking up device for semiconductor chip and picking up method |
| CN204230215U (en) * | 2014-12-16 | 2015-03-25 | 马鞍山太时芯光科技有限公司 | A kind of mould and mold storage device completing the sheet operation of chip button limit fast |
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