CN106784367A - Integrated watertight OLED flat-plate light sources and preparation method thereof - Google Patents

Integrated watertight OLED flat-plate light sources and preparation method thereof Download PDF

Info

Publication number
CN106784367A
CN106784367A CN201611183915.6A CN201611183915A CN106784367A CN 106784367 A CN106784367 A CN 106784367A CN 201611183915 A CN201611183915 A CN 201611183915A CN 106784367 A CN106784367 A CN 106784367A
Authority
CN
China
Prior art keywords
layer
light sources
plate light
oled flat
oled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201611183915.6A
Other languages
Chinese (zh)
Inventor
朱腾飞
沈群
顾虎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HANGZHOU QUALITY TECHNOLOGY SUPERVISION INSPECTION INSTITUTE
Original Assignee
HANGZHOU QUALITY TECHNOLOGY SUPERVISION INSPECTION INSTITUTE
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HANGZHOU QUALITY TECHNOLOGY SUPERVISION INSPECTION INSTITUTE filed Critical HANGZHOU QUALITY TECHNOLOGY SUPERVISION INSPECTION INSTITUTE
Priority to CN201611183915.6A priority Critical patent/CN106784367A/en
Publication of CN106784367A publication Critical patent/CN106784367A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/805Electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301Details of OLEDs
    • H10K2102/302Details of OLEDs of OLED structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention relates to field of semiconductor illumination, more particularly to integrated watertight OLED flat-plate light sources and preparation method thereof, including:Cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate, packing colloid, negative electrical wire, positive electrical wire;Cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate are stacked gradually together from top to bottom;Overall all standing of the packing colloid by cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate after cumulative, is wrapped in interior;Cathode glass substrate layer is connected with negative electrical wire;Anode conducting substrate is connected with positive electrical wire.Small volume of the present invention, with high-grade water resistance, good illumination effect;Preparation method is easy to operate simultaneously, it is easy to which popularity is carried out.

Description

Integrated watertight OLED flat-plate light sources and preparation method thereof
Technical field
The present invention relates to field of semiconductor illumination, more particularly to integrated watertight OLED flat-plate light sources and preparation method thereof.
Background technology
OLED is a kind of excellent organic semiconductor illuminating product, with large scale, face be luminous, integral thickness is extremely light The technical advantage such as thin, brightness uniformity, colour rendering be high, is especially suitable for homogeneous soft and comfortably illuminates occasion.But OLED has one again Significant drawbacks:To the liquid quite sensitive such as water.OLED material contacts to damage completely with water scraps, serious limitation that this is not enough The illumination optical extensive use in its place such as in outdoor landscape and under water.For this present situation, a waterproof high of design invention Grade, the integrated watertight OLED flat-plate light sources that can be used under water are necessary.
The content of the invention
The present invention is to overcome above-mentioned weak point, it is therefore intended that provide integrated watertight OLED flat-plate light sources, the light source Small volume, with high-grade water resistance, good illumination effect.
Another object of the present invention is the preparation method for providing integrated watertight OLED flat-plate light sources, the operation of this preparation method It is convenient, it is easy to which that popularity is carried out.
The present invention is to reach above-mentioned purpose by the following technical programs:Integrated watertight OLED flat-plate light sources, including:Negative electrode Glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate, packing colloid, negative electrical wire, positive pole Electric wire;Cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate heap successively from top to bottom Stack;Packing colloid is by cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate Overall all standing after cumulative, is wrapped in interior;Cathode glass substrate layer is connected with negative electrical wire;Anode conducting substrate and positive pole electricity Line is connected.
Preferably, described packing colloid is solid encapsulation colloid.
Preferably, the thickness of the integrated watertight OLED flat-plate light sources is no more than 10mm.
Preferably, described solid encapsulation colloid is thermal conductor material, produced during for OLED flat-plate light sources to be lighted Heat transfer to extraneous.
Preferably, the classification of waterproof of the integrated watertight OLED flat-plate light sources is IPX8.
The preparation method of integrated watertight OLED flat-plate light sources, comprises the following steps:
(1) by anode conducting substrate, hole transmission layer, light exit layer, electron transfer layer, cathode glass substrate layer from it is lower extremely On stack gradually, obtain OLED flat-plate light source main bodys;
(2) positive electrical wire is drawn from anode conducting substrate, cathode glass substrate layer is drawn negative electrical wire, obtains OLED flat boards Light source entirety;
(3) sealant pouring and sealing is integrally carried out to OLED flat-plate light sources using solid encapsulation colloid;
(4) finished product after sealant pouring and sealing is solidified, solidification obtains integrated watertight OLED flat-plate light sources after terminating.
Preferably, using the drop whole OLED flat boards light of the uniform wrapping and encapsulating of adhesive process during step (3) sealant pouring and sealing Source entirety, the profile after being encapsulated by corresponding encapsulating mould control OLED flat-plate light sources so that the shape of whole OLED flat-plate light sources Shape keeps constant, only increases solid encapsulation colloid thickness in the normal direction perpendicular to light-emitting area.
Preferably, described encapsulating mould is determined by the use demand of OLED flat-plate light sources.
The beneficial effects of the present invention are:(1) thickness of the invention is minimum, no more than 10 millimeters, is easy to use;(2) by In sealant pouring and sealing, the OLED flat-plate light sources show excellent water resistance, and classification of waterproof can reach IPX8, i.e., completely under water Used;(3) preparation method is simple to operate, is easy to popularity to promote;(4) present invention can be used in shower wall, swimming pool Under water, outer surface of automobile and outdoor scene illumination place, play high-quality illuminating effect.
Brief description of the drawings
Fig. 1 is schematic appearance of the invention;
Fig. 2 is structural representation of the invention.
Specific embodiment
With reference to specific embodiment, the present invention is described further, but protection scope of the present invention is not limited in This:
Embodiment:As shown in Figure 1 and Figure 2, integrated watertight OLED flat-plate light sources are transmitted by cathode glass substrate layer 1, electronics Layer 2, light exit layer 3, hole transmission layer 4, anode conducting substrate 5, solid encapsulation colloid 6, negative electrical wire 7,8 groups of positive electrical wire Into;Cathode glass substrate layer 1, electron transfer layer 2, light exit layer 3, hole transmission layer 4, anode conducting substrate 5 from top to bottom according to It is secondary to be stacked;Solid encapsulation colloid 6 by cathode glass substrate layer 1, electron transfer layer 2, light exit layer 3, hole transmission layer 4th, the overall all standing after anode conducting substrate 5 is cumulative, is wrapped in interior;Cathode glass substrate layer 1 is connected with negative electrical wire 7;Sun Pole electrically-conductive backing plate 5 is connected with positive electrical wire 8.Integrated watertight OLED flat-plate light sources carry both positive and negative polarity, positive electrical wire 8, negative electricity The circumscripted power line of line 7.The thickness of the integrated watertight OLED flat-plate light sources is no more than 10mm.Solid encapsulation colloid 6 is thermal conductivity Body material, the heat transfer produced during for OLED flat-plate light sources to be lighted to the external world.
Preferably, the classification of waterproof of the integrated watertight OLED flat-plate light sources is IPX8.
The preparation method of integrated watertight OLED flat-plate light sources, comprises the following steps:
(1) by anode conducting substrate, hole transmission layer, light exit layer, electron transfer layer, cathode glass substrate layer from it is lower extremely On stack gradually, obtain OLED flat-plate light source main bodys;
(2) positive electrical wire is drawn from anode conducting substrate, cathode glass substrate layer is drawn negative electrical wire, obtains OLED flat boards Light source entirety;
(3) sealant pouring and sealing is integrally carried out to OLED flat-plate light sources using solid encapsulation colloid:Solid encapsulation colloid is used, is adopted With the drop adhesive process whole light source of uniform wrapping and encapsulating, by the profile after corresponding encapsulating mould control light-source encapsulation, make whole water The shape of close OLED flat-plate light sources keeps constant, and it is thick only to increase certain polymer latex in the normal direction perpendicular to light-emitting area Degree.But because OLED thickness in itself is minimum, only several millimeters, so the OLED flat-plate light sources thickness after encapsulation does not still surpass Cross 10mm.
(4) finished product after sealant pouring and sealing is solidified, solidification obtains integrated watertight OLED flat-plate light sources after terminating.
It is specific embodiment of the invention and the know-why used described in above, if conception under this invention institute The change of work, function produced by it still without departing from specification and accompanying drawing covered it is spiritual when, should belong to of the invention Protection domain.

Claims (8)

1. integrated watertight OLED flat-plate light sources, it is characterised in that including:Cathode glass substrate layer (1), electron transfer layer (2), Light exit layer (3), hole transmission layer (4), anode conducting substrate (5), packing colloid (6), negative electrical wire (7), positive electrical wire (8);Cathode glass substrate layer (1), electron transfer layer (2), light exit layer (3), hole transmission layer (4), anode conducting substrate (5) Stack gradually from top to bottom together;Packing colloid (6) by cathode glass substrate layer (1), electron transfer layer (2), light exit layer (3) the overall all standing after, hole transmission layer (4), anode conducting substrate (5) are cumulative, is wrapped in interior;Cathode glass substrate layer (1) it is connected with negative electrical wire (7);Anode conducting substrate (5) is connected with positive electrical wire (8).
2. integrated watertight OLED flat-plate light sources according to claim 1, it is characterised in that:Described packing colloid (6) It is solid encapsulation colloid.
3. integrated watertight OLED flat-plate light sources according to claim 1, it is characterised in that:The integrated watertight OLED The thickness of flat-plate light source is no more than 10mm.
4. integrated watertight OLED flat-plate light sources according to claim 2, it is characterised in that:Described solid encapsulation colloid It is thermal conductor material, the heat transfer produced during for OLED flat-plate light sources to be lighted to the external world.
5. integrated watertight OLED flat-plate light sources according to claim 1, it is characterised in that:The integrated watertight OLED The classification of waterproof of flat-plate light source is IPX8.
6. the preparation method of integrated watertight OLED flat-plate light sources, it is characterised in that comprise the following steps:
(1) by anode conducting substrate, hole transmission layer, light exit layer, electron transfer layer, cathode glass substrate layer from bottom to top according to Secondary stacking, obtains OLED flat-plate light source main bodys;
(2) positive electrical wire is drawn from anode conducting substrate, cathode glass substrate layer is drawn negative electrical wire, obtains OLED flat-plate light sources It is overall;
(3) sealant pouring and sealing is integrally carried out to OLED flat-plate light sources using solid encapsulation colloid;
(4) finished product after sealant pouring and sealing is solidified, solidification obtains integrated watertight OLED flat-plate light sources after terminating.
7. preparation method according to claim 6, it is characterised in that:Using drop glue work during step (3) sealant pouring and sealing The whole OLED flat-plate light sources entirety of the uniform wrapping and encapsulating of skill, it is outer after being encapsulated by corresponding encapsulating mould control OLED flat-plate light sources Shape so that the shape of whole OLED flat-plate light sources keeps constant, only increases solid-state envelope in the normal direction perpendicular to light-emitting area Dress colloid thickness.
8. preparation method according to claim 7, it is characterised in that:Described encapsulating mould is made by OLED flat-plate light sources Determined with demand.
CN201611183915.6A 2016-12-20 2016-12-20 Integrated watertight OLED flat-plate light sources and preparation method thereof Pending CN106784367A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201611183915.6A CN106784367A (en) 2016-12-20 2016-12-20 Integrated watertight OLED flat-plate light sources and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201611183915.6A CN106784367A (en) 2016-12-20 2016-12-20 Integrated watertight OLED flat-plate light sources and preparation method thereof

Publications (1)

Publication Number Publication Date
CN106784367A true CN106784367A (en) 2017-05-31

Family

ID=58895986

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201611183915.6A Pending CN106784367A (en) 2016-12-20 2016-12-20 Integrated watertight OLED flat-plate light sources and preparation method thereof

Country Status (1)

Country Link
CN (1) CN106784367A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109860424A (en) * 2019-02-26 2019-06-07 固安翌光科技有限公司 A kind of flexible OLED screen body with outer protection structure
CN114566125A (en) * 2022-02-24 2022-05-31 淮安市润宇光电科技有限公司 Method and device for improving OLED display brightness uniformity

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395323A (en) * 2001-07-03 2003-02-05 株式会社半导体能源研究所 Luminescent device, method and electronic equipment for manufacturing luminescent device
CN101060733A (en) * 2007-04-30 2007-10-24 林万炯 Flexible bar type waterproof LED lamp forming process
CN102636441A (en) * 2012-05-02 2012-08-15 厦门华联电子有限公司 Test evaluation method of LED (light emitting diode) packaging adhesive
CN103137557A (en) * 2013-02-05 2013-06-05 深圳市华星光电技术有限公司 Array substrate and display unit and manufacturing method of array substrate
US8487532B2 (en) * 2010-09-14 2013-07-16 Goto Denshi Co., Ltd. Sealing for panels of an organic electroluminescence display and lighting apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1395323A (en) * 2001-07-03 2003-02-05 株式会社半导体能源研究所 Luminescent device, method and electronic equipment for manufacturing luminescent device
CN101060733A (en) * 2007-04-30 2007-10-24 林万炯 Flexible bar type waterproof LED lamp forming process
US8487532B2 (en) * 2010-09-14 2013-07-16 Goto Denshi Co., Ltd. Sealing for panels of an organic electroluminescence display and lighting apparatus
CN102636441A (en) * 2012-05-02 2012-08-15 厦门华联电子有限公司 Test evaluation method of LED (light emitting diode) packaging adhesive
CN103137557A (en) * 2013-02-05 2013-06-05 深圳市华星光电技术有限公司 Array substrate and display unit and manufacturing method of array substrate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109860424A (en) * 2019-02-26 2019-06-07 固安翌光科技有限公司 A kind of flexible OLED screen body with outer protection structure
CN114566125A (en) * 2022-02-24 2022-05-31 淮安市润宇光电科技有限公司 Method and device for improving OLED display brightness uniformity

Similar Documents

Publication Publication Date Title
Guan et al. Flexible inorganic light emitting diodes based on semiconductor nanowires
CN101539250A (en) LED lamp with high power
CN107086263A (en) Display device and its four sides are emitting led
CN106784367A (en) Integrated watertight OLED flat-plate light sources and preparation method thereof
CN105810780A (en) Method for manufacturing white LED (Light Emitting Diode) chip
CN107112436A (en) Organic luminescent device
CN104576910B (en) The manufacture method of luminous semiconductor device
CN208538907U (en) A kind of fluorescent glass with replacement function
CN102891141A (en) Waterproof anti-corrosion high-heat dispersion and high-insulation LED (Light-Emitting Diode) ceramic integrated light source and manufacturing method of the same
CN207038552U (en) A kind of omnibearing luminous LED lamp bead
CN207558820U (en) Light-emitting diode encapsulation structure
CN204497230U (en) A kind of LED encapsulation structure
CN102226994B (en) Display device for integrating LED (light-emitting diode) chip on conducting glass and manufacturing method thereof
CN104600218B (en) Preparation method based on the lighting device of OLED and the lighting device based on OLED
CN204303868U (en) Improve the light emitting semiconductor device of heat radiation and three-dimensional LED light source
CN205141021U (en) Outdoor high density high contrast emitting diode
CN203644817U (en) LED encapsulation structure
CN109449302A (en) Display panel and display device
CN203641936U (en) LED bulb
CN209374482U (en) A kind of deep ultraviolet LED inorganic encapsulated structure and LED lamp
CN207569552U (en) A kind of LED illumination glass substrate
CN100481545C (en) Seat structure of LED
CN203085528U (en) Waterproof anticorrosion heat radiation high insulation LED ceramic integrated light source
CN209592075U (en) A kind of flip LED COB light source of imitative OLED light source
CN201392848Y (en) White light-emitting diode with uniform light spots

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20170531

RJ01 Rejection of invention patent application after publication