CN106784367A - Integrated watertight OLED flat-plate light sources and preparation method thereof - Google Patents
Integrated watertight OLED flat-plate light sources and preparation method thereof Download PDFInfo
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- CN106784367A CN106784367A CN201611183915.6A CN201611183915A CN106784367A CN 106784367 A CN106784367 A CN 106784367A CN 201611183915 A CN201611183915 A CN 201611183915A CN 106784367 A CN106784367 A CN 106784367A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to field of semiconductor illumination, more particularly to integrated watertight OLED flat-plate light sources and preparation method thereof, including:Cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate, packing colloid, negative electrical wire, positive electrical wire;Cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate are stacked gradually together from top to bottom;Overall all standing of the packing colloid by cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate after cumulative, is wrapped in interior;Cathode glass substrate layer is connected with negative electrical wire;Anode conducting substrate is connected with positive electrical wire.Small volume of the present invention, with high-grade water resistance, good illumination effect;Preparation method is easy to operate simultaneously, it is easy to which popularity is carried out.
Description
Technical field
The present invention relates to field of semiconductor illumination, more particularly to integrated watertight OLED flat-plate light sources and preparation method thereof.
Background technology
OLED is a kind of excellent organic semiconductor illuminating product, with large scale, face be luminous, integral thickness is extremely light
The technical advantage such as thin, brightness uniformity, colour rendering be high, is especially suitable for homogeneous soft and comfortably illuminates occasion.But OLED has one again
Significant drawbacks:To the liquid quite sensitive such as water.OLED material contacts to damage completely with water scraps, serious limitation that this is not enough
The illumination optical extensive use in its place such as in outdoor landscape and under water.For this present situation, a waterproof high of design invention
Grade, the integrated watertight OLED flat-plate light sources that can be used under water are necessary.
The content of the invention
The present invention is to overcome above-mentioned weak point, it is therefore intended that provide integrated watertight OLED flat-plate light sources, the light source
Small volume, with high-grade water resistance, good illumination effect.
Another object of the present invention is the preparation method for providing integrated watertight OLED flat-plate light sources, the operation of this preparation method
It is convenient, it is easy to which that popularity is carried out.
The present invention is to reach above-mentioned purpose by the following technical programs:Integrated watertight OLED flat-plate light sources, including:Negative electrode
Glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate, packing colloid, negative electrical wire, positive pole
Electric wire;Cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate heap successively from top to bottom
Stack;Packing colloid is by cathode glass substrate layer, electron transfer layer, light exit layer, hole transmission layer, anode conducting substrate
Overall all standing after cumulative, is wrapped in interior;Cathode glass substrate layer is connected with negative electrical wire;Anode conducting substrate and positive pole electricity
Line is connected.
Preferably, described packing colloid is solid encapsulation colloid.
Preferably, the thickness of the integrated watertight OLED flat-plate light sources is no more than 10mm.
Preferably, described solid encapsulation colloid is thermal conductor material, produced during for OLED flat-plate light sources to be lighted
Heat transfer to extraneous.
Preferably, the classification of waterproof of the integrated watertight OLED flat-plate light sources is IPX8.
The preparation method of integrated watertight OLED flat-plate light sources, comprises the following steps:
(1) by anode conducting substrate, hole transmission layer, light exit layer, electron transfer layer, cathode glass substrate layer from it is lower extremely
On stack gradually, obtain OLED flat-plate light source main bodys;
(2) positive electrical wire is drawn from anode conducting substrate, cathode glass substrate layer is drawn negative electrical wire, obtains OLED flat boards
Light source entirety;
(3) sealant pouring and sealing is integrally carried out to OLED flat-plate light sources using solid encapsulation colloid;
(4) finished product after sealant pouring and sealing is solidified, solidification obtains integrated watertight OLED flat-plate light sources after terminating.
Preferably, using the drop whole OLED flat boards light of the uniform wrapping and encapsulating of adhesive process during step (3) sealant pouring and sealing
Source entirety, the profile after being encapsulated by corresponding encapsulating mould control OLED flat-plate light sources so that the shape of whole OLED flat-plate light sources
Shape keeps constant, only increases solid encapsulation colloid thickness in the normal direction perpendicular to light-emitting area.
Preferably, described encapsulating mould is determined by the use demand of OLED flat-plate light sources.
The beneficial effects of the present invention are:(1) thickness of the invention is minimum, no more than 10 millimeters, is easy to use;(2) by
In sealant pouring and sealing, the OLED flat-plate light sources show excellent water resistance, and classification of waterproof can reach IPX8, i.e., completely under water
Used;(3) preparation method is simple to operate, is easy to popularity to promote;(4) present invention can be used in shower wall, swimming pool
Under water, outer surface of automobile and outdoor scene illumination place, play high-quality illuminating effect.
Brief description of the drawings
Fig. 1 is schematic appearance of the invention;
Fig. 2 is structural representation of the invention.
Specific embodiment
With reference to specific embodiment, the present invention is described further, but protection scope of the present invention is not limited in
This:
Embodiment:As shown in Figure 1 and Figure 2, integrated watertight OLED flat-plate light sources are transmitted by cathode glass substrate layer 1, electronics
Layer 2, light exit layer 3, hole transmission layer 4, anode conducting substrate 5, solid encapsulation colloid 6, negative electrical wire 7,8 groups of positive electrical wire
Into;Cathode glass substrate layer 1, electron transfer layer 2, light exit layer 3, hole transmission layer 4, anode conducting substrate 5 from top to bottom according to
It is secondary to be stacked;Solid encapsulation colloid 6 by cathode glass substrate layer 1, electron transfer layer 2, light exit layer 3, hole transmission layer
4th, the overall all standing after anode conducting substrate 5 is cumulative, is wrapped in interior;Cathode glass substrate layer 1 is connected with negative electrical wire 7;Sun
Pole electrically-conductive backing plate 5 is connected with positive electrical wire 8.Integrated watertight OLED flat-plate light sources carry both positive and negative polarity, positive electrical wire 8, negative electricity
The circumscripted power line of line 7.The thickness of the integrated watertight OLED flat-plate light sources is no more than 10mm.Solid encapsulation colloid 6 is thermal conductivity
Body material, the heat transfer produced during for OLED flat-plate light sources to be lighted to the external world.
Preferably, the classification of waterproof of the integrated watertight OLED flat-plate light sources is IPX8.
The preparation method of integrated watertight OLED flat-plate light sources, comprises the following steps:
(1) by anode conducting substrate, hole transmission layer, light exit layer, electron transfer layer, cathode glass substrate layer from it is lower extremely
On stack gradually, obtain OLED flat-plate light source main bodys;
(2) positive electrical wire is drawn from anode conducting substrate, cathode glass substrate layer is drawn negative electrical wire, obtains OLED flat boards
Light source entirety;
(3) sealant pouring and sealing is integrally carried out to OLED flat-plate light sources using solid encapsulation colloid:Solid encapsulation colloid is used, is adopted
With the drop adhesive process whole light source of uniform wrapping and encapsulating, by the profile after corresponding encapsulating mould control light-source encapsulation, make whole water
The shape of close OLED flat-plate light sources keeps constant, and it is thick only to increase certain polymer latex in the normal direction perpendicular to light-emitting area
Degree.But because OLED thickness in itself is minimum, only several millimeters, so the OLED flat-plate light sources thickness after encapsulation does not still surpass
Cross 10mm.
(4) finished product after sealant pouring and sealing is solidified, solidification obtains integrated watertight OLED flat-plate light sources after terminating.
It is specific embodiment of the invention and the know-why used described in above, if conception under this invention institute
The change of work, function produced by it still without departing from specification and accompanying drawing covered it is spiritual when, should belong to of the invention
Protection domain.
Claims (8)
1. integrated watertight OLED flat-plate light sources, it is characterised in that including:Cathode glass substrate layer (1), electron transfer layer (2),
Light exit layer (3), hole transmission layer (4), anode conducting substrate (5), packing colloid (6), negative electrical wire (7), positive electrical wire
(8);Cathode glass substrate layer (1), electron transfer layer (2), light exit layer (3), hole transmission layer (4), anode conducting substrate (5)
Stack gradually from top to bottom together;Packing colloid (6) by cathode glass substrate layer (1), electron transfer layer (2), light exit layer
(3) the overall all standing after, hole transmission layer (4), anode conducting substrate (5) are cumulative, is wrapped in interior;Cathode glass substrate layer
(1) it is connected with negative electrical wire (7);Anode conducting substrate (5) is connected with positive electrical wire (8).
2. integrated watertight OLED flat-plate light sources according to claim 1, it is characterised in that:Described packing colloid (6)
It is solid encapsulation colloid.
3. integrated watertight OLED flat-plate light sources according to claim 1, it is characterised in that:The integrated watertight OLED
The thickness of flat-plate light source is no more than 10mm.
4. integrated watertight OLED flat-plate light sources according to claim 2, it is characterised in that:Described solid encapsulation colloid
It is thermal conductor material, the heat transfer produced during for OLED flat-plate light sources to be lighted to the external world.
5. integrated watertight OLED flat-plate light sources according to claim 1, it is characterised in that:The integrated watertight OLED
The classification of waterproof of flat-plate light source is IPX8.
6. the preparation method of integrated watertight OLED flat-plate light sources, it is characterised in that comprise the following steps:
(1) by anode conducting substrate, hole transmission layer, light exit layer, electron transfer layer, cathode glass substrate layer from bottom to top according to
Secondary stacking, obtains OLED flat-plate light source main bodys;
(2) positive electrical wire is drawn from anode conducting substrate, cathode glass substrate layer is drawn negative electrical wire, obtains OLED flat-plate light sources
It is overall;
(3) sealant pouring and sealing is integrally carried out to OLED flat-plate light sources using solid encapsulation colloid;
(4) finished product after sealant pouring and sealing is solidified, solidification obtains integrated watertight OLED flat-plate light sources after terminating.
7. preparation method according to claim 6, it is characterised in that:Using drop glue work during step (3) sealant pouring and sealing
The whole OLED flat-plate light sources entirety of the uniform wrapping and encapsulating of skill, it is outer after being encapsulated by corresponding encapsulating mould control OLED flat-plate light sources
Shape so that the shape of whole OLED flat-plate light sources keeps constant, only increases solid-state envelope in the normal direction perpendicular to light-emitting area
Dress colloid thickness.
8. preparation method according to claim 7, it is characterised in that:Described encapsulating mould is made by OLED flat-plate light sources
Determined with demand.
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109860424A (en) * | 2019-02-26 | 2019-06-07 | 固安翌光科技有限公司 | A kind of flexible OLED screen body with outer protection structure |
CN114566125A (en) * | 2022-02-24 | 2022-05-31 | 淮安市润宇光电科技有限公司 | Method and device for improving OLED display brightness uniformity |
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CN1395323A (en) * | 2001-07-03 | 2003-02-05 | 株式会社半导体能源研究所 | Luminescent device, method and electronic equipment for manufacturing luminescent device |
CN101060733A (en) * | 2007-04-30 | 2007-10-24 | 林万炯 | Flexible bar type waterproof LED lamp forming process |
CN102636441A (en) * | 2012-05-02 | 2012-08-15 | 厦门华联电子有限公司 | Test evaluation method of LED (light emitting diode) packaging adhesive |
CN103137557A (en) * | 2013-02-05 | 2013-06-05 | 深圳市华星光电技术有限公司 | Array substrate and display unit and manufacturing method of array substrate |
US8487532B2 (en) * | 2010-09-14 | 2013-07-16 | Goto Denshi Co., Ltd. | Sealing for panels of an organic electroluminescence display and lighting apparatus |
-
2016
- 2016-12-20 CN CN201611183915.6A patent/CN106784367A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1395323A (en) * | 2001-07-03 | 2003-02-05 | 株式会社半导体能源研究所 | Luminescent device, method and electronic equipment for manufacturing luminescent device |
CN101060733A (en) * | 2007-04-30 | 2007-10-24 | 林万炯 | Flexible bar type waterproof LED lamp forming process |
US8487532B2 (en) * | 2010-09-14 | 2013-07-16 | Goto Denshi Co., Ltd. | Sealing for panels of an organic electroluminescence display and lighting apparatus |
CN102636441A (en) * | 2012-05-02 | 2012-08-15 | 厦门华联电子有限公司 | Test evaluation method of LED (light emitting diode) packaging adhesive |
CN103137557A (en) * | 2013-02-05 | 2013-06-05 | 深圳市华星光电技术有限公司 | Array substrate and display unit and manufacturing method of array substrate |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN109860424A (en) * | 2019-02-26 | 2019-06-07 | 固安翌光科技有限公司 | A kind of flexible OLED screen body with outer protection structure |
CN114566125A (en) * | 2022-02-24 | 2022-05-31 | 淮安市润宇光电科技有限公司 | Method and device for improving OLED display brightness uniformity |
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