CN104487897B - 液浸构件及曝光装置 - Google Patents

液浸构件及曝光装置 Download PDF

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Publication number
CN104487897B
CN104487897B CN201380038451.8A CN201380038451A CN104487897B CN 104487897 B CN104487897 B CN 104487897B CN 201380038451 A CN201380038451 A CN 201380038451A CN 104487897 B CN104487897 B CN 104487897B
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China
Prior art keywords
liquid
component
substrate
liquid immersion
immersion member
Prior art date
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CN201380038451.8A
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English (en)
Chinese (zh)
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CN104487897A (zh
Inventor
佐藤真路
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Nikon Corp
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Nikon Corp
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Priority to CN201710675381.7A priority Critical patent/CN107422612B/zh
Publication of CN104487897A publication Critical patent/CN104487897A/zh
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216Mask projection systems
    • G03F7/70341Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
CN201380038451.8A 2012-07-20 2013-07-16 液浸构件及曝光装置 Active CN104487897B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710675381.7A CN107422612B (zh) 2012-07-20 2013-07-16 液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261674078P 2012-07-20 2012-07-20
US61/674,078 2012-07-20
US201361790328P 2013-03-15 2013-03-15
US61/790,328 2013-03-15
PCT/JP2013/069959 WO2014014123A1 (en) 2012-07-20 2013-07-16 Liquid immersion member and exposure apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201710675381.7A Division CN107422612B (zh) 2012-07-20 2013-07-16 液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法

Publications (2)

Publication Number Publication Date
CN104487897A CN104487897A (zh) 2015-04-01
CN104487897B true CN104487897B (zh) 2017-08-29

Family

ID=48951526

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201380038451.8A Active CN104487897B (zh) 2012-07-20 2013-07-16 液浸构件及曝光装置
CN201710675381.7A Active CN107422612B (zh) 2012-07-20 2013-07-16 液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法

Family Applications After (1)

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CN201710675381.7A Active CN107422612B (zh) 2012-07-20 2013-07-16 液浸构件、曝光装置、液浸曝光装置、液浸曝光方法及元件制造方法

Country Status (8)

Country Link
US (3) US9823580B2 (OSRAM)
EP (1) EP2875405B1 (OSRAM)
JP (1) JP6406250B2 (OSRAM)
KR (1) KR102139033B1 (OSRAM)
CN (2) CN104487897B (OSRAM)
HK (1) HK1208914A1 (OSRAM)
TW (3) TWI661277B (OSRAM)
WO (1) WO2014014123A1 (OSRAM)

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CN112286012A (zh) * 2020-10-29 2021-01-29 浙江启尔机电技术有限公司 一种浸液回收系统及采用该系统的浸液回收方法

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US8896806B2 (en) 2008-12-29 2014-11-25 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method
EP2523210A1 (en) * 2010-01-08 2012-11-14 Nikon Corporation Liquid-immersion member, exposing device, exposing method, and device manufacturing method
US9268231B2 (en) 2012-04-10 2016-02-23 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9323160B2 (en) * 2012-04-10 2016-04-26 Nikon Corporation Liquid immersion member, exposure apparatus, exposure method, device fabricating method, program, and recording medium
US9823580B2 (en) * 2012-07-20 2017-11-21 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method for manufacturing device, program, and recording medium
US9568828B2 (en) 2012-10-12 2017-02-14 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9494870B2 (en) 2012-10-12 2016-11-15 Nikon Corporation Exposure apparatus, exposing method, device manufacturing method, program, and recording medium
US9651873B2 (en) 2012-12-27 2017-05-16 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium
US9720331B2 (en) 2012-12-27 2017-08-01 Nikon Corporation Liquid immersion member, exposure apparatus, exposing method, method of manufacturing device, program, and recording medium

Also Published As

Publication number Publication date
US20180314166A1 (en) 2018-11-01
JP6406250B2 (ja) 2018-10-17
US9823580B2 (en) 2017-11-21
TW201405256A (zh) 2014-02-01
EP2875405A1 (en) 2015-05-27
JP2015528132A (ja) 2015-09-24
TWI661277B (zh) 2019-06-01
US20140022522A1 (en) 2014-01-23
HK1208914A1 (en) 2016-03-18
KR102139033B1 (ko) 2020-08-11
CN107422612A (zh) 2017-12-01
US10007189B2 (en) 2018-06-26
CN107422612B (zh) 2020-05-26
HK1206435A1 (en) 2016-01-08
TWI700557B (zh) 2020-08-01
TW201925928A (zh) 2019-07-01
WO2014014123A1 (en) 2014-01-23
TWI617894B (zh) 2018-03-11
US20150124230A1 (en) 2015-05-07
US10739683B2 (en) 2020-08-11
EP2875405B1 (en) 2020-02-26
CN104487897A (zh) 2015-04-01
TW201809910A (zh) 2018-03-16
KR20150038075A (ko) 2015-04-08

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