CN104470229B - The method and device that copper foil removes at printed circuit board component pin - Google Patents
The method and device that copper foil removes at printed circuit board component pin Download PDFInfo
- Publication number
- CN104470229B CN104470229B CN201410797695.0A CN201410797695A CN104470229B CN 104470229 B CN104470229 B CN 104470229B CN 201410797695 A CN201410797695 A CN 201410797695A CN 104470229 B CN104470229 B CN 104470229B
- Authority
- CN
- China
- Prior art keywords
- copper foil
- pin
- printed circuit
- resistor
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 239000011889 copper foil Substances 0.000 title claims abstract description 80
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000003990 capacitor Substances 0.000 claims abstract description 19
- 239000004744 fabric Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
The present invention discloses the method and device that copper foil at printed circuit board component pin removes, wherein method includes：The Resistor-Capacitor Unit pin that is on selection printed circuit board (PCB) in copper foil area is simultaneously clicked at the pin of selection, copper foil Jin Bu areas is set at the pin of click, then the copper foil in the copper foil Jin Bu areas at Resistor-Capacitor Unit pin automatically removes.The present invention only needs to remove copper foil in the copper foil Jin Bu areas that a key command can be completed to lay at Resistor-Capacitor Unit pin, thus it is simple, fast to avoid the occurrence of appearance " setting up a monument " phenomenon at Resistor-Capacitor Unit pin, so as to substantially increase the operating efficiency of PCB design personnel, and PCB design is caused to seem attractive in appearance.
Description
Technical field
The present invention relates to electronic technology printed circuit board (PCB) (PCB, Printed Circuit Board) design and make, especially
It is related to the method and device that copper foil removes at the Resistor-Capacitor Unit pin of printed circuit board (PCB).
Background technology
In the solder reflow process of surface mount process, be encapsulated as Resistor-Capacitor Unit (also referred to as 0402 paster) because stick up it is vertical and
The defects of causing sealing-off, people are visually referred to as " setting up a monument " phenomenon.Say, the generation of " setting up a monument " phenomenon is due to element two
Holding the soldering paste on pad, the surface tension of two welding ends of element is uneven, and the larger welding end of tension force hauls when flowing back fusing
Element produces the power of a rotation along its bottom and caused.
In order to avoid the generation of " setting up a monument " phenomenon, ensure that 0402 surface mount elements both ends cabling is balanced as far as possible in PCB design.
But it is that cabling one end is copper foil connection in the design, to be frequently encountered 0402 surface mount elements one end, or both ends are all that copper foil connects
Connect, be so easy to cause two pad tension imbalances or be heated too soon, and cause " setting up a monument " phenomenon.
Currently used solution method is exactly in the case of having copper foil connection at 0402 surface mount elements both ends, manually
The copper foil dug at pin, to reduce joint face, so as to avoid setting up a monument, as shown in Figure 1.But manual mode digs the operation of copper foil not only
Waste time and energy, also often occur digging the not of uniform size of copper foil so that PCB design pole unsightly, and digs right angle copper foil and is unfavorable for PCB
Factory process.Meanwhile when designing some bigger pcb boards, 0402 surface mount elements are a lot, use traditional method to solve
" setting up a monument " phenomenon also easily extends PCB design and the cycle made, it is necessary to PCB design personnel expend considerable time and effort.
Accordingly, it is desirable to provide a kind of method that copper foil removes at printed circuit board component pin, can automatically remove 0402
Copper foil at surface mount elements pin.
The content of the invention
The technical problems to be solved by the invention are to provide the side that a kind of copper foil at printed circuit board component pin removes
Method, the copper foil at 0402 surface mount elements pin can be automatically removed.
In order to solve the above-mentioned technical problem, the invention provides the side that copper foil at a kind of printed circuit board component pin removes
Method, including：
Basic step：Select the Resistor-Capacitor Unit pin on printed circuit board (PCB) in copper foil area and click on the pin of selection
Place, copper foil Jin Bu areas are set at the pin of click, then the copper foil in the copper foil Jin Bu areas at Resistor-Capacitor Unit pin automatically removes.
Further, this method also includes：
If judging to also have other pins untreated in the copper foil area on printed circuit board (PCB), return to basic step and continue to hold
OK.
In order to solve the above-mentioned technical problem, the invention provides the dress that copper foil at a kind of printed circuit board component pin removes
Put, including the element pin selecting module and copper foil of interconnection prohibit cloth module, wherein：
Element pin selecting module, the position of Resistor-Capacitor Unit pin is clicked on for selection in copper foil area on a printed circuit
Put, and the position for the pin that will click on is supplied to copper foil to prohibit cloth module；
Copper foil prohibits cloth module, and the position of the pin for being provided in element pin selecting module sets copper foil Jin Bu areas, then
The copper foil in the copper foil Jin Bu areas at Resistor-Capacitor Unit pin automatically removes.
Further, the device also includes the element pin counting module being connected with element pin selecting module, wherein：
Element pin counting module, for counting the number of the Resistor-Capacitor Unit pin selected on printed circuit board (PCB) in copper foil area
Mesh, if the number is not up to the predetermined number of Resistor-Capacitor Unit pin in copper foil area, it indicates that element pin selecting module continues to select
Select the position for clicking on Resistor-Capacitor Unit pin.
The present invention, only need to be by a key command just by performing the program that copper foil removes at 0402 surface mount elements pin
Copper foil is removed in the copper foil Jin Bu areas that can complete to lay at 0402 surface mount elements pin, it is thus simple, fast to avoid 0402
Occur " setting up a monument " phenomenon at surface mount elements pin, so as to substantially increase the operating efficiency of PCB design personnel, and PCB is set
Meter seems attractive in appearance.
Brief description of the drawings
Fig. 1 is the schematic diagram that copper foil at 0402 surface mount elements pin is dug with traditional manual mode；
Fig. 2 is the schematic diagram that copper foil at 0402 surface mount elements pin is automatically removed with the embodiment of the method for the present invention；
Fig. 3 is the flow chart for the embodiment of the method that the copper foil at printed circuit board component pin of the present invention removes；
Fig. 4 is the structured flowchart of copper foil removal device embodiment at printed circuit board component pin of the present invention.
Embodiment
Technical scheme is set forth in below in conjunction with accompanying drawing and preferred embodiment.It should be understood that with
Under the embodiment enumerated be merely to illustrate and explain the present invention, without forming the limitation to technical solution of the present invention.
As shown in figure 1, express copper foil minimizing technology embodiment at printed circuit board component pin provided by the invention
Flow, comprise the following steps：
110：Selection is in 0402 surface mount elements pin on PCB in copper foil area and clicks on it；
120：Copper foil Jin Bu areas are added at 0402 surface mount elements pin of click；
130：Judge whether also have other pins untreated on PCB in copper foil area, be that return to step 110 performs, otherwise
Perform next step；
140：The copper foil in copper foil Jin Bu areas is set to automatically remove at 0402 surface mount elements pin；Terminate flow.
The present invention is directed to above method embodiment, correspondingly additionally provides copper foil at printed circuit board component pin and removes dress
Put embodiment, its structure as shown in figure 4, element pin selecting module including interconnection and copper foil prohibit cloth module, wherein：
Element pin selecting module, the position of 0402 surface mount elements pin is clicked on for selection in the copper foil area on PCB,
And it is supplied to copper foil to prohibit cloth module；
Copper foil prohibits cloth module, for adding copper foil Jin Bu areas according to the position of 0402 surface mount elements pin, then 0402 paster
The copper foil in copper foil Jin Bu areas is set to automatically remove at element pin.
Said apparatus embodiment also includes the element pin counting module being connected with element pin selecting module, wherein：
Element pin counting module, for counting the 0402 surface mount elements pin for selecting to click in the copper foil area on PCB
Number, if the predetermined number for the 0402 surface mount elements pin that the number is not up in the copper foil area on the PCB, it indicates that element tube
Pin selecting module continues selection element pin.
The present invention writes the program that copper foil is added at 0402 surface mount elements pin and prohibits cloth region according to above method embodiment,
Perform the pin that the program only needs a key to click on 0402 surface mount elements, you can complete to prohibit cloth region in pin week end addition copper foil,
The copper foil that then those copper foils are prohibited in cloth region can automatically remove, thus simple, fast to avoid at 0402 surface mount elements pin
There is " setting up a monument " phenomenon, so as to substantially increase the operating efficiency of PCB design personnel, and PCB design is seemed attractive in appearance.
Claims (4)
1. a kind of method that copper foil removes at printed circuit board component pin, including：
Basic step：The Resistor-Capacitor Unit pin that is on selection printed circuit board (PCB) in copper foil area is simultaneously clicked at the pin of selection,
Copper foil Jin Bu areas are set at the pin of click, then the copper foil in the copper foil Jin Bu areas at Resistor-Capacitor Unit pin automatically removes.
2. in accordance with the method for claim 1, it is characterised in that also include：
If judging to also have other pins untreated in the copper foil area on printed circuit board (PCB), return to the basic step and continue to hold
OK.
A kind of 3. device that copper foil removes at printed circuit board component pin, it is characterised in that the element tube including interconnection
Pin selecting module and copper foil prohibit cloth module, wherein：
Element pin selecting module, the position of Resistor-Capacitor Unit pin is clicked on for selection in copper foil area on a printed circuit,
And the position for the pin that will click on is supplied to copper foil to prohibit cloth module；
Copper foil prohibits cloth module, and the position of the pin for being provided in element pin selecting module sets copper foil Jin Bu areas, then capacitance-resistance
The copper foil in the copper foil Jin Bu areas at element pin automatically removes.
4. according to the device described in claim 3, it is characterised in that also include the member being connected with the element pin selecting module
Part pin count module, wherein：
Element pin counting module, for counting the number of the Resistor-Capacitor Unit pin selected on printed circuit board (PCB) in copper foil area, if
The number is not up to the predetermined number of Resistor-Capacitor Unit pin in the copper foil area, it indicates that the element pin selecting module continues
The position of Resistor-Capacitor Unit pin is clicked in selection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410797695.0A CN104470229B (en) | 2014-12-18 | 2014-12-18 | The method and device that copper foil removes at printed circuit board component pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410797695.0A CN104470229B (en) | 2014-12-18 | 2014-12-18 | The method and device that copper foil removes at printed circuit board component pin |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104470229A CN104470229A (en) | 2015-03-25 |
| CN104470229B true CN104470229B (en) | 2018-03-16 |
Family
ID=52915369
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410797695.0A Active CN104470229B (en) | 2014-12-18 | 2014-12-18 | The method and device that copper foil removes at printed circuit board component pin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104470229B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770198A (en) * | 2018-05-31 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of circuit board being packaged with chip component |
| CN109446626B (en) * | 2018-10-22 | 2021-10-29 | 郑州云海信息技术有限公司 | Impedance matching method for differential line pin and related device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101339583A (en) * | 2008-08-28 | 2009-01-07 | 深圳华为通信技术有限公司 | Method and device for designing board |
| CN101795533A (en) * | 2009-12-11 | 2010-08-04 | 福建星网锐捷网络有限公司 | Circuit board and copper-spreading method thereof |
| CN101877228A (en) * | 2009-04-30 | 2010-11-03 | 广明光电股份有限公司 | Method and device for capturing label surface code signals |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302964A (en) * | 1994-04-28 | 1995-11-14 | Nippon Avionics Co Ltd | Formation method of target mark on printed-wiring board |
| CN1625322A (en) * | 2003-12-02 | 2005-06-08 | 夏新电子股份有限公司 | Method for solving faulty solder of self-plug electrolytic capacitor |
| DE102006053696A1 (en) * | 2006-11-13 | 2008-05-29 | Häusermann GmbH | Plant for the production of a printed circuit board with additive and integrated and ultrasonically contacted copper elements |
| CN101203093B (en) * | 2006-12-15 | 2011-06-15 | 英业达股份有限公司 | Circuit board metallic layer amending method |
| CN103593526A (en) * | 2013-11-15 | 2014-02-19 | 浪潮电子信息产业股份有限公司 | Design method for automatically searching copper foil clearances in stacks of PCBs |
-
2014
- 2014-12-18 CN CN201410797695.0A patent/CN104470229B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101339583A (en) * | 2008-08-28 | 2009-01-07 | 深圳华为通信技术有限公司 | Method and device for designing board |
| CN101877228A (en) * | 2009-04-30 | 2010-11-03 | 广明光电股份有限公司 | Method and device for capturing label surface code signals |
| CN101795533A (en) * | 2009-12-11 | 2010-08-04 | 福建星网锐捷网络有限公司 | Circuit board and copper-spreading method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104470229A (en) | 2015-03-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102689065B (en) | A kind of welding method of circuit board element | |
| CN103796446B (en) | The manufacture method of large scale array formula photoelectric sending and receiving sensor | |
| CN102291945B (en) | Through-hole reflow soldering method | |
| CN104470229B (en) | The method and device that copper foil removes at printed circuit board component pin | |
| CN102111991B (en) | Method for soldering through-hole reflow device and printed circuit board | |
| CN106686905A (en) | Surface mount technology for sheet components | |
| Jin et al. | Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints | |
| TW201343008A (en) | Printed circuit board structure | |
| CN204094281U (en) | The fixture of optic module PCB plate contact pin welding | |
| CN207947958U (en) | A kind of modified form SMT steel mesh jigs | |
| CN202479665U (en) | Welding machine fixture for wave-soldering | |
| CN203056147U (en) | Welding pin structure of electronic component | |
| CN205378347U (en) | Area drilling detects circuit board of structure | |
| CN203691749U (en) | Circuit board assembly | |
| CN205546222U (en) | Reflow soldering template, Stencil assembly and solder paste printing process device | |
| CN204470756U (en) | Through-hole reflow positioning fixture | |
| CN204697391U (en) | A kind of printed circuit pads structure | |
| CN104080277A (en) | Method for preventing soldering holes from being blocked in wave soldering process and printed circuit board | |
| CN204069501U (en) | A kind of PCB be connected firmly | |
| CN202026529U (en) | Printed circuit board | |
| CN204104215U (en) | A kind of direct insertion pcb board | |
| CN104105358A (en) | Method of preventing solder bridge in case of printed circuit board plug-in wave soldering | |
| CN102137549B (en) | Electronic component layout method of circuit board with adhesive surfaces on both sides | |
| CN201256486Y (en) | Bond pad construction for hardware piece | |
| CN203352968U (en) | Electronic component pin |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |