CN1625322A - Method for solving faulty solder of self-plug electrolytic capacitor - Google Patents
Method for solving faulty solder of self-plug electrolytic capacitor Download PDFInfo
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- CN1625322A CN1625322A CN 200310114411 CN200310114411A CN1625322A CN 1625322 A CN1625322 A CN 1625322A CN 200310114411 CN200310114411 CN 200310114411 CN 200310114411 A CN200310114411 A CN 200310114411A CN 1625322 A CN1625322 A CN 1625322A
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- plug
- electric capacity
- additional vias
- circuit board
- printed circuit
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Abstract
This invention discloses a method to solve the problem of the unstable welding on the self-inserted electrolyzing capacitor. It has been equipped at least two pin jack through-hole for insert-setting capacitor on the printed circuit board of the self-inserted electrolyzing capacitor position. On the mentioned printed circuit board of the self-inserted electrolyzing capacitor position it has set at least one additive through-hole. When the printed circuit board is welded through wave crest, the air sealed between the electrolyzing capacitor and the printed circuit board heated is heated and expands sharp, then vents from the additive through-hole. This invention commences from design, and adds through-hole in the PCB self-inserted electrolyzing capacitor position. The electrolyzing capacitor adopts the infixed parts installing mode of the self-inserted machine. When the printed circuit board is welded through wave crest, the air between the hermetical capacitor and the printed circuit board is heated and expands sharp, then vents from the additive through-hole so as not to effect the weld.
Description
Affiliated technical field
The present invention relates to a kind of solution and separate the method for electric capacity rosin joint from plug-in, particularly relate to utilization and offer additional vias, the electric capacity rosin joint is separated in the solution that allows the electrochemical capacitor of sealing and the air between printed circuit board (PCB) be heated sharply to expand the back to be discharged from additional vias from plug-in method separating on the electric capacity position of printed circuit board (PCB) from plug-in.
Background technology
The competition in electronic product market at present is more and more fierce, and product is come into the market with high quality and low cost, is the key that can a kind of product obtain the market share, and this forces the electronic product producer must adopt towards the design (DFM) of making.Separate electric capacity solder joint rosin joint from plug-in and connect that to weld bad problem of faulty soldering be a more scabrous problem in electron trade, it not only influences first-pass yield, a friendship rate of product, but also the life-span of product is existed certain influence, and potential hidden danger is difficult to estimate.Existingly separate electric capacity and the printed circuit board (PCB) mounting means has two kinds from plug-in, one is inserted machine transplanting of rice part certainly; Its two, artificial plug-in unit.
One, insert machine transplanting of rice part certainly:
Separate electric capacity and printed circuit board (PCB) close installation from plug-in, when printed circuit board (PCB) by after the wave soldering, will bad shortcoming such as Xi Silian weldering appears having between solder joint rosin joint and electric capacity and printed circuit board (PCB), its fraction defective is up to more than 50%.These bad shortcomings will increase workload and influence product reliability, and be specially: one has increased the workload of repairing plate inspection, maintenance greatly; Its two, the tin silk that exists between electric capacity and printed circuit board (PCB) is bad also be can not check when the product manufacturing detects, it is bad only just can to occur Xi Silian weldering after several hours in the product continuous operation, has influenced reliability of products.
Two, artificial plug-in unit:
Though artificial plug-in unit can solve this poor welding spots problem, electric capacity is separated in artificial plug-in, plug-in unit after the shaping in advance, and be about 20 times from the man-hour that slotting machine transplanting of rice part expends the man-hour that its artificial plug-in unit expends.Electrochemical capacitor and printed circuit board (PCB) are equipped with the positive-negative polarity requirement, so that the artificial easy misplug of plug-in unit or leak is inserted etc. is bad, has increased the inspection of repairing plate virtually and have reprocessed the time.The hand that expends is inserted the number of working processes and repaiies plate that to reprocess the number of working processes very big.
Summary of the invention
Because the solder joint rosin joint connects and to weld badly after plug-in separates electric capacity to cross wave-soldering, the present invention proposes the electric capacity rosin joint is separated in a kind of solution from plug-in method.
The technology that is adopted that addresses this problem of the present invention is: a kind of method of separating the electric capacity rosin joint from plug-in that solves, the printed circuit board (PCB) of separating the electric capacity position from plug-in is provided with two plug-in mounting electric capacity pin through holes, also offer an additional vias at least on the described printed circuit board (PCB) of separating the electric capacity position from plug-in, when printed circuit board (PCB) is crossed wave soldering, be sealed in the be heated back of sharply expanding of air between electrochemical capacitor and printed circuit board (PCB) and from additional vias, discharge.
Also offer an additional vias on the described printed circuit board (PCB) of separating the electric capacity position from plug-in.
Also offer two additional vias on the described printed circuit board (PCB) of separating the electric capacity position from plug-in.
The center of circle of described two plug-in mounting electric capacity pin through holes distributes with respect to the line left-right symmetric in two additional vias centers of circle respectively.
Described additional vias is removed the non-metallic hole of Copper Foil for the edges at two ends place.
Span between described two plug-in mounting electric capacity pin through holes is 2.5mm.
Described printed circuit board (PCB) is a single sided board, the fore-and-aft distance b in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 1.5～2.0mm, lateral separation a is 0.9～1.6mm, and the additional vias diameter is 0.6～1.0mm, and Copper Foil is removed at additional vias two end distance bore edges 0.1～0.4mm place.
The fore-and-aft distance b in the described additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 1.6mm, and lateral separation a is 1.3mm, and the additional vias diameter is 0.7mm, and Copper Foil is removed at additional vias two end distance bore edges 0.2mm places.
Described printed circuit board (PCB) is a double sided board, the fore-and-aft distance b in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 0mm～2.0mm, lateral separation a is 0.2mm～2.2mm, and the additional vias diameter is 0.3～1.1mm, and Copper Foil is removed at additional vias two end distance bore edges 0.1～0.4mm place.
Described printed circuit board (PCB) is a double sided board, and the fore-and-aft distance b in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 0.9mm, and lateral separation a is 1.0mm, and the additional vias diameter is 0.3mm, and Copper Foil is removed at additional vias two end distance bore edges 0.2mm places.
The center of circle of a described additional vias is positioned on the perpendicular bisector of line in two plug-in mounting electric capacity pin through hole centers of circle.
The present invention sets about from design, at least offer an additional vias in holding on the position of PCB from plug-in, it is easier wherein to offer an additional vias, no matter be that it is from inserting the machine transplanting of rice part or the mounting means of artificial plug-in unit (wherein generally being to adopt high efficiency electrochemical capacitor to adopt from inserting machine transplanting of rice part mounting means), when printed circuit board (PCB) is crossed wave soldering, allow the air that is sealed between electric capacity and printed circuit board (PCB) be heated back from additional vias, the discharge of sharply expansion and not influence welding, thoroughly solve the electrochemical capacitor rosin joint and connected bad problems such as weldering, do not influence simultaneously the PCBA quality, be that a kind of the solution separated electric capacity solder joint rosin joint from plug-in and connected and to weld bad manufacturability design, and do not increase any cost.The present invention is used in multilayer board, particularly be applicable to span be 2.5mm from plug-in perhaps span be 3.5mm hold printed circuit board (PCB) from plug-in appearance etc. from plug-in.
Description of drawings
The invention will be further described below in conjunction with accompanying drawing.
Fig. 1 is the schematic perspective view of the embodiment of the invention one;
Fig. 2 is the front view of the embodiment of the invention one;
Fig. 3 is the partial enlarged drawing of the embodiment of the invention one;
Fig. 4 is the schematic perspective view of the embodiment of the invention three.
Specific embodiment
One, embodiment one
A kind of method of separating the electric capacity rosin joint from plug-in that solves, the printed circuit board (PCB) of separating electric capacity position 1 from plug-in is provided with two plug-in mounting electric capacity pin through holes 2, also offers additional vias 3 on the described printed circuit board (PCB) of separating electric capacity position 1 from plug-in.
As shown in Figure 1, span is hold needing to offer the designing requirement of additional vias from plug-in on single-clad board (the present invention being to be holding as embodiment from plug-in of 2.5mm with the span of 2.5mm, but be not exceed holding from plug-in of 2.5mm with the span, other is also to be applicable to the present invention holding from plug-in from plug-in appearance etc. of 3.5mm as span):
1, as shown in Figure 2, additional vias status requirement: the additional vias center of circle and plug-in mounting electric capacity draw
Lateral separation a=0.9～the 1.6mm in the pin through hole center of circle, the fore-and-aft distance b=1.5～2.0mm in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle.
2, as shown in Figure 3, the additional vias diameter is 0.6～1.0mm, and additional vias should be removed Copper Foil apart from bore edges 0.1～0.4mm place.
Wherein, big or small as follows apart from bore edges of the optimum position of additional vias, diameter and additional vias: a=1.3mm, b=1.6mm; The additional vias diameter is 0.7mm; Through hole is removed the non-metallic hole of Copper Foil apart from bore edges c=0.2mm place.
The present invention sets about from design, increase additional vias in holding on the position of PCB from plug-in, no matter be that it is from inserting the machine transplanting of rice part or the mounting means of artificial plug-in unit, as shown in Figure 1, when printed circuit board (PCB) is crossed wave soldering, be sealed in the be heated back of sharply expanding of air between electric capacity and printed circuit board (PCB) and from additional vias, discharge and do not influence welding, thoroughly solve the electrochemical capacitor rosin joint and connected bad problems such as weldering, simultaneously do not influence the PCBA quality, do not increase any cost.
Two, embodiment two
Present embodiment and embodiment one difference are: printed circuit board (PCB) is a double sided board.
Span be 2.5mm hold to need the designing requirement that on double-sided printed-circuit board, offer an additional vias from plug-in:
1, additional vias status requirement: the lateral separation a=0.2mm～2.2mm in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle, fore-and-aft distance b=0.6mm～the 2.0mm in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle, and the centre-to-centre spacing of electric capacity pin through hole and additional vias is not less than (R+r+0.4) mm, and (annotate: R is the radius of electric capacity pin through hole, r is the radius of additional vias), and be not more than 2.3mm; Or a=1.2mm～1.3mm, b=0mm～2.0mm, and the centre-to-centre spacing of electric capacity pin through hole and additional vias is not less than (R+r+0.4) mm (annotate: R is the radius of electric capacity pin through hole, and r is the radius of additional vias), and be not more than 2.3mm.
2, adopting non-metallic additional vias diameter is 0.3～1.1mm, and additional vias should be removed Copper Foil apart from bore edges 0.1～0.4mm place.
Wherein, big or small as follows apart from bore edges of the optimum position of additional vias, diameter and additional vias: a=1.0mm, b=0.9mm; The additional vias diameter is 0.3mm; Through hole should be removed Copper Foil apart from bore edges c=0.2mm place.
Three, embodiment three
Present embodiment and embodiment one difference are: separate from plug-in on the printed circuit board (PCB) of electric capacity position 1 and also offer two additional vias 3.The center of circle of two plug-in mounting electric capacity pin through holes 2 distributes with respect to the line left-right symmetric in two additional vias centers of circle 3 respectively.
As shown in Figure 4, span be 2.5mm hold to need the designing requirement that on single-clad board, offer two additional vias from plug-in:
1, adds the lead to the hole site requirement: the lateral separation a=0.9～1.6mm in each the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle, the fore-and-aft distance b=1.5～2.0mm in each the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle.
2, the additional vias diameter is 0.6～1.0mm, and additional vias should be removed Copper Foil apart from bore edges c=0.1～0.4mm place.
Claims (10)
1, a kind of method of separating the electric capacity rosin joint that solves from plug-in, the printed circuit board (PCB) of separating the electric capacity position from plug-in is provided with two plug-in mounting electric capacity pin through holes, it is characterized in that: also offer an additional vias at least on the described printed circuit board (PCB) of separating the electric capacity position from plug-in, when printed circuit board (PCB) is crossed wave soldering, be sealed in the be heated back of sharply expanding of air between electrochemical capacitor and printed circuit board (PCB) and from additional vias, discharge.
2, the solution according to claim 1 method of separating the electric capacity rosin joint from plug-in is characterized in that: also offer an additional vias on the described printed circuit board (PCB) of separating the electric capacity position from plug-in.
3, the solution according to claim 1 method of separating the electric capacity rosin joint from plug-in is characterized in that: also offer two additional vias on the described printed circuit board (PCB) of separating the electric capacity position from plug-in.
4, the method for separating the electric capacity rosin joint from plug-in according to claim 1 or 2 or 3 described solutions is characterized in that: described additional vias is the non-metallic hole that Copper Foil is removed at the edges at two ends place.
5, the method for separating the electric capacity rosin joint from plug-in according to claim 1 or 2 or 3 described solutions, it is characterized in that: the span between described two plug-in mounting electric capacity pin through holes is 2.5mm.
6, the method for separating the electric capacity rosin joint from plug-in according to claim 2 or 5 described solutions, it is characterized in that: described printed circuit board (PCB) is a single sided board, the fore-and-aft distance b in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 1.5～2.0mm, lateral separation a is 0.9～1.6mm, the additional vias diameter is 0.6～1.0mm, and Copper Foil is removed at additional vias two end distance bore edges 0.1～0.4mm place.
7, the method for electric capacity rosin joint is separated in solution according to claim 5 from plug-in, it is characterized in that: the fore-and-aft distance b in the described additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 1.6mm, lateral separation a is 1.3mm, the additional vias diameter is 0.7mm, and Copper Foil is removed at additional vias two end distance bore edges 0.2mm places.
8, the method for separating the electric capacity rosin joint from plug-in according to claim 2 or 5 described solutions, it is characterized in that: described printed circuit board (PCB) is a double sided board, the fore-and-aft distance b in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 0mm～2.0mm, lateral separation a is 0.2mm～2.2mm, the additional vias diameter is 0.3～1.1mm, and Copper Foil is removed at additional vias two end distance bore edges 0.1～0.4mm place.
9, the method for electric capacity rosin joint is separated in solution according to claim 8 from plug-in, it is characterized in that: described printed circuit board (PCB) is a double sided board, the fore-and-aft distance b in the additional vias center of circle and the plug-in mounting electric capacity pin through hole center of circle is 0.9mm, lateral separation a is 1.0mm, the additional vias diameter is 0.3mm, and Copper Foil is removed at additional vias two end distance bore edges 0.2mm places.
10, the solution according to claim 2 method of separating the electric capacity rosin joint from plug-in is characterized in that: the center of circle of a described additional vias is positioned on the perpendicular bisector of line in two plug-in mounting electric capacity pin through hole centers of circle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310114411 CN1625322A (en) | 2003-12-02 | 2003-12-02 | Method for solving faulty solder of self-plug electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310114411 CN1625322A (en) | 2003-12-02 | 2003-12-02 | Method for solving faulty solder of self-plug electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1625322A true CN1625322A (en) | 2005-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310114411 Pending CN1625322A (en) | 2003-12-02 | 2003-12-02 | Method for solving faulty solder of self-plug electrolytic capacitor |
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| Country | Link |
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| CN (1) | CN1625322A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470229A (en) * | 2014-12-18 | 2015-03-25 | 浪潮(北京)电子信息产业有限公司 | Method and device for removing copper foil on pins of PCB element |
| CN110394523A (en) * | 2019-07-19 | 2019-11-01 | 王育安 | A kind of flexible printed board |
-
2003
- 2003-12-02 CN CN 200310114411 patent/CN1625322A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104470229A (en) * | 2014-12-18 | 2015-03-25 | 浪潮(北京)电子信息产业有限公司 | Method and device for removing copper foil on pins of PCB element |
| CN110394523A (en) * | 2019-07-19 | 2019-11-01 | 王育安 | A kind of flexible printed board |
| CN110394523B (en) * | 2019-07-19 | 2021-10-15 | 朱笑笑 | Flexible printed substrate |
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