CN104470229A - Method and device for removing copper foil on pins of PCB element - Google Patents
Method and device for removing copper foil on pins of PCB element Download PDFInfo
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- CN104470229A CN104470229A CN201410797695.0A CN201410797695A CN104470229A CN 104470229 A CN104470229 A CN 104470229A CN 201410797695 A CN201410797695 A CN 201410797695A CN 104470229 A CN104470229 A CN 104470229A
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Abstract
The invention discloses a method and device for removing copper foil on pins of a PCB element. The method comprises the steps that resistance-capacitor element pins placed in a copper foil area on a PCB are selected, the positions of the selected pins are clicked, copper foil distribution-forbidding areas are arranged on the clicked pins, and the copper foil on the copper distribution-forbidding areas on the pins of a resistance-capacitor element are automatically removed. According to the method and device, the copper coils can be removed in the copper distribution-forbidding areas arranged on the pins of the resistance-capacitor element only by one key instruction, so that the phenomenon of 'tombstoning' on the pins of the resistance-capacitor element is avoided simply and conveniently, the working efficiency of PCB designing personnel is greatly improved, and the PCB design looks attractive.
Description
Technical field
The present invention relates to electronic technology printed circuit board (PCB) (PCB, Printed Circuit Board) design and make, particularly relating to the method and device removed at the Resistor-Capacitor Unit pin place Copper Foil of printed circuit board (PCB).
Background technology
In the solder reflow process of surface mount process, be encapsulated as the Resistor-Capacitor Unit paster of 0402 (also claim) and cause the defect of sealing-off, phenomenon that people are referred to as visually " setting up a monument " because sticking up vertical.Say, the generation of " setting up a monument " phenomenon is that the surface tension of two welding ends of element is uneven because the soldering paste on the pad of element two ends is when refluxing fusing, and the welding end that tension force is larger hauls element and causes along producing the power rotated bottom it.
In order to avoid the generation of " setting up a monument " phenomenon, in PCB design, guarantee 0402 surface mount elements two ends cabling is balanced as far as possible.But in the design, often to run into 0402 surface mount elements one end be cabling one end is that Copper Foil connects, or two ends are all that Copper Foil connects, is easy to like this cause two pad tension imbalances or be heated too fast, and causes " setting up a monument " phenomenon.
Solution conventional is at present exactly when 0402 surface mount elements two ends have Copper Foil to connect, and digs the Copper Foil at pin place, to reduce joint face, thus avoid setting up a monument, as shown in Figure 1 by manual mode.But the operation that manual mode digs Copper Foil is not only wasted time and energy, also normal occur dig the not of uniform size of Copper Foil, make PCB design pole unsightly, and dig right angle Copper Foil and be unfavorable for PCB factory process.Meanwhile, when designing some larger pcb boards, the surface mount elements of 0402 is a lot, uses traditional method to solve " setting up a monument " phenomenon, needs PCB design personnel to spend a large amount of time and efforts, also easily extend the cycle of PCB design and making.
Therefore, need the method providing a kind of printed circuit board component pin place Copper Foil to remove, automatically can remove the Copper Foil at 0402 surface mount elements pin place.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of method removed at printed circuit board component pin place Copper Foil, automatically can remove the Copper Foil at 0402 surface mount elements pin place.
In order to solve the problems of the technologies described above, the invention provides the method that a kind of printed circuit board component pin place Copper Foil is removed, comprising:
Basic step: select printed circuit board (PCB) to be in the Resistor-Capacitor Unit pin in Copper Foil district and the pin place of click selection, arrange Copper Foil Jin Bu district at the pin place clicked, then the Copper Foil in the Copper Foil Jin Bu district at Resistor-Capacitor Unit pin place is removed automatically.
Further, the method also comprises:
If also have other pin untreated in the Copper Foil district on judgement printed circuit board (PCB), then return basic step and continue to perform.
In order to solve the problems of the technologies described above, the invention provides the device that a kind of printed circuit board component pin place Copper Foil is removed, comprise interconnective element pin and selecting module and Copper Foil to prohibit cloth module, wherein:
Element pin selects module, for selecting the position clicking Resistor-Capacitor Unit pin in Copper Foil district on a printed circuit, and the position of the pin of click is supplied to Copper Foil taboo cloth module;
Cloth module prohibited by Copper Foil, and the position for the pin selecting module to provide at element pin arranges Copper Foil Jin Bu district, then the Copper Foil in the Copper Foil Jin Bu district at Resistor-Capacitor Unit pin place is removed automatically.
Further, this device also comprises the element pin counting module selecting model calling with element pin, wherein:
Element pin counting module, for counting the number of the Resistor-Capacitor Unit pin that printed circuit board (PCB) is selected in Copper Foil district, if this number does not reach the predetermined number of Resistor-Capacitor Unit pin in Copper Foil district, then indicator elment pin selects module to continue the position selecting to click Resistor-Capacitor Unit pin.
The program that the present invention is removed by execution 0402 surface mount elements pin place Copper Foil, only just need can be completed by a key command and remove Copper Foil in the Copper Foil Jin Bu district of 0402 surface mount elements pin place laying, there is " setting up a monument " phenomenon in the simple, fast 0402 surface mount elements pin place that avoids thus, thus substantially increase the operating efficiency of PCB design personnel, and PCB design is made to seem attractive in appearance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram digging 0402 surface mount elements pin place Copper Foil by traditional manual mode;
Fig. 2 is the schematic diagram automatically removing 0402 surface mount elements pin place Copper Foil by embodiment of the method for the present invention;
Fig. 3 is the flow chart of the embodiment of the method in the removal of printed circuit board component pin place Copper Foil of the present invention;
Fig. 4 is the structured flowchart in printed circuit board component pin place Copper Foil removal device embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing and preferred embodiment, technical scheme of the present invention is set forth in detail.Should be appreciated that, the embodiment below enumerated only for instruction and explanation of the present invention, and does not form the restriction to technical solution of the present invention.
As shown in Figure 1, have expressed the flow process of printed circuit board component pin place provided by the invention Copper Foil minimizing technology embodiment, comprise the steps:
110: the 0402 surface mount elements pin that selection is on PCB in Copper Foil district also clicks it;
120: add Copper Foil Jin Bu district at the 0402 surface mount elements pin place clicked;
130: judge whether PCB also has other pin in Copper Foil district untreated, be return step 110 and perform, otherwise perform next step;
The Copper Foil that 140:0402 surface mount elements pin place arranges Copper Foil Jin Bu district is removed automatically; Process ends.
The present invention is directed to said method embodiment, correspondingly additionally provide printed circuit board component pin place Copper Foil removal device embodiment, its structure as shown in Figure 4, comprises interconnective element pin and selects module and Copper Foil to prohibit cloth module, wherein:
Element pin selects module, selects the position of click 0402 surface mount elements pin in the Copper Foil district on PCB, and is supplied to Copper Foil taboo cloth module;
Cloth module prohibited by Copper Foil, adds Copper Foil Jin Bu district for the position according to 0402 surface mount elements pin, then the Copper Foil that 0402 surface mount elements pin place arranges Copper Foil Jin Bu district is removed automatically.
Said apparatus embodiment also comprises the element pin counting module selecting model calling with element pin, wherein:
Element pin counting module, for counting in the Copper Foil district on PCB the number selecting the 0402 surface mount elements pin clicked, if this number does not reach the predetermined number of 0402 surface mount elements pin in the Copper Foil district on this PCB, then indicator elment pin selects module to continue selectors pin.
The present invention writes according to said method embodiment the program that 0402 surface mount elements pin place adds Copper Foil taboo cloth region, performing this program only needs a key to click the pin of 0402 surface mount elements, can complete and prohibit cloth region at pin week end interpolation Copper Foil, the Copper Foil that then those Copper Foils are prohibited in cloth region can be removed automatically, there is " setting up a monument " phenomenon in the simple, fast 0402 surface mount elements pin place that avoids thus, thus substantially increase the operating efficiency of PCB design personnel, and PCB design is made to seem attractive in appearance.
Claims (4)
1. a method for printed circuit board component pin place Copper Foil removal, comprising:
Basic step: select printed circuit board (PCB) to be in the Resistor-Capacitor Unit pin in Copper Foil district and the pin place of click selection, arrange Copper Foil Jin Bu district at the pin place clicked, then the Copper Foil in the described Copper Foil Jin Bu district at Resistor-Capacitor Unit pin place is removed automatically.
2. in accordance with the method for claim 1, it is characterized in that, also comprise:
If also have other pin untreated in the Copper Foil district on judgement printed circuit board (PCB), then return described basic step and continue to perform.
3. a device for printed circuit board component pin place Copper Foil removal, is characterized in that, comprises interconnective element pin and selects module and Copper Foil to prohibit cloth module, wherein:
Element pin selects module, for selecting the position clicking Resistor-Capacitor Unit pin in Copper Foil district on a printed circuit, and the position of the pin of click is supplied to Copper Foil taboo cloth module;
Cloth module prohibited by Copper Foil, and the position for the pin selecting module to provide at element pin arranges Copper Foil Jin Bu district, then the Copper Foil in the described Copper Foil Jin Bu district at Resistor-Capacitor Unit pin place is removed automatically.
4. according to device according to claim 3, it is characterized in that, also comprise the element pin counting module selecting model calling with described element pin, wherein:
Element pin counting module, for counting the number of the Resistor-Capacitor Unit pin that printed circuit board (PCB) is selected in Copper Foil district, if this number does not reach the predetermined number of Resistor-Capacitor Unit pin in described Copper Foil district, then described element pin is indicated to select module to continue the position selecting to click Resistor-Capacitor Unit pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410797695.0A CN104470229B (en) | 2014-12-18 | 2014-12-18 | The method and device that copper foil removes at printed circuit board component pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410797695.0A CN104470229B (en) | 2014-12-18 | 2014-12-18 | The method and device that copper foil removes at printed circuit board component pin |
Publications (2)
| Publication Number | Publication Date |
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| CN104470229A true CN104470229A (en) | 2015-03-25 |
| CN104470229B CN104470229B (en) | 2018-03-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410797695.0A Active CN104470229B (en) | 2014-12-18 | 2014-12-18 | The method and device that copper foil removes at printed circuit board component pin |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770198A (en) * | 2018-05-31 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of circuit board being packaged with chip component |
| CN109446626A (en) * | 2018-10-22 | 2019-03-08 | 郑州云海信息技术有限公司 | A kind of the matching impedance method and relevant apparatus of difference wire pin |
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| JPH07302964A (en) * | 1994-04-28 | 1995-11-14 | Nippon Avionics Co Ltd | Formation method of target mark on printed-wiring board |
| CN1625322A (en) * | 2003-12-02 | 2005-06-08 | 夏新电子股份有限公司 | Method for solving faulty solder of self-plug electrolytic capacitor |
| WO2008058674A1 (en) * | 2006-11-13 | 2008-05-22 | Häusermann GmbH | Installation for producing a circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound |
| CN101203093A (en) * | 2006-12-15 | 2008-06-18 | 英业达股份有限公司 | Circuit board metallic layer amending method |
| CN101877228A (en) * | 2009-04-30 | 2010-11-03 | 广明光电股份有限公司 | Method and device for capturing label surface code signals |
| CN103593526A (en) * | 2013-11-15 | 2014-02-19 | 浪潮电子信息产业股份有限公司 | Design method for automatically searching copper foil clearances in stacks of PCBs |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101339583B (en) * | 2008-08-28 | 2011-08-24 | 华为终端有限公司 | Method and device for designing board |
| CN101795533A (en) * | 2009-12-11 | 2010-08-04 | 福建星网锐捷网络有限公司 | Circuit board and copper-spreading method thereof |
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2014
- 2014-12-18 CN CN201410797695.0A patent/CN104470229B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07302964A (en) * | 1994-04-28 | 1995-11-14 | Nippon Avionics Co Ltd | Formation method of target mark on printed-wiring board |
| CN1625322A (en) * | 2003-12-02 | 2005-06-08 | 夏新电子股份有限公司 | Method for solving faulty solder of self-plug electrolytic capacitor |
| WO2008058674A1 (en) * | 2006-11-13 | 2008-05-22 | Häusermann GmbH | Installation for producing a circuit board comprising additional copper elements that are integrated and brought into contact by ultrasound |
| CN101203093A (en) * | 2006-12-15 | 2008-06-18 | 英业达股份有限公司 | Circuit board metallic layer amending method |
| CN101877228A (en) * | 2009-04-30 | 2010-11-03 | 广明光电股份有限公司 | Method and device for capturing label surface code signals |
| CN103593526A (en) * | 2013-11-15 | 2014-02-19 | 浪潮电子信息产业股份有限公司 | Design method for automatically searching copper foil clearances in stacks of PCBs |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108770198A (en) * | 2018-05-31 | 2018-11-06 | 郑州云海信息技术有限公司 | A kind of circuit board being packaged with chip component |
| CN109446626A (en) * | 2018-10-22 | 2019-03-08 | 郑州云海信息技术有限公司 | A kind of the matching impedance method and relevant apparatus of difference wire pin |
| CN109446626B (en) * | 2018-10-22 | 2021-10-29 | 郑州云海信息技术有限公司 | Impedance matching method for differential line pin and related device |
Also Published As
| Publication number | Publication date |
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| CN104470229B (en) | 2018-03-16 |
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