CN104470206A - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
- Publication number
- CN104470206A CN104470206A CN201310415636.8A CN201310415636A CN104470206A CN 104470206 A CN104470206 A CN 104470206A CN 201310415636 A CN201310415636 A CN 201310415636A CN 104470206 A CN104470206 A CN 104470206A
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- Prior art keywords
- circuit board
- main circuit
- functional parts
- connector
- electronic equipment
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The invention relates to the technical field of electronics, discloses a circuit board and electronic equipment, and aims at solving a technical problem of relatively complicated technology in arrangement of multiple functional components on the circuit board in the prior art. The circuit board comprises a primary circuit board; a secondary circuit board which is connected with the primary circuit board; and at least two functional components which are arranged at the surface of the secondary circuit board and connected with the primary circuit board via the first connecting point arranged on the primary circuit board.
Description
Technical field
The present invention relates to electronic technology field, particularly a kind of circuit board and electronic equipment.
Background technology
Along with the fast development of electronic technology, the function of various electronic equipment is also more and more abundanter, more and more hommization, makes user have better Experience Degree in the process using electronic equipment.With regard to adept machine, present smart mobile phone, can say and be modified into a small-sized computer, not only have powerful memory space, can install various software, and various cell-phone function also does and human nature more and more meticulousr.
In the prior art, in order to realize the several functions of electronic equipment, electronic equipment all can comprise the multiple functional parts being arranged at circuit board, such as: camera, microphone, transducer etc., please refer to Fig. 1, for in prior art, this multiple functional part is arranged at the schematic diagram of circuit board, specifically comprise:
Circuit board 10;
First connector 11;
Camera 12, is connected to circuit board 10 by the first connector 11;
Second connector 13;
Transducer 14, is connected to circuit board 10 by the second connector 13;
3rd connector 15;
Microphone 16, is connected to circuit board 10 by the 3rd connector 15;
4th connector 17;
Components A 18, is connected to circuit board 10 by the 4th connector 17.Present inventor finds at least there is following technical problem in prior art:
Due in the prior art, when the circuit board of electronic equipment is provided with multiple functional part, this multiple functional part is all be connected with circuit board separately, so cause needing to adopt independent technique that this multiple functional part is connected to circuit board respectively, thus the technique multiple functional part being arranged at circuit board is comparatively loaded down with trivial details, and causes the cabling of circuit board comparatively complicated.
Summary of the invention
The embodiment of the present invention provides a kind of circuit board and electronic equipment, for solving the comparatively loaded down with trivial details technical problem of the technique that in prior art, multiple functional part is arranged at circuit board.
A kind of circuit board is provided according to a first aspect of the invention, comprises: main circuit board; Secondary circuit board, is connected with described main circuit board; At least two functional parts, are arranged at described secondary circuit board surface, and described at least two functional parts are connected with described main circuit board by the first tie point on described main circuit board.
In conjunction with first aspect, in the implementation that the first is possible, described main circuit board is specially: PCB.
In conjunction with first aspect, in the implementation that the second is possible, described secondary circuit board is specially: flexible PCB.
In conjunction with first aspect, in the implementation that the third is possible, described at least two functional parts, are specially: at least two kinds in camera, transducer, microphone.
In conjunction with first aspect, in the 4th kind of possible implementation, described circuit board also comprises: the first connector, is connected by described main circuit board by described first connector with described secondary circuit board.
In conjunction with first aspect, in the 5th kind of possible implementation, described circuit board also comprises: the second connector, by described second connector, described at least two functional parts are connected to described main circuit board, the intersection point of described second connector and described main circuit board is described first tie point.
In conjunction with first aspect, in the 6th kind of possible implementation, described at least two functional parts are connected to described main circuit board by welding manner, and the solder joint of the corresponding described main circuit board of described welding manner is described first tie point.
In conjunction with first aspect, in the 7th kind of possible implementation, the N number of functional part in described at least two functional parts shares the first pin, wherein N be more than or equal to 2 positive integer.
According to a second aspect of the invention, a kind of electronic equipment is provided, comprises: housing; The circuit board that any embodiment of the present invention is introduced, is arranged at described enclosure interior; Processor, is arranged at described circuit board surface, is connected with described at least two functional parts.
Beneficial effect of the present invention is as follows:
Due in embodiments of the present invention, provide a kind of circuit board, this circuit board comprises in main circuit board and secondary circuit board, wherein secondary circuit board is provided with at least two functional parts, and these at least two functional parts are connected with main circuit board by the first tie point on main circuit board, when in other words comprising multiple functional part on an electronic device, this multiple functional part does not need to be connected to circuit board by independent technique, is arranged at the technique of circuit board so simplify multiple functional part and makes the cabling of circuit board comparatively simple.
Accompanying drawing explanation
Fig. 1 is the structure chart of circuit board in prior art;
Fig. 2 is the structure chart of circuit board in the embodiment of the present invention;
Fig. 3 is the structure chart of electronic equipment in the embodiment of the present invention.
Embodiment
The embodiment of the present invention provides a kind of circuit board and electronic equipment, for solving the comparatively loaded down with trivial details technical problem of the technique that in prior art, multiple functional part is arranged at circuit board.
Technical scheme in the embodiment of the present invention is solve above-mentioned technical problem, and general thought is as follows:
There is provided a kind of circuit board, comprising: main circuit board, main circuit board is such as: PCB; Secondary circuit board, be connected with described main circuit board, secondary circuit board is such as: flexible PCB, wherein both can be connected by welding manner between main circuit board with attached circuit board and also can have been connected by connector; At least two functional parts, be arranged at described secondary circuit board surface, described at least two functional parts are connected with described main circuit board by the first tie point on described main circuit board, at least two functional parts are such as: at least two functional parts in transducer, camera, microphone, the first tie point can be pad, also can the intersection point etc. of connector and main circuit board.
Due in such scheme, circuit board comprises in main circuit board and secondary circuit board, wherein secondary circuit board is provided with at least two functional parts, and these at least two functional parts are connected with main circuit board by the first tie point on main circuit board, when in other words comprising multiple functional part on an electronic device, this multiple functional part does not need to be connected to circuit board by independent technique, is arranged at the technique of circuit board so simplify multiple functional part and makes the cabling of circuit board comparatively simple.
In order to better understand technique scheme, below by accompanying drawing and specific embodiment, technical solution of the present invention is described in detail, the specific features being to be understood that in the embodiment of the present invention and embodiment is the detailed description to technical solution of the present invention, instead of the restriction to technical solution of the present invention, when not conflicting, the technical characteristic in the embodiment of the present invention and embodiment can combine mutually.
On the one hand, please refer to Fig. 2, the embodiment of the present invention provides a kind of circuit board, and this circuit board specifically comprises:
Main circuit board 20;
Secondary circuit board 21, is connected with described main circuit board 20;
At least two functional parts 22, are arranged at described secondary circuit board 21 surface, and described at least two functional parts 22 are connected with described main circuit board 20 by the first tie point 20a on described main circuit board 20.
In specific implementation process, in specific implementation process, main circuit board 20 is such as: PCB.
PCB is also known as printed circuit board (PCB), printed substrate, be called for short printed board, take insulation board as base material, be cut into certain size, at least with a conductive pattern on it, and cloth porose (as component hole, fastener hole, plated-through hole etc.), be used for replacing the chassis of device electronic devices and components in the past, and realize being interconnected between electronic devices and components.Because this plate adopts electron printing to make, therefore be called as printed circuit board (PCB).
In specific implementation process, PCB can comprise polytype, and to enumerate wherein below several is introduced, and certainly, in specific implementation process, is not limited to following several situation.
The first, single sided board (Single-sided), in this PCB circuit, part concentrates on wherein one side, and wire then concentrates on another side.Because wire only appears at wherein one side, so this PCB is called single sided board.Because single sided board has many strict restrictions (because only have one side, can not intersect between wiring and must around path alone) in designed lines, so only have early stage circuit just to use this kind of circuit board.
The second, double sided board, there is wiring on the two sides of this PCB, but with the wire on two sides, suitable circuit must be had between two sides to connect." bridge " between this circuit is called guide hole (via).Guide hole is on PCB, and be full of or the duck eye of coated with metal, it can be connected with the wire on two sides.Because the area ratio single sided board of double sided board is large one times, double sided board solves in single sided board because the staggered difficult point of wiring (can passing hole be conducting to another side), and it is more suitable for being used on the circuit more complicated than single sided board.
The third, multi-layer sheet, in order to increase the area that can connect up, more single or two-sided wiring plates used by multi-layer sheet.With one piece two-sidedly make internal layer, two pieces of one sides do outer or two pieces are two-sidedly made internal layer, two pieces of one sides make outer field printed substrate, by navigation system and adhesive material alternately together and conductive pattern just becomes four layers, six-layer printed circuit board, also referred to as multilayer printed circuit board by the printed substrate that designing requirement is carried out interconnecting.Which floor independently wiring layer is the number of plies of plank do not represented, and can add dead level under special circumstances to control thickness of slab, the usual number of plies is all even number, and comprises outermost two-layer.Most multi-layer sheet is all the structure of 4 to 8 layers, but technically theory can accomplish the pcb board of nearly 100 layers.Large-scale supercomputer uses the PCB of suitable multilayer mostly, but because this kind of computer can replace with the cluster of many common computer, super multi-layer sheet is not employed gradually.Because each layer in PCB combines all closely, generally not too easily find out actual number, if but examine PCB, still can find out.
In specific implementation process, secondary circuit board 21 is such as: flexible PCB, and flexible PCB is that the one made for base material with polyimides or polyester film has height reliability, excellent flexible printed circuit.Be called for short soft board or FPC, have the advantages that distribution density is high, lightweight, thickness is thin.
In specific implementation process, described main circuit board 20 can be connected in several ways with described secondary circuit board 21, introduces two kinds of connected modes wherein below, certainly, in specific implementation process, is not limited to following two kinds of modes.
The first, described main circuit board 20 is connected by welding manner with described secondary circuit board 21.
In specific implementation process, welding refers to two or more of the same race or foreign material by the combination between atom or molecule with spread the technical process linked into an integrated entity, and impel the method producing combination and diffusion between atom and molecule to be heating or pressurization, or heat simultaneously and pressurize.
In specific implementation process, weld and can be divided into polytype again according to the difference of technical process, the three types enumerated below is wherein introduced, and certainly, in specific implementation process, is not limited to following three kinds of situations.
The first, melting welding, so-called melting welding, refers in welding process, by welding point in the effect of high temperature etc. down to molten state.Because welded piece closely sticks together, under the effect of temperature field, gravity etc., not plus-pressure, the melting liquid and mixing phenomena can occur of two work pieces meld.After temperature reduces, melt portions is condensed, and two workpiece, just by firmly welded together, complete the method for welding.
The second, pressure welding, refers to and applies certain pressure when utilizing welding and complete the method for welding.This kind ofly be welded with two kinds of forms, one is to mecystasis or local melting state by welded Metal contacts heated pressure soldering equipment, then certain pressure is applied, firmly welding point is formed, if smithwelding, Contact welding, friction welding (FW), gas pressure welding etc. are exactly such Pressure Welding method to make to be combined with each other between metallic atom.Two is do not heat, and only on welded Metal Contact face, applies enough large pressure, and by means of the plastic deformation caused by pressure, obtain to make close to each other between atom joint of firmly extruding, the method for this Pressure Welding has cold welding, explosive welding (EW) etc.
The third, soldering, soldering adopts to make solder than the low-melting metal material of mother metal, by weldment and solder heat to higher than solder fusing point, lower than mother metal fusion temperature, utilize liquid solder to soak mother metal, fill play movement and realize with the counterdiffusion of mother metal phase the method being connected weldment.Brazing deformation is little, joint smooth and beautiful appearance, is suitable for welding component that is accurate, complicated and that be made up of different materials, as honeycomb panel, turbine blade, hard alloy cutter and printed circuit board (PCB) etc.Careful processing and strict cleaning must be carried out to workpiece before soldering, except degreasing and blocked up oxide-film, ensure interface fit-up gap.Gap General Requirements is between 0.01 ~ 0.1 millimeter.
The second, described electronic equipment also comprises: the first connector, for being connected with described secondary circuit board 21 by described main circuit board 20.
In specific implementation process, connector is mainly used in: be blocked in circuit between place or isolated obstructed circuit, erect the bridge of communication, thus make current flowing, make the function that circuit realiration is predetermined.
Because described main circuit board 20 and described secondary circuit board 21 are two different circuit boards, so need the connection realizing between this two circuit board by connector.
In specific implementation process, described at least two functional parts 22 can be several functions parts, enumerate three kinds of situations wherein below, certainly, in specific implementation process, are not limited to following three kinds of situations.
The first, described at least two functional parts 22 specifically comprise: camera.
Camera is also called camera computer, computer eye etc., is a kind of video input apparatus, is applied to video conference widely, the aspects such as tele-medicine and monitoring in real time.Common people also can to carry out at network each other by camera having image, have the talk of sound and communication.In addition, people can also use it for current various popular digital image, sound processing.
Camera can be divided into digital camera and the large class of simulation camera two.Digital camera can convert the analog video signal that video capture device produces to digital signal, and then is stored in computer.The vision signal that captures of simulation camera has to pass through specific capure card and converts analog signal to figure pattern, and just can be transformed on computer after being compressed and use.Digital camera directly can catch image, is then passed in computer by string, parallel port or USB interface.Camera on computer market is substantially based on digital camera, and to use the USB digital camera of new types of data coffret in digital camera, on market, visible major part is all this product.In addition also have a kind of with video frequency collection card with the use of product, but be not also main flow.Rapidly universal due to PC, the holistic cost of simulation camera is higher, and can not meet the reasons such as the liquid crystal-spliced screen interface of BSV, the transmission speed of USB interface far away higher than the speed of serial ports, parallel port, the therefore digital camera of market USB interface.Current simulation camera can support the use with video frequency collection card or USB video frequency collection card, and connect with computer very easily and use, typical apply is general recording monitor.
The second, described at least two functional parts 22 specifically comprise: microphone.
Microphone formal name used at school is microphone, is energy conversion device voice signal being converted to the signal of telecommunication, is translated by Microphone.Also microphone, microphone is claimed.Twentieth century, by being changed by resistance at first, acoustic-electric develops into inductance to microphone, condenser type is changed, microphone techniques new in a large number grows up gradually, and this is comprising the microphone such as aluminium strip, moving-coil, and current widely used capacitance microphone and electret microphone.
The third, described at least two functional parts 15 specifically comprise: transducer (transducer/sensor).
Transducer is a kind of checkout gear, measured information can be experienced, and can the information experienced be detected, the information being for conversion into the signal of telecommunication or other desired forms according to certain rules exports, to meet the requirements such as the transmission of information, process, storage, display, record and control.It is the primary link realizing automatically detecting and automatically controlling.
In specific implementation process, transducer can comprise a variety of, and that introduces wherein below is several, is certainly not limited to following several situation.
1. laser sensor is that a kind of laser technology that utilizes carries out the transducer measured.
It is made up of laser, laser detector and measuring circuit.Laser sensor is new type measuring instrument table, and its advantage to realize contactless telemeasurement, and speed is fast, and precision is high, and range is large, and anti-light, electrical interference ability is strong.
During laser sensor work, first to be aimed at the mark Emission Lasers pulse by laser emitting diode.After target reflection, laser is to all directions scattering.Some scattered light turns back to transducer receivers, is imaged onto avalanche photodide on after being received by optical system.Avalanche photodide is the optical pickocff that a kind of inside has enlarging function, and therefore it can detect extremely faint light signal, and is translated into the corresponding signal of telecommunication.
2. Hall element
Hall element is a kind of magnetic field sensor made according to Hall effect,
It is widely used in the aspects such as industrial automation technology, detection technique and information processing.Hall effect is the basic skills of research semiconductor material performance.By the Hall coefficient of Hall effect measuring, the important parameters such as the conduction type of semi-conducting material, carrier concentration and carrier mobility can be judged.
3. light sensor
Light sensor is one of modal transducer, it of a great variety, mainly contains: photoelectric tube, photomultiplier, photo resistance, phototriode, solar cell, infrared ray sensor, UV sensor, optical fiber type photoelectric transducer, color sensor, CCD and cmos image sensor etc.Its sensitive wave length, near visible wavelength, comprises Infrared wavelength and ultraviolet wavelength.Optical sensor is not confined to the detection to light, and it can also form other transducers as detecting element, detects many non electrical quantities, as long as these non electrical quantities are converted to the change of light signal.Optical sensor is one of maximum, most widely used transducer of current production rate, it automatically control and non-electrical quantity measurement technology draw in occupy very important status.The simplest light sensor is photo resistance, when photon impact joint will generation current.
In specific implementation process, in order at least two functional parts 22 described in ensureing obtain control signal and current signal, described at least two functional parts 22 are needed to be connected to described main circuit board 20 by the first tie point 20a, in specific implementation process, in several ways at least two functional parts 22 can be connected main circuit board 20, and then form the first different tie point 20a, the two kinds of situations enumerated below are wherein introduced, certainly, in specific implementation process, be not limited to following two kinds of situations.
The first, please continue to refer to Fig. 2, described circuit board also comprises:
Described at least two functional parts 22 are connected to described main circuit board 20 by described second connector 23 by the second connector 23, and described second connector 23 is described first tie point 20a with the intersection point of described main circuit board 20.
The second, described at least two functional parts 22 are connected to described main circuit board 20 by welding manner, and the solder joint of the corresponding described main circuit board 20 of described welding manner is described first tie point.
Owing to specifically describing welding manner above, so again repeat no more.
As further preferred embodiment, the N number of functional part in described at least two functional parts shares the first pin, wherein N be more than or equal to 2 positive integer.
In specific implementation process, if the pin of described N number of functional part is more, the area taking circuit board will be caused excessive, and cause wiring too loaded down with trivial details, so when design circuit plate, a part of pin in this N number of functional part can be shared, and then reach the technique effect of board area and reduction wiring fussy degree.
On the other hand, the embodiment of the present invention provides a kind of electronic equipment, please refer to Fig. 3, and described electronic equipment specifically comprises:
Housing 30;
The circuit board 31 that any embodiment of the present invention is introduced, is arranged at described housing 30 inner;
Processor 32, is arranged at described circuit board 31 surface, is connected with described at least two functional parts 22.
In specific implementation process, described housing 30 mainly plays the effect of protection electronic equipment, and it can be made by various material, enumerates manufacture material wherein below, certainly, in specific implementation process, is not limited to following several situation.
The first, the manufacture material of described housing 30 is: PC, and also namely: Merlon, it has following characteristics:
1. intensity is high, tensile strength 69MPa, flexural strength 96MPa.
2. high temperature resistant, Long-Time Service can resistance to 130 degree celsius temperature environment.
3. transparent good, nontoxic.
4. raw material color matching and surface-coated are not as ABs.
5. the mobile phone being applicable to liding machine and using in the presence of a harsh environment.
The second, the manufacture material of described housing 30 is: ABS, and also namely: propylene fat-butadiene-styrol copolymer, it has performance characteristics:
1. intensity is low, tensile strength 43MPa, flexural strength 79MPa.
2. not heatproof, Long-Time Service temperature must not higher than 60 degrees Celsius.
3. mobility, painted and surface spraying and plating performance are all good.
The third, the manufacture material of described housing 30 is: the synthetic material of Pc and ABs, and it has following performance characteristics:
1. have excellent moulding processability, good fluidity, intensity is wherein higher, tensile strength 56MPa, flexural strength 86MPa.
2. plate rolls is mainly used in and high and to the liding machine of environment without particular/special requirement for outward appearance, color requirements.
Due to the electronic equipment that the embodiment of the present invention is introduced; for being provided with the electronic equipment of the circuit board that the embodiment of the present invention is introduced; so based on the circuit board that the embodiment of the present invention is introduced; those skilled in the art can understand concrete structure and the distortion of the electronic equipment that the embodiment of the present invention is introduced; so do not repeat them here; every electronic equipment being provided with the circuit board that the embodiment of the present invention is introduced, all belong to the embodiment of the present invention for protection scope.
One or more technical schemes that the application provides, at least have following technique effect or advantage:
(1) due in embodiments of the present invention, provide a kind of circuit board, this circuit board comprises in main circuit board and secondary circuit board, wherein secondary circuit board is provided with at least two functional parts, and these at least two functional parts are connected with main circuit board by the first tie point on main circuit board, when in other words comprising multiple functional part on an electronic device, this multiple functional part does not need to be connected to circuit board by independent technique, is arranged at the technique of circuit board so simplify multiple functional part and makes the cabling of circuit board comparatively simple.
(2) due in embodiments of the present invention, at least two functional parts are connected to main circuit board by the second connector, so reach the technique effect that conveniently at least two functional parts can be connected to main circuit board or fractionation, and then facilitate administering and maintaining of at least two functional parts.
(3) due in embodiments of the present invention, public first pin of N number of functional part at least two functional parts, and N be more than or equal to 2 positive integer, in other words N sing functional part can common part pin, so decrease the quantity of pin, and then reduce board area and reduce the wiring complexity of circuit board.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the embodiment of the present invention and not depart from the spirit and scope of the embodiment of the present invention.Like this, if these amendments of the embodiment of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (9)
1. a circuit board, comprising:
Main circuit board;
Secondary circuit board, is connected with described main circuit board;
At least two functional parts, are arranged at described secondary circuit board surface, and described at least two functional parts are connected with described main circuit board by the first tie point on described main circuit board.
2. circuit board as claimed in claim 1, it is characterized in that, described main circuit board is specially: PCB.
3. circuit board as claimed in claim 1, it is characterized in that, described secondary circuit board is specially: flexible PCB.
4. circuit board as claimed in claim 1, it is characterized in that, described at least two functional parts, are specially: at least two kinds in camera, transducer, microphone.
5. circuit board as claimed in claim 1, it is characterized in that, described circuit board also comprises:
First connector, is connected described main circuit board with described secondary circuit board by described first connector.
6. circuit board as claimed in claim 1, it is characterized in that, described circuit board also comprises:
Described at least two functional parts are connected to described main circuit board by described second connector by the second connector, and the intersection point of described second connector and described main circuit board is described first tie point.
7. circuit board as claimed in claim 1, it is characterized in that, described at least two functional parts are connected to described main circuit board by welding manner, and the solder joint of the corresponding described main circuit board of described welding manner is described first tie point.
8. circuit board as claimed in claim 1, it is characterized in that, the N number of functional part in described at least two functional parts shares the first pin, wherein N be more than or equal to 2 positive integer.
9. an electronic equipment, comprising:
Housing;
Circuit board as described in claim as arbitrary in claim 1-8, is arranged at described enclosure interior;
Processor, is arranged at described circuit board surface, is connected with described at least two functional parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310415636.8A CN104470206A (en) | 2013-09-12 | 2013-09-12 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310415636.8A CN104470206A (en) | 2013-09-12 | 2013-09-12 | Circuit board and electronic equipment |
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|---|---|
| CN104470206A true CN104470206A (en) | 2015-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201310415636.8A Pending CN104470206A (en) | 2013-09-12 | 2013-09-12 | Circuit board and electronic equipment |
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| CN107580086A (en) * | 2017-08-23 | 2018-01-12 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
| CN107613047A (en) * | 2017-08-23 | 2018-01-19 | 广东欧珀移动通信有限公司 | Preparation method, electronic building brick and the electronic installation of electronic building brick |
| CN107660097A (en) * | 2017-08-23 | 2018-02-02 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
| CN107690251A (en) * | 2017-08-23 | 2018-02-13 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
| CN108418912A (en) * | 2018-02-14 | 2018-08-17 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
| CN109995898A (en) * | 2017-12-29 | 2019-07-09 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
| CN110519918A (en) * | 2019-09-11 | 2019-11-29 | 广东虹勤通讯技术有限公司 | A kind of circuit board and electronic equipment |
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| CN107660097B (en) * | 2017-08-23 | 2020-02-18 | Oppo广东移动通信有限公司 | Electronic assembly and electronic device |
| CN107613047B (en) * | 2017-08-23 | 2020-04-21 | Oppo广东移动通信有限公司 | Manufacturing method of electronic assembly, electronic assembly and electronic device |
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| CN107690251A (en) * | 2017-08-23 | 2018-02-13 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
| CN107580086B (en) * | 2017-08-23 | 2019-10-18 | Oppo广东移动通信有限公司 | Electronic building brick and electronic device |
| CN107580086A (en) * | 2017-08-23 | 2018-01-12 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
| CN107566561A (en) * | 2017-08-23 | 2018-01-09 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic installation |
| CN109995898A (en) * | 2017-12-29 | 2019-07-09 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
| US11057507B2 (en) | 2017-12-29 | 2021-07-06 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Electronic assembly and electronic device |
| CN109995898B (en) * | 2017-12-29 | 2022-01-04 | Oppo广东移动通信有限公司 | Electronic component and electronic equipment |
| CN108418912A (en) * | 2018-02-14 | 2018-08-17 | 广东欧珀移动通信有限公司 | Electronic building brick and electronic equipment |
| CN108418912B (en) * | 2018-02-14 | 2020-07-07 | Oppo广东移动通信有限公司 | Electronic component and electronic device |
| CN110519918A (en) * | 2019-09-11 | 2019-11-29 | 广东虹勤通讯技术有限公司 | A kind of circuit board and electronic equipment |
| CN110519918B (en) * | 2019-09-11 | 2020-12-04 | 广东虹勤通讯技术有限公司 | Circuit board and electronic equipment |
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Application publication date: 20150325 |