CN108418912B

CN108418912B - Electronic component and electronic device

Info

Publication number: CN108418912B
Application number: CN201810153304.XA
Authority: CN
Inventors: 王世超
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-02-14
Filing date: 2018-02-14
Publication date: 2020-07-07
Anticipated expiration: 2038-02-14
Also published as: CN108418912A

Abstract

The embodiment of the application provides an electronic assembly, including the sensor, the flexible circuit board, seal assembly and receiver, the sensor sets up on the first face of flexible circuit board, the receiver sets up on the second face of flexible circuit board, the receiving hole is seted up to the flexible circuit board, seal assembly includes elastic component and suction piece, the elastic component sets up between flexible circuit board and receiver, the elastic component has the inner chamber, suction piece detachable sets up between flexible circuit board and receiver, and suction piece is used for making the elastic component clamp arrange in between flexible circuit board and the receiver. The electronic component that this application embodiment provided sets up between flexible circuit board and receiver through the actuation piece that can dismantle the connection, and the elasticity piece clamp is arranged in between receiver and the flexible circuit board and is guaranteed sealed between receiver and the flexible circuit board under the effect of the piece that closes, and the seal assembly that the combination of the piece that closes and elasticity piece formed is convenient for electronic component's dismouting. In addition, the embodiment of the application also provides electronic equipment.

Description

Electronic component and electronic device

Technical Field

The present application relates to the field of electronic devices, and more particularly, to an electronic component and an electronic device.

Background

With the increasing development of electronic device technology, the demand for the mobile phone to be light and thin is higher and higher. In the prior art, in order to realize more and more functions in electronic equipment such as a mobile phone, more and more devices are integrated in the mobile phone, the position relationship among the devices is more and more complex, and the influence on the lightness and thinness of the mobile phone is more and more large, which is not beneficial to the appearance design of the mobile phone.

Disclosure of Invention

The application provides an electronic component and an electronic device.

The embodiment of the application provides an electronic component, including sensor, flexible circuit board, seal assembly and receiver, the flexible circuit board is including the first face and the second face that set up mutually back on the body, the sensor set up in on the first face of flexible circuit board, the receiver set up in on the second face of flexible circuit board, the telephone receiver hole is seted up to the flexible circuit board, seal assembly includes elastic component and suction piece, the elastic component set up in the flexible circuit board with between the receiver, the elastic component have communicate to the vibration portion of receiver with the inner chamber of telephone receiver hole, suction piece detachable set up in the flexible circuit board with between the receiver, just suction piece is used for making the elastic component clamp is arranged in the flexible circuit board with between the receiver, the vibration portion of receiver extremely passageway between the telephone receiver hole of flexible circuit board forms the output the sound channel of the sound signal of receiver . On the other hand, the embodiment of the application also provides electronic equipment which comprises an electronic component.

The electronic component and the electronic equipment provided by the embodiment of the application are arranged between the flexible circuit board and the telephone receiver through the suction piece which can be detachably connected, the elastic piece is clamped between the telephone receiver and the flexible circuit board under the action of the suction piece, the sealing between the telephone receiver and the flexible circuit board is ensured, and the suction piece and the elastic piece are combined to form the sealing component, so that the electronic component is convenient to disassemble and assemble.

Drawings

In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of the electronic components of the electronic device shown in FIG. 1;

FIG. 3 is a schematic view of one of the electronic assemblies shown in FIG. 2;

FIG. 4 is a cross-sectional view of the electronic assembly shown in FIG. 3 taken along line A-A;

FIG. 5 is an exploded schematic view of the electronic assembly shown in FIG. 2, except for the engaging member;

FIG. 6 is a cross-sectional view of one of the electronic assemblies shown in FIG. 2 taken along line B-B;

FIG. 7 is a cross-sectional view of the alternative electronic assembly shown in FIG. 2 taken along line B-B;

FIG. 8 is a schematic view of the electronic assembly of FIG. 6 with an engaging member disposed therein;

FIG. 9 is a schematic view of a first magnet of the electronic assembly shown in FIG. 8;

FIG. 10 is a schematic view of another suction element disposed in the electronic assembly shown in FIG. 6;

FIG. 11 is a schematic view of a suction member of the electronic assembly shown in FIG. 10;

FIG. 12 is a schematic diagram of the relative relationship of the sensor and receiver of the electronic assembly of FIG. 2;

FIG. 13 is a schematic diagram of another relative relationship of the sensor and receiver of the electronics assembly in other embodiments;

FIG. 14 is a schematic diagram of yet another relative relationship of the sensor and receiver of the electronics assembly in other embodiments;

fig. 15 is a schematic diagram showing the relative relationship between the receiver and the vibrating portion of the electronic assembly shown in fig. 2;

fig. 16 is a schematic view showing another relative relationship between the receiver and the vibrating portion of the electronic component in other embodiments;

FIG. 17 is a schematic diagram of the electronic assembly with the sensor and receiver arranged non-side-by-side in other embodiments;

FIG. 18 is a schematic view of a display module of the electronic device shown in FIG. 1;

FIG. 19 is a schematic view of a panel assembly of the display module of FIG. 18.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

In addition, the following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be used to practice the present application. Directional phrases used in this application, such as "length," "width," "thickness," and the like, refer only to the orientation of the appended drawings and, therefore, are used in a better and clearer sense to describe and understand the present application and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and, therefore, should not be considered limiting of the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are intended to be inclusive and mean, for example, that they may be fixedly coupled, detachably coupled, or integrally coupled; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The terms described above are meant to be illustrative in the present invention and are understood to be specific to those of ordinary skill in the art.

Referring to fig. 1 and fig. 2, fig. 1 is a first perspective view of an electronic device 100. The electronic device 100 comprises an electronic assembly 1. The electronic component 1 is housed inside the electronic apparatus 100, and is used for realizing functions of the electronic apparatus 100 such as receiving a telephone. The electronic device 100 may be any device having electronic components, such as: smart devices such as tablet computers, mobile phones, cameras, personal computers, notebook computers, vehicle-mounted devices, wearable devices, and the like. For convenience of description, the electronic device 100 is defined with reference to the first viewing angle, the width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device is defined as the Z direction.

Referring to fig. 2, the electronic assembly 11 includes a sensor 11, a flexible circuit board 12, a sealing assembly 15 and a receiver 13, the flexible circuit board 12 includes a first surface 121 and a second surface 122 opposite to each other, the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12, the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12, the flexible circuit board 12 is provided with a receiver 123, the sealing assembly 15 includes an elastic member 14 and an engaging member 16, the elastic member 14 is disposed between the flexible circuit board 12 and the receiver 13, the elastic member 14 has a vibrating portion 131 communicated with the receiver 13 and an inner cavity 14a communicated with the receiver 123, the engaging member 16 is detachably disposed between the flexible circuit board 12 and the receiver 13, and the engaging member 16 is used for clamping the elastic member 14 between the flexible circuit board 12 and the receiver 13, a channel between the vibrating portion 131 of the receiver 13 to the receiver hole 123 of the flexible circuit board 12 forms an acoustic channel 131 that outputs an acoustic signal of the receiver 13.

The suction element 16 which can be detachably connected is arranged between the flexible circuit board 12 and the telephone receiver 13, the elastic element 14 is clamped between the telephone receiver 13 and the flexible circuit board 12 under the action of the suction element 16 to ensure the sealing between the telephone receiver 13 and the flexible circuit board 12, and the sealing assembly 15 formed by combining the suction element 16 and the elastic element 14 is convenient for the disassembly and assembly of the electronic assembly 1.

In one embodiment, as shown in fig. 2, the flexible circuit board 12 includes a first side 121 and a second side 122 that are opposite to each other. The flexible circuit board 12 is used to electrically connect with the sensor 11, and the flexible circuit board 12 is electrically connected with a circuit board in the electronic device 100 to transmit the electrical signal on the sensor 11 to the circuit board in the electronic device 100.

Referring to fig. 3 and 4, the first surface 121 and the second surface 122 of the flexible circuit board 12 are opposite to each other, and the area of the board surface is large, so that the flexible circuit board 12 can carry components. Correspondingly, the edges of the board surface of the flexible circuit board 12 are respectively a first side S1 and a second side S2 which are oppositely arranged, and a third side S3 and a fourth side S4 which are oppositely arranged, the third side S3 and the fourth side S4 are respectively connected between the first side S1 and the second side S2, and the second side S2 extends in a direction away from the first side S1, so that the flexible circuit board 12 is electrically connected with the circuit board. That is, the flexible circuit board 12 has a substantially long rectangular shape. The first side S1 and the second side S2 are shorter sides of the flexible circuit board 12 than the third side S3 and the fourth side S4. That is, when the flexible circuit board 12 is disposed in the electronic device 100, the flexible circuit board is arranged in a substantially elongated shape along the Y-direction of the electronic device 100 so as to extend to be electrically connected to the circuit board.

In one embodiment, as shown in fig. 4, the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12.

It is understood that, referring to fig. 3 and 4, the sensor 11 includes at least one of a distance sensor, a light sensor, or a photoelectric sensor. In this embodiment, the sensor 11 is a light sensor 11. The light sensor 11 is disposed near a screen of the electronic device 100 so as to adjust brightness of the screen of the electronic device 100 according to light of an environment in which the electronic device 100 is located. The medium sensed by the light sensor 11 is light, the electronic device 100 does not need to specially drill holes or arrange a special structure to pass through the light, the sensor 11 in the electronic component 1 is arranged as the light sensor 11, and is stacked in the Z direction together with the receiver 13, so that the structure of the electronic device 100 is further optimized, and the direction of the electronic device 100 in the X direction is facilitated.

As shown in fig. 5, the receiver 13 is substantially rectangular, and the middle region of the receiver 13 is the vibrating portion 132. The vibrating portion 132 is typically hermetically sealed to other components or structures to form a vibrating chamber, and vibrations in the vibrating portion 132 can be transmitted through an opening in the component or structure. The sound channel 131 of the receiver 13 is actually a channel through which the sound signal in the receiver 13 propagates, and corresponds to a channel between the vibrating portion 132 and the opening of the component or structure. After the receiver 13 receives the audio signal, the sealed vibration cavity vibrates, and the sound signal passes through the opening on the component or the structure.

In an embodiment, as shown in fig. 3 to 5, the component for hermetically connecting the vibration part 132 of the receiver 13 may be a flexible circuit board 12, and the flexible circuit board 12 serves as both a carrier for stacking the sensor 11 and the receiver 13 together and a part of the sound channel 131 of the receiver 13, thereby reducing the component assembly of the electronic component 1, saving the thickness of the electronic component 1 in the Z of the electronic device 100, and further optimizing the electronic components.

Referring to fig. 4, the flexible circuit board 12 covers and hermetically connects the receiver 13, and the flexible circuit board 12 is provided with a receiver hole 123, so that the sound channel 131 is formed by a channel from the vibration part 132 of the receiver 13 to the receiver hole 123 of the flexible circuit board 12.

Referring to fig. 4, since the receiver 123 is opened on the flexible circuit board 12, the sound channel 131 is formed between the vibration portion 132 of the receiver 13 and the receiver 123 of the flexible circuit board 12, and the sound channel 131 of the receiver 13 passes through the flexible circuit board 12.

The area of the second surface 122 of the flexible circuit board 12 is slightly larger than the area of the receiver 13, that is, the receiver 13 does not occupy too much space in the electronic device 100 due to the oversize of the flexible circuit board 12, and when the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12, the orthographic projection area of the receiver 13 on the flexible circuit board 12 is located in the area occupied by the second surface 122 of the flexible circuit board 12, that is, the flexible circuit board 12 entirely covers the receiver 13. Of course, in other embodiments, the size of the flexible circuit board 12 can be much larger than the area of the receiver 13.

When the receiver 13 receives the audio signal, the vibration portion 132 of the receiver 13 vibrates to form an audio signal, and the audio signal is transmitted from the vibration chamber to the receiver 123 and then transmitted to the outside through the receiver 123, thereby realizing the receiving function of the receiver 13.

Referring to fig. 2, the receiver 13 and the flexible circuit board 12 are sealed by a sealing assembly 15, the sealing assembly 15 has an absorbing member 16 detachably connected therein and disposed between the flexible circuit board 12 and the receiver 13, the elastic member 14 is sandwiched between the receiver 13 and the flexible circuit board 12 under the action of the absorbing member 16 to ensure the sealing between the receiver 13 and the flexible circuit board 12, and the sealing assembly 15 formed by combining the absorbing member 16 and the elastic member 14 facilitates the assembly and disassembly of the electronic assembly 1.

In this embodiment, referring to fig. 5, the elastic element 14 has elasticity, and can be elastically deformed when receiving a clamping force between the receiver 13 and the flexible circuit board 12, and under the condition that the external force received by the receiver 13 and the flexible circuit board 12 is not cancelled, the elastic element 14 always contacts with the receiver 13 and the flexible circuit board 12, so as to ensure that the sound channel 131 of the receiver 13 can be better sealed, and ensure good audio output of the electronic component 1.

It can be understood that, referring to fig. 6, the elastic element 14 is annular, the middle of the elastic element 14 is hollowed to form an inner cavity 14a, when the elastic element 14 is disposed between the flexible circuit board 12 and the receiver 13, the inner cavity 14a of the elastic element 14 can be communicated to the vibration portion 131 of the receiver 13 and the receiver hole 123 on the flexible circuit board 12, so that when the elastic element 14 is sandwiched between the flexible circuit board 12 and the receiver 13, the vibration portion 131 of the receiver 13 vibrates to form a sound signal, and the sound signal is sequentially transmitted to the inner cavity of the elastic element 14 until being transmitted from the receiver hole 123 of the flexible circuit board 12.

In this embodiment, the elastic member 14 may be foam. The elasticity of the foam enables the electronic component 1 to be adjusted in the space in the Z direction, and the foam is used as the sealing member 14, so that the sealing performance is good, and the sound signal of the receiver 13 is not easy to leak from the foam, thereby affecting the output of the sound signal of the receiver 13. Of course, in other embodiments, the elastic member may also be silicone rubber.

In this embodiment, referring to fig. 4, the area of the orthographic projection of the inner cavity 14a of the elastic element 14 on the receiver 13 includes an area where the vibration portion 132 of the receiver 13 is located. That is, the opening of the inner cavity 14a of the elastic member 14 is larger than the size of the vibrating portion 132 of the receiver 13, ensuring that the sound signal of the vibrating portion 132 can entirely pass through the inner cavity 14a of the elastic member 14. Of course, in other embodiments, referring to fig. 6, the orthographic projection area of the inner cavity 14a of the elastic element 14 on the receiver 13 may also overlap the area where the vibration part 132 of the receiver 13 is located.

Optionally, referring to fig. 6, the elastic element 14 has an inner cavity surface 14b, the inner cavity surface 14b surrounds the inner cavity 14a, and the inner cavity surface 14a is a conical surface. That is, the inner cavity surface 14a of the elastic element 14 is a conical surface, and the elastic element 14 has a first opening 1411 and a second opening 1412 which are opposite, the first opening 1411 is close to the receiver 13, and the caliber of the inner cavity surface 14a gradually increases along the direction from the first opening 1411 to the second opening 1412. The elastic element 14 with such a structure has a function of amplifying sound, so that when the sound signal of the receiver 13 goes from the first opening 1411 to the second opening 1412, the sound signal is amplified due to the effect of the tapered inner cavity surface 14b of the elastic element 14, and the amplified sound signal is output through the receiving hole 123 on the flexible circuit board 12.

Optionally, referring to fig. 7, the elastic element 14 has an inner cavity surface 14c, the inner cavity surface 14c surrounds to form the inner cavity, and the inner cavity surface 14c is a curved surface. The inner cavity surface 14c is provided with a first circular arc section q1 and a second circular arc section q2 which are sequentially connected, and the aperture formed by the connection part of the first circular arc section q1 and the second circular arc section q2 in a surrounding mode is the smallest aperture of the inner cavity surface 14 c. That is, the inner cavity surface 14c of the elastic member 14 has a convex surface protruding toward the central axis direction of the inner cavity of the elastic member 14. The inner cavity surface 14c of the drumhead can enable the sound signal of the receiver 13 to be reduced and then increased when passing through the inner cavity of the elastic element 14, and then the sound signal is output through the receiver hole 123 on the flexible circuit board 12.

The inner cavity surfaces 14b and 14c of the elastic member 14 are configured to control various requirements of the sound signal of the receiver 13 by adjusting the vibration part 132 of the receiver 13 in the prior art, which is more beneficial to improving the sound performance of the receiver 13.

Referring to fig. 2, the suction element 16 is used to tightly attach the receiver 13 to the flexible circuit board 12, so that the elastic element 14 is sandwiched between the receiver 13 and the flexible circuit board 12 to seal the receiver 13, and to ensure that a sound channel 131 with better sealing performance is formed between the receiver 13 and the flexible circuit board 12, thereby ensuring that the electronic component 1 has better sound quality. The detachable structure of the absorbing part 16 ensures that the receiver 13 can be detached from the flexible circuit board 12 without damaging the absorbing part 16 when the electronic component 1 needs to be detached, so that the electronic component 1 can be detached conveniently.

It will be appreciated that the engaging member 16 is offset from the resilient member 14. That is, the absorbing element 16 and the elastic element 14 are not stacked in the Z direction but arranged in the Y direction, when the elastic element 14 is disposed between the receiver 13 and the flexible circuit board 12, the receiver 13 and the flexible circuit board 12 have a space in the Z direction due to the elastic element 14, and the absorbing element 16 is disposed in the space, so that the spatial arrangement of the electronic component 1 is further optimized, and the size of the electronic component in the Z direction is reduced by the relative position of the absorbing element 16 and the elastic element 14. Of course, in other embodiments, the engaging member 16 and the elastic member 14 may be partially stacked.

It is understood that the orthographic projection area of the elastic member 14 on the flexible circuit board 12 is located in the orthographic projection area of the absorbing member 16 on the flexible circuit board 12. I.e. the engaging element 16 is located at the outer circumference of the resilient element 14. When the electronic component 1 is installed, the elastic element 14 can be arranged between the flexible circuit board and the telephone receiver, the absorbing element 16 is arranged on the outer ring of the elastic element 14, and the elastic element 14 is clamped between the flexible circuit board 12 and the telephone receiver 13, so that better sealing performance between the telephone receiver 13 and the flexible circuit board 12 is ensured. The relative position of the elastic member 14 and the absorbing member 16 facilitates the assembly of the electronic component 1. Of course, in other embodiments, the elastic member 14 may be located at the outer ring of the absorbing member 16.

It can be understood that, referring to fig. 8 and 10, the structure of the engaging element 16 includes, but is not limited to, the following embodiments:

in an embodiment, referring to fig. 8, the engaging member 161 includes a first magnet 161a and a second magnet 161b engaged with each other, and the first magnet 161a and the second magnet 161b are respectively disposed on the flexible circuit board 12 and the receiver 13, so that the flexible circuit board 12 and the receiver 13 are engaged with each other.

In this embodiment, the first magnet 161a may be welded, bonded, fastened, or embedded on the flexible circuit board 12, and the second magnet 161b and the first magnet 161a may have the same structure, and may also be welded, bonded, fastened, or embedded on the receiver 13. It can be understood that the first magnet 161a and the second magnet 161b are offset from the elastic element 14, and the first magnet 161a and the second magnet 161b are arranged on the outer ring of the elastic element 14, and the first magnet 161a faces the second magnet 161b, which ensures that the first magnet 161a and the second magnet 161b can attract each other magnetically, so that the flexible circuit board 12 and the receiver 13 are close to each other under the action of magnetic force, so that the elastic element 14 is sandwiched between the flexible circuit board 12 and the receiver 13, thereby realizing the sealing of the receiver 13, and ensuring that the sound channel 131 with better sealing performance is formed between the receiver 13 and the flexible circuit board 12, so as to ensure that the electronic component 1 has better sound quality.

It is understood that, referring to fig. 9, the first magnet 161a has a ring shape, and the second magnet 161b has a ring shape. Specifically, the first magnet 161a and the second magnet 161b have the same structure, and the first magnet 161a will be described here: the first magnet 161a is a hollow rectangle, a hollow area 161c is formed in the middle of the first magnet 161a, and when the first magnet 161a is disposed on the flexible circuit board 12, the elastic member 14 is located in the hollow area 161c of the first magnet 161 a. The second magnet 161b has the same structure, and is not described in detail herein. Of course, in other embodiments, one of the first magnet 161a or the second magnet 161b may be annular, and the other magnet may be rectangular, or arc-shaped, etc.

The installation process of the electronic component comprises the following steps: the first magnet 161a and the second magnet 161b are respectively arranged on the flexible circuit board 12 and the receiver 13, and then the elastic member 14 is aligned with the receiver 13 and abuts against the receiver 13; next, the flexible circuit board 12 is abutted against the elastic element 14, and at this time, because the first magnet 161a and the second magnet 161b are respectively arranged on the flexible circuit board 12 and the receiver 13, the flexible circuit board 12 and the receiver 13 approach each other under the action of magnetic force, so that the elastic element 14 is sandwiched between the flexible circuit board 12 and the receiver 13, thereby realizing the sealing of the receiver 13, and ensuring that a sound channel 131 with better sealing performance is formed between the receiver 13 and the flexible circuit board 12, so as to ensure that the electronic component 1 has better sound quality.

The process of disassembling and assembling the electronic component 1 is as follows: the electronic component 1 can be disassembled and assembled only by removing the flexible circuit board 12 from the receiver 13 by overcoming the magnetic force, so that the electronic component 1 can be conveniently disassembled and assembled.

In another embodiment, referring to fig. 10, the sucking element 162 includes a connecting portion 162a and a plurality of suckers 162b, the plurality of suckers 162b are fixedly disposed on the connecting portion 162a, the connecting portion 162a is adhered to the flexible circuit board 12, the connecting portion 162a has a hollow hole 162c, the hollow hole 162c is communicated between the receiver 123 and the vibrating portion 132, and the plurality of suckers 162b are adhered to the receiver 13.

Optionally, the connecting portion 162a is annular, and the plurality of suckers 162b are annularly disposed on the connecting portion 162 a.

In this embodiment, referring to fig. 11, the connecting portion 162a is in a shape of a thin sheet and a long rectangle, a hollow hole 162c is formed in the middle of the connecting portion, and the plurality of suckers 162b are disposed around the connecting portion 162a and uniformly arranged on the connecting portion 162 a. The connecting portion 162a is adhered to the flexible circuit board 12, and the elastic member 14 is accommodated in the hollow hole 162c of the connecting portion 162 a. The suction cup 162b is sucked to the receiver 13 by contacting the receiver 13 and pressing out air in the suction cup 162 b. The suction of the suction cup 162b and the receiver 13 can make the receiver 13 and the flexible circuit board 12 approach each other, so that the elastic element 14 is sandwiched between the receiver 13 and the flexible circuit board 12, and a better sealing performance between the receiver 13 and the flexible circuit board 12 is ensured. Of course, in other embodiments, the connecting portion 162a may be formed by splicing four straight portions to form a rectangle.

The installation process of the electronic component 1 is as follows: disposing the connecting portion 162a on the flexible circuit board 12, and then abutting the elastic member 14 on the flexible circuit board 12; aligning the receiver 13 with the elastic member 14 and abutting against the elastic member 14; then, the suction cup 162b of the suction piece is adsorbed on the receiver 13, and the adsorption of the suction cup 162b and the receiver 13 makes the receiver 13 and the flexible circuit board 12 approach each other, so that the elastic piece 14 is sandwiched between the receiver 13 and the flexible circuit board 12, thereby ensuring better sealing performance between the receiver 13 and the flexible circuit board 12.

The process of disassembling and assembling the electronic assembly comprises the following steps: the electronic component 1 can be disassembled and assembled only by overcoming the adsorption force and taking down the sucker 162b relative to the receiver 13, so that the electronic component 1 can be conveniently disassembled and assembled.

Further, referring to fig. 12, an orthographic projection area D1 of the sensor 11 on the flexible circuit board 12 is located in an orthographic projection area D2 of the receiver 13 on the flexible circuit board 12. The sensor 11 and the receiver 13 are overlapped in the Z direction, so that the size of the flexible circuit board 12 loaded between the sensor 11 and the receiver 13 is reduced, the size of the electronic component 1 in the X direction is saved when the electronic component 1 is assembled in the circuit board, and the structure of the electronic device 100 is further optimized. Of course, in other embodiments, as shown in fig. 13, the orthographic projection area of the sensor 11 and the receiver 13 on the flexible circuit board 12 may also partially overlap, that is, the orthographic projection area D1 of the sensor 11 on the flexible circuit board 12 partially overlaps the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12; or as shown in fig. 14, the orthographic projection area D1 of the sensor 11 on the flexible circuit board 12 is located at the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12, and the like.

It can be understood that, referring to fig. 12, the sensor 11 is disposed near a connection point of the first side S1 and the third side S3 of the flexible circuit board 12. The sensor 11 is disposed at a corner of the flexible circuit board 12 and is further away from a connection point of the flexible circuit board 12 and the circuit board, so that when the electronic assembly 1 is disposed on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing a size of a non-display area of the electronic device 100.

It is understood that, referring to fig. 15, the sound channel 131 and the sensor 11 are arranged side by side along the direction from the third side S3 to the fourth side S4.

As shown in fig. 15, the orthographic projection area of the receiver 123 on the receiver 13 is located in a range overlapping with the vibration part 132 on the receiver 13. Namely, the receiver 123 is aligned with the vibrating portion 132 of the upper portion of the receiver 13. That is, the size of the receiver 123 is smaller than the size of the vibrating portion 132 of the receiver 13. Correspondingly, the orthographic projection area D3 of the receiver 123 on the flexible circuit board 12 is located in the orthographic projection area D4 of the vibration part 132 of the receiver 13 on the flexible circuit board 12. The sound guide structure can be additionally covered on the telephone receiver 123 to ensure the sound output of the telephone receiver 13. That is, the forward projection area D3 of the receiver 123 on the flexible circuit board 12 is located in the forward projection area D4 of the vibrating portion 132 of the receiver 13 on the flexible circuit board 12. The receiver 123 is close to the corners of the first side S1 and the fourth side S4, so as to realize the side-by-side arrangement of the sound channel 131 and the sensor 11. The telephone receiver 123 is arranged side by side with the sensor 11, so that the requirement for a non-display area of the electronic device 100 can be reduced, and the screen occupation ratio of the electronic device 100 can be improved. Of course, in other embodiments, please refer to fig. 16, the size of the receiver 123 may be half of the vibration portion 132 of the receiver 13, or, referring to fig. 17, the receiver 123 and the sensor 11 are arranged in different rows.

Further, referring to fig. 1, the electronic device 100 further includes a display module 2, the display module 2 has a non-display area Z2, the non-display area Z2 is provided with a receiving window 21a, the electronic component 1 is disposed on the non-display area Z2, and the sound channel 131 of the electronic component 1 is communicated to the receiving window 21 a.

In one embodiment, referring to fig. 18 and 19, the display module 2 includes a cover plate 21 and a panel assembly 22 stacked and connected in sequence. The display module 2 and the housing of the electronic device 100 are covered to form an inner cavity enclosed by the electronic device 100, the electronic component 1 is accommodated in the inner cavity, and the receiver 123 and the sensor 11 in the electronic component 1 are both aligned with the non-display area Z2 of the display module 2, so that the sound signal in the receiver 13 can be transmitted to the receiver window 21a through the receiver 123, so that the user can listen to the sound signal through the receiver window 21a, and the sensor 11 is aligned with the display module 2, so that the sensor 11 can receive external light to operate. Here, the non-display area Z2 is an area of the electronic apparatus 100 that is not used for displaying electronic images. The electronic component 1 and the display module 2 are assembled as follows: the electronic component 1 is connected to the display module 2 in a stacked manner, and the first side 121 of the flexible circuit board 12 faces the screen component 22, so that the receiving opening 123 and the sensor 11 are aligned with the non-display area Z2, so that the sound signal in the receiving unit 13 can be transmitted to the receiving window 21a through the receiving opening 123, so that the user can listen to the sound signal through the receiving window 21a, and the sensor 11 can receive external light for operation.

Because the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked, when the electronic assembly 1 with the structure is arranged in the electronic device 100, the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, so that the size of the non-display area Z2 in the electronic device 100 in the X direction is saved, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is improved.

In an embodiment, as shown in fig. 1, the display module 2 further has a display area Z1, and the display area Z1 surrounds the non-display area Z2.

It can be understood that, as shown in fig. 18, the display module 2 includes a cover plate 21 and a screen assembly 22 sequentially stacked and connected, the screen assembly 22 has two short sides S5 opposite to each other and two long sides S6 opposite to each other, the two long sides S6 are respectively connected between the two short sides S5, one short side S5 is recessed toward the other short side S5 to form a groove 22a, a region of the display module 2 within the groove 22a is the non-display region Z2, a region of the display module 2 outside the groove 22a is the display region Z1, and the cover plate 21 opens the telephone receiving window 21 a. Of course, in other embodiments, the display module 2 may also be the panel assembly 22, a groove 22a is opened on an edge of the display module 2, that is, the panel assembly 22, to form a non-display area Z2, and an area of the display module 2 outside the non-display area Z2 is a display area Z1.

As shown in fig. 1 and 18, the display module 2 formed by the cover plate 21 and the panel assembly 22 is a display area Z1 except for the groove 22 a. Wherein the recess 22a opens in the middle of one short side of the screen assembly 22. The cover 21 is provided with a receiver window 21a corresponding to the receiver 123. It will be appreciated that the receiving window 21a is elongated and has a size approximately 2 times that of the receiving opening 123. The portion of the cover plate 21 corresponding to the recess 22a may be printed with a coating to form the non-display area Z2 of the display module 2. Since the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked in sequence along the Z direction of the electronic device 100, the size of the groove 22a in the X direction is reduced, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is improved. Of course, in other embodiments, as shown in FIG. 18, the notch 22a may be located at other locations such as the corners of the screen assembly 22. Of course, in other embodiments, the ratio range of the lengths of the receiver window and the receiver along the short side direction is 3: 1 or 4: 1.

it can be understood that the electronic component 1 is disposed opposite to the display module 2, and the receiver 13 is at least partially aligned with the non-display area Z2.

In an embodiment, referring to fig. 1 and fig. 19, a groove 22a is formed in an edge of the display module 2 to form a non-display area Z2, an area of the display module 2 outside the non-display area Z2 is a display area Z1, the electronic component 1 is disposed opposite to the display module 2, and at least a portion of the telephone receiver 13 is aligned with the non-display area Z2, that is, an area of at least a partial orthographic projection of the telephone receiver 13 on the display module 2 is located in the non-display area Z2. The receiver 13 is partially aligned with the non-display area Z2, so that the size of the non-display area Z2 in the Y direction is further reduced, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is further improved.

Further, at least a part of the orthographic projection area of the sensor 11 on the display module 2 is located in the non-display area Z2.

The partial structures of the telephone receiver 13 and the sensor 11 are located in the groove 22a, and the orthographic projection range of the rest structures of the telephone receiver 13 and the sensor 11 on the display module 2 is located in the range of the display area Z1 of the display module 2, so that the size of the non-display area Z2 in the Y direction is further reduced, namely, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is further improved.

It will be appreciated that the electronic assembly 1 is located at the corner of the recess 22a, as shown in fig. 19, to facilitate the continued placement of other components, such as camera modules, etc., in the X-direction of the recess 22 a. Of course, in other embodiments, the electronic component 1 may also be located in the middle of the groove 22a, and other components are respectively located on two sides of the electronic component 1.

When the electronic device 100 provided in the embodiment of the application is assembled, the sensor 11 is first disposed on the flexible circuit board 12 and electrically connected to the flexible circuit board 12, and then the receiver 13 and the sensor 11 are disposed on the flexible circuit board 12 in a reverse manner to form the electronic component 1, and the receiver 13 is hermetically connected to the flexible circuit board 12 through the sealing component 15; the electronic component 1 is abutted against the display module 2 for assembly, the telephone receiver 123 of the electronic component 1 is aligned with the telephone receiver window 21a on the cover plate 21, part of the structures of the telephone receiver 13 and the sensor 11 are positioned in the groove 22a, and the orthographic projection range of the rest structures of the telephone receiver 13 and the sensor 11 on the display module 2 is positioned in the range of the display area Z1 of the display module 2.

The electronic component 1 and the electronic device 100 provided by the embodiment of the application are arranged between the flexible circuit board 12 and the telephone receiver 13 through the suction element 16 which can be detachably connected, the elastic element 14 is clamped between the telephone receiver 13 and the flexible circuit board 12 under the action of the suction element 16 to ensure the sealing between the telephone receiver 13 and the flexible circuit board 12, and the sealing component 15 formed by combining the suction element 16 and the elastic element 14 is convenient for the disassembly and assembly of the electronic component 1.

The foregoing is a preferred embodiment of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Claims

1. The utility model provides an electronic component, its characterized in that includes sensor, flexible circuit board, seal assembly and receiver, the flexible circuit board is including the first face and the second face that back of the body set up mutually, the sensor set up in on the first face of flexible circuit board, the receiver set up in on the second face of flexible circuit board, the receiver hole is seted up to the flexible circuit board, seal assembly includes elastic component and suction piece, the elastic component set up in the flexible circuit board with between the receiver, the elastic component have communicate to the vibration portion of receiver with the inner chamber of receiver hole, suction piece detachable set up in the flexible circuit board with between the receiver, just suction piece is used for making the elastic component clamp is arranged in between the flexible circuit board and between the receiver, the vibration portion of receiver extremely the passageway between the receiver hole of flexible circuit board forms the sound passageway of output the sound signal of receiver.

2. The electronic assembly of claim 1, wherein the engaging member and the resilient member are offset from each other.

3. The electronic assembly of claim 2, wherein an area of the orthographic projection of the elastic member on the flexible circuit board is located in an area of the orthographic projection of the suction member on the flexible circuit board.

4. The electronic assembly of claim 2, wherein the engaging member comprises a first magnet and a second magnet engaging with each other, and the first magnet and the second magnet are respectively disposed on the flexible circuit board and the receiver, so that the flexible circuit board and the receiver engage with each other.

5. The electronic assembly of claim 4, wherein the first magnet is ring-shaped; and/or the second magnet is annular.

6. The electronic assembly of claim 2, wherein the suction member comprises a connecting portion and a plurality of suckers, the suckers are fixedly disposed on the connecting portion, the connecting portion is adhered to the flexible circuit board, the connecting portion has a hollow hole, the hollow hole is communicated between the receiver hole and the vibrating portion, and the suckers are attached to the receiver.

7. The electronic assembly of claim 6,

the connecting part is annular, and the plurality of suckers are annularly arranged on the connecting part.

8. The electronic assembly of any of claims 1-7, wherein the resilient member is foam.

9. The electronic assembly of claim 8, wherein an area of the inner cavity of the elastic member in the orthographic projection of the receiver comprises an area of a vibrating portion of the receiver.

10. The electronic assembly of claim 9, wherein the resilient element has an inner cavity surface that surrounds the inner cavity, the inner cavity surface being a tapered surface.

11. The electronic assembly of claim 10, wherein the elastic member has a first opening and a second opening opposite to each other, the first opening is close to the receiver, and the aperture of the inner cavity surface gradually increases along a direction from the first opening to the second opening.

12. The electronic assembly of any one of claims 1 to 7, wherein an area of orthographic projection of the sensor on the flexible circuit board is located in an area of orthographic projection of the receiver on the flexible circuit board.

13. The electronic assembly of claim 12, wherein the flexible circuit board includes two first and second oppositely disposed edges and two third and fourth oppositely disposed edges, the third and fourth edges being connected between the first and second edges, respectively, the second edge extending away from the first edge to electrically connect the flexible circuit board to the circuit board, and the sensor is disposed proximate to a junction of the first and third edges of the flexible circuit board.

14. The electronic assembly of claim 13, wherein the sound channel is positioned alongside the transducer in a direction from the third edge to the fourth edge.

15. An electronic device, characterized in that it comprises an electronic assembly according to any one of claims 1 to 14.