CN109995912B

CN109995912B - Electronic component and electronic device

Info

Publication number: CN109995912B
Application number: CN201711499799.3A
Authority: CN
Inventors: 谢香焜
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-29
Filing date: 2017-12-29
Publication date: 2024-02-23
Anticipated expiration: 2037-12-29
Also published as: CN109995912A

Abstract

The embodiment of the application provides an electronic component, electronic component includes sensor, flexible circuit board and receiver, the flexible circuit board is including the first face and the second face that set up in opposite directions, the sensor set up in on the first face of flexible circuit board, just the sensor electricity connect in the flexible circuit board, the receiver set up in on the second face of flexible circuit board, the sound passageway of receiver passes over or through flexible circuit board intercommunication to outside. According to the electronic component and the electronic device, the sensor, the flexible circuit board and the receiver are in a stacked shape, and when the electronic component with the structure is arranged in the electronic device, the sensor, the flexible circuit board and the receiver are sequentially stacked along the Z direction of the electronic device, so that the X direction of the electronic component and the X direction of the electronic device are saved. In addition, the embodiment of the application also provides electronic equipment.

Description

Electronic component and electronic device

Technical Field

The present disclosure relates to the field of electronic devices, and more particularly, to an electronic component and an electronic device.

Background

With the development of electronic equipment technology, the demand for lightening and thinning of mobile phones is increasing. In the prior art, in order to realize more and more functions in electronic equipment such as a mobile phone, more and more devices are integrated in the mobile phone, the position relationship among the devices is more and more complex, and the influence on the thinning of the mobile phone is more and more great along with the effect on the appearance design of the mobile phone.

Disclosure of Invention

The application provides an electronic component and electronic equipment.

The embodiment of the application provides an electronic component, electronic component includes sensor, flexible circuit board and receiver, the flexible circuit board is including the first face and the second face that set up in opposite directions, the sensor set up in on the first face of flexible circuit board, just the sensor electricity connect in the flexible circuit board, the receiver set up in on the second face of flexible circuit board, the sound passageway of receiver passes over or through flexible circuit board intercommunication to outside.

On the other hand, the embodiment of the application also provides electronic equipment, which comprises the electronic component.

In still another aspect, an embodiment of the present application further provides an electronic device, including a receiver, a sensor, and a display screen; the receiver and the sensor are stacked in a thickness direction of the display screen; a groove is formed in one edge of the display screen, the groove is used for arranging the sensor and the receiver, and at least part of the display area of the display screen is overlapped with the receiver.

According to the electronic component and the electronic device, the sensor, the flexible circuit board and the receiver are in a stacked shape, and when the electronic component with the structure is arranged in the electronic device, the sensor, the flexible circuit board and the receiver are sequentially stacked along the Z direction of the electronic device, so that the X direction of the electronic component and the X direction of the electronic device are saved.

Drawings

In order to more clearly illustrate the technical solutions of the present application, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of an electronic device according to a first embodiment of the present application;

FIG. 2 is a schematic diagram of the electronic components of the electronic device shown in FIG. 1;

FIG. 3 is a schematic view of an electronic assembly shown in FIG. 2;

FIG. 4 is a cross-sectional view of the electronic assembly shown in FIG. 3 taken along line A-A;

FIG. 5 is a schematic diagram of another view of the electronic assembly shown in FIG. 3;

FIG. 6 is a schematic diagram of another electronic assembly shown in FIG. 2;

FIG. 7 is a cross-sectional view of one of the seals in the electronic assembly shown in FIG. 6, taken along line A-A;

FIG. 8 is a cross-sectional view of another seal in the electronic assembly shown in FIG. 6, taken along line A-A;

FIG. 9 is a schematic diagram of the relative relationship of the sensor and receiver of the electronic assembly shown in FIG. 2;

FIG. 10 is a schematic diagram of another relative relationship of the sensor and the receiver of the electronic assembly in other embodiments;

FIG. 11 is a schematic diagram of yet another relative relationship of the sensor and the receiver of the electronic assembly in other embodiments;

FIG. 12 is a schematic diagram of the relative relationship of the receiving hole and the vibrating portion of the electronic assembly shown in FIG. 2;

FIG. 13 is a schematic diagram of another relative relationship of a receiving hole and a vibrating portion of an electronic assembly in other embodiments;

FIG. 14 is a schematic view of the sensor and receiver of the electronics assembly in other embodiments, not disposed side-by-side;

FIG. 15 is a schematic diagram of a display module of the electronic device shown in FIG. 1;

FIG. 16 is a schematic view of a screen assembly of the display module of FIG. 15;

FIG. 17 is a schematic view of another screen assembly of a display module in other embodiments;

FIG. 18 is a schematic view of a display module according to another embodiment;

FIG. 19 is a schematic view of an electronic assembly in other embodiments fully seated in a recess of a screen assembly;

fig. 20 is a schematic diagram of another electronic device according to the second embodiment of the present application.

Fig. 21 is a schematic view of another electronic device provided in the third embodiment of the present application;

FIG. 22 is a schematic view of the sensor, flexible circuit board and receiver in the electronic device of FIG. 21;

fig. 23 is a schematic view of still another electronic device provided in the fourth embodiment of the present application;

fig. 24 is a schematic view of the sensor, flexible circuit board and receiver in the electronic device of fig. 23.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In order that the above-recited objects, features and advantages of the present application will be more clearly understood, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description. In addition, embodiments of the present application and features of the embodiments may be combined with each other without conflict.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application, and the described embodiments are merely some, rather than all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.

Furthermore, the following description of the embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. Directional terms referred to in this application, such as "length", "width", "thickness", etc., are only with reference to the directions of the attached drawings, and thus, the directional terms are used for better, more clear description and understanding of the present application, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. It will be understood by those of ordinary skill in the art that the terms described above have a specific meaning within the context of the present invention.

Example 1

Referring to fig. 1, fig. 1 is a schematic view of an electronic device 100 at a first viewing angle. The electronic device 100 comprises an electronic assembly 1. The electronic component 1 is accommodated in the electronic device 100, and is used for realizing functions such as receiving a call of the electronic device 100. The electronic device 100 may be any device provided with electronic components, such as: tablet personal computers, cell phones, cameras, personal computers, notebook computers, vehicle-mounted devices, wearable devices and other intelligent devices. For convenience of description, the width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device is defined as the Z direction, with reference to the electronic device 100 at the first viewing angle.

Referring to fig. 2 together, fig. 2 is a schematic diagram of an electronic assembly 1 of the electronic device shown in fig. 1. The electronic assembly 1 comprises a sensor 11, a flexible circuit board 12 and a receiver 13. When the electronic component 1 with the structure is arranged in the electronic device 100, the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, so that the size of the electronic component 1 and the X direction of the electronic device 100 is saved.

In one embodiment, as shown in fig. 2, flexible circuit board 12 includes a first side 121 and a second side 122 disposed opposite each other. The flexible circuit board 12 is used for electrically connecting with the sensor 11, and the flexible circuit board 12 is electrically connected with a circuit board in the electronic device 100, so as to transmit the electric signal on the sensor 11 to the circuit board in the electronic device 100.

Referring to fig. 2 and 3, the first surface 121 and the second surface 122 of the flexible circuit board 12 are respectively opposite surfaces of the flexible circuit board 12, and the surface area is large to be able to carry components. Correspondingly, edges of the board surface of the flexible circuit board 12 are a first side S1 and a second side S2 which are disposed opposite to each other, a third side S3 and a fourth side S4 which are disposed opposite to each other, the third side S3 and the fourth side S4 are respectively connected between the first side S1 and the second side S2, and the second side S2 extends in a direction away from the first side S1, so that the flexible circuit board 12 is electrically connected with the circuit board. That is, the flexible circuit board 12 has a substantially long rectangular shape. The first side S1 and the second side S2 are shorter sides in the flexible circuit board 12 than the third side S3 and the fourth side S4. That is, when the flexible circuit board 12 is disposed in the electronic device 100, it is arranged in a substantially elongated shape along the Y-direction of the electronic device 100 so as to extend to be electrically connected to the circuit board.

In one embodiment, as shown in fig. 2, the sensor 11 is disposed on the first side 121 of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12.

It will be appreciated that the sensor 11 comprises at least one of a distance sensor, a light sensor or a photoelectric sensor. In this embodiment, the sensor 11 is a light sensor 11. The light sensor 11 is disposed near the screen of the electronic device 100 so as to adjust the brightness of the screen of the electronic device 100 according to the light of the environment in which the electronic device 100 is located. The medium sensed by the light sensor 11 is light, and the electronic device 100 does not need to drill holes or set special structures to pass through the light, the sensor 11 in the electronic component 1 is set as the light sensor 11 and stacked with the receiver 13 in the Z direction, so that the structure of the electronic device 100 is further optimized, and the X direction of the electronic device 100 is facilitated.

In an embodiment, referring to fig. 2, the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12. Referring to fig. 4 or 6, the sound channel 131 of the receiver 13 is connected to the outside through or over the flexible circuit board 12, so that the sound signal can be transmitted to the outside through the sound channel 131 after the receiver 13 converts the audio signal into the sound signal.

As shown in fig. 5, the receiver 13 is substantially rectangular, and the middle region of the receiver 13 is a vibrating portion 132. The vibration portion 132 is typically hermetically connected to other components or structures to form a vibration cavity, and vibrations in the vibration portion 132 are transmitted through openings in the components or structures. The sound channel 131 of the receiver 13 is a channel for transmitting sound signals in the receiver 13, and corresponds to a channel between the vibration part 132 and an opening on a component or a structural member. After receiving the audio signal, the receiver 13 is vibrated by the vibration cavity formed by sealing, and the sound signal passes through the opening on the component or the structural member.

In an embodiment, as shown in fig. 3 to 5, the component of the vibration part 132 connected with the receiver 13 in a sealing manner may be a flexible circuit board 12, where the flexible circuit board 12 is used as a carrier for stacking the sensor 11 and the receiver 13 together and also is used as a part of the sound channel 131 of the receiver 13, so that the component assembly of the electronic component 1 is reduced, the thickness of the electronic component 1 in the Z of the electronic device 100 is saved, and the electronic components are further optimized.

Referring to fig. 4, the flexible circuit board 12 covers and is connected with the receiver 13 in a sealing manner, and the flexible circuit board 12 is provided with a receiving hole 123, so that a channel between the vibration portion 132 of the receiver 13 and the receiving hole 123 of the flexible circuit board 12 forms the sound channel 131.

Referring to fig. 4, since the receiving hole 123 is formed in the flexible circuit board 12, a channel between the vibration portion 132 of the receiver 13 and the receiving hole 123 of the flexible circuit board 12 forms a sound channel 131, and thus the sound channel 131 of the receiver 13 passes through the flexible circuit board 12.

The area of the second surface 122 of the flexible circuit board 12 is slightly larger than the area of the receiver 13, that is, the size of the flexible circuit board 12 is too large, so that too much space in the electronic device 100 is not occupied, and when the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12, the orthographic projection area of the receiver 13 on the flexible circuit board 12 is located in the area occupied by the second surface 122 of the flexible circuit board 12, that is, the whole flexible circuit board 12 covers the receiver 13. Of course, in other embodiments, the size of the flexible circuit board 12 may also be much larger than the area of the receiver 13.

Referring to fig. 4, the flexible circuit board 12 and the receiver 13 are bonded by the foam 14, so that the receiver 13 is sealed by the flexible circuit board 12, which is beneficial to forming the sound channel 131 of the receiver 13. Specifically, referring to fig. 5, the foam 14 is in a hollow ring shape and is disposed between the second surface 122 of the flexible circuit board 12 and the receiver 13, and the foam 14 just surrounds the edge of the vibration portion 132 of the receiver 13, so that after the flexible circuit board 12 is connected with the receiver 13 in a sealing manner, a cavity is formed between the vibration portion 132 of the receiver 13 and the flexible circuit board 12 and is a part of the sound channel 131 of the receiver 13, in order to facilitate the transmission of the sound signal of the receiver 13 to the outside, a receiving hole 123 is formed in the flexible circuit board 12, and the receiving hole 123 is communicated to the cavity formed between the vibration portion 132 of the receiver 13 and the flexible circuit board 12, so as to form the sound channel 131. Of course, in other embodiments, the flexible circuit board 12 and the receiver 13 may be hermetically connected by welding or gluing.

After the receiver 13 receives the audio signal, the vibration part 132 of the receiver 13 vibrates to form a sound signal, the sound signal is transmitted to the receiving hole 123 from the vibration cavity, and the receiving hole 123 is transmitted to the outside, so that the receiving function of the receiver 13 can be realized.

In another embodiment, referring to fig. 6, fig. 6 is a schematic diagram of another electronic component 1. The components of the vibrating portion 132 of the seal connection receiver 13 may also be the sealing members 15, 15', and the specific structure is as follows: the flexible circuit board 12 is partially covered and is in sealing connection with the receiver 13, the electronic assembly 1 further comprises sealing elements 15 and 15 'spliced with the flexible circuit board 12, the sealing elements 15 and 15' are covered and are in sealing connection with the rest of the receiver 13, and the sealing elements 15 and 15 'are provided with receiving holes 123, so that a channel between a vibration part 132 of the receiver 13 and the receiving holes 123 of the sealing elements 15 and 15' forms the sound channel 131.

Since the receiving hole 123 is provided in the sealing member 15, 15', i.e. the sound signal of the receiver 13 is transmitted to the outside through the receiving hole 123 of the sealing member 15, 15', i.e. the sound channel 131 of the receiver 13 bypasses the flexible circuit board 12.

The construction of the seal 15, 15' is more practical, but does not rely on the construction of the flexible circuit board 12 to carry and seal the receiver 13, further optimizing the construction of the functional assembly.

The size of the flexible circuit board 12 is substantially the same as the size of the sensor 11, i.e. the size of the flexible circuit board 12 is too large to occupy too much space in the electronic device 100, and the sensor 11 can be preferably carried on the flexible circuit board 12, i.e. the flexible circuit board 12 entirely covers the flexible circuit board 12.

Wherein the sealing members 15, 15' are essentially rectangular foam. The seal 15, 15' is spliced with the flexible circuit board 12 to form a size substantially the same as the size of the receiver 13. Of course, in other embodiments, the sealing members 15, 15' may be reinforcing plates made of metal or plastic.

After the sealing members 15 and 15 'are in sealing connection with the receiver 13, a cavity is formed between the vibrating portion 132 of the receiver 13 and the structure formed by splicing the flexible circuit board 12 and the sealing members 15 and 15', and is a part of the sound channel 131 of the receiver 13, in order to facilitate the transmission of the sound signal of the receiver 13 to the outside, the sealing members 15 and 15 'are provided with a receiving hole 123, and the receiving hole 123 is communicated with the cavity formed between the vibrating portion 132 of the receiver 13 and the structure formed by splicing the flexible circuit board 12 and the sealing members 15 and 15', so as to form the sound channel 131.

The structure of the seal 15 spliced with the flexible circuit board 12 is specifically as follows:

as can be appreciated, referring to fig. 7, fig. 7 is a cross-sectional view of one seal 15 of fig. 6 along line A-A. The structure of one seal 15 is as follows: the sealing member 15 has a first sealing portion 151 and a second sealing portion 152 connected in sequence, the first sealing portion 151 is fixedly connected with the flexible circuit board 12, so that the flexible circuit board 12 is partially covered and hermetically connected with the receiver 13 through the first sealing portion 151, and the second sealing portion 152 is covered and hermetically connected with the rest of the receiver 13.

The first sealing portion 151 and the second sealing portion 152 of the sealing member 15 are vertically connected, and the cross section of the sealing member 15 is substantially L-shaped, so that when the flexible circuit board 12 is fixedly connected to the second sealing portion 152, the first sealing portion 151 and the flexible circuit board 12 are on the same plane. Since the sealing member 15 is foam, the sealing connection between the flexible circuit board 12 and the receiver 13 is directly connected in a sealing manner through the second sealing portion 152 of the sealing member 15, so that the structure of the electronic assembly 1 is optimized.

The first sealing portion 151 is provided with the rest of the receiver 13 to achieve a sealed connection of the receiver 13 by the sealing member 15 and the flexible circuit board 12. The first sealing portion 151 is provided with a receiving hole 123.

It will be appreciated that in other embodiments, referring to fig. 8, fig. 8 is a cross-sectional view of another seal 15' of fig. 6 taken along line A-A. The other seal 15 is specifically configured as follows: the sealing member 15 is adhered to the side edge of the flexible circuit board 12 so that the sealing member 15 is spliced with the flexible circuit board 12.

Wherein the sealing member 15 is in the shape of a flat plate. A side surface of the sealing member 15 adjacent to the flexible circuit board 12 is directly adhered to a side surface (third side S3) on the flexible circuit board 12. The connection between the flexible circuit board 12 and the receiver 13 needs to be further provided with foam, and the sealing element 15 is made of foam and is directly bonded with the receiver 13, so that the vibration part 132 of the receiver 13 and the structure formed by splicing the flexible circuit board 12 and the sealing element 15 form a cavity, and the cavity is a part of the sound channel 131 of the receiver 13.

According to the electronic component 1 and the electronic device 100, the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked, and when the electronic component 1 with the structure is arranged in the electronic device 100, the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, so that the size of the electronic component 1 and the X direction of the electronic device 100 is saved.

Further, referring to fig. 9, the area D1 of the front projection of the sensor 11 on the flexible circuit board 12 is located in the area D2 of the front projection of the receiver 13 on the flexible circuit board 12. The sensor 11 and the receiver 13 overlap in the Z direction, so that the size of a bearing part (such as the flexible circuit board 12 or a splicing structure formed by combining the flexible circuit board 12 and the sealing part 15) borne between the sensor 11 and the receiver 13 is reduced, the size of the electronic component 1 in the X direction is saved when the electronic component 1 is assembled in the circuit board, and the structure of the electronic device 100 is further optimized. Of course, in other embodiments, as shown in fig. 10, the area of the front projection of the sensor 11 and the receiver 13 on the flexible circuit board 12 may also partially overlap, that is, the area D1 of the front projection of the sensor 11 on the flexible circuit board 12 and the area D2 of the front projection of the receiver 13 on the flexible circuit board 12 partially overlap; or as shown in fig. 11, the area D1 of the front projection of the sensor 11 on the flexible circuit board 12 is located at the area D2 of the front projection of the receiver 13 on the flexible circuit board 12, and is offset from each other.

As can be appreciated, referring to fig. 9, the sensor 11 is disposed near the connection between the first side S1 and the third side S3 of the flexible circuit board 12. The sensor 11 is disposed at a corner of the flexible circuit board 12 and is further away from a connection between the flexible circuit board 12 and the circuit board, so that when the electronic component 1 is disposed on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing the size of the non-display area of the electronic device 100.

As can be appreciated, referring to fig. 12, the sound channel 131 and the sensor 11 are disposed side by side along the directions from the third side S3 to the fourth side S4.

As shown in fig. 12, the orthographic projection area of the receiving hole 123 on the receiver 13 is located in a range overlapping with the range of the vibration part 132 on the upper part of the receiver 13. I.e. the receiving hole 123 is aligned with the vibration part 132 of the upper part of the receiver 13. I.e. the size of the receiving aperture 123 is smaller than the size of the vibrating portion 132 of the receiver 13. Correspondingly, the orthographic projection area D3 of the receiving hole 123 on the flexible circuit board 12 is located in the orthographic projection area D4 of the vibration portion 132 of the receiver 13 on the flexible circuit board 12. A sound guide structure may be additionally covered on the receiving hole 123 to ensure sound output of the receiver 13. That is, the orthographic projection area D3 of the receiving hole 123 on the flexible circuit board 12 is located in the orthographic projection area D4 of the vibration portion 132 of the receiver 13 on the flexible circuit board 12. The receiving hole 123 is adjacent to the corners of the first side S1 and the fourth side S4, and the sound channel 131 and the sensor 11 are arranged side by side. The receiving hole 123 is arranged side by side with the sensor 11, so that the requirement for a non-display area of the electronic device 100 can be reduced, and the screen occupation ratio of the electronic device 100 can be improved. Of course, in other embodiments, referring to fig. 13, the size of the receiving hole 123 may be half of the vibrating portion 132 of the receiver 13, or referring to fig. 14, the receiving hole 123 may be arranged in a different row from the sensor 11.

Further, referring to fig. 1, the electronic device 100 further includes a display module 2, the display module 2 has a non-display area Z2, the non-display area Z2 is provided with a receiving window 21a, the electronic component 1 is disposed on the non-display area Z2, and the sound channel 131 of the electronic component 1 is connected to the receiving window 21a.

In an embodiment, referring to fig. 15 and 16, the display module 2 includes a cover plate 21 and a screen assembly 22 sequentially stacked. The display module 2 and the housing of the electronic device 100 are covered to form a closed inner cavity of the electronic device 100, the electronic component 1 is accommodated in the inner cavity, and the receiving hole 123 and the sensor 11 in the electronic component 1 are aligned to the non-display area Z2 of the display module 2, so that the sound signal in the receiver 13 can be transmitted to the receiving window 21a through the receiving hole 123, the user can hear the sound signal through the receiving window 21a, and the sensor 11 is aligned to the display module 2, so that the sensor 11 can receive external light to operate. The non-display area Z2 is an area of the electronic device 100 that is not used for displaying electronic images. The assembly of the electronic assembly 1 and the display module 2 is as follows: the electronic assembly 1 is connected to the display module 2 in a stacked manner, and the first surface 121 of the flexible circuit board 12 faces the screen assembly 22, so that the receiving hole 123 and the sensor 11 are aligned to the non-display area Z2, and the sound signal in the receiver 13 can be transmitted to the receiving window 21a through the receiving hole 123, so that the user can hear the sound signal through the receiving window 21a, and the sensor 11 can receive external light to operate.

Because the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked, when the electronic component 1 with the structure is arranged in the electronic device 100, the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, so that the X-direction size of a non-display area Z2 in the electronic device 100 is saved, namely, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is improved.

In an embodiment, as shown in fig. 15, the display module 2 further has a display area Z1, and the display area Z1 surrounds the non-display area Z2.

It will be appreciated that, as shown in fig. 16, the display module 2 includes a cover plate 21 and a screen assembly 22 that are sequentially stacked and connected, the screen assembly 22 has two short sides S5 that are disposed opposite to each other, and two long sides S6 that are disposed opposite to each other, the two long sides S6 are respectively connected between the two short sides S5, one short side S5 is recessed toward the other short side S5 to form a groove 22a, an area of the display module 2 within the groove 22a is the non-display area Z2, an area of the display module 2 outside the groove 22a is the display area Z1, and the cover plate 21 is provided with the receiving window 21a.

As shown in fig. 1 and 16, the display module 2 formed by the cover plate 21 and the screen assembly 22 is a display area Z1 except the recess 22 a. The groove 22a is formed in the middle of one short side of the screen assembly 22. The cover 21 is provided with a receiving window 21a corresponding to the receiving hole 123. It will be appreciated that the receiving window 21a is elongated and has a size approximately 2 times that of the receiving hole 123. The portion of the cover plate 21 corresponding to the recess 22a may be printed with a coating to form a non-display area Z2 of the display module 2. Since the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, the size of the recess 22a in the X direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be improved. Of course, in other embodiments, as shown in FIG. 17, the recess 22a may be located at a corner of the screen assembly 22, among other locations. Of course, in other embodiments, the ratio of the length of the receiving window to the length of the receiving hole along the short side direction ranges from 3:1 or 4:1.

it will be appreciated that the electronic assembly 1 is disposed opposite the display module 2, and that the receiver 13 is at least partially aligned with the non-display area Z2.

In an embodiment, referring to fig. 1 and 16, a recess 22a is formed at an edge of the display module 2 to form a non-display area Z2, an area of the display module 2 outside the non-display area Z2 is a display area Z1, the electronic component 1 is disposed opposite to the display module 2, and the receiver 13 is at least partially aligned to the non-display area Z2, that is, an area of orthographic projection of the receiver 13 on the display module 2 is located in the non-display area Z2. The receiver 13 is partially aligned to the non-display area Z2, so that the size of the non-display area Z2 in the Y direction is further reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 is further improved.

Further, at least a portion of the front projection area of the sensor 11 on the display module 2 is located in the non-display area Z2.

The partial structures of the receiver 13 and the sensor 11 are positioned in the groove 22a, and the range of the orthographic projection of the rest structures of the receiver 13 and the sensor 11 on the display module 2 is positioned in the range of the display area Z1 of the display module 2, so that the size of the non-display area Z2 in the Y direction is further reduced, namely, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic equipment 100 is further improved. Of course, in other embodiments, referring to fig. 19, the entire electronic component 1 may be located in the recess 22 a.

It will be appreciated that, as shown in fig. 16, the electronic component 1 is located at a corner of the recess 22a, so as to facilitate the continuous placement of other components, such as a camera module, in the X-direction of the recess 22 a. Of course, in other embodiments, as shown in fig. 18, the electronic component 1 may be located in the middle of the recess 22a, and other components are located on two sides of the electronic component 1.

When the electronic device 100 provided in the embodiment of the present application is assembled, the sensor 11 is first disposed on the flexible circuit board 12 and electrically connected to the flexible circuit board 12, and then the receiver 13 and the sensor 11 are disposed on the flexible circuit board 12 opposite to each other to form the electronic component 1; the electronic assembly 1 is assembled against the display module 2, so that the receiving hole 123 of the electronic assembly 1 is aligned to the receiving window 21a on the cover plate 21, part of the structures of the receiver 13 and the sensor 11 are located in the groove 22a, and the range of the orthographic projection of the rest of the structures of the receiver 13 and the sensor 11 on the display module 2 is located in the range of the display area Z1 of the display module 2.

Example two

Referring to fig. 20, an electronic device 200 provided in a second embodiment of the present application, the electronic device 200 provided in the second embodiment of the present application is substantially the same as the electronic device 100 provided in the first embodiment of the present application, and the difference is that: the electronic device 200 'comprises a receiver 13', a sensor 11 'and a display screen 22'; the receiver 13' and the sensor 11' are stacked in the thickness direction of the display screen 22'; a recess 22a 'is formed at one edge of the display screen 22', the recess 22a 'is used for setting the sensor 11' and the receiver 13', and at least a partial area of a display area Z1' of the display screen 22 'overlaps with the receiver 13'.

By stacking the receiver 13' and the sensor 11', the size of the mobile terminal 200 in the Z direction is reduced, and in addition, the receiver 13' is partially aligned to the non-display area Z2, so that the size of the non-display area Z2' in the Y direction is further reduced, that is, the size of the display area Z1' can be increased, and the screen occupation ratio of the electronic device 200 is further improved.

In an embodiment, referring to fig. 20, a recess 22a ' is formed at an edge of the display screen 22' to form a non-display area Z2', an area of the display screen 22' outside the non-display area Z2' is a display area Z1', the receiver 13' and the sensor 11' are opposite to the display screen 22', and the receiver 13' is at least partially aligned to the non-display area Z2', that is, an area of at least partial orthographic projection of the receiver 13' on the display screen 22' is located in the non-display area Z2.

Further, at least a portion of the front projection area of the sensor 11' on the display screen 22' is located in the non-display area Z2 '.

It will be appreciated that, as shown in fig. 20, the receiver 13' and the sensor 11' are located at the corners of the groove 22a ', so as to facilitate the continuous arrangement of other components, such as a camera module, in the X-direction of the groove 22 a.

Further, the electronic device 200 further includes a flexible circuit board 12, the flexible circuit board 12' is electrically connected to the sensor 11', and the receiver 13' and the sensor 11' are respectively disposed on two sides of the flexible circuit board 12 '.

It will be appreciated that the area of the front projection of the sensor 11' onto the flexible circuit board 12' is located in the area of the front projection of the receiver 13' onto the flexible circuit board.

The specific connection and positional relationship between the display 22', the flexible circuit board 12', and the receiver 13' are shown in the electronic device 100, and will not be described herein.

According to the electronic device 200 provided by the embodiment of the invention, the size of the mobile terminal 200 in the Z direction is reduced by stacking the receiver 13' and the sensor 11', and in addition, the receiver 13' is partially aligned with the non-display area Z2, so that the size of the non-display area Z2' in the Y direction is further reduced, namely, the size of the display area Z1' can be increased, and the screen occupation ratio of the electronic device 200 is further improved. Example III

Referring to fig. 21 to 22, another electronic device 300 provided in the second embodiment of the present application includes a display module 2", a flexible circuit board 12" and a receiver 13", wherein the display module 2" has a non-display area Z2", the non-display area Z2" is provided with a receiving window 21a ", the flexible circuit board 12" includes a first surface 121 "and a second surface 122" that are opposite to each other, the first surface 121 "of the flexible circuit board 12" is used for setting and electrically connecting with the sensor 11", the receiver 13" is disposed on the second surface 122 "of the flexible circuit board 12", and a sound channel of the receiver 13 "passes over or through the flexible circuit board 12" and is connected to the receiving window 21a.

The specific connection and positional relationship between the display module 2", the flexible circuit board 12" and the receiver 13 "refer to the specific description of the electronic device 100 provided herein, and are not described herein.

Example IV

Referring to fig. 23 to 24, still another electronic device 400 provided in the third embodiment of the present application includes a display module 2 '", a flexible circuit board 12'" and a sensor 11 '", where the display module 2'" has a non-display area Z2 '", the non-display area Z2'" is provided with a receiving window 21a '", the flexible circuit board 12'" includes a first face 121 '"and a second face 122'" disposed opposite to each other, the sensor 11 '"is disposed on the first face 121'" of the flexible circuit board 12 '", and the sensor 11'" is electrically connected to the flexible circuit board 12 '", the second face 122'" of the flexible circuit board 12 '"is used for setting a receiver 13'", and the flexible circuit board 12 '"is used for being crossed or passed by a sound channel of the receiver 13'" to communicate the sound channel of the receiver 13 '"to the receiving window 21 a'", so that the receiver 13 '"converts an audio signal into a sound signal, and the sound signal can be sequentially propagated to the receiving window 21'".

The specific connection relationship and the positional relationship between the display module 2 '", the flexible circuit board 12'" and the sensor 11 '"refer to the specific description in the electronic device 100'" for implementing the present disclosure, and are not described herein again.

The foregoing is a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be within the scope of the present application.

Claims

1. The utility model provides an electronic component, its characterized in that, electronic component includes sensor, flexible circuit board and receiver, the flexible circuit board is including the first face and the second face that set up in opposite directions, the sensor set up in on the first face of flexible circuit board, just the sensor electricity connect in the flexible circuit board, the receiver set up in on the second face of flexible circuit board, flexible circuit board at least part covers and sealing connection the vibrating part of receiver is in order to form the vibration chamber, the sound passageway of receiver passes over or through flexible circuit board intercommunication to outside.

2. The electronic assembly of claim 1, wherein the area of orthographic projection of the sensor on the flexible circuit board is located in the area of orthographic projection of the receiver on the flexible circuit board.

3. The electronic assembly of claim 2, wherein the flexible circuit board includes two oppositely disposed first and second sides and two oppositely disposed third and fourth sides, the third and fourth sides being connected between the first and second sides, respectively, the second side extending away from the first side to electrically connect the flexible circuit board to the circuit board, the sensor being disposed proximate a junction of the first and third sides of the flexible circuit board.

4. An electronic assembly according to claim 3, wherein the sound channel is arranged side by side with the sensor in the direction of the third side to the fourth side.

5. The electronic assembly of claim 1, wherein the flexible circuit board partially covers and sealingly connects the receiver, the electronic assembly further comprising a seal member spliced to the flexible circuit board, the seal member covering and sealingly connecting the remainder of the receiver, the seal member defining a receiver aperture such that a passage between the vibrating portion of the receiver and the receiver aperture of the seal member forms the sound passage.

6. The electronic assembly of claim 5, wherein the seal has a first seal portion and a second seal portion connected in sequence, the first seal portion being fixedly connected to the flexible circuit board such that the flexible circuit board partially covers and sealingly connects the receiver via the first seal portion, and the second seal portion covers and sealingly connects the remainder of the receiver.

7. The electronic assembly of claim 5, wherein the seal is bonded to a side edge of the flexible circuit board such that the seal is mated with the flexible circuit board.

8. The electronic assembly of claim 6 or 7, wherein the seal is foam.

9. The electronic assembly of claim 1, wherein the flexible circuit board covers and sealingly connects the receiver, the flexible circuit board having a receiving aperture such that a passage between the vibrating portion of the receiver and the receiving aperture of the flexible circuit board forms the sound passage.

10. An electronic assembly according to claim 5 or 9, wherein the area of orthographic projection of the receiving aperture on the receiver is located overlapping with the range of the vibration part of the upper part of the receiver.

11. The electronic assembly of claim 1, wherein the sensor comprises at least one of a distance sensor, a light sensor, or a photoelectric sensor.

12. An electronic device comprising an electronic assembly as claimed in any one of claims 1 to 11.

13. The electronic device of claim 12, further comprising a display module having a non-display area, the non-display area having a call receiving window, the electronic component being disposed on the non-display area, and a sound channel of the electronic component being connected to the call receiving window.

14. The electronic device of claim 13, wherein the display module further has a display area surrounding the non-display area.

15. The electronic device of claim 14, wherein the display module includes a cover plate and a screen assembly that are sequentially stacked and connected, the screen assembly has two short sides that are disposed opposite to each other, and two long sides that are disposed opposite to each other, the two long sides are respectively connected between the two short sides, one of the short sides is recessed toward the other short side to form a groove, an area of the display module within the groove is the non-display area, an area of the display module outside the groove is the display area, and the cover plate is provided with the receiving window.

16. The electronic device of claim 15, wherein the electronic component is disposed proximate a corner of the recess of the screen component.

17. An electronic device is characterized by comprising a flexible circuit board, a receiver, a sensor and a display screen; the flexible circuit board at least partially covers and is in sealing connection with the vibration part of the receiver to form a vibration cavity, and the receiver and the sensor are stacked along the thickness direction of the display screen; a groove is formed in one edge of the display screen, the groove is used for arranging the sensor and the receiver, and at least part of the display area of the display screen is overlapped with the receiver.

18. The electronic device of claim 17, wherein the flexible circuit board is electrically connected to the sensor, and the receiver and the sensor are disposed on two sides of the flexible circuit board, respectively.

19. The electronic device of claim 18, wherein the area of orthographic projection of the sensor on the flexible circuit board is located in the area of orthographic projection of the receiver on the flexible circuit board.