WO2019129192A1

WO2019129192A1 - Electronic device

Info

Publication number: WO2019129192A1
Application number: PCT/CN2018/124793
Authority: WO
Inventors: 王小兵
Original assignee: Oppo广东移动通信有限公司
Priority date: 2017-12-29
Filing date: 2018-12-28
Publication date: 2019-07-04

Abstract

The embodiments of the present application provide an electronic device, comprising a display module, an electronic assembly, and a camera module, the display module comprising a non-display area. At least part of the area of the orthographic projection of the electronic assembly on the display module overlaps with the non-display area. The electronic assembly comprises a sensor, a flexible circuit board and a receiver, the flexible circuit board comprising a first face and a second face facing away from one another, the sensor being arranged on the first face of the flexible circuit board, the sensor being electrically connected to the flexible circuit board, the receiver being arranged on the second face of the flexible circuit board. The camera module and the electronic assembly are arranged in parallel to each other, and at least part of the area of the orthographic projection of the camera module on the display module overlaps with the non-display area. The invention causes a sensor, a flexible circuit board and a receiver to be a stacked electronic assembly in the electronic device provided by the embodiments of the present application, reducing the size of the electronic assembly and the electronic device in an x direction.

Description

Electronic equipment

Technical field

The present application relates to the field of electronic devices, and in particular, to an electronic device.

Background technique

With the development of electronic device technology, the demand for thin and light mobile phones is increasing. In the prior art, in order to realize more and more functions in electronic devices such as mobile phones, more and more devices are integrated in the mobile phone, and the positional relationship between the devices is more and more complicated, and the influence on the thin and light of the mobile phone is also increasing. Large, not conducive to the design of the phone.

Summary of the invention

The application provides an electronic device.

The embodiment of the present application provides an electronic device, including a display module, an electronic component, and a camera module, the display module having a non-display area; and at least a portion of the orthographic projection of the electronic component on the display module The area overlaps the non-display area, the electronic component includes a sensor, a flexible circuit board and a receiver, the flexible circuit board includes a first side and a second side disposed opposite each other, and the sensor is disposed on the flexible circuit a first surface of the board, and the sensor is electrically connected to the flexible circuit board, the receiver is disposed on a second side of the flexible circuit board, and the sound channel of the receiver passes over or passes through the flexible circuit board Connected to the outside; the camera module is disposed side by side with the electronic component, and at least a portion of the orthographic projection area of the camera module on the display module overlaps with the non-display area.

On the other hand, an embodiment of the present application further provides an electronic device, including a receiver, a sensor, a camera module disposed alongside the receiver, and a display screen; the thickness of the receiver and the sensor along the display screen Stacking in a direction; an edge of the display screen is provided with a groove for setting the sensor, the receiver and the camera module, and at least part of the display area of the display screen The receivers overlap.

In another aspect, an embodiment of the present application further provides an electronic device, including a display module, an electronic component, and a camera module, the display module having a non-display area; at least part of the electronic component being aligned with the non-display a display area, the electronic component includes a sensor, a flexible circuit board and a receiver arranged in a stack; the camera module is disposed side by side with the electronic component, and at least a portion of the camera module is aligned with the non-display area.

DRAWINGS

In order to more clearly illustrate the technical solutions of the present application, the drawings to be used in the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the present application, which are common in the art. For the skilled person, other drawings can be obtained as shown in these drawings without any creative work.

1 is a schematic diagram of an electronic device according to Embodiment 1 of the present application;

2 is a schematic diagram of a display module of the electronic device shown in FIG. 1;

3 is a schematic view of a screen assembly of the display module of FIG. 2;

4 is a schematic diagram of another screen assembly of a display module in other embodiments;

Figure 5 is a schematic illustration of the electronic components of the electronic device shown in Figure 1;

Figure 6 is a schematic view of an electronic component shown in Figure 5;

Figure 7 is a cross-sectional view of the electronic component shown in Figure 6 taken along line A-A;

Figure 8 is a schematic view of another perspective of the electronic component shown in Figure 6;

9 is a schematic diagram of a camera module and an electronic component in other embodiments;

Figure 10 is a schematic view of a camera module;

Figure 11 is a schematic illustration of another electronic component shown in Figure 8;

Figure 12 is a cross-sectional view of a sealing member of the electronic component shown in Figure 11 taken along line A-A;

Figure 13 is a cross-sectional view of another seal member of the electronic component shown in Figure 11 taken along line A-A;

Figure 14 is a schematic view showing the relative relationship between the sensor and the receiver of the electronic component shown in Figure 5;

15 is a schematic diagram showing another relative relationship between a sensor and a receiver of an electronic component in other embodiments;

16 is a schematic diagram showing still another relative relationship between a sensor and a receiver of an electronic component in other embodiments;

17 is a schematic view showing a relative relationship between a receiving hole and a vibrating portion of the electronic component shown in FIG. 5;

18 is a schematic view showing another relative relationship between a receiving hole and a vibrating portion of an electronic component in another embodiment;

19 is a schematic view showing a non-side-by-side arrangement of a sensor and a receiver of an electronic component in other embodiments;

20 is a schematic diagram of still another screen assembly of the display module in other embodiments;

21 is a schematic view showing the electronic components in other embodiments all located in the grooves of the screen assembly;

FIG. 22 is a schematic diagram of another electronic device according to Embodiment 2 of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described in the following with reference to the accompanying drawings in the embodiments of the present application.

The above described objects, features and advantages of the present application will be more clearly understood from the following description in conjunction with the appended claims. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments of the present application may be combined with each other.

Embodiment 1

Please refer to FIG. 1 , which is a schematic diagram of a first perspective of the electronic device 100 . The electronic device 100 includes a display module 2, an electronic component 1 and a camera module 3. The electronic component 1 is housed inside the electronic device 100 for implementing functions such as receiving the electronic device 100. The electronic device 100 can be any device having an electronic component, such as a smart device such as a tablet computer, a mobile phone, a camera, a personal computer, a notebook computer, an in-vehicle device, or a wearable device. For convenience of description, the electronic device 100 is defined with reference to the first viewing angle. The width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device 100 is defined as Z. to.

Referring to FIG. 1 , the embodiment provides an electronic device, including a display module 2 , an electronic component 1 , and a camera module 3 . The display module 2 has a non-display area Z2 ; at least part of the electronic component 1 is The area of the orthographic projection on the display module 2 overlaps with the non-display area Z2. The electronic component 1 includes a sensor 11, a flexible circuit board 12 and a receiver 13, and the flexible circuit board 12 includes a first surface disposed opposite to each other. 121 and the second surface 122, the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12, and the receiver 13 is disposed on the flexible circuit board 12. On the second side 122, the sound channel 131 of the receiver 13 passes over or through the flexible circuit board 12 to the outside; the camera module 3 is disposed side by side with the electronic component 1, and at least part of the camera module The area of the group 3 that is orthographically projected on the display module 2 overlaps with the non-display area Z2. In this embodiment, the display module 2 in the electronic device 100 has a non-display area Z2, the non-display area Z2 opens a receiving window 21a and an imaging hole 21b, and the electronic component 1 is disposed in the non-display area. On the Z2, the sound channel 131 of the electronic component 1 is connected to the receiving window 21a, and the camera hole 21b is used to align the camera module 3 so that the light passes through the camera hole 21b and reaches the camera module 3. .

In other words, the electronic device 100 includes a display module 2, an electronic component 1 and a camera module 3, the display module 2 has a non-display area Z2; at least part of the electronic component 1 is aligned with the non-display area Z2. The electronic component 1 includes a sensor 11 , a flexible circuit board 12 and a receiver 13 arranged in a stack; the camera module 3 is arranged side by side with the electronic component 1 , and at least part of the camera module 3 is aligned with the non- Display area Z2.

Referring to FIG. 1, the receiving window 21a and the imaging hole 21b are independently provided. Of course, in other embodiments, the receiving window 21a and the imaging hole 21b may also be combined with one hole.

In an embodiment, referring to FIG. 2 and FIG. 3 together, the display module 2 includes a cover plate 21 and a screen assembly 22 which are sequentially connected and connected. The display module 2 is covered with the housing of the electronic device 100 to form a closed cavity of the electronic device 100. The electronic component 1 and the camera module 3 are all accommodated in the inner cavity. The non-display area Z2 is an area in the electronic device 100 that is not used to display an electronic image.

In an embodiment, referring to FIG. 1 and FIG. 3, an edge of the display module 2 defines a recess 22a to form a non-display area Z2, and the display module 2 is outside the non-display area Z2. Display area Z1.

As shown in FIGS. 1 and 3, the display module 2 formed by the cover 21 and the panel assembly 22 is a display area Z1 in the area other than the recess 22a. The groove 22a is opened at an intermediate position of one short side of the screen assembly 22. A receiving window 21a corresponding to the sound passage 131 is opened in the cover plate 21. An imaging hole 21b corresponding to the camera module 3 is opened on the cover plate 21. Of course, in other embodiments, as shown in FIG. 17, the recess 22a may also be located at other corners of the screen assembly 22 or the like.

Please refer to FIG. 5 together. FIG. 5 is a schematic diagram of the electronic component 1 of the electronic device 100 shown in FIG. The electronic component 1 includes a sensor 11, a flexible circuit board 12, and a receiver 13. The sensor 11, the flexible circuit board 12, and the receiver 13 are stacked, and when the electronic component 1 of the structure is disposed in the electronic device 100, the sensor 11, the flexible circuit board 12, and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, saving The size of the electronic component 1 and the electronic device 100 in the X direction.

Referring to FIG. 3, at least a portion of the orthographic projection of the electronic component 1 on the display module 2 overlaps with the non-display area Z2, that is, the electronic component 1 is disposed on the display module 2 . Further, the receiver 13 in the electronic component 1 is at least partially aligned with the non-display area Z2. The portion of the receiver 13 is aligned with the non-display area Z2, which further reduces the size of the non-display area Z2 in the Y direction, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 is further increased.

In one embodiment, as shown in FIG. 5, the flexible circuit board 12 includes a first face 121 and a second face 122 disposed opposite each other. The flexible circuit board 12 is for electrical connection with the sensor 11, which in turn is electrically coupled to a circuit board in the electronic device 100 to transmit electrical signals on the sensor 11 to a circuit board in the electronic device 100.

Referring to FIG. 5 and FIG. 6 together, the first surface 121 and the second surface 122 of the flexible circuit board 12 are respectively opposite surface surfaces of the flexible circuit board 12, and the board surface area is large, and can carry components. Correspondingly, the edges of the board surface of the flexible circuit board 12 are respectively a first side S1 and a second side S2 disposed opposite each other, and a third side S3 and a fourth side S4 disposed opposite to each other, the third side S3 and The fourth side S4 is respectively connected between the first side S1 and the second side S2, and the second side S2 extends in a direction away from the first side S1 to make the flexible circuit The board 12 is electrically connected to the board. That is, the flexible circuit board 12 is substantially long rectangular. The first side S1 and the second side S2 are shorter sides of the flexible circuit board 12 than the third side S3 and the fourth side S4. That is, when the flexible circuit board 12 is disposed in the electronic device 100, it is arranged substantially in an elongated shape along the Y direction of the electronic device 100 so as to be extended to be electrically connected to the circuit board.

In one embodiment, as shown in FIG. 5, the sensor 11 is disposed on the first side 121 of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12.

It will be appreciated that the sensor 11 comprises at least one of a distance sensor, a light sensor or a photoelectric sensor. In this embodiment, the sensor 11 is a light sensor. The light sensor is disposed proximate to the screen of the electronic device 100 to facilitate adjusting the brightness of the screen of the electronic device 100 according to the light of the environment in which the electronic device 100 is located. The medium sensed by the light sensor 11 is light, and the electronic device 100 does not need to be specially drilled or provided with a special structure to pass the light, and the sensor 11 in the electronic component 1 is set as the light sensor 11 together with the receiver 13 in the Z direction. Stacking further optimizes the structure of the electronic device 100 to facilitate the direction of the X-direction of the electronic device 100.

In an embodiment, referring to FIG. 5, the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12. Referring to FIG. 6 or FIG. 7, the sound channel 131 of the receiver 13 passes over or through the flexible circuit board 12 to the outside, so that after the receiver 13 converts the audio signal into a sound signal, the sound signal can pass through The sound channel 131 is propagated to the outside.

As shown in FIG. 8, the receiver 13 is substantially rectangular, and the intermediate portion of the receiver 13 is the vibrating portion 132. The vibrating portion 132 is generally hermetically connected to other members or structural members to form a vibrating cavity, and the vibration in the vibrating portion 132 can be propagated by opening on the member or the structural member. The sound channel 131 of the receiver 13 refers to a channel through which the sound signal in the receiver 13 propagates, corresponding to the structure being the passage between the vibrating portion 132 and the opening of the component or the structural member. After the receiver 13 receives the audio signal, the sealed vibration chamber vibrates with the sound signal passing through the opening in the component or structural member.

In an embodiment, as shown in FIGS. 6 to 8, the member sealingly connecting the vibrating portion 132 of the receiver 13 may be a flexible circuit board 12, that is, a carrier that stacks the sensor 11 and the receiver 13 together. As a part of the sound channel 131 of the receiver 13, the device components of the electronic component 1 are reduced, the thickness of the electronic component 1 in the Z of the electronic device 100 is saved, and the electronic components are further optimized.

Referring to FIG. 7 , the flexible circuit board 12 covers and hermetically connects the receiver 13 , and the flexible circuit board 12 defines a receiving hole 123 to enable the vibrating portion 132 of the receiver 13 to the flexible circuit board 12 . The passage between the receiving holes 123 forms the sound passage 131.

Referring to FIG. 7, since the receiving hole 123 opens the flexible circuit board 12, the passage between the vibrating portion 132 of the receiver 13 and the receiving hole 123 of the flexible circuit board 12 forms a sound passage 131, so that the sound passage 131 of the receiver 13 passes. Flexible circuit board 12.

The receiving hole 123 has an elongated shape and is approximately 1/2 times larger than the received window 21a. The portion of the cover plate 21 corresponding to the recess 22a can be printed to form a non-display area Z2 of the display module 2. Since the sensor 11, the flexible circuit board 12, and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, the size of the recess 22a in the X direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 can be increased. Of course, in other embodiments, the ratio of the length of the received window to the length of the received hole along the short side direction is 3:1 or 4:1.

The area of the second surface 122 of the flexible circuit board 12 is slightly larger than the area of the receiver 13, that is, the excess space of the electronic device 100 is not occupied by the excessive size of the flexible circuit board 12, and the receiver 13 can also be disposed in the flexible state. When the second side 122 of the circuit board 12 is on, the area of the receiver 13 on the flexible circuit board 12 is located in the area occupied by the second side 122 of the flexible circuit board 12, that is, the flexible circuit board 12 entirely covers the receiver 13. . Of course, in other embodiments, the size of the flexible circuit board 12 can also be much larger than the area of the receiver 13.

Referring to FIG. 7, the flexible circuit board 12 and the receiver 13 are bonded by the foam 14 so that the receiver 13 is sealed by the flexible circuit board 12 to facilitate the formation of the sound channel 131 of the receiver 13. Specifically, referring to FIG. 8 , the foam 14 has a hollow annular shape and is disposed between the second surface 122 of the flexible circuit board 12 and the receiver 13 , and the foam 14 is just around the edge of the vibrating portion 132 of the receiver 13 . After the flexible circuit board 12 is sealed and connected to the receiver 13, the cavity formed between the vibrating portion 132 of the receiver 13 and the flexible circuit board 12 is a part of the sound channel 131 of the receiver 13, and the sound signal of the receiver 13 is transmitted for convenience. To the outside, a receiving hole 123 is opened in the flexible circuit board 12, and the receiving hole 123 communicates with a cavity formed between the vibrating portion 132 of the receiver 13 and the flexible circuit board 12 to form a sound passage 131. Of course, in other embodiments, the flexible circuit board 12 and the receiver 13 can also be sealed by various means such as welding or gluing.

After the receiver 13 receives the audio signal, the vibrating portion 132 of the receiver 13 vibrates to form a sound signal, and the sound signal is transmitted from the vibrating chamber to the receiving hole 123, and the speech hole 123 is transmitted to the outside to realize the receiving function of the receiver 13.

Referring to FIG. 2, the receiving hole 123 and the sensor 11 in the electronic component 1 are aligned with the non-display area Z2 of the display module 2, so that the sound signal in the receiver 13 can be transmitted to the receiving window 21a through the receiving hole 123. In order to enable the user to listen to the sound signal through the receiving window 21a, and the sensor 11 is aligned with the display module 2, the sensor 11 can also be enabled to receive external light for operation.

In an embodiment, referring to FIG. 2 and FIG. 3 , the camera module 3 is arranged side by side with the electronic component 1 , and at least part of the orthographic projection of the camera module 3 on the display module 2 The area overlaps with the non-display area Z2. The camera module 3 is a front camera for the user to take a picture and take a self-photograph toward the front of the electronic device 1. Of course, in other embodiments, the camera module 3 can also be an infrared camera, a vein camera, or the like.

It can be understood that, referring to FIG. 2 and FIG. 3, the camera module 3 and the electronic component 1 are arranged side by side along the short side direction of the screen assembly 22. That is, the camera module 3 and the electronic component 1 are disposed along the X direction of the electronic device 100. Since the electronic component 1 is in a stacked structure, the electronic component 1 and the camera module 3 are arranged side by side in the electronic device 100, which can effectively reduce the X-direction dimension of the electronic component 1 and the camera module 3 in the electronic device 100, and improve the screen component. 22 screen ratio. Of course, in other embodiments, the camera module 3 can also be disposed along the Y direction of the electronic device 100 in the electronic component 1 .

In an embodiment, referring to FIG. 3 , the camera module 3 is disposed on one side of the flexible circuit board 12 . That is, the camera module 3 is directly connected to the fourth side S4 of the flexible circuit board 12, further reducing the size of the camera module 3 and the electronic component 1 arranged side by side, and further reducing the X of the camera module 3 and the electronic component 1 in the electronic device 100. The size of the direction. Of course, in other embodiments, as shown in FIG. 9 , the camera module 3 can also be spaced apart from the flexible circuit board 12 .

Optionally, referring to FIG. 3 and FIG. 10 , the camera module 3 is recessed with a connecting slot 31 , and one side of the flexible circuit board 12 is embedded in the connecting slot 31 of the camera module 3 . Specifically, the camera module 3 has an imaging housing. The imaging housing is adjacent to a side of the fourth side S4 of the flexible circuit board 12 with a connecting groove 31 smaller than the size of the flexible circuit board 12, thus ensuring the flexible circuit board. 12 can be embedded in the connection groove 31. The connection structure of the camera module 3 and the flexible circuit board 12 splices the camera module 3 and the flexible circuit board 12 into one unit. When the two are mounted in the electronic device 100, the two can be assembled first and then corresponding. It is disposed in the electronic device 100 to facilitate assembly. Of course, in other embodiments, the camera module 3 can also be bonded or fastened to one side of the flexible circuit board 12.

The assembly of the camera module 3, the electronic component 1 and the display module 2 is as follows: the electronic component 1 is laminated on the display module 2, and the fourth side S4 of the flexible circuit board 12 is embedded in the camera module 3. In the connecting slot 31, the electronic component 1 and the camera module 3 are integrated into one body, and the first surface 121 of the camera module 3 and the flexible circuit board 12 faces the screen component 22 to make the camera module 3 and the receiving hole 123 and sensor 11 are aligned with the non-display area Z2 to enable the user to listen to the sound signal through the receiving window 21a, so that the sensor 11 can receive external light to operate, so that the camera module 3 can acquire the external from the imaging hole 21b. The light is imaged so that the sound signal in the receiver 13 can be transmitted to the receiving window 21a through the receiving hole 123.

Of course, in other embodiments, referring to FIG. 11, the component that seals the vibrating portion 132 of the connection receiver 13 may also be a sealing member 15, 15'. The specific structure is that the flexible circuit board 12 partially covers and seals the connection. The receiver 13, the electronic component 1 further includes a sealing member 15, 15' spliced with the flexible circuit board 12, the sealing member 15, 15' covering and sealingly connecting to the remaining portion of the receiver 13, The sealing member 15, 15' opens the receiving hole 123 so that the passage between the vibrating portion 132 of the receiver 13 to the receiving hole 123 of the sealing member 15, 15' forms the sound passage 131.

Since the receiving hole 123 is disposed on the sealing member 15, 15', that is, the sound signal of the receiver 13 is propagated to the outside through the receiving hole 123 of the sealing member 15, 15', that is, the sound passage 131 of the receiver 13 bypasses the flexible circuit board. 12.

The structure of the seals 15, 15' is more practical and does not rely excessively on the structure of the flexible circuit board 12 to carry and seal the receiver 13, further optimizing the structure of the functional components.

The size of the flexible circuit board 12 is substantially the same as the size of the sensor 11, that is, the excessive space of the flexible circuit board 12 does not occupy too much space in the electronic device 100, and the sensor 11 can be preferably carried on the flexible circuit. The flexible circuit board 12 is entirely covered on the board 12, i.e., the flexible circuit board 12.

Among them, the sealing members 15, 15' are substantially rectangular foams. The size of the seals 15, 15' spliced with the flexible circuit board 12 is substantially the same as the size of the receiver 13. Of course, in other embodiments, the seals 15, 15' may also be reinforcing plates of materials such as metal or plastic.

After the sealing member 15, 15' is sealed and connected to the receiver 13, the cavity formed by the vibrating portion 132 of the receiver 13 and the structure of the flexible circuit board 12 and the sealing members 15, 15' is the sound channel of the receiver 13. A part of 131, in order to facilitate the transmission of the sound signal of the receiver 13 to the outside, a receiving hole 123 is formed in the sealing member 15, 15', and the receiving hole 123 communicates with the vibrating portion 132 of the receiver 13, and the flexible circuit board 12 and A cavity formed between the structures in which the seals 15, 15' are spliced to form a sound passage 131.

The structure in which the sealing member 15 is spliced with the flexible circuit board 12 is as follows:

It can be understood that referring to FIG. 12, FIG. 12 is a cross-sectional view of the sealing member 15 of FIG. 11 taken along line A-A. The sealing member 15 has a structure in which the sealing member 15 has a first sealing portion 151 and a second sealing portion 152 which are sequentially connected, and the first sealing portion 151 is fixedly connected with the flexible circuit board 12 so that The flexible circuit board 12 is partially covered by the first sealing portion 151 and is sealingly connected to the receiver 13, and the second sealing portion 152 covers and seals the remaining portion with the receiver 13.

Wherein, the first sealing portion 151 and the second sealing portion 152 of the sealing member 15 are vertically connected, and the sealing member 15 has a substantially L-shaped cross section, so that when the second sealing portion 152 is fixedly connected with the flexible circuit board 12, the first sealing portion The 151 is on the same plane as the flexible circuit board 12. Since the sealing member 15 is a foam, the sealed connection between the flexible circuit board 12 and the receiver 13 is directly sealed by the second sealing portion 152 of the sealing member 15, and the structure of the electronic component 1 is optimized.

The first sealing portion 151 and the remaining portion of the receiver 13 are used to realize the sealed connection of the receiver 13 by the sealing member 15 and the flexible circuit board 12. The first sealing portion 151 defines a receiving hole 123.

It is to be understood that in other embodiments, reference is made to Figure 13, which is a cross-sectional view of another seal 15' of Figure 11 taken along line A-A. Another structure of the sealing member 15 is specifically that the sealing member 15 is adhered to the side of the flexible circuit board 12 to splicing the sealing member 15 with the flexible circuit board 12.

Among them, the sealing member 15 has a flat plate shape. The sealing member 15 is directly attached to the side (the third side S3) of the flexible circuit board 12 near a side of the flexible circuit board 12. The connection between the flexible circuit board 12 and the receiver 13 needs to be further provided with foam, and the sealing member 15 is foamed, and directly bonded to the receiver 13 to realize the vibrating portion 132 of the receiver 13 and the flexible circuit board 12 and The cavity formed between the structures in which the seals 15 are formed is a part of the sound passage 131 of the receiver 13.

The electronic component 1 and the electronic device 100 provided by the embodiments of the present application are arranged in the electronic component 1 in which the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked, and the camera module 3 is arranged side by side with the electronic component 1 of the structure in the electronic device. In the case of 100, the sensor 11, the flexible circuit board 12, and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, saving the size of the electronic component 1 and the electronic device 100 in the X direction.

Further, referring to FIG. 14, the area D1 of the orthographic projection of the sensor 11 on the flexible circuit board 12 is located in the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12. The sensor 11 and the receiver 13 overlap in the Z direction, reducing the size of the carrier (such as the flexible circuit board 12, or the spliced structure in which the flexible circuit board 12 and the sealing member 15 are combined) carried between the sensor 11 and the receiver 13. When the electronic component 1 is assembled in the circuit board, the size of the electronic component 1 in the X direction is saved, and the structure of the electronic device 100 is further optimized. Of course, in other embodiments, as shown in FIG. 15, the area of the orthographic projection of the sensor 11 and the receiver 13 on the flexible circuit board 12 may also partially overlap, that is, the orthographic projection of the sensor 11 on the flexible circuit board 12. The area D1 partially overlaps the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12; or as shown in FIG. 16, the area of the sensor 11 on the flexible circuit board 12 is an orthographic projection D1 The area D2 of the orthographic projection of the receiver 13 on the flexible circuit board 12 is shifted from each other, and the like.

It can be understood that, referring to FIG. 15, the sensor 11 is disposed near the junction of the first side S1 and the third side S3 of the flexible circuit board 12. The sensor 11 is disposed at a corner of the flexible circuit board 12 and is far from the junction of the flexible circuit board 12 and the circuit board, so that when the electronic component 1 is disposed on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing The size of the non-display area of the electronic device 100.

It can be understood that, referring to FIG. 17, the sound channel 131 and the sensor 11 are arranged side by side along the direction of the third side S3 to the fourth side S4.

Here, as shown in FIG. 17, the area of the orthographic projection of the receiving hole 123 on the receiver 13 is located in a range in which the vibrating portion 132 of the upper portion of the receiver 13 is located. That is, the receiving hole 123 is aligned with the vibrating portion 132 of the upper portion of the receiver 13. That is, the size of the receiving hole 123 is smaller than the size of the vibrating portion 132 of the receiver 13. Correspondingly, the area D3 of the orthographic projection 123 on the flexible circuit board 12 is located in the orthographic projection area D4 of the vibrating portion 132 of the receiver 13 on the flexible circuit board 12. The sound guiding structure can be additionally covered on the receiving hole 123 to ensure the sound output of the receiver 13. That is, the area D3 of the orthographic projection of the receiving hole 123 on the flexible circuit board 12 is located in the area D4 of the orthographic projection of the vibrating portion 132 of the receiver 13 of the flexible circuit board 12. The receiving hole 123 is close to the corners of the first side S1 and the fourth side S4, and the side arrangement of the sound channel 131 and the sensor 11 is realized. The receiving hole 123 is arranged side by side with the sensor 11, which can reduce the demand for the non-display area of the electronic device 100 and increase the screen ratio of the electronic device 100. Of course, in other embodiments, referring to FIG. 18, the size of the receiving hole 123 may also be half of the vibrating portion 132 of the receiver 13, or, referring to FIG. 19, the receiving hole 123 is disposed in a different row from the sensor 11.

Further, at least part of the orthographic projection area of the sensor 11 on the display module 2 is located in the non-display area Z2.

Part of the structure of the receiver 13 and the sensor 11 is located in the recess 22a, and the range of the orthographic projection of the remaining structure of the receiver 13 and the sensor 11 on the display module 2 is within the range of the display area Z1 of the display module 2, further The size of the non-display area Z2 in the Y direction is reduced, that is, the size of the display area Z1 can be increased, and the screen ratio of the electronic device 100 is further increased. Of course, in other embodiments, referring to FIG. 19, the entire electronic component 1 can be located in the recess 22a.

It can be understood that, as shown in FIG. 20, the electronic component 1 is located at the corner of the recess 22a to facilitate the further arrangement of other components such as the camera module 3 and the like in the X direction of the recess 22a. Of course, in other embodiments, as shown in FIG. 21, the electronic component 1 may also be located at an intermediate position of the recess 22a, and other components are respectively located at two sides of the electronic component 1.

When the electronic device 100 provided by the embodiment of the present application is assembled, the sensor 11 is first disposed on the flexible circuit board 12 and electrically connected to the flexible circuit board 12, and then the receiver 13 and the sensor 11 are disposed on the flexible circuit board 12 opposite to each other. The electronic component 1 is formed; the fourth side S4 of the flexible circuit board 12 is embedded in the connecting slot 31 of the camera module 3, so that the electronic component 1 and the camera module 3 are integrated into one body, and the camera module 3 and the flexible module The first surface 121 of the circuit board 12 faces the screen assembly 22, and the electronic component 1 is abutted against the display module 2 for assembly, so that the receiving hole 123 of the electronic component 1 is aligned with the receiving window 21a on the cover 21. The camera module 3 is aligned with the imaging hole 21b on the cover 21, and part of the structure of the camera module 3, the receiver 13 and the sensor 11 is located in the recess 22a, and the remaining structures of the camera module 3, the receiver 13 and the sensor 11 are displayed. The range of orthographic projections on the module 2 is within the range of the display area Z1 of the display module 2.

Embodiment 2

Referring to FIG. 22, the electronic device 200 provided in the second embodiment of the present application is substantially the same as the electronic device 100 provided in the first embodiment of the present application, except that the electronic device 200 is different. a camera module 3' including a receiver 13', a sensor 11' arranged side by side with the receiver 13, and a display screen 22'; the receiver 13' and the sensor 11' along the thickness direction of the display screen 22' Stacking; an edge of the display screen 22' is provided with a recess 22a' for setting the sensor 11', the receiver 13' and the camera module 3, and At least a portion of the display area Z1' of the display screen 22' overlaps the receiver 13'.

By stacking the receiver 13' with the sensor 11', the size of the mobile terminal 200 in the Z direction is reduced, and in addition, the receiver 13' is partially aligned with the non-display area Z2, further reducing the size of the non-display area Z2' in the Y direction, ie The size of the display area Z1' can be increased to further increase the screen ratio of the electronic device 200.

In an embodiment, referring to FIG. 22, an edge of the display screen 22' defines a recess 22a' to form a non-display area Z2', and an area of the display 22' outside the non-display area Z2' is a display area. Z1', the receiver 13' and the sensor 11' are disposed on the display screen 22', and the receiver 13' is at least partially aligned with the non-display area Z2', that is, the receiver 13' At least a portion of the orthographic projection area on display screen 22' is located in said non-display area Z2.

Further, at least a portion of the orthographic projection area of the sensor 11' on the display screen 22' is located in the non-display area Z2'.

It can be understood that, as shown in Fig. 22, the receiver 13' and the sensor 11' are located at the corners of the recess 22a' to facilitate the further arrangement of other components such as the camera module 3 and the like in the X direction of the recess 22a.

Further, the electronic device 200 further includes a flexible circuit board 12, the flexible circuit board 12' is electrically connected to the sensor 11', and the receiver 13' and the sensor 11' are respectively disposed on the flexible Both sides of the circuit board 12'.

It will be appreciated that the area of the orthographic projection of the sensor 11' on the flexible circuit board 12' is located in the area of the orthographic projection of the receiver 13' on the flexible circuit board 12'.

For a specific connection relationship and positional relationship between the display screen 22', the flexible circuit board 12' and the receiver 13', refer to the detailed description in the electronic device 100 provided in the implementation of the present invention, and details are not described herein again.

The electronic device 200 provided by the embodiment of the present application reduces the size of the mobile terminal 200 in the Z direction by stacking the receiver 13' and the sensor 11'. In addition, the receiver 13' is partially aligned with the non-display area Z2, thereby further reducing the non-display area. The size of Z2' in the Y direction, that is, the size of the display area Z1' can be increased, further increasing the screen ratio of the electronic device 200.

The above is a preferred embodiment of the present application, and it should be noted that those skilled in the art can also make several improvements and retouchings without departing from the principles of the present application. These improvements and retouchings are also considered as The scope of protection for the application.

Claims

An electronic device, comprising: a display module, an electronic component, and a camera module, wherein the display module has a non-display area; at least a portion of the orthographic projection area of the electronic component on the display module Overlapped with the non-display area, the electronic component includes a sensor, a flexible circuit board, and a receiver, the flexible circuit board includes a first side and a second side disposed opposite to each other, and the sensor is disposed on the flexible circuit board a first surface, and the sensor is electrically connected to the flexible circuit board, the receiver is disposed on the second surface of the flexible circuit board, and the sound channel of the receiver passes over or passes through the flexible circuit board to Externally; the camera module is disposed side by side with the electronic component, and at least a portion of the orthographic projection area of the camera module on the display module overlaps with the non-display area.
The electronic device according to claim 1, wherein the display module further has a display area, the display area surrounding the non-display area.
The electronic device according to claim 2, wherein the display module comprises a cover plate and a screen assembly which are sequentially connected in a stack, the screen assembly has two short sides disposed opposite each other, and two oppositely disposed a long side of the strip, wherein the two long sides are respectively connected between the two short sides, and one of the short sides is recessed toward the other short side to form a groove, and the display module is The area inside the groove is the non-display area, the area of the display module outside the groove is the display area, the cover plate opens the receiving window, and the receiving window communicates with the The sound channel of the receiver.
The electronic device according to claim 3, wherein the camera module and the electronic component are arranged side by side along a short side direction of the screen assembly.
The electronic device according to claim 4, wherein the camera module is disposed on one side of the flexible circuit board.
The electronic device according to claim 5, wherein the camera module is recessed with a connecting slot, and one side of the flexible circuit board is embedded in a connecting slot of the camera module; or The camera module is bonded to one side of the flexible circuit board.
The electronic device according to any one of claims 1 to 6, wherein an area of the sensor projected onto the flexible circuit board is located in an orthographic projection area of the receiver on the flexible circuit board. in.
The electronic device according to claim 7, wherein the flexible circuit board comprises two opposite sides, a first side and a second side, and two opposite sides, a third side and a fourth side, The third side and the fourth side are respectively connected between the first side and the second side, and the second side extends in a direction away from the first side to make the flexible circuit The board is electrically connected to the circuit board, the sensor being disposed adjacent to a junction of the first side of the flexible circuit board and the third side.
The electronic device according to claim 8, wherein the sound channel and the sensor are arranged side by side along a direction from the third side to the fourth side.
The electronic device according to any one of claims 1 to 9, wherein the flexible circuit board partially covers and hermetically connects the receiver, and the electronic component further includes a sealing member spliced with the flexible circuit board. The sealing member covers and is sealingly connected to a remaining portion of the receiver, the sealing member opening a receiving hole to form a passage between the vibrating portion of the receiver to the receiving hole of the sealing member Sound channel.
The electronic device according to claim 10, wherein the sealing member has a first sealing portion and a second sealing portion that are sequentially connected, and the first sealing portion is fixedly coupled to the flexible circuit board to The flexible circuit board is partially covered by the first sealing portion and sealingly connected to the receiver, and the second sealing portion covers and seals the connection with the remaining portion of the receiver.
The electronic device according to claim 11, wherein said sealing member is bonded to a side of said flexible circuit board to splicing said sealing member with said flexible circuit board.
The electronic device according to any one of claims 10 to 12, wherein the sealing member is a foam.
The electronic device according to any one of claims 1 to 9, wherein the flexible circuit board covers and hermetically connects the receiver, and the flexible circuit board opens a receiving hole to make the vibration portion of the receiver A passage between the receiving holes of the flexible circuit board forms the sound channel.
The electronic device according to any one of claims 1 to 14, characterized in that the area of the orthographic projection of the speech hole on the receiver is located in a range overlapping with the vibration portion of the upper portion of the receiver.
The electronic device according to any one of claims 1 to 15, wherein the sensor comprises at least one of a distance sensor, a light sensor or a photoelectric sensor.
The electronic device according to any one of claims 3 to 6, wherein the electronic component is disposed adjacent to a corner of a groove of the screen assembly.
An electronic device, comprising: a receiver, a sensor, a camera module disposed side by side with the receiver, and a display screen; the receiver and the sensor are stacked along a thickness direction of the display screen; the display An edge of the screen is provided with a groove for arranging the sensor, the receiver and the camera module, and at least part of the display area of the display screen overlaps with the receiver.
The electronic device according to claim 18, wherein the electronic device further comprises a flexible circuit board, the flexible circuit board is electrically connected to the sensor, and the receiver and the sensor are respectively disposed on the Both sides of the flexible circuit board.
An electronic device, comprising: a display module, an electronic component, and a camera module, the display module having a non-display area; at least a portion of the electronic component being aligned with the non-display area, the electronic component The invention comprises a sensor, a flexible circuit board and a receiver arranged in a stack; the camera module is arranged side by side with the electronic component, and at least part of the camera module is aligned with the non-display area.