CN108494905B

CN108494905B - Electronic component and electronic device

Info

Publication number: CN108494905B
Application number: CN201810170107.9A
Authority: CN
Inventors: 姚坤
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-02-28
Filing date: 2018-02-28
Publication date: 2021-04-23
Anticipated expiration: 2038-02-28
Also published as: CN108494905A; CN113114806B; CN113114806A

Abstract

The embodiment of the application provides an electronic assembly, including sensor, flexible circuit board, receiver, center and mounting, receiver and sensor set up respectively in flexible circuit board's both sides, and the receiving hole is seted up to flexible circuit board, and flexible circuit board has the receiving hole, and the center has through-hole in first well through-hole and the second, and the mounting sets up between center and flexible circuit board to be fixed in the flexible circuit board on the center, and first well through-hole intercommunication to receiving hole, the sensor is arranged in the second in the through-hole. The electronic component that this application embodiment provided is through setting up the mounting between flexible circuit board and center to on the flexible circuit board that the messenger was provided with sensor and receiver can be fixed in the center through the mounting, the location between flexible circuit board and the center of being convenient for has improved electronic component's assembly efficiency. In addition, the embodiment of the application also provides electronic equipment.

Description

Electronic component and electronic device

Technical Field

The present application relates to the field of electronic devices, and more particularly, to an electronic component and an electronic device.

Background

With the increasing development of electronic device technology, the demand for the mobile phone to be light and thin is higher and higher. In the prior art, in order to realize more and more functions in electronic equipment such as a mobile phone, more and more devices are integrated in the mobile phone, the position relationship among the devices is more and more complex, and the influence on the lightness and thinness of the mobile phone is more and more large, which is not beneficial to the appearance design of the mobile phone.

Disclosure of Invention

The application provides an electronic component and an electronic device.

The embodiment of the application provides an electronic component, including sensor, flexible circuit board, receiver, center and mounting, the receiver with the sensor sets up respectively in flexible circuit board's both sides, flexible circuit board sets up the receiver hole, flexible circuit board has the receiver hole, the center has first well through-hole and second well through-hole, the mounting set up in the center with between the flexible circuit board, in order to incite somebody to action flexible circuit board is fixed in on the center, just first well through-hole intercommunication extremely the receiver hole, the sensor is located in the second well through-hole.

On the other hand, the embodiment of the application also provides electronic equipment which comprises an electronic component.

The electronic component and the electronic equipment provided by the embodiment of the application are provided with the fixing piece between the flexible circuit board and the middle frame, so that the flexible circuit board provided with the sensor and the telephone receiver can be fixed on the middle frame through the fixing piece, the positioning between the flexible circuit board and the middle frame is facilitated, and the assembling efficiency of the electronic component is improved.

Drawings

In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of electronic components of the electronic device shown in FIG. 1 without middle boxes;

FIG. 3 is a cross-sectional view of the electronic assembly shown in FIG. 2 taken along line A-A;

FIG. 4 is a schematic view of the electronic assembly shown in FIG. 1;

FIG. 5 is a cross-sectional view of the electronic assembly shown in FIG. 4 taken along line B-B;

FIG. 6 is a cross-sectional view of the other electronic assembly shown in FIG. 4 taken along line B-B;

FIG. 7 is a cross-sectional view of still another electronic component assembly shown in FIG. 4 taken along line B-B;

FIG. 8 is a schematic diagram of the relative relationship of the sensor and receiver of the electronic assembly shown in FIG. 2;

FIG. 9 is a schematic diagram of another relative relationship of the sensor and receiver of the electronics assembly in other embodiments;

FIG. 10 is a schematic diagram of yet another relative relationship of the sensor and receiver of the electronics assembly in other embodiments;

fig. 11 is a schematic diagram showing the relative relationship between the receiver and the vibrating portion of the electronic assembly shown in fig. 2;

fig. 12 is a schematic view showing another relative relationship between the receiver and the vibrating portion of the electronic component in other embodiments;

FIG. 13 is a schematic diagram of the electronic assembly with the sensor and receiver arranged non-side-by-side in other embodiments;

fig. 14 is a schematic view of a display module of the electronic device shown in fig. 1.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

In addition, the following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be used to practice the present application. Directional phrases used in this application, such as "length," "width," "thickness," and the like, refer only to the orientation of the appended drawings and, therefore, are used in a better and clearer sense to describe and understand the present application and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and, therefore, should not be considered limiting of the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are intended to be inclusive and mean, for example, that they may be fixedly coupled, detachably coupled, or integrally coupled; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The terms described above are meant to be illustrative in the present invention and are understood to be specific to those of ordinary skill in the art.

Referring to fig. 1 and fig. 2, an electronic device 100 according to an embodiment of the present disclosure is provided, where the electronic device 100 includes an electronic component 1. The electronic component 1 is housed inside the electronic apparatus 100, and is used for realizing functions of the electronic apparatus 100 such as receiving a telephone. The electronic device 100 may be any device having electronic components, such as: smart devices such as tablet computers, mobile phones, cameras, personal computers, notebook computers, vehicle-mounted devices, wearable devices, and the like. For convenience of description, the electronic device 100 is defined with reference to the first viewing angle, the width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device is defined as the Z direction.

Referring to fig. 2 and 3, the electronic assembly 1 includes a sensor 11, a flexible circuit board 12, a receiver 13, a middle frame 16 and a fixing element 17, wherein the receiver 13 and the sensor 11 are respectively disposed on two sides of the flexible circuit board 12, the flexible circuit board 12 is provided with a receiver hole 123, the flexible circuit board 12 is provided with the receiver hole 123, the middle frame 16 is provided with a first middle through hole 16a and a second middle through hole 16b, the fixing element 17 is disposed between the middle frame 16 and the flexible circuit board 12 to fix the flexible circuit board 12 on the middle frame 16, the first middle through hole 16a is communicated with the receiver hole 123, and the sensor 11 is disposed in the second middle through hole 16 b.

By arranging the fixing member 17 between the flexible circuit board 12 and the middle frame 16, the flexible circuit board 12 provided with the sensor 11 and the receiver 13 can be fixed on the middle frame 16 through the fixing member 17, so that the positioning between the flexible circuit board 12 and the middle frame 16 is facilitated, and the assembly efficiency of the electronic component 1 is improved.

In one embodiment, as shown in fig. 2 and 3, the flexible circuit board 12 includes a first side 121 and a second side 122 that are opposite to each other. The flexible circuit board 12 is used to electrically connect with the sensor 11, and the flexible circuit board 12 is electrically connected with a circuit board in the electronic device 100 to transmit the electrical signal on the sensor 11 to the circuit board in the electronic device 100.

Referring to fig. 2 and fig. 3, the first surface 121 and the second surface 122 of the flexible circuit board 12 are opposite to each other, and the area of the plate surface is large, so that the flexible circuit board 12 can carry components. Correspondingly, the edges of the board surface of the flexible circuit board 12 are respectively a first side S1 and a second side S2 which are oppositely arranged, and a third side S3 and a fourth side S4 which are oppositely arranged, the third side S3 and the fourth side S4 are respectively connected between the first side S1 and the second side S2, and the second side S2 extends in a direction away from the first side S1, so that the flexible circuit board 12 is electrically connected with the circuit board. That is, the flexible circuit board 12 has a substantially long rectangular shape. The first side S1 and the second side S2 are shorter sides of the flexible circuit board 12 than the third side S3 and the fourth side S4. That is, when the flexible circuit board 12 is disposed in the electronic device 100, the flexible circuit board is arranged in a substantially elongated shape along the Y-direction of the electronic device 100 so as to extend to be electrically connected to the circuit board.

In one embodiment, as shown in fig. 2, the sensor 11 is disposed on the first surface 121 of the flexible circuit board 12, and the sensor 11 is electrically connected to the flexible circuit board 12.

It is understood that, referring to fig. 3, the sensor 11 includes at least one of a distance sensor, a light sensor or a photoelectric sensor. In this embodiment, the sensor 11 is a light sensor 11. The light sensor 11 is disposed near a screen of the electronic device 100 so as to adjust brightness of the screen of the electronic device 100 according to light of an environment in which the electronic device 100 is located. The medium sensed by the light sensor 11 is light, the electronic device 100 does not need to specially drill holes or arrange a special structure to pass through the light, the sensor 11 in the electronic component 1 is arranged as the light sensor 11, and is stacked in the Z direction together with the receiver 13, so that the structure of the electronic device 100 is further optimized, and the direction of the electronic device 100 in the X direction is facilitated.

As shown in fig. 3, the receiver 13 is substantially rectangular, and the middle region of the receiver 13 is a vibrating portion 132. The vibrating portion 132 is typically hermetically sealed to other components or structures to form a vibrating chamber, and vibrations in the vibrating portion 132 can be transmitted through an opening in the component or structure. The sound channel 131 of the receiver 13 is actually a channel through which the sound signal in the receiver 13 propagates, and corresponds to a channel between the vibrating portion 132 and the opening of the component or structure. After the receiver 13 receives the audio signal, the sealed vibration cavity vibrates, and the sound signal passes through the opening on the component or the structure.

In an embodiment, as shown in fig. 2 and fig. 3, the component for hermetically connecting the vibration part 132 of the receiver 13 may be a flexible circuit board 12, and the flexible circuit board 12 serves as both a carrier for stacking the sensor 11 and the receiver 13 together and a part of the sound channel 131 of the receiver 13, thereby reducing the component assembly of the electronic component 1, saving the thickness of the electronic component 1 in the Z of the electronic device 100, and further optimizing the electronic components.

Referring to fig. 4, the flexible circuit board 12 covers and hermetically connects the receiver 13, and the flexible circuit board 12 is provided with a receiver hole 123, so that the sound channel 131 is formed by a channel from the vibration part 132 of the receiver 13 to the receiver hole 123 of the flexible circuit board 12.

Referring to fig. 2 and 3, since the receiver 123 is opened on the flexible circuit board 12, the sound channel 131 is formed between the vibration part 132 of the receiver 13 and the receiver 123 of the flexible circuit board 12, and the sound channel 131 of the receiver 13 passes through the flexible circuit board 12.

The area of the second surface 122 of the flexible circuit board 12 is slightly larger than the area of the receiver 13, that is, the receiver 13 does not occupy too much space in the electronic device 100 due to the oversize of the flexible circuit board 12, and when the receiver 13 is disposed on the second surface 122 of the flexible circuit board 12, the orthographic projection area of the receiver 13 on the flexible circuit board 12 is located in the area occupied by the second surface 122 of the flexible circuit board 12, that is, the flexible circuit board 12 entirely covers the receiver 13. Of course, in other embodiments, the size of the flexible circuit board 12 can be much larger than the area of the receiver 13.

When the receiver 13 receives the audio signal, the vibration portion 132 of the receiver 13 vibrates to form an audio signal, and the audio signal is transmitted from the vibration chamber to the receiver 123 and then transmitted to the outside through the receiver 123, thereby realizing the receiving function of the receiver 13.

Referring to fig. 3, the receiver 13 and the flexible circuit board 12 are sealed by the elastic element 14, and the elastic element 14 is sandwiched between the receiver 13 and the flexible circuit board 12 to ensure the sealing between the receiver 13 and the flexible circuit board 12.

Referring to fig. 4 and 5, the middle frame 16 includes a bearing portion 161 and a side portion 162, the bearing portion 161 is provided with a first middle through hole 16a and a second middle through hole 16b, so that when the flexible circuit board 12 is disposed on the bearing portion 161, the first middle through hole 16a can be aligned with the receiver hole 123 to output the sound of the receiver 13, and the second middle through hole 16b can be penetrated by the sensor 11, i.e., the sensor 11 is located in an inner cavity surrounded by a hole wall of the second middle through hole 16b, so that the sensor 11 can sense the external light.

Referring to fig. 5, the supporting portion 161 has a first supporting surface 161a and a second supporting surface 161b opposite to each other, the first supporting surface 161a is opposite to the flexible circuit board 12, and the second supporting surface 161b faces the flexible circuit board 12.

Referring to fig. 5, the side portion 162 is adjacent to the carrying portion 161, so that when the flexible circuit board 12 is disposed on the second carrying surface 161b of the carrying portion 161, the side portion 162 surrounds the flexible circuit board 12.

Referring to fig. 5, a fixing member 17 is disposed between the middle frame and the flexible circuit board 12 to fix the flexible circuit board 12 on the middle frame, the first middle through hole 16a is communicated to the receiver 123, and the sensor 11 is located in the second middle through hole 16 b.

The structure of the fixing member 17 includes, but is not limited to, the following embodiments:

in an embodiment, referring to fig. 5, the fixing member 17 includes a plurality of first fixing grooves 171 and a plurality of first fixing protrusions 172, the plurality of first fixing grooves 171 are disposed on the flexible circuit board 12, the plurality of first fixing protrusions 172 are protruded on the middle frame, and one first fixing protrusion 172 is embedded in one first fixing groove 171.

It is understood that the first fixing groove 171 is disposed near an edge of the flexible circuit board 12.

Specifically, the first fixing groove 171 corresponds to the first fixing protrusion 172. I.e., one first fixing projection 172 is matched with the first fixing groove 171. The number of the first fixing grooves 171 is four, wherein two first fixing grooves 171 are disposed near the third side S3, and the remaining two second fixing grooves 173 are disposed near the fourth side S4. The first fixing recess 171 is located near the edge of the flexible circuit board 12, so as to reduce the influence on the arrangement of other devices on the flexible circuit board 12. The first fixing grooves 171 of the flexible circuit board 12 provided with the receivers 13 and the sensors 11 are respectively embedded on the first fixing protrusions 172 of the bearing part 161 to assemble the flexible circuit board 12 and the middle frame together, and meanwhile, as the flexible circuit board 12 and the middle frame are fixed through the fixing part 17, the receiver holes 123 of the flexible circuit board 12 can be accurately communicated with the first middle through holes 16a, and the sensors 11 are just positioned in the second middle through holes 16b, namely, the positioning function is realized while the sensors are fixed, and the assembly efficiency of the flexible circuit board 12 and the middle frame is further improved.

In another embodiment, referring to fig. 6, the fixing member 18 includes a plurality of first concave holes 181 and first convex points 182, the plurality of first concave holes 181 are disposed on the flexible circuit board 12, the plurality of first convex points 182 are convexly disposed on the surface of the middle frame 16 facing the flexible circuit board 12, and one first convex point 182 is pressed against one first concave hole 181.

Specifically, the first concave hole 181 corresponds to the first convex point 182. The first bump 182 is pressed against the first recess hole 181 to fix and position the middle frame 16 and the flexible circuit board 12.

Further, referring to fig. 7, the fixing member 17 further includes a second fixing groove 173, the second fixing grooves 173 are annularly disposed on the middle frame, an area formed by surrounding the second fixing grooves 173 includes an area formed by surrounding the first fixing protrusions 172, the flexible circuit board 12 further includes a plurality of bending portions 174, and one of the bending portions 174 is embedded in one of the second fixing grooves 173.

It will be appreciated that the side portion 162 defines the second retaining recess 173. The second fixing recess 173 has a groove wall 173a surrounding an inner cavity forming the second fixing recess 173, the groove wall 173a having a slope. In this case, the distance between the groove wall 173a and the side portion 162 decreases gradually toward the closed end, that is, the flexible circuit board 12 can extend into the second fixing groove 173 along the slope of the groove wall 173a, so as to achieve a better fixing effect.

Specifically, the second fixing recess 173 has a groove wall 173a, the groove wall 173a surrounds an inner cavity forming the second fixing recess 173, and the groove wall 173a has a slope.

Correspondingly, the side of the flexible circuit board 12 is bent to form a corresponding protrusion-forming bending portion 174 corresponding to the second fixing recess 173, so as to further fix the flexible circuit board 12 on the middle frame 16.

Further, referring to fig. 8, an orthographic projection area D1 of the sensor 11 on the flexible circuit board 12 is located in an orthographic projection area D2 of the receiver 13 on the flexible circuit board 12. The sensor 11 and the receiver 13 are overlapped in the Z direction, so that the size of the flexible circuit board 12 loaded between the sensor 11 and the receiver 13 is reduced, the size of the electronic component 1 in the X direction is saved when the electronic component 1 is assembled in the circuit board, and the structure of the electronic device 100 is further optimized. Of course, in other embodiments, as shown in fig. 9, the orthographic projection area of the sensor 11 and the receiver 13 on the flexible circuit board 12 may also partially overlap, that is, the orthographic projection area D1 of the sensor 11 on the flexible circuit board 12 partially overlaps the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12; or as shown in fig. 10, the orthographic projection area D1 of the sensor 11 on the flexible circuit board 12 is located at the orthographic projection area D2 of the receiver 13 on the flexible circuit board 12, and the like.

It can be understood that, referring to fig. 8, the sensor 11 is disposed near a connection point of the first side S1 and the third side S3 of the flexible circuit board 12. The sensor 11 is disposed at a corner of the flexible circuit board 12 and is further away from a connection point of the flexible circuit board 12 and the circuit board, so that when the electronic assembly 1 is disposed on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing a size of a non-display area of the electronic device 100.

It can be understood that, referring to fig. 11, the receiver 123, i.e., the sound channel 131, is arranged side by side with the sensor 11 along the direction from the third side S3 to the fourth side S4.

As shown in fig. 11, the orthographic projection area of the receiver 123 on the receiver 13 is located in a range overlapping with the vibration part 132 on the receiver 13. Namely, the receiver 123 is aligned with the vibrating portion 132 of the upper portion of the receiver 13. That is, the size of the receiver 123 is smaller than the size of the vibrating portion 132 of the receiver 13. Correspondingly, the orthographic projection area D3 of the receiver 123 on the flexible circuit board 12 is located in the orthographic projection area D4 of the vibration part 132 of the receiver 13 on the flexible circuit board 12. The sound guide structure can be additionally covered on the telephone receiver 123 to ensure the sound output of the telephone receiver 13. That is, the forward projection area D3 of the receiver 123 on the flexible circuit board 12 is located in the forward projection area D4 of the vibrating portion 132 of the receiver 13 on the flexible circuit board 12. The receiver 123 is close to the corners of the first side S1 and the fourth side S4, so as to realize the side-by-side arrangement of the sound channel 131 and the sensor 11. The telephone receiver 123 is arranged side by side with the sensor 11, so that the requirement for a non-display area of the electronic device 100 can be reduced, and the screen occupation ratio of the electronic device 100 can be improved. Of course, in other embodiments, please refer to fig. 12, the size of the receiver 123 may be half of the vibration portion 132 of the receiver 13, or, referring to fig. 13, the receiver 123 and the sensor 11 are arranged in different rows.

Further, referring to fig. 1, the electronic device 100 further includes a display module 2, the display module 2 has a non-display area Z2, the non-display area Z2 is provided with a receiving window 21a, the electronic component 1 is disposed on the non-display area Z2, and the sound channel 131 of the electronic component 1 is communicated to the receiving window 21 a.

In one embodiment, referring to fig. 14, the display module 2 includes a cover plate 21 and a panel assembly 22 stacked and connected in sequence. The display module 2 and the housing of the electronic device 100 are covered to form an inner cavity enclosed by the electronic device 100, the electronic component 1 is accommodated in the inner cavity, and the receiver 123 and the sensor 11 in the electronic component 1 are both aligned with the non-display area Z2 of the display module 2, so that the sound signal in the receiver 13 can be transmitted to the receiver window 21a through the receiver 123, so that the user can listen to the sound signal through the receiver window 21a, and the sensor 11 is aligned with the display module 2, so that the sensor 11 can receive external light to operate. Here, the non-display area Z2 is an area of the electronic apparatus 100 that is not used for displaying electronic images. The electronic component 1 and the display module 2 are assembled as follows: the electronic component 1 is connected to the display module 2 in a stacked manner, and the first side 121 of the flexible circuit board 12 faces the screen component 22, so that the receiving opening 123 and the sensor 11 are aligned with the non-display area Z2, so that the sound signal in the receiving unit 13 can be transmitted to the receiving window 21a through the receiving opening 123, so that the user can listen to the sound signal through the receiving window 21a, and the sensor 11 can receive external light for operation.

Because the sensor 11, the flexible circuit board 12 and the receiver 13 are stacked, when the electronic assembly 1 with the structure is arranged in the electronic device 100, the sensor 11, the flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, so that the size of the non-display area Z2 in the electronic device 100 in the X direction is saved, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is improved.

In an embodiment, as shown in fig. 1, the display module 2 further has a display area Z1, and the display area Z1 surrounds the non-display area Z2.

When the electronic device 100 provided in the embodiment of the application is assembled, the sensor 11 is first disposed on the flexible circuit board 12 and electrically connected to the flexible circuit board 12, and then the receiver 13 and the sensor 11 are disposed on the flexible circuit board 12 in a reverse manner to form the electronic component 1; then, the first fixing grooves 171 of the flexible circuit board 12 provided with the receiver 13 and the sensor 11 are respectively embedded on the first fixing protrusions 172 of the bearing part 161 to assemble the flexible circuit board 12 with the middle frame; the electronic component 1 is abutted against the display module 2 for assembly, the telephone receiver 123 of the electronic component 1 is aligned with the telephone receiver window 21a on the cover plate 21, part of the structures of the telephone receiver 13 and the sensor 11 are positioned in the groove 22a, and the orthographic projection range of the rest structures of the telephone receiver 13 and the sensor 11 on the display module 2 is positioned in the range of the display area Z1 of the display module 2.

According to the electronic component 1 and the electronic device 100 provided by the embodiment of the application, the fixing piece 17 is arranged between the flexible circuit board 12 and the middle frame 16, so that the flexible circuit board 12 provided with the sensor 11 and the receiver 13 can be fixed on the middle frame 16 through the fixing piece 17, the positioning between the flexible circuit board 12 and the middle frame 16 is facilitated, and the assembling efficiency of the electronic component 1 is improved.

The foregoing is a preferred embodiment of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Claims

1. An electronic component is characterized by comprising a sensor, a flexible circuit board, a receiver, a middle frame and a fixing piece,

the telephone receiver and the sensor are respectively arranged on two sides of a flexible circuit board, the flexible circuit board is provided with a telephone receiver hole, the middle frame is provided with a first middle through hole and a second middle through hole, the fixing piece is arranged between the middle frame and the flexible circuit board so as to fix the flexible circuit board on the middle frame, the first middle through hole is communicated with the telephone receiver hole, and the sensor is positioned in the second middle through hole;

the fixing piece comprises a plurality of first fixing grooves and a plurality of first fixing bulges, the first fixing grooves are formed in the flexible circuit board, the first fixing bulges are arranged on the middle frame in a protruding mode, and one first fixing bulge is embedded in one first fixing groove;

the fixing piece further comprises a plurality of second fixing grooves, the second fixing grooves are annularly arranged on the middle frame, areas formed by the second fixing grooves in a surrounding mode comprise areas formed by the first fixing bulges in a surrounding mode, the flexible circuit board further comprises a plurality of bending portions, and one bending portion is embedded in one second fixing groove;

wherein the content of the first and second substances,

the orthographic projection area of the telephone receiver on the telephone receiver is overlapped with the range of the vibration part on the upper part of the telephone receiver, the telephone receiver is aligned with the vibration part on the upper part of the telephone receiver, the size of the telephone receiver is smaller than that of the vibration part of the telephone receiver, and the orthographic projection area of the telephone receiver on the flexible circuit board is located in the orthographic projection area of the vibration part of the telephone receiver on the flexible circuit board;

the orthographic projection area of the sensor on the flexible circuit board is positioned in the orthographic projection area of the receiver on the flexible circuit board, or the orthographic projection area of the sensor on the flexible circuit board is partially overlapped with the orthographic projection area of the receiver on the flexible circuit board; or the orthographic projection area of the sensor on the flexible circuit board and the orthographic projection area of the receiver on the flexible circuit board are mutually staggered.

2. The electronic assembly of claim 1, wherein the first securing recess is disposed proximate an edge of the flexible circuit board.

3. The electronic component of any of claims 1 to 2,

the flexible circuit board comprises a first edge and a second edge which are arranged in a back-to-back mode, and a third edge and a fourth edge which are arranged in a back-to-back mode, the third edge and the fourth edge are connected between the first edge and the second edge respectively, the second edge extends towards the direction far away from the first edge, so that the flexible circuit board is electrically connected with the circuit board, and the sensor is close to the first edge of the flexible circuit board and the junction of the third edge.

4. The electronic assembly of claim 3, wherein the receiver is located side by side with the sensor along the direction from the third edge to the fourth edge.

5. An electronic device, characterized in that it comprises an electronic assembly according to any one of claims 1 to 4.