CN108429827B

CN108429827B - Electronic component and electronic device

Info

Publication number: CN108429827B
Application number: CN201810160415.3A
Authority: CN
Inventors: 姚坤
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-02-26
Filing date: 2018-02-26
Publication date: 2020-07-07
Anticipated expiration: 2038-02-26
Also published as: CN108429827A

Abstract

The embodiment of the application provides an electronic assembly, including the sensor, first flexible circuit board, first elastic component, receiver and support, the sensor sets up on first face of first flexible circuit board, the receiver sets up on the second face of first flexible circuit board, first flexible circuit board sets up the receiving hole, first elastic component sets up between first flexible circuit board and receiver, the support has bearing part and stabilizer blade, bearing part sets up on the receiver, the stabilizer blade extends until the stabilizer blade lock joint on first flexible circuit board towards the direction of keeping away from bearing part. The electronic component provided by the embodiment of the application is arranged on the telephone receiver through the bearing part of the support, the support legs of the support are buckled on the first flexible circuit board, the support can be used for bearing other devices, meanwhile, the support also ensures the sealing between the telephone receiver and the first flexible circuit board, and the support is used for one object, so that the structure of the electronic component is optimized. In addition, the embodiment of the application also provides electronic equipment.

Description

Electronic component and electronic device

Technical Field

The present application relates to the field of electronic devices, and more particularly, to an electronic component and an electronic device.

Background

With the increasing development of electronic device technology, the demand for the mobile phone to be light and thin is higher and higher. In the prior art, in order to realize more and more functions in electronic equipment such as a mobile phone, more and more devices are integrated in the mobile phone, the position relationship among the devices is more and more complex, and the influence on the lightness and thinness of the mobile phone is more and more large, which is not beneficial to the appearance design of the mobile phone.

Disclosure of Invention

The application provides an electronic component and an electronic device.

The embodiment of the application provides an electronic assembly, which comprises a sensor, a first flexible circuit board, a first elastic piece, a receiver and a bracket, the first flexible circuit board comprises a first surface and a second surface which are arranged oppositely, the sensor is arranged on the first surface of the first flexible circuit board, the telephone receiver is arranged on the second surface of the first flexible circuit board, the first flexible circuit board is provided with a telephone receiver hole, the first elastic piece is arranged between the first flexible circuit board and the telephone receiver and is provided with an inner cavity communicated with the vibration part of the telephone receiver and the telephone receiver hole, the support is provided with a bearing part and a support leg, the bearing part is arranged on the telephone receiver, the support leg extends towards the direction far away from the bearing part until the support leg is buckled on the first flexible circuit board, so that the first elastic piece is clamped between the first flexible circuit board and the telephone receiver.

On the other hand, the embodiment of the application also provides electronic equipment which comprises an electronic component.

The electronic assembly and the electronic equipment provided by the embodiment of the application are arranged on the telephone receiver through the bearing part of the support, the support legs of the support are buckled on the first flexible circuit board, when the support can be used as a bearing part for other devices, the support also clamps the first elastic piece between the telephone receiver and the first flexible circuit board to ensure the sealing between the telephone receiver and the first flexible circuit board, and the support is used for one thing, so that the structure of the electronic assembly is optimized.

Drawings

In order to more clearly illustrate the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.

Fig. 1 is a schematic view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of the electronic components of the electronic device shown in FIG. 1;

FIG. 3 is a cross-sectional view of the electronic assembly shown in FIG. 2 taken along line A-A;

FIG. 4 is a cross-sectional view of one of the electronic assemblies shown in FIG. 3, except for the bracket;

FIG. 5 is a cross-sectional view of the alternative electronic assembly shown in FIG. 3, except for the bracket;

FIG. 6 is a cross-sectional view of another electronic assembly shown in FIG. 3;

FIG. 7 is a partial view of the VII of the electronic assembly shown in FIG. 6;

FIG. 8 is a cross-sectional view of yet another electronic assembly shown in FIG. 3;

FIG. 9 is a cross-sectional view of yet another electronic assembly shown in FIG. 3;

fig. 10 is a sectional view of the electronic component shown in fig. 3 further provided with heat dissipating projections;

FIG. 11 is a schematic diagram of the relative relationship of the sensor and receiver of the electronic assembly of FIG. 2;

FIG. 12 is a schematic diagram of another relative relationship of the sensor and receiver of the electronics assembly in other embodiments;

FIG. 13 is a schematic diagram of yet another relative relationship of the sensor and receiver of the electronics assembly in other embodiments;

fig. 14 is a schematic diagram showing the relative relationship between the receiver and the vibrating portion of the electronic assembly shown in fig. 2;

fig. 15 is a schematic view showing another relative relationship between the receiver and the vibrating portion of the electronic component in other embodiments;

FIG. 16 is a schematic diagram of the electronic assembly with the sensor and receiver arranged non-side-by-side in other embodiments;

FIG. 17 is a schematic view of a display module of the electronic device shown in FIG. 1;

FIG. 18 is a schematic view of a panel assembly of the display module of FIG. 17.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict.

In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

In addition, the following description of the various embodiments refers to the accompanying drawings, which are included to illustrate specific embodiments that can be used to practice the present application. Directional phrases used in this application, such as "length," "width," "thickness," and the like, refer only to the orientation of the appended drawings and, therefore, are used in a better and clearer sense to describe and understand the present application and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and, therefore, should not be considered limiting of the present application. Unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are intended to be inclusive and mean, for example, that they may be fixedly coupled, detachably coupled, or integrally coupled; may be a mechanical connection; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The terms described above are meant to be illustrative in the present invention and are understood to be specific to those of ordinary skill in the art.

Referring to fig. 1 and fig. 2, fig. 1 is a first perspective view of an electronic device 100. The electronic device 100 comprises an electronic assembly 1. The electronic component 1 is housed inside the electronic apparatus 100, and is used for realizing functions of the electronic apparatus 100 such as receiving a telephone. The electronic device 100 may be any device having electronic components, such as: smart devices such as tablet computers, mobile phones, cameras, personal computers, notebook computers, vehicle-mounted devices, wearable devices, and the like. For convenience of description, the electronic device 100 is defined with reference to the first viewing angle, the width direction of the electronic device 100 is defined as the X direction, the length direction of the electronic device 100 is defined as the Y direction, and the thickness direction of the electronic device is defined as the Z direction.

Referring to fig. 2 and fig. 3, the electronic assembly 1 includes a sensor 11, a first flexible circuit board 12, a first elastic element 14, a receiver 13 and a bracket 15, wherein the first flexible circuit board 12 includes a first surface 121 and a second surface 122 that are disposed opposite to each other, the sensor 11 is disposed on the first surface 121 of the first flexible circuit board 12, the receiver 13 is disposed on the second surface 122 of the first flexible circuit board 12, the first flexible circuit board 12 is provided with a receiver hole 123, the first elastic element 14 is disposed between the first flexible circuit board 12 and the receiver 13, the first elastic element 14 has a vibrating portion 132 connected to the receiver 13 and an inner cavity 14a connected to the receiver hole 123, the bracket 15 has a bearing portion 151 and a supporting leg 152, the bearing portion 151 is disposed on the receiver 13, the supporting leg 152 extends in a direction away from the bearing portion 151 until the supporting leg 152 is fastened to the first flexible circuit board 12, so that the first elastic member 14 is sandwiched between the first flexible circuit board 12 and the receiver 13.

The bearing part 151 of the bracket 15 is arranged on the receiver 13, the support leg 152 of the bracket 15 is buckled on the first flexible circuit board 12, the bracket 15 can bear other devices, and meanwhile, the first elastic element 14 is clamped between the receiver 13 and the first flexible circuit board 12 by the bracket 15 to ensure the sealing between the receiver 13 and the first flexible circuit board 12, and the structure of the electronic component 1 is optimized by using the bracket 15.

In one embodiment, as shown in fig. 3, the first flexible circuit board 12 includes a first side 121 and a second side 122 that are opposite to each other. The first flexible circuit board 12 is used to electrically connect with the sensor 11, and the first flexible circuit board 12 is electrically connected with a circuit board in the electronic device 100 to transmit the electrical signal on the sensor 11 to the circuit board in the electronic device 100.

Referring to fig. 2 and fig. 3, the first surface 121 and the second surface 122 of the first flexible printed circuit board 12 are opposite to each other on the first flexible printed circuit board 12, and the first flexible printed circuit board 12 has a larger area and can carry components. Correspondingly, the edges of the board surface of the first flexible circuit board 12 are respectively a first side S1 and a second side S2 which are oppositely arranged, and a third side S3 and a fourth side S4 which are oppositely arranged, the third side S3 and the fourth side S4 are respectively connected between the first side S1 and the second side S2, and the second side S2 extends towards the direction far away from the first side S1, so that the first flexible circuit board 12 is electrically connected with the circuit board. That is, the first flexible circuit board 12 has a substantially long rectangular shape. The first side S1 and the second side S2 are shorter sides of the first flexible circuit board 12 than the third side S3 and the fourth side S4. That is, when the first flexible circuit board 12 is disposed in the electronic device 100, the first flexible circuit board is substantially arranged in a long bar shape along the Y direction of the electronic device 100, so as to extend to be electrically connected to the circuit board.

In one embodiment, as shown in fig. 2, the sensor 11 is disposed on the first surface 121 of the first flexible circuit board 12, and the sensor 11 is electrically connected to the first flexible circuit board 12.

It is understood that, referring to fig. 3, the sensor 11 includes at least one of a distance sensor, a light sensor or a photoelectric sensor. In this embodiment, the sensor 11 is a light sensor 11. The light sensor 11 is disposed near a screen of the electronic device 100 so as to adjust brightness of the screen of the electronic device 100 according to light of an environment in which the electronic device 100 is located. The medium sensed by the light sensor 11 is light, the electronic device 100 does not need to specially drill holes or arrange a special structure to pass through the light, the sensor 11 in the electronic component 1 is arranged as the light sensor 11, and is stacked in the Z direction together with the receiver 13, so that the structure of the electronic device 100 is further optimized, and the direction of the electronic device 100 in the X direction is facilitated.

As shown in fig. 3, the receiver 13 is substantially rectangular, and the middle region of the receiver 13 is a vibrating portion 132. The vibrating portion 132 is typically hermetically sealed to other components or structures to form a vibrating chamber, and vibrations in the vibrating portion 132 can be transmitted through an opening in the component or structure. The sound channel 131 of the receiver 13 is actually a channel through which the sound signal in the receiver 13 propagates, and corresponds to a channel between the vibrating portion 132 and the opening of the component or structure. After the receiver 13 receives the audio signal, the sealed vibration cavity vibrates, and the sound signal passes through the opening on the component or the structure.

In an embodiment, as shown in fig. 2 and fig. 3, the component for hermetically connecting the vibrating portion 132 of the receiver 13 may be the first flexible circuit board 12, and the first flexible circuit board 12 is used as a carrier for stacking the sensor 11 and the receiver 13 together and is also used as a part of the sound channel 131 of the receiver 13, so that the component assembly of the electronic component 1 is reduced, the thickness of the electronic component 1 in the Z of the electronic device 100 is saved, and the electronic components are further optimized.

Referring to fig. 4, the first flexible circuit board 12 covers and hermetically connects the receiver 13, and the first flexible circuit board 12 is provided with a receiver hole 123, so that the sound channel 131 is formed by a channel from the vibration portion 132 of the receiver 13 to the receiver hole 123 of the first flexible circuit board 12.

Referring to fig. 2 and 3, since the receiver 123 is opened on the first flexible circuit board 12, a sound channel 131 is formed between the vibration portion 132 of the receiver 13 and the receiver 123 of the first flexible circuit board 12, and the sound channel 131 of the receiver 13 passes through the first flexible circuit board 12.

The area of the second surface 122 of the first flexible circuit board 12 is slightly larger than the area of the receiver 13, that is, the receiver 13 does not occupy too much space in the electronic device 100 due to the oversize of the first flexible circuit board 12, and when the receiver 13 is disposed on the second surface 122 of the first flexible circuit board 12, the orthographic projection area of the receiver 13 on the first flexible circuit board 12 is located in the area occupied by the second surface 122 of the first flexible circuit board 12, that is, the first flexible circuit board 12 entirely covers the receiver 13. Of course, in other embodiments, the size of the first flexible circuit board 12 may be much larger than the area of the receiver 13.

When the receiver 13 receives the audio signal, the vibration portion 132 of the receiver 13 vibrates to form an audio signal, and the audio signal is transmitted from the vibration chamber to the receiver 123 and then transmitted to the outside through the receiver 123, thereby realizing the receiving function of the receiver 13.

Referring to fig. 3, the receiver 13 and the first flexible circuit board 12 are sealed by the first elastic element 14, and the first elastic element 14 is sandwiched between the receiver 13 and the first flexible circuit board 12 to ensure the sealing between the receiver 13 and the first flexible circuit board 12.

In this embodiment, referring to fig. 3, the first elastic element 14 has elasticity, and can be elastically deformed when receiving a clamping force between the receiver 13 and the first flexible circuit board 12, and under the condition that the external force received by the receiver 13 and the first flexible circuit board 12 is not cancelled, the first elastic element 14 always contacts with the receiver 13 and the first flexible circuit board 12, so as to ensure that the sound channel 131 of the receiver 13 can be better sealed, and ensure good audio output of the electronic component 1.

It can be understood that, referring to fig. 4, the first elastic element 14 is annular, the middle of the first elastic element 14 is hollowed to form an inner cavity 14a, when the first elastic element 14 is disposed between the first flexible circuit board 12 and the receiver 13, the inner cavity 14a of the first elastic element 14 can be communicated to the vibration portion 131 of the receiver 13 and the receiver hole 123 on the first flexible circuit board 12, so that when the first elastic element 14 is sandwiched between the first flexible circuit board 12 and the receiver 13, the vibration portion 131 of the receiver 13 vibrates to form a sound signal, and the sound signal is sequentially transmitted to the inner cavity of the first elastic element 14 until being transmitted out from the receiver hole 123 of the first flexible circuit board 12.

In this embodiment, referring to fig. 4, the first elastic member 14 may be foam. The elasticity of the foam enables the electronic component 1 to be adjusted in the space in the Z direction, and the foam is used as the sealing member 14, so that the sealing performance is good, and the sound signal of the receiver 13 is not easy to leak from the foam, thereby affecting the output of the sound signal of the receiver 13. Of course, in other embodiments, the first elastic member may also be silicone rubber.

In this embodiment, referring to fig. 4, the area of the orthographic projection of the inner cavity 14a of the first elastic element 14 on the receiver 13 includes an area where the vibration portion 132 of the receiver 13 is located. That is, the opening of the inner cavity 14a of the first elastic member 14 is larger than the size of the vibration part 132 of the receiver 13, ensuring that the sound signal of the vibration part 132 can entirely pass through the inner cavity 14a of the first elastic member 14. Of course, in other embodiments, referring to fig. 6, the orthographic projection area of the inner cavity 14a of the first elastic element 14 on the receiver 13 may also overlap the area where the vibration part 132 of the receiver 13 is located.

Optionally, referring to fig. 4, the first elastic element 14 has an inner cavity surface 14b, the inner cavity surface 14b surrounds the inner cavity 14a, and the inner cavity surface 14a is a conical surface. That is, the inner cavity surface 14a of the first elastic element 14 is a conical surface, and the first elastic element 14 has a first opening 1411 and a second opening 1412 which are opposite to each other, the first opening 1411 is close to the receiver 13, and the caliber of the inner cavity surface 14a gradually increases along the direction from the first opening 1411 to the second opening 1412. The first elastic element 14 with such a structure has a function of amplifying sound, so that when the sound signal of the receiver 13 reaches the second opening 1412 from the first opening 1411, the sound signal is amplified due to the influence of the tapered inner cavity surface 14b of the first elastic element 14, and the amplified sound signal is output through the receiver hole 123 on the first flexible circuit board 12.

Optionally, referring to fig. 5, the first elastic element 14 has an inner cavity surface 14c, the inner cavity surface 14c surrounds to form the inner cavity, and the inner cavity surface 14c is a curved surface. The inner cavity surface 14c is provided with a first circular arc section q1 and a second circular arc section q2 which are sequentially connected, and the aperture formed by the connection part of the first circular arc section q1 and the second circular arc section q2 in a surrounding mode is the smallest aperture of the inner cavity surface 14 c. That is, the inner cavity surface 14c of the first elastic member 14 has a bulging surface protruding toward the central axis direction of the inner cavity of the first elastic member 14. The inner cavity surface 14c of the drumhead can make the sound signal of the receiver 13 decrease and then increase when passing through the inner cavity of the first elastic element 14, and then output through the receiver hole 123 on the first flexible circuit board 12.

The above-mentioned structure of the inner cavity surfaces 14b and 14c of the first elastic element 14 is more beneficial to improving the sound performance of the receiver 13 instead of controlling various requirements of the sound signal of the receiver 13 by adjusting the vibration part 132 of the receiver 13 in the prior art.

Referring to fig. 3, the bracket 15 is used to provide a clamping force for the electronic assembly 1 to clamp the first elastic element 14 between the receiver 13 and the flexible circuit board 12, so as to ensure the flexible circuit board 12 is sealed against the receiver 13.

Referring to fig. 2, the entire bracket 15 is substantially U-shaped. The bearing portion 151 is provided on the receiver 13 and can bear other components. The supporting legs 152 are divided into two groups, and the two groups of supporting legs 152 are oppositely disposed on the supporting portion 151. For convenience of description, the supporting portion 151 includes a first supporting surface 151a and a second supporting surface 151b disposed opposite to each other, and a supporting side surface 151c adjacent to and between the first supporting surface 151a and the second supporting surface 151 b. The supporting legs 152 are disposed on the supporting side 151c, and the two sets of supporting legs 151 are disposed oppositely.

In an embodiment, referring to fig. 3, the supporting leg 1521 has a first fixing segment 1521a and a second fixing segment 1521b connected in sequence, the first fixing segment 1521a is fixedly connected to the carrier portion 151, the second fixing segment 1521b is bent and connected to the first fixing segment 1521a, and the second fixing segment 1521b is fastened to the second surface 122 of the first flexible circuit board 12.

In this embodiment, referring to fig. 2 and fig. 3, the number of the support legs 1521 is four, and the four support legs are divided into two groups. The supporting leg 1521 is substantially L-shaped, and after the first supporting surface 151a of the supporting portion 151 faces the receiver 13, the second fixing section 1521b faces the second surface 122 of the first flexible circuit board 12 and abuts against the second surface 122 of the first flexible circuit board 12, so that the first elastic element 14 is sandwiched between the receiver 13 and the first flexible circuit board 12.

Optionally, referring to fig. 6 and fig. 7, the second fixing section 1521b has a pressing surface 1521c facing the second surface 122, the pressing surface 1521c is provided with an anti-slip structure 153, and the anti-slip structure 13 presses against the second surface 122. Specifically, the anti-slip structure 153 may be at least one strip-shaped protrusion protruding on the pressing surface, so as to enhance the friction between the second fixing section 1521b and the first flexible circuit board 12, so that the second fixing section 1521b can better grip the first flexible circuit board 12, and the first elastic element 14 can be better clamped between the receiver 13 and the first flexible circuit board 12.

Optionally, referring to fig. 8, the bracket 15 further has a second elastic member 154, one end of the second elastic member 154 is fixedly connected to the second fixing section 1521b, and the other end of the second elastic member 154 is pressed against the second surface 122. Specifically, the second elastic member 154 is a spring, and the elastic deformation direction of the second elastic member 154 is along the Z direction. One end of the second elastic element 154 can be fixed on the second fixing section 1521b by welding, and after the second fixing section 1521b faces the second surface 122, the second elastic element 154 is compressed and disposed between the second fixing section 1521b and the first flexible circuit board 12, so that the second fixing section 1521b better abuts against the first flexible circuit board 12, and the first elastic element 14 is better clamped between the receiver 13 and the first flexible circuit board 12.

In another embodiment, referring to fig. 9, the first flexible circuit board 12 is provided with a first fastening groove 12a, the supporting leg 1522 has a first supporting section 1522a, a second supporting section 1522b and a third supporting section 1522c, the first supporting section 1522a is fixedly connected to the carrying portion 151, the second supporting section 1522b is connected to the first supporting section 1522a in a bending manner, the third supporting section 1522c is connected to the second supporting section 1522b in a bending manner, the third supporting section 1522c is arranged opposite to the first supporting section 1522a, and the third supporting section 1522c is inserted into the first fastening groove 12 a.

In this embodiment, the leg 1522 is substantially U-shaped. The size of the first fastening groove 12a of the first flexible circuit board 12 is slightly smaller than that of the third branch section 1522c, so that the third branch section 1522c can be fixed on the first flexible circuit board 12 when fastened in the first fastening groove 12a, and the first elastic element 14 is better sandwiched between the receiver 13 and the first flexible circuit board 12.

Further, referring to fig. 10, the supporting leg 152 has an outer side surface F1, the outer side surface F1 is disposed opposite to the side surface of the first flexible circuit board 12, and the outer side surface F1 is protruded with a heat dissipating protrusion 18. By providing the heat dissipating projections 18 on the outer side surfaces F1 of the legs 152, heat generated in the electronic component 1 can be conducted to the outside, and the reliability of the electronic component 1 can be further improved. It is understood that when the middle frame is matched with the electronic component 1, the middle frame may be correspondingly provided with a groove corresponding to the heat dissipating protrusion 18, so that the heat on the heat dissipating protrusion 18 can be transferred to the middle frame.

Further, referring to fig. 3, an accommodating space U is formed between the bearing portion 151 and the receiver 13, the electronic component 1 further includes a second flexible circuit board 16 electrically connected to the receiver 13, and at least a portion of the second flexible circuit board 16 is accommodated in the accommodating space U.

An accommodating space U is formed between the bearing part 151 and the telephone receiver 13 to accommodate the second flexible circuit board 16, the second flexible circuit board 16 is electrically connected with the telephone receiver 13, and the electronic component 1 provides a space in the Z direction for accommodating the second flexible circuit board 16, so that the second flexible circuit board 16 is prevented from being arranged at other positions, and the electronic component 1 with compact arrangement and more reasonable structure is provided.

In an embodiment, referring to fig. 3, a space is formed between the first bearing surface 151a of the bearing portion 151 and the receiver 13 to form an accommodating space U, and a size of the accommodating space U corresponds to a size of a portion of the second flexible circuit board 16 accommodated in the accommodating space U, that is, the portion of the second flexible circuit board 16 accommodated in the accommodating space U is sandwiched between the first bearing surface 151a and the receiver 13, so as to ensure that the first elastic element 14 can be better sandwiched between the receiver 13 and the first flexible circuit board 12.

Optionally, referring to fig. 3, the second flexible circuit board 16 includes a first portion 161 and a second portion 162, the first portion 161 is electrically connected to the receiver 13, the first portion 16 is accommodated in the accommodating space U, the second portion 162 is connected to the first portion 161 in a bending manner, and the second portion 162 is disposed on the supporting portion 151.

The second flexible circuit board 16 is bent to form two parts, one part is used to electrically connect with the receiver 13, and the other part is used to electrically connect with other devices. The number of flexible circuit boards is eliminated, and the thickness of the electronic component 1 in the Z direction is reduced.

It is understood that, referring to fig. 3, the electronic component 1 further includes a flash lamp 17, the flash lamp 17 is electrically connected to the second portion 162, and the flash lamp is disposed on the second portion 162.

Further, referring to fig. 11, an orthographic projection area D1 of the sensor 11 on the first flexible circuit board 12 is located in an orthographic projection area D2 of the receiver 13 on the first flexible circuit board 12. The sensor 11 and the receiver 13 are overlapped in the Z direction, so that the size of the first flexible circuit board 12 loaded between the sensor 11 and the receiver 13 is reduced, when the electronic component 1 is assembled in the circuit board, the size of the electronic component 1 in the X direction is saved, and the structure of the electronic device 100 is further optimized. Of course, in other embodiments, as shown in fig. 12, the orthographic projection area D1 of the sensor 11 on the first flexible circuit board 12 and the orthographic projection area D2 of the receiver 13 on the first flexible circuit board 12 may also partially overlap each other between the sensor 11 and the receiver 13 on the first flexible circuit board 12; or as shown in fig. 13, the orthographic projection area D1 of the sensor 11 on the first flexible circuit board 12 is located at the orthographic projection area D2 of the receiver 13 on the first flexible circuit board 12, and the like.

It can be understood that, referring to fig. 11, the sensor 11 is disposed near a connection point of the first side S1 and the third side S3 of the first flexible circuit board 12. The sensor 11 is disposed at a corner of the first flexible circuit board 12 and is further away from a connection between the first flexible circuit board 12 and the circuit board, so that when the electronic assembly 1 is disposed on the electronic device 100, the sensor 11 is close to the top of the electronic device 100, thereby reducing a size of a non-display area of the electronic device 100.

It is understood that, referring to fig. 14, the sound channel 131 and the sensor 11 are arranged side by side along the direction from the third side S3 to the fourth side S4.

As shown in fig. 14, the orthographic projection area of the receiver 123 on the receiver 13 is located in a range overlapping with the vibration part 132 on the receiver 13. Namely, the receiver 123 is aligned with the vibrating portion 132 of the upper portion of the receiver 13. That is, the size of the receiver 123 is smaller than the size of the vibrating portion 132 of the receiver 13. Correspondingly, the area D3 of the orthographic projection of the receiver 123 on the first flexible circuit board 12 is located in the area D4 of the orthographic projection of the vibration part 132 of the receiver 13 on the first flexible circuit board 12. The sound guide structure can be additionally covered on the telephone receiver 123 to ensure the sound output of the telephone receiver 13. That is, the orthographic projection area D3 of the hole of the receiver 123 on the first flexible circuit board 12 is located in the orthographic projection area D4 of the vibrating part 132 of the receiver 13 on the first flexible circuit board 12. The receiver 123 is close to the corners of the first side S1 and the fourth side S4, so as to realize the side-by-side arrangement of the sound channel 131 and the sensor 11. The telephone receiver 123 is arranged side by side with the sensor 11, so that the requirement for a non-display area of the electronic device 100 can be reduced, and the screen occupation ratio of the electronic device 100 can be improved. Of course, in other embodiments, please refer to fig. 15, the size of the receiver 123 may be half of the vibration portion 132 of the receiver 13, or, referring to fig. 16, the receiver 123 and the sensor 11 are arranged in different rows.

Further, referring to fig. 1, the electronic device 100 further includes a display module 2, the display module 2 has a non-display area Z2, the non-display area Z2 is provided with a receiving window 21a, the electronic component 1 is disposed on the non-display area Z2, and the sound channel 131 of the electronic component 1 is communicated to the receiving window 21 a.

In one embodiment, referring to fig. 17 and 18, the display module 2 includes a cover plate 21 and a panel assembly 22 stacked and connected in sequence. The display module 2 and the housing of the electronic device 100 are covered to form an inner cavity enclosed by the electronic device 100, the electronic component 1 is accommodated in the inner cavity, and the receiver 123 and the sensor 11 in the electronic component 1 are both aligned with the non-display area Z2 of the display module 2, so that the sound signal in the receiver 13 can be transmitted to the receiver window 21a through the receiver 123, so that the user can listen to the sound signal through the receiver window 21a, and the sensor 11 is aligned with the display module 2, so that the sensor 11 can receive external light to operate. Here, the non-display area Z2 is an area of the electronic apparatus 100 that is not used for displaying electronic images. The electronic component 1 and the display module 2 are assembled as follows: the electronic component 1 is connected to the display module 2 in a stacked manner, and the first surface 121 of the first flexible circuit board 12 faces the screen component 22, so that the receiving hole 123 and the sensor 11 are aligned with the non-display area Z2, so that a sound signal in the receiving unit 13 can be transmitted to the receiving window 21a through the receiving hole 123, a user can listen to the sound signal through the receiving window 21a, and the sensor 11 can receive external light for operation.

Since the sensor 11, the first flexible circuit board 12 and the receiver 13 are stacked, when the electronic assembly 1 with the structure is disposed in the electronic device 100, the sensor 11, the first flexible circuit board 12 and the receiver 13 are sequentially stacked along the Z direction of the electronic device 100, so that the size of the non-display area Z2 in the electronic device 100 in the X direction is saved, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 can be improved.

In an embodiment, as shown in fig. 1, the display module 2 further has a display area Z1, and the display area Z1 surrounds the non-display area Z2.

It can be understood that, as shown in fig. 17, the display module 2 includes a cover plate 21 and a screen assembly 22 sequentially stacked and connected, the screen assembly 22 has two short sides S5 opposite to each other and two long sides S6 opposite to each other, the two long sides S6 are respectively connected between the two short sides S5, one short side S5 is recessed toward the other short side S5 to form a groove 22a, a region of the display module 2 within the groove 22a is the non-display region Z2, a region of the display module 2 outside the groove 22a is the display region Z1, and the cover plate 21 is provided with the telephone receiving window 21 a. Of course, in other embodiments, the display module 2 may also be the panel assembly 22, a groove 22a is opened on an edge of the display module 2, that is, the panel assembly 22, to form a non-display area Z2, and an area of the display module 2 outside the non-display area Z2 is a display area Z1.

As shown in fig. 1 and 17, the display module 2 formed by the cover plate 21 and the panel assembly 22 is a display area Z1 except for the groove 22 a. Wherein the recess 22a opens in the middle of one short side of the screen assembly 22. The cover 21 is provided with a receiver window 21a corresponding to the receiver 123. It will be appreciated that the receiving window 21a is elongated and has a size approximately 2 times that of the receiving opening 123. The portion of the cover plate 21 corresponding to the recess 22a may be printed with a coating to form the non-display area Z2 of the display module 2. Since the sensor 11, the first flexible circuit board 12 and the receiver 13 are stacked in sequence along the Z direction of the electronic device 100, the size of the groove 22a in the X direction is reduced, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is improved. Of course, in other embodiments, the notch 22a may be located at other locations such as at the corners of the screen assembly 22. Of course, in other embodiments, the ratio range of the lengths of the receiver window and the receiver along the short side direction is 3: 1 or 4: 1.

it can be understood that the electronic component 1 is disposed opposite to the display module 2, and the receiver 13 is at least partially aligned with the non-display area Z2.

In an embodiment, referring to fig. 1 and 18, a groove 22a is formed in an edge of the display module 2 to form a non-display area Z2, an area of the display module 2 outside the non-display area Z2 is a display area Z1, the electronic component 1 is disposed opposite to the display module 2, and at least a portion of the telephone receiver 13 is aligned with the non-display area Z2, that is, an area of at least a partial orthographic projection of the telephone receiver 13 on the display module 2 is located in the non-display area Z2. The receiver 13 is partially aligned with the non-display area Z2, so that the size of the non-display area Z2 in the Y direction is further reduced, that is, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is further improved.

Further, at least a part of the orthographic projection area of the sensor 11 on the display module 2 is located in the non-display area Z2.

The partial structures of the telephone receiver 13 and the sensor 11 are located in the groove 22a, and the orthographic projection range of the rest structures of the telephone receiver 13 and the sensor 11 on the display module 2 is located in the range of the display area Z1 of the display module 2, so that the size of the non-display area Z2 in the Y direction is further reduced, namely, the size of the display area Z1 can be increased, and the screen occupation ratio of the electronic device 100 is further improved.

It will be appreciated that the electronic assembly 1 is located at the corner of the recess 22a, as shown in fig. 18, to facilitate the continued placement of other components, such as camera modules, etc., in the X-direction of the recess 22 a. Of course, in other embodiments, the electronic component 1 may also be located in the middle of the groove 22a, and other components are respectively located on two sides of the electronic component 1.

When the electronic device 100 provided in the embodiment of the application is assembled, the sensor 11 is first disposed on the first flexible circuit board 12 and electrically connected to the first flexible circuit board 12, and then the receiver 13 and the sensor 11 are disposed on the first flexible circuit board 12 in a reverse manner to form the electronic component 1, and the receiver 13 is hermetically connected to the first flexible circuit board 12 through the elastic member 14; then, the first part of the second flexible circuit board is arranged on the telephone receiver in a stacked mode, the bearing part of the support is arranged on the first part in a stacked mode, the support legs are buckled on the first flexible circuit board, and the second part is folded relative to the first part and is arranged on the second bearing surface of the support in a stacked mode to form a whole electronic component 1; the electronic component 1 is abutted against the display module 2 for assembly, the telephone receiver 123 of the electronic component 1 is aligned with the telephone receiver window 21a on the cover plate 21, part of the structures of the telephone receiver 13 and the sensor 11 are positioned in the groove 22a, and the orthographic projection range of the rest structures of the telephone receiver 13 and the sensor 11 on the display module 2 is positioned in the range of the display area Z1 of the display module 2.

The electronic component 1 and the electronic device 100 provided by the embodiment of the application are disposed on the receiver 13 through the bearing portion 151 of the bracket 15, the supporting leg 152 of the bracket 15 is fastened to the first flexible circuit board 12, and when the bracket 15 can be used as a bearing for other devices, the bracket 15 also clamps the first elastic element 14 between the receiver 13 and the first flexible circuit board 12 to ensure the sealing between the receiver 13 and the first flexible circuit board 12, and the bracket 15 is used for one thing, thereby optimizing the structure of the electronic component 1.

The foregoing is a preferred embodiment of the present application, and it should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present application, and these improvements and modifications are also considered as the protection scope of the present application.

Claims

1. An electronic component is characterized by comprising a sensor, a first flexible circuit board, a first elastic piece, a receiver and a bracket, the first flexible circuit board comprises a first surface and a second surface which are arranged oppositely, the sensor is arranged on the first surface of the first flexible circuit board, the telephone receiver is arranged on the second surface of the first flexible circuit board, the first flexible circuit board is provided with a telephone receiver hole, the first elastic piece is integrally arranged between the first flexible circuit board and the telephone receiver, the first elastic piece is provided with a vibration part communicated with the telephone receiver and an inner cavity of the telephone receiver, the support is provided with a bearing part and a support leg, the bearing part is arranged on the telephone receiver, the support leg extends towards the direction far away from the bearing part until the support leg is buckled on the first flexible circuit board, so that the first elastic piece is clamped between the first flexible circuit board and the telephone receiver.

2. The electronic assembly according to claim 1, wherein the supporting leg has a first fixing section and a second fixing section connected in sequence, the first fixing section is fixedly connected to the bearing portion, the second fixing section is connected to the first fixing section in a bending manner, and the second fixing section is fastened to the second surface of the first flexible circuit board.

3. The electronic component according to claim 2, wherein the second fixing section has a pressing surface facing the second surface, and an anti-slip structure is disposed on the pressing surface and presses against the second surface.

4. The electronic assembly according to claim 2, wherein the bracket further comprises a second elastic member, one end of the second elastic member is fixedly connected to the second fixing section, and the other end of the second elastic member abuts against the second surface.

5. The electronic assembly of claim 1, wherein the first flexible circuit board defines a first fastening groove, the supporting leg has a first branch section, a second branch section and a third branch section, the first branch section is fixedly connected to the carrying portion, the second branch section is connected to the first branch section in a bent manner, the third branch section is connected to the second branch section in a bent manner, the third branch section is arranged opposite to the first branch section, and the third branch section is inserted into the first fastening groove.

6. The electronic assembly according to any one of claims 1 to 5, wherein the support leg has an outer side surface, the outer side surface is opposite to the side surface of the flexible circuit board, and the outer side surface is provided with a heat dissipation protrusion in a protruding manner.

7. The electronic assembly of any one of claims 1 to 5, wherein an accommodating space is formed between the carrying portion and the receiver, and the electronic assembly further comprises a second flexible circuit board electrically connected to the receiver, and at least a portion of the second flexible circuit board is accommodated in the accommodating space.

8. The electronic assembly of claim 7, wherein the second flexible circuit board comprises a first portion and a second portion, the first portion is electrically connected to the receiver and is accommodated in the accommodating space, the second portion is connected to the first portion in a bending manner, and the second portion is disposed on the carrying portion.

9. The electronic assembly of claim 8, further comprising a flash electrically connected to the second portion, the flash disposed on the second portion.

10. The electronic component according to any one of claims 1 to 5, wherein a forward projection area of the inner cavity of the first elastic member on the receiver includes an area where a vibrating portion of the receiver is located.

11. The electronic assembly of claim 10, wherein the first resilient element has an inner cavity surface that surrounds the inner cavity, the inner cavity surface being a tapered surface.

12. The electronic assembly of claim 11, wherein the first elastic member has a first opening and a second opening opposite to each other, the first opening is close to the receiver, and the aperture of the inner cavity surface gradually increases along a direction from the first opening to the second opening.

13. An electronic device, characterized in that it comprises an electronic assembly according to any one of claims 1 to 12.