CN205079864U - A machine core circuit that what was used for thermal infrared imager takes faradic electricity cage - Google Patents
A machine core circuit that what was used for thermal infrared imager takes faradic electricity cage Download PDFInfo
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- CN205079864U CN205079864U CN201520723328.6U CN201520723328U CN205079864U CN 205079864 U CN205079864 U CN 205079864U CN 201520723328 U CN201520723328 U CN 201520723328U CN 205079864 U CN205079864 U CN 205079864U
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Abstract
The utility model discloses a machine core circuit that what was used for thermal infrared imager takes faradic electricity cage belongs to radiation pyrometry technical field. It includes detector, base, switching PCB circuit hardboard, core PCB circuit hardboard, first flexible circuit board, second flexible circuit board, eyepiece interface PCB circuit hardboard, faradic electricity cage, and wherein, core PCB circuit hardboard is connected in eyepiece interface PCB circuit hardboard through first flexible circuit board, and core PCB circuit hardboard passes through the second flexible circuit board and connects in switching PCB circuit hardboard. Its configuration is restricted less, the volume is less, the electric rosin joint phenomenon of difficult emergence. This faradic electricity cage can weaken the electromagnetic interference who comes from core PCB circuit hardboard outside effectively for the signal reception and registration of thermal infrared imager is more accurate, and the image is more clear.
Description
Technical field
The utility model relates to radiation high-temperature determinator technical field, particularly relates to a kind of movement circuit of the band Faradic electricity cage for thermal infrared imager.
Background technology
Thermal infrared imager is that the infrared energy distribution pattern utilizing infrared eye and optical imagery object lens to accept measured target is reflected on the light activated element of infrared eye, thus acquisition Infrared Thermogram, this thermography is corresponding with the heat distribution field of body surface.Generally thermal infrared imager is exactly that the invisible infrared energy sent by object changes visible heat picture into.Different colours above heat picture represents the different temperatures of testee.Such as,
Publication number is that the Chinese invention patent of CN101029846A discloses a kind of thermal infrared imager, see accompanying drawing 1, comprise infrared detection device, the outside of described infrared detection device is provided with casing, described casing comprises further: casing 101, casing 105 and support 113, wherein, described casing 101 is positioned at the top of thermal infrared imager, casing 105 is positioned at the middle part of thermal infrared imager, support 113 is positioned at the bottom of thermal infrared imager, the lower end of casing 101 is connected with the upper end of casing 105, the lower end of casing 105 is connected with the upper end of support 113, the lower end of support 113 is plane, thermal infrared imager is by described Planar realization horizontal positioned, in fig. 1, label 110 represents handle, label 102 represents optical lens, label 103 represents control panel, label 104 represents viewfinder window, label 112 represents display, label 114 represents power supply and switch.Thermal infrared imager provided by the present invention can pass through the Planar realization horizontal positioned of pedestal lower end, thus convenient for users.
The structure of the movement circuit of thermal infrared imager of the prior art as shown in Figure 2, this movement circuit comprises a PCB circuit hardboard 01, 2nd PCB circuit hardboard 02, 3rd PCB circuit hardboard 03, pedestal 04, containment vessel 05, for the ease of arranging the components and parts on each PCB circuit hardboard, one PCB circuit hardboard 01, between 2nd PCB circuit hardboard 02, 2nd PCB circuit hardboard 02, between 3rd PCB circuit hardboard 03, 3rd PCB circuit hardboard 03, baffle is equipped with between pedestal 04, detector is installed in bottom pedestal 04, containment vessel 05 is for providing protection for detector, each PCB circuit hardboard, be serially connected successively by trip bolt 06 between baffle.
What this movement circuit adopted is traditional PCB circuit hardboard, it is a kind of hardboard, its connection uses flexible cable, it is this that to be interconnected for short design be feasible, but it needs all assembly connection plug-in unit and matching used cable on every block plate, not only the design configuration of movement circuit itself, cabling are limited to, and the volume of movement circuit itself is also larger; Easily there is electric rosin joint phenomenon in the rigidity PCB circuit hardboard adopting flexible cable to connect, thus the generation of causing trouble.
In addition, the core of this movement circuit is by a PCB circuit hardboard 01, 2nd PCB circuit hardboard 02, 3rd PCB circuit hardboard 03 superposition is formed, every block PCB circuit hardboard has oneself signal conditioning circuit, electromagnetic wave can with the electronic component effect on each PCB circuit hardboard, produce electromagnetic interference (EMI), and thermal infrared imager belongs to high precision, high integrated instrument and equipment, very harsh requirement is had to the Treatment Analysis of signal, any one slight interference all can have an impact to imaging effect, which results in this movement circuit imaging effect of application not good, the signal of the thermal infrared imager of this movement circuit of application is caused to pass on accuracy to reduce, and then, image definition is not good.
Utility model content
In view of this, the utility model provides a kind of movement circuit of the band faraday cup for thermal infrared imager, and its configuration, cabling are restrained less, small volume, not easily electric rosin joint phenomenon occurred, and imaging effect is better, thus is more suitable for practicality.
In order to achieve the above object, the utility model mainly provides following technical scheme:
The movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides comprises detector, pedestal, switching PCB circuit hardboard, movement PCB circuit hardboard, the first flexible PCB, the second flexible PCB, eye lens interface PCB circuit hardboard, Faradic electricity cage
Described detector is for accepting and reflecting the infrared energy distribution pattern of measured target;
Described pedestal is for carrying described switching PCB circuit hardboard, movement PCB circuit hardboard;
Described switching PCB circuit hardboard is used for the connection of described detector and transmits data;
Described movement PCB circuit hardboard is used for data processing;
Described eye lens interface PCB circuit hardboard is used for being connected with the eyepiece circuit of thermal infrared imager;
Described movement PCB circuit hardboard is connected to described eye lens interface PCB circuit hardboard by described first flexible PCB, and described movement PCB circuit hardboard is connected to described switching PCB circuit hardboard by described second flexible PCB;
Described Faradic electricity cage comprises top layer copper sheet, bottom copper sheet, multiple via hole, described top layer copper sheet is laid in the edge of described movement PCB circuit hardboard top layer, described bottom copper sheet is laid in the edge of described movement PCB circuit hardboard bottom, described top layer copper sheet and bottom copper sheet join end to end respectively, and described via hole is connected between described top layer copper sheet and bottom copper sheet.
The purpose of this utility model and solve its technical matters and also can be applied to the following technical measures to achieve further.
As preferably, one end of described first flexible PCB is embedded in described movement PCB circuit hardboard, and the other end of described first flexible PCB is embedded in described eye lens interface PCB circuit hardboard;
One end of described second flexible PCB is embedded in described movement PCB circuit hardboard, and the other end of described second flexible PCB is embedded in described switching PCB circuit hardboard.
As preferably, the material of described first flexible PCB, the second substrate of flexible circuit board is selected from polyimide or mylar.
As preferably, the transparent adhesive tape of described first flexible PCB, the second flexible PCB is selected from epoxy resin or tygon.
As preferably, the Copper Foil of described first flexible PCB, the second flexible PCB is selected from calendering copper or cathode copper.
As preferably, the diaphragm thickness of described first flexible PCB, the second flexible PCB is 25 μm or 13 μm.
As preferably, described switching PCB circuit hardboard center offers through hole, and described base central is provided with projection, and the specification of described through hole is identical with the specification of described projection, when described switching PCB circuit hardboard is installed in described pedestal, described through hole is nested in the periphery of described projection.
As preferably, described switching PCB circuit hardboard is provided with the first convex pin, the second convex pin, the 3rd convex pin, described pedestal is provided with the first groove, the second groove, the 3rd groove, when described switching PCB circuit hardboard is installed in described pedestal, described first convex pin is embedded in described first groove, described second convex pin is embedded in described second groove, and described 3rd convex pin is embedded in described 3rd groove.
As preferably, described pedestal is also provided with the 4th groove, when described switching PCB circuit hardboard, movement PCB circuit hardboard are installed in described pedestal, described 4th groove is used for accommodating described second flexible PCB.
As preferably, also comprise shutter, described pedestal is provided with the 5th groove, and described shutter is installed on described 5th groove.
In the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides, movement PCB circuit hardboard is connected to eye lens interface PCB circuit hardboard by the first flexible PCB, movement PCB circuit hardboard is connected to switching PCB circuit hardboard by the second flexible PCB, wherein, switching PCB circuit hardboard is used for the connection of detector and transmits data, eye lens interface PCB circuit hardboard is used for being connected with the eyepiece circuit of thermal infrared imager, and movement PCB circuit hardboard is used for data processing
Design by such:
Switching PCB circuit hardboard can be made, pros and cons that movement PCB circuit hardboard is carried on pedestal respectively, and eye lens interface PCB circuit hardboard dissociates, only need a pedestal, therefore, the small volume of the band Faradic electricity cage movement circuit for thermal infrared imager that the utility model provides;
The first flexible PCB is selected to connect between movement PCB circuit hardboard, eye lens interface PCB circuit hardboard, select the second flexible PCB to connect between movement PCB circuit hardboard, switching PCB circuit hardboard and can not form electric rosin joint phenomenon, therefore, the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides can avoid the failure problems because electric rosin joint causes;
Length, the width of the first flexible PCB, the second flexible PCB can regulate according to user demand, and therefore, restraining that the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides is subject to when configuration and cabling is also less.
The movement PCB circuit hardboard applied in the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides, by top layer copper sheet, bottom copper sheet, multiple via hole constitutes Faradic electricity cage, it forms a cover in space, this Faradic electricity cage is actually a shield, it can be surrounded whole for the interference source of movement PCB circuit hardboard, it all has absorption energy to from the interference electromagnetic wave of movement PCB circuit hardboard outside and the electromagnetic wave of inside, the effect of reflected energy and inefficient energy, therefore, this Faradic electricity cage can weaken the electromagnetic interference (EMI) from movement PCB circuit hardboard outside effectively, the signal of thermal infrared imager is passed on more accurate, image is more clear.
Accompanying drawing explanation
By reading hereafter detailed description of the preferred embodiment, various other advantage and benefit will become cheer and bright for those of ordinary skill in the art.Accompanying drawing only for illustrating the object of preferred implementation, and is not thought restriction of the present utility model.And in whole accompanying drawing, represent identical parts by identical reference symbol.In the accompanying drawings:
Fig. 1 is the structural representation of publication number thermal infrared imager disclosed in the Chinese invention patent of CN101029846A;
Fig. 2 is in prior art, for the structural representation of the movement circuit of thermal infrared imager;
In the movement circuit of the band Faradic electricity cage for thermal infrared imager that Fig. 3 provides for the utility model embodiment, a typical structure schematic diagram of movement PCB circuit hardboard;
Fig. 4 is the partial enlarged drawing of part A in Fig. 3;
Fig. 5 is the partial enlarged drawing of part B in Fig. 4;
The structural representation of the movement circuit of the band Faradic electricity cage for thermal infrared imager that Fig. 6 provides for the utility model embodiment;
The structural representation of movement circuit after dismounting detector of the band Faradic electricity cage for thermal infrared imager that Fig. 7 provides for the utility model embodiment;
An exemplary view of the movement circuit of the band Faradic electricity cage for thermal infrared imager that Fig. 8 provides for the utility model embodiment;
The structural representation of the detector applied in the movement circuit of the band Faradic electricity cage for thermal infrared imager that Fig. 9 provides for the utility model embodiment;
The card extender applied in the movement circuit of the band Faradic electricity cage for thermal infrared imager that Figure 10 provides for the utility model embodiment and the structural representation of the first flexible PCB be attached thereto;
The structural representation of the detector pedestal applied in the movement circuit of the band Faradic electricity cage for thermal infrared imager that Figure 11 provides for the utility model embodiment;
Another exemplary view (wherein, Faradic electricity cage is not shown) of the movement circuit of the band Faradic electricity cage for thermal infrared imager that Figure 12 provides for the utility model embodiment;
The movement circuit of the band Faradic electricity cage for thermal infrared imager that Figure 13 provides for the utility model embodiment coordinates fast structural representation behind the door.
Embodiment
The utility model be solve the own design configuration of movement circuit of the band Faradic electricity cage for thermal infrared imager that prior art exists, cabling is subject to limiting to, volume is comparatively large, electric rosin joint easily occurs, problem that image definition is not good, provide a kind of movement circuit of the band Faradic electricity cage for thermal infrared imager, its configuration, cabling are restrained less, small volume, not easily electric rosin joint phenomenon are occurred, and imaging effect is better, thus is more suitable for practicality.
For further setting forth the utility model for the technological means reaching predetermined utility model object and take and effect, below in conjunction with accompanying drawing and preferred embodiment, to the movement circuit according to the band Faradic electricity cage for thermal infrared imager that the utility model proposes, its embodiment, structure, feature and effect thereof, be described in detail as follows.In the following description, the not necessarily same embodiment that different " embodiment " or " embodiment " refers to.In addition, special characteristic, structure or feature in one or more embodiment can be combined by any suitable form.
Term "and/or" herein, being only a kind of incidence relation describing affiliated partner, can there are three kinds of relations in expression, such as, A and/or B, concrete is interpreted as: can include A and B simultaneously, can individualism A, also can individualism B, above-mentioned three kinds of any one situations can be possessed.
Embodiment one
See accompanying drawing 5 ~ 12, the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides comprises detector 1, pedestal 2, switching PCB circuit hardboard 3, movement PCB circuit hardboard 4, first flexible PCB 5, second flexible PCB 6, eye lens interface PCB circuit hardboard 7, Faradic electricity cage.Detector 1 is for accepting and reflecting the infrared energy distribution pattern of measured target; Pedestal 2 is for carrying switching PCB circuit hardboard 3, movement PCB circuit hardboard 4; Switching PCB circuit hardboard 3 for detector 1 connection and transmit data; Movement PCB circuit hardboard 3 is for data processing; Eye lens interface PCB circuit hardboard 7 is for being connected with the eyepiece circuit of thermal infrared imager; Movement PCB circuit hardboard 4 is connected to eye lens interface PCB circuit hardboard 7, movement PCB circuit hardboard 4 by the first flexible PCB 5 and is connected to switching PCB circuit hardboard 3 by the second flexible PCB 6; See accompanying drawing 3 ~ 5, Faradic electricity cage comprises top layer copper sheet 41, bottom copper sheet (not shown), multiple via hole 42, top layer copper sheet 41 is laid in the edge of movement PCB circuit hardboard 4 top layer, bottom copper sheet (not shown) is laid in the edge of movement PCB circuit hardboard 4 bottom, top layer copper sheet 41 and bottom copper sheet (not shown) join end to end respectively, and via hole 42 is connected between top layer copper sheet 41 and bottom copper sheet (not shown).
In the present embodiment, the width of top layer copper sheet 41 and bottom copper sheet (not shown) is 1mm, and multiple mistake 42 is connected between top layer copper sheet 41 and the copper sheet (not shown) equably, wherein, via hole 42 more intensive, the effect of this Faradic electricity cage is better.
In the present embodiment, the method for designing of Faradic electricity cage comprises the following steps:
Step 1: when designing movement PCB circuit hardboard 4, lays top layer copper sheet 41 at the top edge of movement PCB circuit hardboard 4, lays bottom copper sheet (not shown) at movement PCB circuit hardboard bottom;
Step 2: design software auxiliary under, complete the design of this Faradic electricity cage, making.
Wherein, design software can be AltiumDesigner.
Wherein, the pad of interpolation is slightly shorter than this movement PCB circuit hardboard plate factory, makes this copper sheet just be laid in top edge and the bottom edges of this movement PCB circuit hardboard.
Wherein, the width of pad can be 1mm.
Wherein, when carrying out optimum configurations to AltiumDesigner, profile is typically chosen in round, network selects NO.NET, and appliance type selects land, and it can be multi-layer that the number of plies is arranged, or monolayer, in the present embodiment, the number of plies is set to monolayer.
In the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides, movement PCB circuit hardboard 4 is connected to eye lens interface PCB circuit hardboard 7 by the first flexible PCB 5, movement PCB circuit hardboard 4 is connected to switching PCB circuit hardboard 3 by the second flexible PCB 6, wherein, switching PCB circuit hardboard 3 for detector 1 connection and transmit data, eye lens interface PCB circuit hardboard 7 is for being connected with the eyepiece circuit of thermal infrared imager, movement PCB circuit hardboard 4 for data processing, the design by such:
Switching PCB circuit hardboard 3 can be made, pros and cons that movement PCB circuit hardboard 4 is carried on pedestal 2 respectively, and eye lens interface PCB circuit hardboard 7 dissociates, only need a pedestal 2, therefore, the small volume of the movement circuit of the band Faradic electricity cage for thermal infrared imager that provides of the utility model;
The first flexible PCB 5 is selected to connect between movement PCB circuit hardboard 4, eye lens interface PCB circuit hardboard 7, select the second flexible PCB 6 to connect between movement PCB circuit hardboard 4, switching PCB circuit hardboard 3 and can not form electric rosin joint phenomenon, therefore, the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides can avoid the failure problems because electric rosin joint causes;
Length, the width of the first flexible PCB 5, second flexible PCB 6 can regulate according to user demand, therefore, restraining that the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides is subject to when configuration and cabling is also less.
The movement PCB circuit hardboard 4 applied in the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model provides, by top layer copper sheet 41, bottom copper sheet (not shown), multiple via hole 42 constitutes Faradic electricity cage, it forms a cover in space, this Faradic electricity cage is actually a shield, it can be surrounded whole for the interference source of movement PCB circuit hardboard 4, it all has absorption energy to from the interference electromagnetic wave of movement PCB circuit hardboard 4 outside and the electromagnetic wave of inside, the effect of reflected energy and inefficient energy, therefore, this Faradic electricity cage can weaken the electromagnetic interference (EMI) from movement PCB circuit hardboard 4 outside effectively, the signal of thermal infrared imager is passed on more accurate, image is more clear.
Wherein, one end of the first flexible PCB 5 is embedded in movement PCB circuit hardboard 4, and the other end of the first flexible PCB 5 is embedded in eye lens interface PCB circuit hardboard 7; One end of second flexible PCB 6 is embedded in movement PCB circuit hardboard 4, and the other end of the second flexible PCB 6 is embedded in switching PCB circuit hardboard 3.In this case, the first flexible cable 5 is more reliable and more stable with the junction of movement PCB circuit hardboard 4, eye lens interface PCB circuit hardboard 7.
Wherein, the material of the first flexible PCB 5, second flexible PCB 6 base material is selected from polyimide or mylar.In the present embodiment, the base material of the first flexible PCB 5 is polyimide, and it has height reliability, excellent pliability, the feature that distribution density is high, lightweight, thickness is thin, bending property is good.
Wherein, the transparent adhesive tape of the first flexible PCB 5, second flexible PCB 6 is selected from epoxy resin or tygon.Epoxy resin or tygon are all hot-setting adhesive.Poly strength ratio is lower, if wish that circuit board is soft, then selects tygon; If wish that circuit board is harder, then select epoxy resin.Base material is thicker with the transparent adhesive tape on it, and circuit board is harder.If the region that circuit board has bending larger, then thinner base material and transparent adhesive tape should be selected to reduce the stress of copper foil surface as far as possible.In the present embodiment, the transparent adhesive tape of the second flexible PCB 6 is tygon, because the second flexible PCB 6 is for the connection between PCB circuit hardboard 3 of transferring, movement PCB circuit hardboard 4, connection distance between them is shorter, and need bending, therefore, tygon transparent adhesive tape is selected can to ensure the buckling performance of this second flexible PCB 6.
Wherein, the Copper Foil of the first flexible PCB 5, second flexible PCB 6 is selected from calendering copper or cathode copper.Calendering copper intensity is high, resistance to bending, but price is more expensive.Cathode copper is low-cost many, but intensity difference, frangibility, is generally used in the occasion of seldom bending.In the present embodiment, the Copper Foil of the second flexible PCB 6 is calendering copper, because the second flexible PCB 6 is for the connection between PCB circuit hardboard 3 of transferring, movement PCB circuit hardboard 4, connection distance between them is shorter, and need bending, therefore, calendering copper is selected can to ensure the buckling performance of this second flexible PCB 6 as Copper Foil.
Wherein, the diaphragm thickness of the first flexible PCB 5, second flexible PCB 6 is 25 μm or 13 μm.The diaphragm of 25 μm can make circuit board harder, but price comparison is cheap.For the circuit board that bending is larger, preferably select the diaphragm of 13 μm.
Wherein, switching PCB circuit hardboard 3 center offers through hole 34, and pedestal 2 center is provided with protruding 24, and the specification of through hole 34 is identical with the specification of protruding 24, and when switching PCB circuit hardboard 3 is installed in pedestal 2, through hole 34 is nested in the periphery of protruding 24.In this case, when switching PCB circuit hardboard 3 is installed in pedestal 2, protruding 24 can be used in positioning it.
Wherein, switching PCB circuit hardboard 3 is provided with the convex pin 32 of the first convex pin 31, second, the 3rd convex pin 33, pedestal is provided with the first groove 21, second groove 22, the 3rd groove 23, when switching PCB circuit hardboard 3 is installed in pedestal 2, first convex pin 31 to be embedded in the first groove 21, second convex pin 32 is embedded in the second groove 22, and the 3rd convex pin 33 is embedded in the 3rd groove 23.In this case, when switching PCB circuit hardboard 3 is installed in pedestal 2, each convex pin 31,32,33 can strictly with each groove 21,22,23 suitable, avoid switching PCB circuit hardboard 3 to connect instead.
Wherein, pedestal 2 is also provided with the 4th groove 26, when switching PCB circuit hardboard 3, movement PCB circuit hardboard 4 are installed in pedestal 2, the 4th groove 26 is for accommodating second flexible PCB 6.In this case, the movement circuit compact conformation of the band Faradic electricity cage for thermal infrared imager assembled can be made, can play a protective role to the second flexible PCB 6 meanwhile.
Embodiment two
See accompanying drawing 13, different from the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model embodiment one provides, the movement circuit of the band Faradic electricity cage for thermal infrared imager that the utility model embodiment two provides also comprises shutter 8, pedestal 2 is provided with the 5th groove 28, and shutter 8 is installed on the 5th groove 28.
Although described preferred embodiment of the present utility model, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the utility model scope.
Obviously, those skilled in the art can carry out various change and modification to the utility model and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present utility model and modification belong within the scope of the utility model claim and equivalent technologies thereof, then the utility model is also intended to comprise these change and modification.
Claims (10)
1. the movement circuit for the band Faradic electricity cage of thermal infrared imager, it is characterized in that, comprise detector, pedestal, switching PCB circuit hardboard, movement PCB circuit hardboard, the first flexible PCB, the second flexible PCB, eye lens interface PCB circuit hardboard, Faradic electricity cage
Described detector is for accepting and reflecting the infrared energy distribution pattern of measured target;
Described pedestal is for carrying switching PCB circuit hardboard, movement PCB circuit hardboard;
Described switching PCB circuit hardboard is used for the connection of described detector and transmits data;
Described movement PCB circuit hardboard is used for data processing;
Described eye lens interface PCB circuit hardboard is used for being connected with the eyepiece circuit of thermal infrared imager;
Described movement PCB circuit hardboard is connected to described eye lens interface PCB circuit hardboard by described first flexible PCB, and described movement PCB circuit hardboard is connected to described switching PCB circuit hardboard by described second flexible PCB;
Described Faradic electricity cage comprises top layer copper sheet, bottom copper sheet, multiple via hole, described top layer copper sheet is laid in the edge of described movement PCB circuit hardboard top layer, described bottom copper sheet is laid in the edge of described movement PCB circuit hardboard bottom, described top layer copper sheet and bottom copper sheet join end to end respectively, and described via hole is connected between described top layer copper sheet and bottom copper sheet.
2. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, is characterized in that,
One end of described first flexible PCB is embedded in described movement PCB circuit hardboard, and the other end of described first flexible PCB is embedded in described eye lens interface PCB circuit hardboard;
One end of described second flexible PCB is embedded in described movement PCB circuit hardboard, and the other end of described second flexible PCB is embedded in described switching PCB circuit hardboard.
3. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, it is characterized in that, the material of described first flexible PCB, the second substrate of flexible circuit board is selected from polyimide or mylar.
4. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, it is characterized in that, the transparent adhesive tape of described first flexible PCB, the second flexible PCB is selected from epoxy resin or tygon.
5. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, is characterized in that, the Copper Foil of described first flexible PCB, the second flexible PCB is selected from calendering copper or cathode copper.
6. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, is characterized in that, the diaphragm thickness of described first flexible PCB, the second flexible PCB is 25 μm or 13 μm.
7. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, it is characterized in that, described switching PCB circuit hardboard center offers through hole, described base central is provided with projection, the specification of described through hole is identical with the specification of described projection, when described switching PCB circuit hardboard is installed in described pedestal, described through hole is nested in the periphery of described projection.
8. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, it is characterized in that, described switching PCB circuit hardboard is provided with the first convex pin, the second convex pin, the 3rd convex pin, described pedestal is provided with the first groove, the second groove, the 3rd groove, when described switching PCB circuit hardboard is installed in described pedestal, described first convex pin is embedded in described first groove, described second convex pin is embedded in described second groove, and described 3rd convex pin is embedded in described 3rd groove.
9. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, it is characterized in that, described pedestal is also provided with the 4th groove, when described switching PCB circuit hardboard, movement PCB circuit hardboard are installed in described pedestal, described 4th groove is used for accommodating described second flexible PCB.
10. the movement circuit of the band Faradic electricity cage for thermal infrared imager according to claim 1, it is characterized in that, also comprise shutter, described pedestal is provided with the 5th groove, and described shutter is installed on described 5th groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520723328.6U CN205079864U (en) | 2015-09-17 | 2015-09-17 | A machine core circuit that what was used for thermal infrared imager takes faradic electricity cage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520723328.6U CN205079864U (en) | 2015-09-17 | 2015-09-17 | A machine core circuit that what was used for thermal infrared imager takes faradic electricity cage |
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| Publication Number | Publication Date |
|---|---|
| CN205079864U true CN205079864U (en) | 2016-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201520723328.6U Active CN205079864U (en) | 2015-09-17 | 2015-09-17 | A machine core circuit that what was used for thermal infrared imager takes faradic electricity cage |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109357769A (en) * | 2018-11-07 | 2019-02-19 | 中国电子科技集团公司第十研究所 | A kind of detector module on focal plane of infrared ray signal processor |
-
2015
- 2015-09-17 CN CN201520723328.6U patent/CN205079864U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109357769A (en) * | 2018-11-07 | 2019-02-19 | 中国电子科技集团公司第十研究所 | A kind of detector module on focal plane of infrared ray signal processor |
| CN109357769B (en) * | 2018-11-07 | 2024-03-29 | 中国电子科技集团公司第十一研究所 | Signal processor of infrared focal plane detector assembly |
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Address after: 101300, No. two, 1 road, Shunyi Park, Zhongguancun science and Technology Park, Beijing, Shunyi District Patentee after: Beijing fujirui Optoelectronic Technology Co.,Ltd. Address before: 100085, Room 302, building 11, No. 4 Anning Road, Beijing, Haidian District Patentee before: BEIJING FJR OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |