CN104465454A - Manufacturing apparatus and manufacturing method of binding device - Google Patents

Manufacturing apparatus and manufacturing method of binding device Download PDF

Info

Publication number
CN104465454A
CN104465454A CN201410462532.7A CN201410462532A CN104465454A CN 104465454 A CN104465454 A CN 104465454A CN 201410462532 A CN201410462532 A CN 201410462532A CN 104465454 A CN104465454 A CN 104465454A
Authority
CN
China
Prior art keywords
mentioned
pressure
sucker
vacuum degree
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201410462532.7A
Other languages
Chinese (zh)
Other versions
CN104465454B (en
Inventor
横田道也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Publication of CN104465454A publication Critical patent/CN104465454A/en
Application granted granted Critical
Publication of CN104465454B publication Critical patent/CN104465454B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Optical Record Carriers (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Securing Of Glass Panes Or The Like (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention provides a manufacturing apparatus and a manufacturing method of a binding device. A pair of base plates are overlapped in a pressure-variating chamber with the pressure being reduced to a second vacuum degree so that a sucking pressure of one sucking disk onto one base plate is increased from a first vacuum degree to the second vacuum degree so that the sucking pressure of the one sucking disk and the internal pressure of the pressure-variating chamber are formed into an equal second vacuum degree to eliminate vacuum adsorption from pressure difference of a sucking disk surface of the one sucking disk onto the one base plate. Then the internal pressure of the pressure-variating chamber and the sucking force on the one sucking disk is increased from a second vacuum degree to a third vacuum degree, thereby compressing and deforming an unhardened sealing material by means of the pressure difference between a third vacuum degree in the pressure-variating chamber and the second vacuum degree between the base paltes. The surface of one base plates is fall off from the sucking surface of the one sucking disk, and then the internal pressure of the pressure-variating chamber and the sucking pressure of the one sucking disk is incrased from the third vacuum degree to atmosphere pressure, thereby fitting the base plates with the pressure difference at a required interval.

Description

The manufacturing installation of laminating device and manufacture method
Technical field
The present invention relates to the manufacturing installation of laminating device and the manufacture method of laminating device, for the substrate such as Liquid Crystal Module (LCM), flexible printing patch panel (FPC) such relative to the flat-panel screens (FPD) such as such as liquid crystal display (LCD), OLED display (OLED), plasma display (PDP), flexible display, senser element or such as touch-screen type FPD, 3D (three-dimensional) display, e-book etc., another plate bases such as laminating touch-screen, cover glass, coverlay, FPD.
Background technology
Before, as manufacturing installation and the manufacture method of this laminating device, be wafer and cover this wafer overlay forward surface one or both on apply the bonding agent of certain altitude, wafer and overlay overlap is made in the enclosure space of decompression, form the seal cavity surrounded by above-mentioned bonding agent between which, then, by above-mentioned enclosure space towards atmosphere opening, make and produce pressure differential between pressing in above-mentioned seal cavity, utilize this pressure differential, entirety is carried out to above-mentioned wafer and above-mentioned overlay and pressurizes (for example, see patent documentation 1) equably.Like this, bonding agent is crushed, and forms predetermined gap, do not need distance piece between above-mentioned wafer and above-mentioned overlay, and wafer and overlay just can be made to fit abreast at certain intervals.
In addition, the gas volume in above-mentioned seal cavity is sealed to when calculating overlap according to the area in the coating of above-mentioned bonding agent height and the above-mentioned seal cavity that surrounded by this bonding agent, simultaneously, calculate and above-mentioned wafer and above-mentioned overlay are fitted and the volume flattened at both intervals to the sealing gas in above-mentioned seal cavity during required gap, thus set the interior pressure of above-mentioned seal cavity so that produce when the atmosphere opening of above-mentioned enclosure space above-mentioned overlapping time sealing gas volume be compressed to pressure differential needed for the sealing gas volume after above-mentioned laminating.Like this, the gap between wafer and overlay can be regulated according to calculated value in advance.
Patent documentation 1: Japanese Patent No. 4373491 publication
Summary of the invention
The problem that invention will solve
As the ultraviolet ray hardening type of bonding agent use, the encapsulant of thermmohardening type, be coated in same height in the mode of surrounding seal cavity along all-round.As the coating example of encapsulant, as shown in Figure 12 (a) ~ (c), relative to as the upper substrate 1 ' of wafer, overlay and infrabasal plate 2 ', multiple seal cavity 3s ' is configured every predetermined space, after its laminating, be partitioned into the device use that each seal cavity 3s ' is hermetically sealed.Under these circumstances, in order to conscientiously form seal cavity 3s ' in each device, the coating of encapsulant 3 ' highly must be roughly consistent.
Therefore, as shown in Figure 12 (a), when the coating of encapsulant 3 ' highly produces difference, the stack height of upper substrate 1 ' and infrabasal plate 2 ' is as shown in Figure 12 (b), as long as there is an encapsulant 3 ' not contact upper substrate 1 ', stack height just not.That is, as shown in Figure 12 (c), with sucker 11 ', upper substrate 1 ' vacuum suction must be landed towards infrabasal plate 2 ' close to moving to the position contacted all respectively with whole encapsulant 3 '.
But, as shown in Figure 12 (c), when most encapsulant 3 ' is expressed to the position of flattening by the upper substrate 1 ' that upper sucker 11 ' vacuum suction, because the sucker face of upper sucker 11 ' and the surface of upper substrate 1 ' are touched, so, the surface of upper substrate 1 ' can not be made to depart from the sucker face of upper sucker 11 '.In this condition, even if created pressure differential by between the seal cavity 3s ' of encapsulant 3 ' encirclement and the transformation room 10 ' as enclosure space, can not overall pressurization equably be carried out to upper substrate 1 ' and infrabasal plate 2 ' and make it to fit with predetermined gap.
That is, if the sucker face of upper sucker 11 ' can not be separated with the surface of the upper substrate 1 ' of overlap condition and form gap between the two, just there is the problem that pressure official post upper substrate 1 ' and infrabasal plate 2 ' can not be utilized to fit with predetermined gap.
Therefore, in order to solve this problem, once considering to spray the fluid such as compressed air from the face up surface of substrate 1 ' of the sucker of upper sucker 11 ', forcibly making the sucker face of sucker 11 ' be separated with the surface of the upper substrate 1 ' of overlap condition.
But unhardened encapsulant 3 ' exceedingly flattens and causes the disorder of application pattern shape or cause because excessively flattening the solid constituents such as the interior contained filler of encapsulant 3 ' to be separated the anxiety of such other problem with liquid component by the injection that this compulsory point of defection produces fluid.In addition, the transformation room 10 ' of having reduced pressure interior from the sucker face of sucker 11 ' spray the fluid such as compressed air time, in the pipeline of upper sucker 11 ', transformation room 10 ' is interior can produce strong air vibration, may produce mechanical oscillation to by the upper substrate 1 ' adsorbed.
The present invention, to solve the problem as problem, its objective is and realizes not making side's sucker be separated with side's substrate of overlap condition thus can not cause the laminating etc. between the substrate of the disorder of encapsulant shape with not applying any impact on unhardened encapsulant.
Solve the technical scheme of problem
To achieve these goals, the manufacturing installation of laminating device of the present invention, make a pair substrate overlapping in the transformation indoor of having reduced pressure, the seal cavity surrounded by unhardened encapsulant is formed between this is to substrate, utilize the pressure differential produced between the interior pressure after the atmosphere opening of above-mentioned transformation room and above-mentioned seal cavity, aforesaid substrate entirety is pressurizeed equably, made it fit with predetermined gap, the feature of the manufacturing installation of above-mentioned laminating device is to have: above-mentioned transformation room, accommodates the aforesaid substrate of freely coming in and going out in above-mentioned transformation indoor, a pair sucker, indoor in above-mentioned transformation, sandwich the mode of above-mentioned encapsulant with aforesaid substrate, freely adsorb maintenance aforesaid substrate with loading and unloading respectively with the first vacuum degree, driving mechanism, being decompressed to, the above-mentioned transformation than the second vacuum degree of above-mentioned first vacuum degree high pressure is indoor, makes either one or both in above-mentioned sucker in Z-direction relatively close to mobile and make aforesaid substrate overlapping, first suction pressure governor motion, carries out pressure adjustment to the suction pressure of either party of above-mentioned sucker, second suction pressure governor motion, carries out pressure adjustment to the suction pressure of the opposing party of above-mentioned sucker, room pressure governor motion, is adjusted to predetermined Vacuum Pressure by pressing in above-mentioned transformation room from atmospheric environmental pressure, and control part, respectively action control is carried out to above-mentioned driving mechanism, above-mentioned first suction pressure governor motion, above-mentioned second suction pressure governor motion and above-mentioned room pressure governor motion, above-mentioned control part controls as follows, above-mentioned driving mechanism is utilized to make aforesaid substrate indoor overlapping in the above-mentioned transformation of above-mentioned second vacuum degree, the above-mentioned seal cavity surrounded by unhardened above-mentioned encapsulant is formed between aforesaid substrate, then, utilize above-mentioned first suction pressure governor motion, above-mentioned first vacuum degree when making the suction pressure of either party of above-mentioned sucker overlapping from aforesaid substrate to than its high pressure and with above-mentioned transformation room in press impartial above-mentioned second vacuum degree to rise, then, utilize above-mentioned first suction pressure governor motion and above-mentioned room pressure governor motion, the interior pressure of the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room is made to rise to respectively than its high pressure from above-mentioned second vacuum degree and compare the 3rd vacuum degree that atmospheric pressure is negative pressure, then, 3rd vacuum degree is kept the scheduled time, the unhardened above-mentioned encapsulant compression of pressure official post of the above-mentioned seal cavity between utilization and aforesaid substrate is to make a side of aforesaid substrate leave the sucker face of either party of above-mentioned sucker, have left the sucker face of a side of above-mentioned sucker a side of aforesaid substrate after, the interior pressure of the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room is made to rise to atmospheric pressure from above-mentioned 3rd vacuum degree.
The manufacture method of laminating device of the present invention, a pair sucker relatively moved freely towards direction close to each other is provided with in transformation indoor, relative to above-mentioned sucker, the mode of unhardened encapsulant is sandwiched with a pair substrate, maintenance a pair substrate is freely adsorbed with loading and unloading respectively with the first vacuum degree, being decompressed to, the above-mentioned transformation than the second vacuum degree of above-mentioned first vacuum degree high pressure is indoor, utilize the overlapping close to the mobile aforesaid substrate that makes of above-mentioned sucker, the seal cavity surrounded by above-mentioned encapsulant is formed between aforesaid substrate, utilize the pressure differential produced between the interior pressure after the atmosphere opening of above-mentioned transformation room and above-mentioned seal cavity, aforesaid substrate entirety is pressurizeed equably, it is made to fit with predetermined gap, the feature of the manufacture method of above-mentioned laminating device is, comprise: pressure equalization operation, after aforesaid substrate overlap, make above-mentioned sucker either party overlapping from aforesaid substrate to the suction pressure of either party of aforesaid substrate time above-mentioned first vacuum degree rise to above-mentioned second vacuum degree than its high pressure, make it to press equalization with the above-mentioned interior of above-mentioned transformation room, the absorption of the side to aforesaid substrate that pressure relief difference causes keeps, boosting operation, after above-mentioned pressure equalization operation, makes the suction pressure of either party of above-mentioned sucker and the interior pressure of above-mentioned transformation room rise to respectively than above-mentioned second vacuum degree high pressure and compares the 3rd vacuum degree that atmospheric pressure is negative pressure, standby operation, after above-mentioned boosting operation, the 3rd vacuum degree is remained on the scheduled time by pressing in the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room, the pressure differential of the above-mentioned seal cavity of above-mentioned second vacuum degree between utilization and aforesaid substrate, make unhardened above-mentioned encapsulant compression, make a side of aforesaid substrate leave a side of above-mentioned sucker, and atmosphere opening operation, after a side of aforesaid substrate have left a side of above-mentioned sucker in above-mentioned boosting operation, the interior pressure of above-mentioned transformation room and the suction pressure of either party of above-mentioned sucker is made to rise to atmospheric pressure from above-mentioned 3rd vacuum degree, utilize the pressure differential with above-mentioned seal cavity, aforesaid substrate is fitted with predetermined gap.
Invention effect
There is manufacturing installation and the manufacture method of the laminating device of the present invention of above-mentioned feature, the transformation being decompressed to the second vacuum degree indoor by a pair substrate overlap after, side's sucker is made to increase to second vacuum degree of the suction pressure of side's substrate from the first vacuum degree to the transformation room than its high pressure, thus press to the second impartial vacuum degree in the suction pressure of side's sucker and transformation room, so, that the pressure differential in the sucker face of origin My World sucker causes, the vacuum suction of side's substrate is removed.Then, the suction pressure of the interior pressure of transformation room and side's sucker is made to rise to than its high pressure from the second vacuum degree and compare the 3rd vacuum degree that atmospheric pressure is negative pressure, thus utilize the pressure differential of the enclosure space of the 3rd of transformation indoor the second vacuum degree between vacuum degree and substrate, make unhardened encapsulant compression, the surface of side's substrate departs from the sucker face of side's sucker.Then, make the suction pressure of the interior pressure of transformation room and side's sucker rise to atmospheric pressure from the 3rd vacuum degree, thus fit with predetermined gap by pressure official post substrate.
Therefore, side's sucker is separated with side's substrate of overlap condition, and does not apply any impact to unhardened encapsulant, so, the bonded to each other of the substrate of the shape not upsetting encapsulant can be realized.
As a result, even if the height of sealing exists deviation, also can utilize pressure differential, substrate is fitted with predetermined gap.
And, with spray the fluids such as compressed air from sucker towards substrate surface and forcibly carry out compared with the method that is separated, unhardened encapsulant is not excessively flattened, in the suction pipeline that can prevent being separated of the solid constituent of the disorder of the application pattern shape of encapsulant, the filler contained by encapsulant etc. and liquid component, side's sucker and the generation of the air vibration of transformation indoor, the raising of the Anawgy accuracy of substrate can be realized.
Accompanying drawing explanation
Fig. 1 is the key diagram of the manufacturing installation unitary construction of the laminating device representing embodiment of the present invention, is the vertical profile front elevation of the adsorbed state representing the substrate be transported into.
Fig. 2 is also above-mentioned key diagram, is the vertical profile front elevation of the state representing overlapping step.
Fig. 3 is also above-mentioned key diagram, is the vertical profile front elevation of the state representing pressure equalization operation.
Fig. 4 is also above-mentioned key diagram, is the vertical profile front elevation of the state represented at the end of pressure equalization operation.
Fig. 5 is also above-mentioned key diagram, is the vertical profile front elevation of the state representing boosting operation.
Fig. 6 is also above-mentioned key diagram, is the vertical profile front elevation of the state representing atmosphere opening operation.
Fig. 7 is also above-mentioned key diagram, is the vertical profile front elevation of state when representing that substrate transports.
Fig. 8 is the time diagram of the manufacture method of the laminating device of embodiment of the present invention.
Fig. 9 represents the key diagram of the unitary construction of the manufacturing installation of the laminating device of another embodiment of the present invention, is the vertical profile front elevation of the state representing boosting operation.
Figure 10 is also above-mentioned key diagram, is the vertical profile front elevation of the state representing atmosphere opening operation.
Figure 11 is the time diagram of the manufacture method of the laminating device of further embodiment of this invention.
Figure 12 is the key diagram of the coating example representing encapsulant, and (a) is the front elevation before substrate overlap, and (b) is the front elevation in overlapping way, and (c) is the front elevation after overlap.
The explanation of Reference numeral
A ... laminating device, 1 ... substrate (upper substrate), 2 ... substrate (infrabasal plate), 3 ... encapsulant, 3s ... seal cavity, B ... manufacturing installation, 10 ... transformation room, 11 ... sucker (upper sucker), 12 ... sucker (lower sucker), 13 ... driving mechanism, 14a ... first suction pressure governor motion, 14b ... suction pipeline, 14d ... contact pipeline, 15 ... second suction pressure governor motion, 16 ... room pressure governor motion, 16b ... gas exhaust piping, 17 ... control part, P1 ... the suction pressure of one side's sucker, P2 ... the interior pressure of transformation room, S2 ... pressure equalization operation, S4 ... boosting operation, S6 ... atmosphere opening operation
Embodiment
Below, the execution mode that present invention will be described in detail with reference to the accompanying.
The manufacturing installation B of the laminating device A of embodiment of the present invention and manufacture method, as shown in Fig. 1 ~ Figure 11, in transformation room 10, a pair sucker 11,12 can be provided with relatively moving freely in a direction close to each other, relative to sucker 11,12, with sandwich be located at a pair substrate 1,2 either one or both on mode first vacuum degree of unhardened encapsulant 3 releasably adsorb maintenance a pair substrate 1,2, being decompressed in the transformation room 10 than the second vacuum degree of the first vacuum degree high pressure, utilize the substrate 1,2 is overlapping close to moving of sucker 11,12.Between the substrate 1,2 of this overlap, form the seal cavity 3s surrounded by encapsulant 3, utilize in the atmosphere opening of transformation room 10, press the pressure differential produced between P2 and seal cavity 3s, substrate 1,2 entirety is pressurizeed equably and substrate 1,2 is fitted with predetermined gap.
Specifically, the manufacturing installation B of the laminating device A of embodiment of the present invention, as shown in Fig. 2 ~ Fig. 8 and Figure 10, Figure 11, has as main composition key element: transformation room 10, and a pair substrate 1,2 can be housed in this transformation room 10 with coming in and going out; A pair sucker 11,12, is arranged to releasably adsorb maintenance a pair substrate 1,2 to sandwich unhardened encapsulant 3 in transformation room 10; Driving mechanism 13, is configured to make either one or both in sucker 11,12 in Z-direction relatively close to mobile; First suction pressure governor motion 14, carries out pressure adjustment to the suction pressure of either party of sucker 11,12; Second suction pressure governor motion 15, carries out pressure adjustment to the suction pressure of the opposing party of sucker 11,12; Room pressure governor motion 16, is adjusted to predetermined Vacuum Pressure by transformation room 10 from atmospheric environmental pressure; And control part 17, respectively action control is carried out to driving mechanism 13, first suction pressure governor motion 14, the second suction pressure governor motion 15 of these suckers 11,12 and room pressure governor motion 16 etc.
Substrate 1,2 is such as such thin plate-shaped structure body being become to be integrated by multiple assembling parts such as FPD, senser element.
One side's substrate 1 is such as touch-screen, cover glass, coverlay etc., is formed FPD, senser element etc. by bonding to cover the opposing party's substrate 2.
And substrate 1,2, as shown in Fig. 1 ~ Fig. 7 and Fig. 9, Figure 10, usually along Z-direction (above-below direction) configuration, calls the substrate 1 of top " upper substrate 1 " below, the substrate 2 of below is called " infrabasal plate 2 ".
Encapsulant 3 can adopt the unhardened or semi-harden mobility with energy compression, the luminous energy absorbing ultraviolet etc. carries out being polymerized and the ray hardening type adhesive of the cementability that hardens, presents, undertaken being polymerized by the absorption of heat energy and the thermmohardening type bonding agent hardened, two liquid mixed hardening type bonding agents etc.
As the collocation method of encapsulant 3, preferably, before the overlap of upper substrate 1 and infrabasal plate 2, the forward surface of upper substrate 1 and infrabasal plate 2 either one or both on, such as with the quantitative ozzle of distributor etc., frame-shaped encapsulant 3 being applied as reservation shape forms seal cavity 3s to divide within it, along surrounding the all-round of seal cavity 3s, configures continuously with roughly the same height.After the laminating of upper substrate 1 and infrabasal plate 2, preferably, by making it harden with such as Ultraviolet radiation, heating etc.In addition, as other example, also encapsulant 3 can be configured by printing etc.
As the configuration of encapsulant 3, as shown in Fig. 1 ~ Fig. 7 and Fig. 9, Figure 10, preferably, on upper substrate 1 and infrabasal plate 2, configure multiple seal cavity 3s every predetermined space, after its laminating, be partitioned into the device use that each seal cavity 3s is hermetically sealed.
Transformation room 10 is formed in the inside of chamber 10a, the entirety of chamber 10a or a part can openedly and closedly be formed, making to come in and go out between transformation room 10 in chamber 10a of upper substrate 1 and infrabasal plate 2 and the space outerpace of chamber 10a by conveyers (not shown) such as such as transportation manipulators.Specifically, in atmospheric environment, conveyer is transported into upper substrate 1 and infrabasal plate 2 the transformation room 10 in chamber 10a respectively, and the laminating device A after upper substrate 1 and infrabasal plate 2 have been fitted transports.
As the concrete example of chamber 10a, as shown in Fig. 1 ~ Fig. 7 and Fig. 9, Figure 10, a part of chamber 10a is arranged can the door 10b of freely openable, thus be configured to transformation room 10 can freely openable and the structure of sealing.
In addition, as other example (not shown), also shutter door mode can be substituted, and by chamber 10a in Z-direction segmentation (not shown), by making its close to each other or remotely reciprocating motion in Z-direction, transformation room 10 is become can freely openable and sealing structure.
In the inside of chamber 10a, being provided with respectively can at Z-direction reciprocating holding member 11a and holding member 12a.Holding member 11a has the sucker 11 of detachably vacuum suction upper substrate 1.Holding member 12a has the sucker 12 of detachably vacuum suction infrabasal plate 2.
Below, the sucker 11 of upper substrate 1 is called " upper sucker ", the holding member 11a with upper sucker 11 is called " upper holding member ".Below, the sucker 12 of infrabasal plate 2 is called " lower sucker ", the holding member 12a with lower sucker 12 is called " lower holding member ".
Upper holding member 11a and lower holding member 12a is made up of the flat platform etc. such as utilizing the rigid body such as metal, pottery to be formed as the thickness of not buckle, and its forward surface is located in chamber 10a in parallel to each other with in Z-direction in opposite directions.
The forward surface of upper holding member 11a is provided with sucker 11, the forward surface of lower holding member 12a is provided with lower sucker 12.And the forward surface of upper holding member 11a and lower holding member 12a has not because upper sucker 11, lower sucker 12 carry out vacuum attraction and produce the adsorption structure of twisted such fine holes, groove at upper substrate 1, infrabasal plate 2.
In addition, on the forward surface of upper holding member 11a and lower holding member 12a, except upper sucker 11, lower sucker 12, as required, also bonding sucker, electrostatic chuck etc. can be set.
Either party or the upper holding member 11a of upper holding member 11a or lower holding member 12a and lower holding member 12a both sides, can be bearing on the wall of chamber 10a in Z-direction with moving freely, and connects and arrange driving mechanism 13.
Driving mechanism 13 is made up of actuator etc., when upper substrate 1 and infrabasal plate 2 are overlapping, utilizes control part 17 described later to carry out action control, with make upper holding member 11a or lower holding member 12a either one or both in Z-direction relatively close to mobile.
In addition, upper holding member 11a or lower holding member 12a either one or both on, there is contraposition drive division (not shown), by making upper holding member 11a and lower holding member 12a in XY θ direction relative movement by upper substrate 1 and infrabasal plate 2 contraposition.
On upper sucker 11, be provided with the first suction pressure governor motion 14 its suction pressure P1 being adjusted to predetermined vacuum level from atmospheric environment.
First suction pressure governor motion 14, preferably, adopt the vacuum governor etc. of electric empty control formula, in a planned way boost to atmospheric process from vacuum pressure when upper substrate 1 and infrabasal plate 2 overlap, in advance by the decompression desired value that boosting curve setting is from 1 point-to-multipoint stage, thus control from vacuum pressure to the rate of pressure rise of atmospheric boost process.
Specifically, the first suction pressure governor motion 14 has the first suction pipeline 14b and first flow adjusting portion 14c.First suction pipeline 14b attracts source 14a to be communicated with from the sucker of upper sucker 11 facing to vacuum pump etc.First flow adjusting portion 14c is located in the way of the first suction pipeline 14b.
First flow adjusting portion 14c by opening and closing first suction pipeline 14b open and close valve, regulate and formed by the voltage regulator etc. of flow.
On lower sucker 12, be provided with the second suction pressure governor motion 15 for its suction pressure to be adjusted to predetermined vacuum level from atmospheric environment.
Second suction pressure governor motion 15 has the second suction pipeline 15b and the second flow control division 15c.Second suction pipeline 15b attracts source 14a to be communicated with from the sucker of lower sucker 12 facing to such as vacuum pump etc.Second flow control division 15c is located in the way of the second suction pipeline 15b.
Second flow control division 15c is made up of the open and close valve etc. of opening and closing second suction pipeline 15b.
As the concrete example of upper sucker 11 and lower sucker 12, as shown in Fig. 1 ~ Fig. 7 and Fig. 9, Figure 10, be configured to upper substrate 1 and infrabasal plate 2 overlapping after upper substrate 1 to depart from the sucker face of sucker 11 by gravity.
In addition, as other example (not shown), the sucker face of sucker 12 under upper substrate 1 and the overlapping rear infrabasal plate 2 of infrabasal plate 2 depart from also can be configured to.
And the first suction pressure governor motion 14 of upper sucker 11, also can press the gas exhaust piping 16b of governor motion 16 to be communicated with aftermentioned room via contact pipeline 14d.Be provided with in the way of contact pipeline 14d and all press adjusting portion 14e, all pressures open and close valve etc. of all pressing adjusting portion 14e to get in touch with pipeline 14d by opening and closing is formed.
First suction pressure governor motion 14 of upper sucker 11 and the second suction pressure governor motion 15 of lower sucker 12 carry out action control by control part 17 described later respectively, set the upper suction pressure P1 of sucker 11 and the suction pressure of lower sucker 12 respectively as follows.
When upper substrate 1 and infrabasal plate 2 overlap, the suction pressure P1 of upper sucker 11 and the suction pressure of lower sucker 12 are set to the first vacuum degree respectively.After upper substrate 1 and infrabasal plate 2 overlap, the suction pressure P1 of upper sucker 11 be set to from the first vacuum degree to than its high pressure the second vacuum degree, from the second vacuum degree to than its high pressure and than atmospheric pressure low pressure the 3rd vacuum degree, periodically boost to atmospheric pressure from the 3rd vacuum degree.
The suction pressure of lower sucker 12 is set to, and completing, becomes laminating device A and before transporting from transformation room 10, remain the first vacuum degree, boosting to atmospheric pressure when being about to transport quickly in the laminating of upper substrate 1 and infrabasal plate 2.
As the concrete example of these first vacuum degrees, the second vacuum degree, the 3rd vacuum degree, as shown in Figure 8 and Figure 11, first vacuum degree is such as the high vacuum pressure (hereinafter referred to " high vacuum pressure ") before and after 10,000 Pa or 10,000 Pa, second vacuum degree is such as the middle Vacuum Pressure (hereinafter referred to " middle Vacuum Pressure ") before and after 50,000 Pa or 50,000 Pa, and the 3rd vacuum degree is such as the low vacuum pressure (hereinafter referred to " low vacuum pressure ") before and after 70,000 Pa or 70,000 Pa.
Here, atmospheric pressure is about 100,000 Pa.
On the other hand, to the chamber 10a room of being provided with pressure governor motion 16.This room pressure governor motion 16 is communicated with transformation room 10, for will P2 be pressed in it to be adjusted to predetermined vacuum degree from atmospheric environment.
Room pressure governor motion 16 has exhaust line 16b and room pressure adjusting portion 16c.Exhaust line 16b is communicated with from transformation room 10 towards exhaust source 16a such as such as vacuum pumps.Room pressure adjusting portion 16c is located in the way of exhaust line 16b.
Room pressure adjusting portion 16c by opening and closing exhaust line 16b open and close valve, regulate and formed by the voltage regulator etc. of flow, carry out action control by aftermentioned control part 17, set the interior pressure P2 of transformation room 10 as follows.
When upper substrate 1 and infrabasal plate 2 overlap, the interior pressure P2 of transformation room 10 is set to the second vacuum degree (middle Vacuum Pressure) than the first vacuum degree (high vacuum pressure) high pressure.After upper substrate 1 and infrabasal plate 2 overlap, the interior pressure P2 of transformation room 10 is set to, and through comparing than the second vacuum degree (middle Vacuum Pressure) high pressure the 3rd vacuum degree (low vacuum pressure) that atmospheric pressure is negative pressure, periodically boosts to atmospheric pressure.
And, press on the exhaust line 16b of governor motion 16 at the suction pipeline 14b of upper sucker 11, the suction pipeline 15b of lower sucker 12 and the room that is communicated with transformation room 10, preferably arrange and make the negative pressure in each pipeline towards the breather valve of atmosphere opening.
In illustrated example, via getting in touch with on exhaust line 16b that pipeline 14d is communicated with the suction pipeline 14b of upper sucker 11, transformation room 10, be configured with breather valve 16d.On the suction pipeline 15b of lower sucker 12, be configured with breather valve 15d.
Control part 17 is controllers, not only with sucker 11, the driving mechanism 13 of 12, the first flow adjusting portion 14c of the first suction pressure governor motion 14 of upper sucker 11, all press adjusting portion 14e, second flow control division 15c of the second suction pressure governor motion 15 of lower sucker 12, the room pressure adjusting portion 16c of the room pressure governor motion 16 of transformation room 10, with breather valve 16d, 15d is electrically connected, and with the conveyer making upper substrate 1 and infrabasal plate 2 in and out of above-mentioned transformation room 10, make upper substrate 1 and infrabasal plate 2 towards the contraposition drive division of XY θ direction relative movement, the electrical connections such as the sclerosis mechanism that encapsulant 3 is hardened.
The control of control part 17 to the first suction pressure governor motion 14 of upper sucker 11 is preferably as follows to be carried out: the vacuum pressure when overlapping from upper substrate 1 and infrabasal plate 2 until atmospheric pressure stage boost process in, in order to make the surface of sucker emaciated face from upper substrate 1 of upper sucker 11, the dead slow speed degree of all pressing of P2 is pressed to start to depart from, to prevent from producing negative pressure in disengaging face with considering in the inside in this sucker face and transformation room 10.
As the controller of control part 17, according to the program be set in advance in its control circuit (not shown), carry out action control successively with the time preset.
Specifically, control part 17 controls like this: under substrate 1,2 clips the state of encapsulant 3 by driving mechanism 3 overlap, with the first suction pressure governor motion 14, second vacuum degree of suction pressure P1 from the first vacuum degree towards the transformation room 10 than its high pressure of either party (upper sucker 11) of sucker 11,12 is made to increase; Then, with the first suction pressure governor motion 14 and room pressure governor motion 16, make sucker 11,12 either party suction pressure P1 and the interior pressure P2 of transformation room 10 to rise to respectively than the second vacuum degree high pressure in transformation room 10 and compare atmospheric pressure be after the 3rd vacuum degree of negative pressure, rise to atmospheric pressure from the 3rd vacuum degree.
Below, as the manufacture method of producing laminating device A, the program be set in the control circuit of control part 17 is described.
For the manufacture method of the laminating device A of present embodiment, comprise as master operation: the overlapping step S1 of upper substrate 1 and infrabasal plate 2; Pressure equalization operation S2, makes the suction pressure P1 of either party (upper sucker 11) of sucker 11 or lower sucker 12 rise from the first vacuum degree (high vacuum pressure) towards the second vacuum degree (middle Vacuum Pressure); Boosting operation S4, makes the suction pressure P1 of either party (upper sucker 11) in the interior pressure P2 of transformation room 10 and upper sucker 11 or lower sucker 12 rise to the 3rd vacuum degree (low vacuum pressure); And atmosphere opening operation S6, make the suction pressure P1 of either party (upper sucker 11) in the interior pressure P2 of transformation room 10 and upper sucker 11 or lower sucker 12, rise to atmospheric pressure (low vacuum pressure).
Especially, in boosting operation S4, preferably make the suction pressure P1 of either party (upper sucker 11) in the interior pressure P2 of transformation room 10 and upper sucker 11 or lower sucker 12, rise gradually towards the 3rd vacuum degree (low vacuum pressure) from the second vacuum degree (middle Vacuum Pressure).
In addition, the suction pressure of the opposing party's (lower sucker 12) of upper sucker 11 or lower sucker 12, from overlapping step S1 to pressure equalization operation S2, boosting operation S4, atmosphere opening operation S6 whole operations in, remain the first vacuum degree (high vacuum pressure).
In addition, between pressure equalization operation S2 and boosting operation S4, the first standby operation S3 can also be comprised.At this first standby operation S3, the suction pressure P1 of either party in upper sucker 11 or lower sucker 12 is kept the scheduled time.
Between boosting operation S4 and atmosphere opening operation S6, preferably also comprise the second standby operation S5.Second treating mechanism operation S5 at this, keeping the scheduled time by pressing the suction pressure P1 of either party in P2 and upper sucker 11 or lower sucker 12 in transformation room 10.
Namely, preferably be controlled to: make the suction pressure P1 of either party and the interior pressure P2 of transformation room 10 in sucker 11 or lower sucker 12, after rising to the 3rd vacuum degree (low vacuum pressure) respectively, 3rd vacuum degree (low vacuum pressure) is kept the scheduled time, then, atmospheric pressure is risen to from the 3rd vacuum degree (low vacuum pressure).
As the manufacture method concrete example of laminating device A, first, as shown in Figure 1, upper substrate 1 and infrabasal plate 2 are transported into from outside towards the upper sucker 11 in transformation room 10 and lower sucker 12 respectively.In this moment, upper sucker 11 and lower sucker 12, by the action of driving mechanism 13, carry out away from movement in Z-direction.
Open the open and close valve of the first flow adjusting portion 14c as the first suction pressure governor motion 14, the suction pressure P1 of upper sucker 11 is adjusted to the first vacuum degree (high vacuum pressure) by voltage regulator pressure.Open the open and close valve of the second flow control division 15c as the second suction pressure governor motion 15, the suction pressure of lower sucker 12 is adjusted to the first vacuum degree (high vacuum pressure) by pressure.Like this, upper substrate 1 and infrabasal plate 2 can not be remain by upper sucker 11 and lower sucker 12 absorption with the first vacuum degree (high vacuum pressure) respectively movably.
In addition, after transformation room 10 becomes air-tight state, open the vent valve of the pressure regulating part 16c as room pressure governor motion 16, the interior pressure P2 of transformation room 10 is reduced pressure to than second vacuum degree (middle Vacuum Pressure) of the first vacuum degree (high vacuum pressure) high pressure by voltage regulator.Therefore, upper substrate 1 does not fall from the sucker face of upper sucker 11 and does not misplace in XY direction, and meanwhile, infrabasal plate 2 does not misplace in XY direction on the sucker face of lower sucker 12.
Then, in the overlapping step S1 shown in Fig. 2, in the transformation room 10 being depressurized to the second vacuum degree (middle Vacuum Pressure), action by driving mechanism 13 makes upper sucker 11 and lower sucker 12 in Z-direction relatively close to mobile, and it is overlapping in Z-direction that upper substrate 1 and infrabasal plate 2 clip encapsulant 3 ground.
Like this, between upper substrate 1 and infrabasal plate 2, form the seal cavity 3s surrounded by encapsulant 3, the pressure in seal cavity 3s is the second vacuum degree (middle Vacuum Pressure).
Then, in the pressure equalization operation S2 shown in Fig. 3, as on the state opened of the open and close valve of first flow adjusting portion 14c of sucker 11, by the action of the first flow adjusting portion 14c of the first suction pressure governor motion 14 of upper sucker 11, the suction pressure P1 of the upper sucker 11 of absorption upper substrate 1 is made to rise to the second vacuum degree (middle Vacuum Pressure) than its high pressure from the first vacuum degree (high vacuum pressure).
At the end of pressure equalization operation S2, as shown in Figure 4, the first suction pressure governor motion 14 of upper sucker 11 is preferably controlled to and the suction pipeline 14b of sucker 11 is communicated with the gas exhaust piping 16b contact path 14d of transformation room 10.
Like this, the suction pressure P1 of upper the sucker 11 and interior pressure P2 of transformation room 10 becomes impartial the second vacuum degree (middle Vacuum Pressure) respectively.Therefore, when to this time, that the pressure differential from the sucker face of upper sucker 11 causes, the vacuum suction of upper substrate 1 is removed.
And, in order to remove the vacuum suction to upper substrate 1 effectively, preferably using the first standby operation S3, after a predetermined time, remaining on the second vacuum degree (middle Vacuum Pressure) by pressing P2 in the suction pressure P1 of upper sucker 11 and transformation room 10.
Then, in the boosting operation S4 shown in Fig. 5, by the voltage regulator of the pressure regulating part 16c as room pressure governor motion 16, the interior pressure P2 of transformation room 10 is made to rise to than its high pressure from the second vacuum degree (middle Vacuum Pressure) and compare the 3rd vacuum degree (low vacuum pressure) that atmospheric pressure is negative pressure.
Meanwhile, by the action of the first flow adjusting portion 14c of the first suction pressure governor motion 14, all pressure adjusting portion 14e, the suction pressure P1 of sucker 11 is made to rise to the 3rd vacuum degree (low vacuum pressure) from the second vacuum degree (middle Vacuum Pressure).
As its concrete example, when illustrated example, the first flow adjusting portion 14c of upper sucker 11 is controlled so as to, be communicated with via contact pipeline 14d by the gas exhaust piping 16b of the suction pipeline 14b with transformation room 10 that make upper sucker 11, the suction pressure P1 of upper sucker 11 rises with identical the 3rd vacuum degree (low vacuum pressure) that presses to linkedly with the rising of the interior P2 of pressure of transformation room 10.
In addition, as other example (not shown), also can utilize the action of the first flow adjusting portion 14c of the first suction pressure governor motion 14 of sucker 11, make the suction pressure P1 of sucker 11 and the interior of transformation room 10 press the rising of P roughly side by side to rise to the 3rd vacuum degree (low vacuum pressure) gradually.
Utilize boosting operation S4, the interior pressure P2 of transformation the room 10 and suction pressure P1 of upper sucker 11 becomes the 3rd vacuum degree (low vacuum pressure) respectively, so, interior pressure P2 i.e. the 3rd vacuum degree (low vacuum pressure) of transformation room 10 and between substrate 1,2 by between pressure i.e. the second vacuum degree (middle Vacuum Pressure) in encapsulant 3 cingens seal cavity 3s, can pressure differential be produced.
Therefore, at the end of having arrived boosting operation S4, this pressure differential has made the compression of unhardened encapsulant 3, and the surface of upper substrate 1 starts the sucker face departing from sucker 11.
At this moment, the fully compression effectively of unhardened encapsulant 3 is made in order to utilize the pressure differential of the seal cavity 3s of the 3rd vacuum degree (low vacuum pressure) in transformation room 10 and the second vacuum degree (middle Vacuum Pressure) between substrate 1,2, preferably utilizing the second standby operation S5, after a predetermined time, remaining the 3rd vacuum degree (low vacuum pressure) by pressing the suction pressure P1 of P2 and upper sucker 11 in transformation room 10.
Then, the atmosphere opening operation S6 shown in Fig. 6, utilizes the voltage regulator of the pressure regulating part 16c as room pressure governor motion 16, makes the interior pressure P2 of transformation room 10 rise to the atmospheric pressure than its high pressure from the 3rd vacuum degree (low vacuum pressure).Meanwhile, by the action of the first flow adjusting portion 14c of the first suction pressure governor motion 14, all pressure adjusting portion 14e, the suction pressure P1 of sucker 11 is made to rise to atmospheric pressure from the 3rd vacuum degree (low vacuum pressure).
As its concrete example, when illustrated example, close the path from the suction pipeline 14b of upper sucker 11 to attraction source 14a, utilize and all press adjusting portion 14e, the suction pipeline 14b of sucker 11 is communicated with via contact pipeline 14d with the gas exhaust piping 16b of transformation room 10, thus the suction pressure P1 of upper sucker 11 and the interior of transformation room 10 press the rising of P2 side by side to rise to atmospheric pressure gradually.
As other example (not shown), also can, by the action of the first flow adjusting portion 14c of the first suction pressure governor motion 14 of upper sucker 11, the suction pressure P1 of sucker 11 and the interior of transformation room 10 be made to press the rising of P2 roughly side by side to rise to atmospheric pressure gradually.
At atmosphere opening operation S6, atmospheric pressure is become respectively owing to pressing the suction pressure P1 of P2 and upper sucker 11 in transformation room 10, so the pressure differential of pressure i.e. the second vacuum degree (middle Vacuum Pressure) in the interior pressure P2 of transformation room 10 and atmospheric pressure and the seal cavity 3s between substrate 1,2 expands.
By the compression further of the unhardened encapsulant 3 of the pressure official post of this expansion, the surface of upper substrate 1 departs from the sucker face of sucker 11 completely, and upper substrate 1 and infrabasal plate 2 entirety are flattened equably, fit with required gap.
The interior pressure P2 of transformation room 10 rise to atmospheric pressure or close to atmospheric pressure time, close the vent valve of the pressure regulating part 16c as room pressure governor motion 16, open the breather valve 16d on the exhaust line 16b being located at transformation room 10, by the earth pressure release in the suction pipeline 14b of the exhaust line 16b of transformation room 10 and upper sucker 11.
At this moment, as shown in the double dot dash line in Fig. 6, by the action of driving mechanism 13, upper sucker 11 and lower sucker 12 are in Z-direction relatively away from movement, and the upper substrate 1 and the infrabasal plate 2 that clip encapsulant 3 laminating can not be kept by the absorption of the sucker face of lower sucker 12 movably.
After atmosphere opening operation S6, as shown in Figure 7, close the open and close valve of the flow control division 14e as lower sucker 12, open the breather valve 15d on the suction pipeline 14c being located at lower sucker 12, by the earth pressure release in the suction pipeline 14c of lower sucker 12.
In this condition, the laminating device A that upper substrate 1 and infrabasal plate 2 are fitted with required gap is transported to outside in transformation room 10.
Afterwards, repeatedly aforesaid action is carried out.
According to manufacturing installation B and the manufacture method of the laminating device A of embodiment of the present invention, as shown in Figure 2, in the transformation room 10 being decompressed to the second vacuum degree (middle Vacuum Pressure), make a pair substrate 1,2 overlapping, after this overlapping step S1, pressure process S2 shown in Fig. 3, makes suction pressure P1 second vacuum degree (middle Vacuum Pressure) from from first vacuum degree (high vacuum pressure) to transformation room 10 than its high pressure of side's sucker (upper sucker) 11 to side's substrate (upper substrate) 1 rise.Like this, as shown in Figure 4, the suction pressure P1 of one side's sucker (upper sucker) the 11 and interior pressure P2 of transformation room 10 becomes impartial the second vacuum degree (middle Vacuum Pressure), so, that the pressure differential coming from the sucker face of side's sucker (upper sucker) 11 causes, the vacuum suction of side's substrate (upper substrate) 1 is removed.Then, boosting operation S4 shown in Fig. 5, makes the interior pressure P2 of transformation room 10 rise to than the second vacuum degree (middle Vacuum Pressure) high pressure in transformation room 10 with the suction pressure P1 of side's sucker (upper sucker) 11 and compare the 3rd vacuum degree that atmospheric pressure is negative pressure.Like this, utilize the 3rd vacuum degree (low vacuum pressure) in transformation room 10 and the pressure differential between the seal cavity 3s of the second vacuum degree (middle Vacuum Pressure) between substrate 1,2 and make the compression of unhardened encapsulant 3, the surface of side's substrate (upper substrate) 1 departs from the sucker face of side's sucker (upper sucker) 11.Then, in the atmosphere opening operation S6 shown in Fig. 6, make the suction pressure P1 of the interior pressure P2 of transformation room 10 and side's sucker (upper sucker) 11 rise to atmospheric pressure from the 3rd vacuum degree (low vacuum pressure).
If enumerate concrete example to be described, at overlapping step S1, in the seal cavity 3s sealed by unhardened encapsulant 3 between substrate 1,2, enclose the middle Vacuum Pressure (50,000 Pa) of transformation room 10.
At boosting operation S4 afterwards, when making the interior pressure P2 of transformation room 10 rise to low vacuum pressure (70,000 Pa), relative to substrate 1,2, certainly lead to the inside and outside differential pressure (20,000 Pa) of encapsulant 3.
At atmosphere opening operation S6 afterwards, under atmospheric pressure (100,000 Pa), about 1000g/cm can be obtained 2the contiguity power of vacuum pressure reduction, so, under the inside and outside differential pressure (20,000 Pa) of encapsulant 3, about 200g/cm can be obtained 2contiguity power.
Like this, unhardened encapsulant 3 is in thickness direction compression, and the thickness correspondingly integral thinned of substrate 1,2, so by pressure differential, substrate 1,2 is fitted with required gap.
Experimentally, on upper substrate 1 before laminating and infrabasal plate 2, the deviation of the coating height of encapsulant 3 is average 60 μm, when the flattening size that the driving mechanism 13 by overlapping step S1 makes encapsulant 3 is 10 μm, if rise to low vacuum pressure (70,000 Pa) at the end of boosting operation S4, then encapsulant 3 on average flattens 20 μm, and upper substrate 1 is become average 40 μm with the gap of infrabasal plate 2 by compression.And if rise to atmospheric pressure (100,000 Pa) at the end of atmosphere opening operation S6, then encapsulant 3 on average flattens 35 μm, and the gap of upper substrate 1 and infrabasal plate 2 is compacted into 25 μm of desired value.Can confirm for the laminating device A be made into like this, even if produce pressure reduction between closed loculus, the contact interface of encapsulant 3 and upper substrate 1 and infrabasal plate 2 also will cause air through because of pressure reduction, be stabilized seal state, can object be realized.
Therefore, make side's sucker (upper sucker) 11 depart from side's substrate (upper substrate) 1 of overlap condition and not apply any impact to unhardened encapsulant 3, thus realize the bonded to each other of substrate 1,2 while the shape of encapsulant 3 can not be upset.
As a result, even if the height of encapsulant exists deviation, also can utilize pressure differential, substrate 1,2 is fitted with predetermined gap.
And, with spray the fluids such as compressed air from sucker towards substrate surface and compared with the method be forcibly separated, unhardened encapsulant 3 is not excessively crushed, can prevent that the application pattern shape of encapsulant 3 is disorderly, being separated of the solid state component of filler contained by encapsulant 3 etc. and liquid-like constituents, side's sucker (upper sucker) 11 pipeline in, the generation of air vibration in transformation room 10, the Anawgy accuracy of substrate 1,2 can be improved.
Especially, after making side's sucker (upper sucker) the suction pressure P1 of the 11 and interior pressure P2 of transformation room 10 rise to the 3rd vacuum degree (low vacuum pressure) respectively, 3rd vacuum degree (low vacuum pressure) is kept the scheduled time, then, atmospheric pressure is risen to from the 3rd vacuum degree (low vacuum pressure), when controlling like this, utilization produces at boosting operation S4, the 3rd vacuum degree (low vacuum pressure) in transformation room 10 and substrate 1, pressure differential between the seal cavity 3s of the second vacuum degree (middle Vacuum Pressure) between 2, wait for the fully compression effectively of unhardened encapsulant 3.Like this, even if the compression speed of unhardened encapsulant 3 is slow, also can carry out in standby operation S5 and complete the compression of encapsulant 3, the surface of side's substrate (upper substrate) 1 departs from the sucker face of side's sucker (upper sucker) 11 completely.
Therefore, side's sucker (upper sucker) 11 can be made more effectively to be separated from side's substrate (upper substrate) 1 of overlap condition.
As a result, side's sucker (upper sucker) 11 separating property departing from side's substrate (upper substrate) 1 improves, and the Anawgy accuracy of substrate 1,2 improves more.
And, utilize the first suction pressure governor motion 14 and room pressure governor motion 16, make sucker 11, in 12, the suction pressure P1 of either party and the interior pressure P2 of transformation room 10 periodically rises from the second vacuum degree towards the 3rd vacuum degree (low vacuum pressure), when controlling like this, at boosting operation S4, utilize the 3rd vacuum degree (low vacuum pressure) in transformation room 10 and substrate 1, pressure differential between the seal cavity 3s of the second vacuum degree (middle Vacuum Pressure) between 2, make the little by little compression of unhardened encapsulant 3, so, the surface of one side's substrate (upper substrate) 1 departs from the sucker face of side's sucker (upper sucker) 11 with dead slow speed degree.
Therefore, it is possible to via side's substrate (upper substrate) 1, unhardened encapsulant 3 is not applied a bit to affect ground, (upper sucker) 11 departs from side's substrate (upper substrate) 1 more effectively to make side's sucker.
As a result, side's sucker (upper sucker) 11 separating property departing from side's substrate (upper substrate) 1 improves, and the Anawgy accuracy of substrate 1,2 improves more.
[embodiment 1]
Below, with reference to accompanying drawing, various embodiments of the present invention are described.
The present embodiment 1, as shown in Figure 4 and Figure 8, at the end of pressure equalization operation S2, first suction pressure governor motion 14 of one side's sucker (upper sucker) 11 is controlled so as to, and side's sucker (upper sucker) the suction pipeline 14b of 11 is communicated with by contact pipeline 14d with the gas exhaust piping 16b of transformation room 10.
In the example shown in Figure 4, close the open and close valve as the first flow governor motion 14c of upper sucker 11 and the path that blocks towards attraction source 14a, open all pressures open and close valve as all pressing adjusting portion 14e simultaneously, like this, the suction pipeline 14b of upper sucker 11 is communicated with via contact pipeline 14d with the gas exhaust piping 16b of transformation room 10, by the voltage regulator of the pressure regulating part 16c as room pressure governor motion 16, rise to the 3rd vacuum degree (low vacuum pressure) gradually.
Like this, the gas exhaust piping 16b of transformation room 10 is communicated with the suction pipeline 14b of upper sucker 11 via contact pipeline 14d, so the suction pressure P1 of upper sucker 11 also with in transformation room 10 presses the rising of P2 side by side to rise to the 3rd vacuum degree (low vacuum pressure) gradually.
According to manufacturing installation B and the manufacture method of the laminating device A of the embodiment of the present invention 1, even if do not arrange pressure sensor etc. respectively on the suction pipeline 14b of side's sucker (upper sucker) 11 and the gas exhaust piping 16b of transformation room 10 to carry out management control, by making suction pipeline 14b be communicated with by contact pipeline 14d with gas exhaust piping 16b, the suction pressure P1 of side's sucker (upper sucker) the 11 and interior pressure P2 of transformation room 10 becomes impartial the second vacuum degree (middle Vacuum Pressure) respectively by contact pipeline 14d.Like this, that the pressure differential coming the sucker face of My World sucker (upper sucker) 11 causes, the vacuum suction of side's substrate (upper substrate) 1 is removed.
Therefore, side's substrate (upper substrate) 1 can be made to depart from side's sucker (upper sucker) 11 effectively with simple structure and control.
As a result, available low cost improves the separating property of side's sucker (upper sucker) 11 and side's substrate (upper substrate) 1, and the Anawgy accuracy of substrate 1,2 improves further.
In addition, the room pressure governor motion 16 regulated by utilizing the pressure of transformation room 10, can regulate the interior pressure P2 of transformation the room 10 and suction pressure P1 of side's sucker (upper sucker) 11 simultaneously and correctly.
As a result, no matter the evaluated error of pressure sensor etc. how, critically can control side's sucker (upper sucker) the suction pressure P1 of the 11 and interior pressure P2 of transformation room 10, operability and good economy performance.
[embodiment 2]
The present embodiment 2, as shown in Fig. 9 ~ Figure 11, following formation is different from the embodiment 1 shown in Fig. 1 ~ Fig. 8, and formation is in addition identical with the embodiment 1 shown in Fig. 1 ~ Fig. 8.At least at atmosphere opening operation S6, as embodiment 1 Fig. 6 and Fig. 8 substitute, as shown in Figure 10 and Figure 11, be controlled to make the suction pressure P1 of side's sucker (upper sucker) 11 than press P2 in transformation room 10 slightly highland rise to atmospheric pressure from the 3rd vacuum degree (low vacuum pressure).
And, embodiment 2 shown in Fig. 9 ~ Figure 11, at boosting operation S4, as embodiment 1 Fig. 5 and Fig. 8 substitute, as shown in figures 9 and 11, be controlled to and make the suction pressure P1 of side's sucker (upper sucker) 11 slightly from the second vacuum degree (middle Vacuum Pressure), rise to the 3rd vacuum degree (low vacuum pressure) in highland than pressing P2 in transformation room 10.
In addition, as other example (not shown), also can be that boosting operation S4 is identical with Fig. 5 and Fig. 8 of embodiment 1, be controlled to and make side's sucker (upper sucker) the suction pressure P1 of 11 press the rising of P2 to be raised to the 3rd vacuum degree (low vacuum pressure) with identical pressing linkedly with the interior of transformation room 10.
According to manufacturing installation B and the manufacture method of the laminating device A of the embodiment of the present invention 2, at atmosphere opening operation S6, press the slight pressure of the rising of P2 poor by the rising of suction pressure P1 of side's sucker (upper sucker) 11 and the interior of transformation room 10, the air of trace is from the sucker surface current of side's sucker (sucker) 11 to the surface of side's substrate (upper substrate) 1, thus the gap on side's sucker (going up sucker) sucker face of 11 and the surface of side's substrate (upper substrate) 1 must expand.
Therefore, available simple control, does not apply a bit to affect ground via side's substrate (upper substrate) 1 to unhardened encapsulant 3, makes side's substrate (upper substrate) 1 depart from side's sucker (upper sucker) 11 more effectively.
As a result, available low cost improves the separating property that side's sucker (upper sucker) 11 departs from side's substrate (upper substrate) 1, and the Anawgy accuracy of substrate 1,2 improves more.
And, as illustrated example, even if being also controlled at the operation S4 that boosts makes the suction pressure P1 of side's sucker (upper sucker) 11 than when pressing P2 slightly highly to rise to the 3rd vacuum degree (low vacuum pressure) from the second vacuum degree (middle Vacuum Pressure) in transformation room 10, in boosting operation S4, press the slight pressure of the rising of P2 poor by the rising of suction pressure P1 of side's sucker (upper sucker) 11 and the interior of transformation room 10, the air of trace is from the sucker surface current of side's sucker (sucker) 11 to the surface of side's substrate (upper substrate) 1, thus side's sucker (upper sucker) sucker face of 11 and the gap on side's substrate (upper substrate) 1 surface must expand.
Therefore, when illustrated example, when proceeding to boosting operation S4, the surface of side's substrate (upper substrate) 1 starts the sucker face departing from side's sucker (upper sucker) 11.
Therefore, compared with the embodiment 1 shown in Fig. 1 ~ Fig. 8, side's substrate (upper substrate) 1 can be made to be more prone to and to depart from side's sucker (upper sucker) 11 effectively.
In addition, in illustrated example, be make sucker 11,12 both sides in Z-direction relatively close to mobile and make substrate 1,2 overlap with driving mechanism 13, but be not limited thereto, also can make either party in sucker 11,12 towards the opposing party close to mobile and make substrate 1,2 overlapping.

Claims (5)

1. the manufacturing installation of a device of fitting, make a pair substrate overlapping in the transformation indoor of having reduced pressure, the seal cavity surrounded by unhardened encapsulant is formed between above-mentioned a pair substrate, utilize the pressure differential produced between the interior pressure after the atmosphere opening of above-mentioned transformation room and above-mentioned seal cavity, aforesaid substrate entirety is pressurizeed equably, made it fit with predetermined gap;
The feature of the manufacturing installation of above-mentioned laminating device is to have:
Above-mentioned transformation room, accommodates the aforesaid substrate of freely coming in and going out in above-mentioned transformation indoor;
A pair sucker, indoor in above-mentioned transformation, sandwich the mode of above-mentioned encapsulant with aforesaid substrate, freely adsorb maintenance aforesaid substrate with loading and unloading respectively with the first vacuum degree;
Driving mechanism, being decompressed to, the above-mentioned transformation than the second vacuum degree of above-mentioned first vacuum degree high pressure is indoor, makes either one or both in above-mentioned sucker in Z-direction relatively close to mobile and make aforesaid substrate overlapping;
First suction pressure governor motion, carries out pressure adjustment to the suction pressure of either party of above-mentioned sucker;
Second suction pressure governor motion, carries out pressure adjustment to the suction pressure of the opposing party of above-mentioned sucker;
Room pressure governor motion, is adjusted to predetermined Vacuum Pressure by pressing in above-mentioned transformation room from atmospheric environmental pressure; And
Control part, carries out action control to above-mentioned driving mechanism, above-mentioned first suction pressure governor motion, above-mentioned second suction pressure governor motion and above-mentioned room pressure governor motion respectively;
Above-mentioned control part controls as follows: utilize above-mentioned driving mechanism to make aforesaid substrate indoor overlapping in the above-mentioned transformation of above-mentioned second vacuum degree, the above-mentioned seal cavity surrounded by unhardened above-mentioned encapsulant is formed between aforesaid substrate, then, utilize above-mentioned first suction pressure governor motion, above-mentioned first vacuum degree when making the suction pressure of either party of above-mentioned sucker overlapping from aforesaid substrate to than its high pressure and with above-mentioned transformation room in press impartial above-mentioned second vacuum degree to rise, then, utilize above-mentioned first suction pressure governor motion and above-mentioned room pressure governor motion, the interior pressure of the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room is made to rise to respectively than its high pressure from above-mentioned second vacuum degree and compare the 3rd vacuum degree that atmospheric pressure is negative pressure, then, above-mentioned 3rd vacuum degree is kept the scheduled time, the unhardened above-mentioned encapsulant compression of pressure official post of the above-mentioned seal cavity between utilization and aforesaid substrate is with the sucker face making a side of aforesaid substrate leave either party of above-mentioned sucker, have left the sucker face of a side of above-mentioned sucker a side of aforesaid substrate after, the interior pressure of the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room is made to rise to atmospheric pressure from above-mentioned 3rd vacuum degree.
2. the manufacturing installation of laminating device as claimed in claim 1, it is characterized in that, utilize above-mentioned first suction pressure governor motion and above-mentioned room pressure governor motion to be controlled to, make the interior pressure of the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room periodically increase towards above-mentioned 3rd vacuum degree from above-mentioned second vacuum degree.
3. the manufacturing installation of laminating device as claimed in claim 1 or 2, it is characterized in that, above-mentioned first suction pressure governor motion is controlled to, and makes the gas exhaust piping of the suction pipeline of either party of above-mentioned sucker and above-mentioned transformation room by contact pipeline connection.
4. the manufacturing installation of laminating device as claimed in claim 1 or 2, is characterized in that, the suction pressure being controlled to either party making above-mentioned sucker rises to atmospheric pressure than pressing slightly highland in above-mentioned transformation room from above-mentioned 3rd vacuum degree.
5. the manufacture method of a device of fitting, a pair sucker relatively moved freely towards direction close to each other is provided with in transformation indoor, relative to above-mentioned sucker, the mode of unhardened encapsulant is sandwiched with a pair substrate, maintenance a pair substrate is freely adsorbed with loading and unloading respectively with the first vacuum degree, being decompressed to, the above-mentioned transformation than the second vacuum degree of above-mentioned first vacuum degree high pressure is indoor, utilize the overlapping close to the mobile aforesaid substrate that makes of above-mentioned sucker, the seal cavity surrounded by above-mentioned encapsulant is formed between aforesaid substrate, utilize the pressure differential produced between the interior pressure after the atmosphere opening of above-mentioned transformation room and above-mentioned seal cavity, aforesaid substrate entirety is pressurizeed equably, it is made to fit with predetermined gap, the feature of the manufacture method of above-mentioned laminating device is, comprising:
Pressure equalization operation, after aforesaid substrate overlap, make above-mentioned sucker either party overlapping from aforesaid substrate to the suction pressure of either party of aforesaid substrate time above-mentioned first vacuum degree rise to above-mentioned second vacuum degree than its high pressure, make it to press equalization with the above-mentioned interior of above-mentioned transformation room, the absorption removing the side to aforesaid substrate caused by pressure differential keeps;
Boosting operation, after above-mentioned pressure equalization operation, makes the suction pressure of either party of above-mentioned sucker and the interior pressure of above-mentioned transformation room rise to respectively than above-mentioned second vacuum degree high pressure and compares the 3rd vacuum degree that atmospheric pressure is negative pressure;
Standby operation, after above-mentioned boosting operation, above-mentioned 3rd vacuum degree is kept with the scheduled time by pressing in the suction pressure of either party of above-mentioned sucker and above-mentioned transformation room, the pressure differential of the above-mentioned seal cavity of above-mentioned second vacuum degree between utilization and aforesaid substrate, make unhardened above-mentioned encapsulant compression, make a side of aforesaid substrate leave a side of above-mentioned sucker; And
Atmosphere opening operation, after a side of aforesaid substrate have left a side of above-mentioned sucker in above-mentioned boosting operation, the interior pressure of above-mentioned transformation room and the suction pressure of either party of above-mentioned sucker is made to rise to atmospheric pressure from above-mentioned 3rd vacuum degree, utilize the pressure differential with above-mentioned seal cavity, aforesaid substrate is fitted with predetermined gap.
CN201410462532.7A 2013-09-13 2014-09-12 It is bonded the manufacture device and manufacture method of device Active CN104465454B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013190882A JP5705937B2 (en) 2013-09-13 2013-09-13 Bonding device manufacturing apparatus and manufacturing method
JP2013-190882 2013-09-13

Publications (2)

Publication Number Publication Date
CN104465454A true CN104465454A (en) 2015-03-25
CN104465454B CN104465454B (en) 2018-02-13

Family

ID=52820257

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410462532.7A Active CN104465454B (en) 2013-09-13 2014-09-12 It is bonded the manufacture device and manufacture method of device

Country Status (3)

Country Link
JP (1) JP5705937B2 (en)
CN (1) CN104465454B (en)
TW (1) TWI624376B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107009718A (en) * 2017-05-10 2017-08-04 东莞市万丰纳米材料有限公司 Abutted equipment in bend glass vacuum
CN108735586A (en) * 2017-06-30 2018-11-02 上海微电子装备（集团）股份有限公司 A kind of vacuum extractor and vacuum pumping method

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6737575B2 (en) * 2015-09-30 2020-08-12 Ａｉメカテック株式会社 Board assembly system, board assembly apparatus used in the system, and board assembly method using the system
CN106793488B (en) 2015-11-20 2019-04-30 财团法人工业技术研究院 Flexible electronic device and manufacturing process method thereof
CN106739424B (en) 2015-11-20 2020-02-14 财团法人工业技术研究院 Taking-down and bonding device, taking-down method and bonding method using same
JP6810584B2 (en) * 2016-11-30 2021-01-06 タツモ株式会社 Laminating device
CN110164798B (en) * 2019-05-29 2021-05-25 无锡胜脉电子有限公司 Packaging air pressure alarm control system based on ceramic substrate meter
CN117390572B (en) * 2023-12-11 2024-04-19 深圳蓝狐思谷科技有限公司 Vacuum anomaly monitoring system for lamination

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1026763A (en) * 1996-07-11 1998-01-27 Seiko Epson Corp Production of liquid crystal panel and device therefor
JP2003057665A (en) * 2001-08-21 2003-02-26 Hitachi Industries Co Ltd Device for assembling liquid crystal substrate
JP3757231B1 (en) * 2005-06-20 2006-03-22 長州産業株式会社 Ferroelectric liquid crystal device manufacturing equipment
CN101179032A (en) * 2006-11-09 2008-05-14 三星Sdi株式会社 Sealing device and method of manufacturing display device using the same
JP2010258274A (en) * 2009-04-27 2010-11-11 Shin-Etsu Engineering Co Ltd Laminating method and device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4248890B2 (en) * 2002-02-22 2009-04-02 芝浦メカトロニクス株式会社 Substrate bonding apparatus and substrate bonding method
JP4482395B2 (en) * 2004-08-03 2010-06-16 芝浦メカトロニクス株式会社 Substrate bonding method and bonding apparatus
JP2007133145A (en) * 2005-11-10 2007-05-31 Ulvac Japan Ltd Substrate bonding apparatus and substrate bonding method
TW200914270A (en) * 2007-09-21 2009-04-01 Easy Field Corp Method for pasting touch panel and other optical glass on liquid crystal display (LCD)
US8245751B2 (en) * 2007-11-07 2012-08-21 Advanced Display Process Engineering Co., Ltd. Substrate bonding apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1026763A (en) * 1996-07-11 1998-01-27 Seiko Epson Corp Production of liquid crystal panel and device therefor
JP2003057665A (en) * 2001-08-21 2003-02-26 Hitachi Industries Co Ltd Device for assembling liquid crystal substrate
JP3757231B1 (en) * 2005-06-20 2006-03-22 長州産業株式会社 Ferroelectric liquid crystal device manufacturing equipment
CN101179032A (en) * 2006-11-09 2008-05-14 三星Sdi株式会社 Sealing device and method of manufacturing display device using the same
JP2010258274A (en) * 2009-04-27 2010-11-11 Shin-Etsu Engineering Co Ltd Laminating method and device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107009718A (en) * 2017-05-10 2017-08-04 东莞市万丰纳米材料有限公司 Abutted equipment in bend glass vacuum
CN108735586A (en) * 2017-06-30 2018-11-02 上海微电子装备（集团）股份有限公司 A kind of vacuum extractor and vacuum pumping method
CN108735586B (en) * 2017-06-30 2021-05-28 上海微电子装备（集团）股份有限公司 Vacuumizing device and vacuumizing method
US11664228B2 (en) 2017-06-30 2023-05-30 Shanghai Micro Electronics Equipment (Group) Co., Ltd. Vacuumizing device and vacuumizing method for bonding substrate

Also Published As

Publication number Publication date
JP5705937B2 (en) 2015-04-22
TWI624376B (en) 2018-05-21
TW201522067A (en) 2015-06-16
JP2015055853A (en) 2015-03-23
CN104465454B (en) 2018-02-13

Similar Documents

Publication Publication Date Title
CN104465454A (en) Manufacturing apparatus and manufacturing method of binding device
CN102598091B (en) Display panel production method and production system therefor
JP5395306B1 (en) Bonding device manufacturing apparatus and bonding device manufacturing method
JP2010080087A (en) Method of manufacturing flat panel display device, apparatus for manufacturing flat panel display device, and flat panel display device
JP5523646B1 (en) Bonding device manufacturing equipment
JP5654155B1 (en) Work bonding machine
JP6406247B2 (en) Laminate manufacturing apparatus and laminate manufacturing method
JP5810207B1 (en) Board assembly apparatus and board assembly method using the same
KR102330225B1 (en) Vacuum bonding apparatus of bonding device
JP4482395B2 (en) Substrate bonding method and bonding apparatus
CN106313858B (en) The manufacturing device and manufacturing method of abutted equipment
CN104765167A (en) Substrate bonding apparatus, apparatus and method for manufacturing display device member
JP5837247B1 (en) Board assembly apparatus and board assembly method using the same
WO2010095215A1 (en) Work transfer apparatus and vacuum bonding method
CN103847207A (en) Substrate sticking device and substrate sticking method
JP2017024306A (en) Manufacturing apparatus and manufacturing method of bonding device
JP5877264B1 (en) Bonding device manufacturing apparatus and manufacturing method
JP4421868B2 (en) Manufacturing method of liquid crystal panel and gap adjusting device
JP4420640B2 (en) Substrate bonding apparatus and substrate bonding method
JP5797863B1 (en) Joining member manufacturing apparatus and joining member manufacturing method
JP2012043582A (en) Lamination body and method of manufacturing the same
JP2009230870A (en) Organic el panel assembly system
JP2003315805A (en) Panel alignment system of substrate for flat panel
JP2014066917A (en) Plate-like body holding mechanism, substrate sticking device, and substrate sticking method
JP2015191196A (en) Tabular body sticking device and tabular body sticking method

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant