CN104451794A - 镀层厚度均匀之电镀方法及其产品 - Google Patents

镀层厚度均匀之电镀方法及其产品 Download PDF

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CN104451794A
CN104451794A CN201410470018.8A CN201410470018A CN104451794A CN 104451794 A CN104451794 A CN 104451794A CN 201410470018 A CN201410470018 A CN 201410470018A CN 104451794 A CN104451794 A CN 104451794A
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metal layer
electroplating region
electroplating
thickness
conductive substrate
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CN104451794B (zh
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廖本逸
吴宗翰
何耀棕
黄博承
林芳如
林正益
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Taiwan Green Point Enterprise Co Ltd
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Abstract

一种镀层厚度均匀之电镀方法包含以下步骤：于一非导电基材的表面上形成一第一金属层；对于该第一金属层进行加工处理，将该第一金属层区分成多数间隔设置的电镀区及一位于所述电镀区外的非电镀区，所述电镀区的面积趋近相同，所述电镀区包括一全为实际电镀图案的第一电镀区，及一由一实际电镀图案与一虚拟电镀图案所组成的第二电镀区；以电镀方式于该第一金属层的所述电镀区上分别形成一第二金属层；移除该第一金属层的非电镀区部分；及移除该第一金属层的各虚拟电镀图案的部分及各第二金属层位于虚拟电镀图案的部分。

Description

镀层厚度均匀之电镀方法及其产品
技术领域
本发明涉及一种电镀方法，特别是涉及一种金属镀层厚度均匀之电镀方法及其产品。
背景技术
电镀是利用电解的原理于导电体上形成一层金属的方法。除了导电体以外，电镀亦可用于经过特殊处理的塑料上。电镀的过程基本如下：
把镀上去的金属接在阳极，而被电镀的物件接在阴极，且把待镀金属的可溶性盐添加在槽液中形成电解质溶液，其中，阴阳极浸置于以镀上去的金属的正离子组成的电解质溶液。通以直流电的电源后，阳极的金属会释放电子而变成正离子，溶液中的正离子则在阴极还原(得到电子)成原子并积聚在阴极表层。
电镀后被电镀物件上的金属镀层的厚度和电流密度大小有关系，电流密度指一定面积上的电流分布。在可操作电流密度范围内，电流密度越小，被电镀的物件上所形成的金属镀层就越致密，相反地则会出现一些不平整的形状。然而，欲在被电镀物件上的多数面积大小不相同的区域镀上金属层时，由于在固定供电电流之下，不同的电镀面积会造成电流密度不同，因此经由同一时间的电镀制程后，各区域上所形成的金属镀层的厚度差异就会很大。
发明内容
本发明的目的在于提供一种金属镀层厚度均匀之电镀方法。
本发明镀层厚度均匀之电镀方法，包含以下步骤：
于一非导电基材的表面上形成一第一金属层；
对于该第一金属层进行加工处理，将该第一金属层区分成多数间隔设置的电镀区及一位于所述电镀区外的非电镀区，所述电镀区的面积趋近相同，所述电镀区包括一全为实际电镀图案的第一电镀区，及一由一实际电镀图案与一虚拟电镀图案所组成的第二电镀区；
以电镀方式于该第一金属层的所述电镀区上分别形成一第二金属层；
移除该第一金属层的非电镀区部分；及
移除该第一金属层的该第二电镀区的虚拟电镀图案的部分及该第二金属层位于该第二电镀区的虚拟电镀图案的部分。
本发明所述的镀层厚度均匀之电镀方法，该第一电镀区与该第二电镀区间的面积差与平均面积的比值小于10％。
本发明所述的镀层厚度均匀之电镀方法，还包含一步骤：对于该非导电基材进行激光加工处理，以在该非导电基材的表面形成多数分别对应该第一金属层的该第一电镀区及该第二电镀区的实际电镀图案的实际电镀图案区。
本发明所述的镀层厚度均匀之电镀方法，是以激光加工方式对于该第一金属层进行加工处理。
本发明所述的镀层厚度均匀之电镀方法，是以无电解电镀方式形成该第一金属层。
本发明的另一目的在于提供一种根据前述之电镀方法所制造之产品。
本发明之电镀方法所制造之产品，包含该非导电基材，及多数由存留于该非导电基材的表面上的部分该第一金属层及部分该第二金属层所组成的导电线路。
本发明的有益效果在于：借由所述电镀区的面积趋近相同，而在固定供电电流下，各电镀区具有趋近相同的电流密度，以达到在相同电镀时间下，该第一金属层的电镀区上分别形成的第二金属层的厚度都趋近相同，接着移除该第一金属层的非电镀区的部分及对应该第二电镀区的该虚拟电镀图案的部分第一、二金属层，以达到位于该非导电基材上的各电镀区的第二金属层的厚度是均匀的。
附图说明
图1是本发明镀层厚度均匀之电镀方法的一实施例的流程图；
图2是一立体图，说明本实施例于一非导电基材的表面上所形成之多数实际图案电镀区；
图3是一立体图，说明本实施例由该非导电基材的表面上往上依序形成一金属媒介层及一第一金属层；
图4是一立体图，说明本实施例将该第一金属层区分成多数电镀区及一非电镀区；
图5是一立体图，说明本实施例将该第一金属层的非电镀区的部分移除；
图6是一立体图，说明本实施例于各电镀区上形成一第二金属层；及
图7是一立体图，说明本实施例将对应于该电镀区的一虚拟电镀图案的第一、二金属层移除后即制得一产品。
具体实施方式
下面结合附图及实施例对本发明进行详细说明。
参阅图1，本发明金属镀层厚度均匀之电镀方法的一实施例，包含以下步骤：
搭配参阅图2，一表面粗化步骤310：依据所需之电镀图案，对于一非导电基材9进行激光加工处理，以在该非导电基材9的表面形成多数由激光烧蚀而成的实际电镀图案区91。该激光包含但不限于红外光脉冲激光及绿光脉冲激光，其功率可介于6.0至13.0W之间，脉冲频率可介于5.0至30.0kHz之间。各实际电镀图案区91的表面具有微结构，可增加该非导电基材9表面之粗糙度而提高后续形成于上的金属层的附着力。较佳地，该非导电基材9可为例如由玻璃、高分子材料、陶瓷等非导电材料所构成之电子产品外壳等。
搭配参阅图3，一第一金属层形成步骤320：将该非导电基材9浸泡于一含有金属离子的活性金属溶液之中一预定时间(较佳例下反应温度为70-80度、反应时间为1-2分钟)，令该金属离子吸附至非导电基材9的表面以形成一金属媒介层10，其中该金属离子包含但不限于钯、铑、铂、铱、锇、金、镍、铁及其组合，接着再以无电解电镀(electroless plating)方式于该金属媒介层10上形成一由镍所构成的第一金属层1，由于无电解电镀的制程条件是本技术领域业者所周知，因此，在此不再多加赘述。该第一金属层1在此作为后续电镀的晶种层(seed layer)。在此值得一提的是，也可以以溅镀(sputtering)或蒸镀(vapor deposition)方式形成该第一金属层1。另外，该第一金属层1的材料可依后续电镀层的材料进行选择，以达到较佳的电镀效果。
搭配参阅图4，一第一金属层图案化步骤330：利用激光加工方式同时对于该第一金属层1及该金属媒介层10进行部分烧蚀移除，以将该第一金属层1区分成多数间隔设置的电镀区11及一位于所述电镀区11外的非电镀区12。所述电镀区11的面积趋近相同，致使后续电镀制程于所述电镀区11分别所形成的镀层厚度趋近相同。该激光包含但不限于红外光脉冲激光及绿光脉冲激光。所述电镀区11包括一全为实际电镀图案113的第一电镀区111，及一由一实际电镀图案113与一虚拟电镀图案114所组成的第二电镀区112。该第一金属层1的该第一电镀区111及该第二电镀区112的所述实际电镀图案113分别对应该非导电基材9的实际电镀图案区91，该虚拟电镀图案114并不是最终产品所需的电路图案，而是用于添补该第二电镀区112的实际电镀图案113与该第一电镀区111的实际电镀图案113的面积差，使得该第二电镀区112的面积趋近于该第一电镀区111的面积。其中，各电镀区11与该非电镀区12电性绝缘。较佳地，该第一电镀区111与该第二电镀区112间的面积差与平均面积的比值小于10％。
搭配参阅图5，一非电镀区金属移除步骤340：同时移除该第一金属层1的非电镀区12部分及该金属媒介层10对应于该非电镀区12的部分。详细地说，由于该非导电基材9的表面对应于该第一金属层1的非电镀区12部分没有经过激光烧蚀，导致该金属媒介层对应该非电镀区12的部分与该非导电基材9的表面附着力差，因此仅须浸入化学药剂中经过一短暂时间，即可移除该部分之金属媒介层10，同时位于其上的该第一金属层1的部分随之移除。
搭配参阅图6，一第二金属层形成步骤350：以电镀方式于该第一金属层1的所述电镀区11的表面上分别形成一由第二金属所构成的第二金属层2，例如铜的电镀层。详细地说，电镀的阳极件(图未示)的材质由该第二金属所组成，而所述电镀区11分别电连接阴极件(图未示)，且将阳极件及该非导电基材9浸置于以第二金属的正离子组成的电解质溶液。通以直流电的电源后，阳极件的第二金属会释放电子而变成正离子，溶液中的正离子则在与阴极件电连接的各电镀区11还原成原子并积聚在各电镀区11的表面，而形成该等第二金属层2。由于电镀的制程条件是本技术领域业者所周知，因此，在此不再多加赘述。特别要说明的是，在本实施例中，是先进行该非电镀区金属移除步骤340，再执行该第二金属层形成步骤350，当然也可先执行该第二金属层形成步骤350，接着再进行该非电镀区金属移除步骤340，步骤340与步骤350的先后顺序并不以本实施例揭露为限。
搭配参阅图7，一虚拟金属层移除步骤360：同时移除该金属媒介层10对应于该第二电镀区112的该虚拟电镀图案114的部分、该第一金属层1的该第二电镀区112的虚拟电镀图案114的部分及对应该第二电镀区112的该虚拟电镀图案114的该第二金属层2的部分后，从而得到一产品100。详细地说，由于该非导电基材9对应该第二电镀区112的该虚拟电镀图案114的表面也没有经过激光烧蚀，导致于该金属媒介层10对应于该虚拟电镀图案114的部分与该非导电基材9的表面附着力差，因此可以直接用水刀或风力(高压气枪)切断就可以进行上述的移除动作。
参阅图7，该产品100包含该非导电基材9，及二由存留于该非导电基材9的表面上的部分该第一金属层1及部分该第二金属层2所组成的导电线路4。值得一提的是，所述导电线路数目不以上述两个为限，更能为两个以上的数量组合，且任二导电线路4间的面积差与两者中面积较小者的比值大于20％，且所述导电线路4间的厚度相同。较佳地，所述导电线路4间的厚度差与两者中厚度较小者的比值小于10％。
综上所述，本发明金属镀层厚度均匀之电镀方法借由所述电镀区11的面积趋近相同，而在固定供电电流下，各电镀区11具有趋近相同的电流密度，以达到在相同电镀时间下，该第一金属层1的电镀区11上分别形成的第二金属层2的厚度都趋近相同，接着移除该第一金属层1的非电镀区12的部分及对应该虚拟电镀图案114的第一、二金属层1、2的部分，以达到位于该非导电基材9上的各实际电镀图案区91上的第二金属层2的厚度是均匀的，故确实能达成本发明之目的。
以上所述者，仅为本发明之实施例而已，当不能以此限定本发明实施之范围，即大凡依本发明权利要求及发明说明内容所作之简单的等效变化与修饰，皆仍属本发明专利涵盖之范围内。

Claims (10)

1.一种镀层厚度均匀之电镀方法，其特征在于：该方法包含以下步骤：
于一非导电基材的表面上形成一第一金属层；
将该第一金属层区分成多数间隔设置的电镀区及一位于所述电镀区外的非电镀区，所述电镀区的面积趋近相同，所述电镀区包括一全为实际电镀图案的第一电镀区，及一由一实际电镀图案与一虚拟电镀图案所组成的第二电镀区；
以电镀方式于该第一金属层的所述电镀区上分别形成一第二金属层；及
移除该第一金属层的该第二电镀区的虚拟电镀图案的部分及该第二金属层位于该第二电镀区的虚拟电镀图案的部分。
2.根据权利要求1所述的镀层厚度均匀之电镀方法，其特征在于：该第一电镀区与该第二电镀区间的面积差与平均面积的比值小于10％。
3.根据权利要求1所述的镀层厚度均匀之电镀方法，其特征在于：该方法还包含一步骤：对于该非导电基材进行激光加工处理，以在该非导电基材的表面形成多数分别对应该第一金属层的该第一电镀区及该第二电镀区的实际电镀图案的实际电镀图案区。
4.根据权利要求1所述的镀层厚度均匀之电镀方法，其特征在于：该非导电基材对应各实际电镀图案的表面具有增加该非导电基材表面粗糙度的微结构。
5.根据权利要求1所述的镀层厚度均匀之电镀方法，其特征在于：形成该第一金属层的步骤包含于该非导电基材的表面上形成一包含活性金属的金属媒介层。
6.根据权利要求5所述的镀层厚度均匀之电镀方法，其特征在于：形成该第一金属层的步骤更包含于该金属媒介层的表面上以无电解电镀方式形成该第一金属层。
7.根据权利要求1所述的镀层厚度均匀之电镀方法，其特征在于：该方法还包含一步骤：移除该第一金属层的非电镀区部分。
8.一种利用根据权利要求1至7任一项所述之电镀方法所制造之产品，其特征在于：该产品包含该非导电基材，及多数由存留于该非导电基材的表面上的部分该第一金属层及部分该第二金属层所组成的导电线路。
9.根据权利要求8所述的产品，其特征在于：任二导电线路间的面积差与两者中面积较小者的比值大于20％。
10.根据权利要求8所述的产品，其特征在于：任二导电线路间的厚度差与两者中厚度较小者的比值小于10％。
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