TW201512465A - 鍍層厚度均勻之電鍍方法 - Google Patents

鍍層厚度均勻之電鍍方法 Download PDF

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TW201512465A
TW201512465A TW102133470A TW102133470A TW201512465A TW 201512465 A TW201512465 A TW 201512465A TW 102133470 A TW102133470 A TW 102133470A TW 102133470 A TW102133470 A TW 102133470A TW 201512465 A TW201512465 A TW 201512465A
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plating
metal layer
electroplating
pattern
region
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TWI531688B (zh
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Pen-Yi Liao
zong-han Wu
yao-zong He
Bo-Cheng Huang
Fang-Ru Lin
zheng-yi Lin
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Taiwan Green Point Entpr Co
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Priority to US14/487,467 priority patent/US20150075847A1/en
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    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
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    • C23C18/2026—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by radiant energy
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
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Abstract

一種鍍層厚度均勻之電鍍方法包含以下步驟：於一非導電基材的表面上形成一第一金屬層；對於該第一金屬層進行加工處理，將該第一金屬層區分成多數間隔設置的電鍍區及一位於該等電鍍區外的非電鍍區，該等電鍍區的面積趨近相同，該等電鍍區包括一全為實際電鍍圖案的第一電鍍區，及一由一實際電鍍圖案與一虛擬電鍍圖案所組成的第二電鍍區；以電鍍方式於該第一金屬層的該等電鍍區上分別形成一第二金屬層；移除該第一金屬層的非電鍍區部分；及移除該第一金屬層的各虛擬電鍍圖案的部分及各第二金屬層位於虛擬電鍍圖案的部分。

Description

鍍層厚度均勻之電鍍方法
本發明是有關於一種電鍍方法，特別是指一種金屬鍍層厚度均勻之電鍍方法。
電鍍是利用電解的原理於導電體上形成一層金屬的方法。除了導電體以外，電鍍亦可用於經過特殊處理的塑膠上。電鍍的過程基本如下：把鍍上去的金屬接在陽極，而被電鍍的物件接在陰極，且把待鍍金屬的可溶性鹽添加在槽液中形成電解質溶液，其中，陰陽極浸置於以鍍上去的金屬的正離子組成的電解質溶液。通以直流電的電源後，陽極的金屬會釋放電子而變成正離子，溶液中的正離子則在陰極還原(得到電子)成原子並積聚在陰極表層。
電鍍後被電鍍物件上的金屬鍍層的厚度和電流密度大小有關係，電流密度指一定面積上的電流分布。在可操作電流密度範圍內，電流密度越小，被電鍍的物件上所形成的金屬鍍層就越緻密，反之則會出現一些不平整的形狀。然而，欲在被電鍍物件上的多數面積大小不相同的區域鍍上金屬層時，由於在固定供電電流之下，不同的電鍍面積會造成電流密度不同，因此經由同一時間的電鍍製 程後，各區域上所形成的金屬鍍層的厚度差異就會很大。
因此，本發明之目的，即在提供一種金屬鍍層厚度均勻之電鍍方法。
於是本發明金屬鍍層厚度均勻之電鍍方法，包含以下步驟：於一非導電基材的表面上形成一第一金屬層；對於該第一金屬層進行加工處理，將該第一金屬層區分成多數間隔設置的電鍍區及一位於該等電鍍區外的非電鍍區，該等電鍍區的面積趨近相同，該等電鍍區包括一全為實際電鍍圖案的第一電鍍區，及一由一實際電鍍圖案與一虛擬電鍍圖案所組成的第二電鍍區；以電鍍方式於該第一金屬層的該等電鍍區上分別形成一第二金屬層；移除該第一金屬層的非電鍍區部分；及移除該第一金屬層的該第二電鍍區的虛擬電鍍圖案的部分及該第二金屬層位於該第二電鍍區的虛擬電鍍圖案的部分。
較佳地，每兩電鍍區間的面積差與平均面積的比值小於10%。
較佳地，金屬鍍層厚度均勻之電鍍方法還包含一步驟：對於該非導電基材進行雷射加工處理，以在該非導電基材的表面形成多數分別對應該第一金屬層的該第一 電鍍區及該第二電鍍區的實際電鍍圖案的實際電鍍圖案區。
較佳地，是以雷射加工方式對於進行該第一金屬層加工處理。
較佳地，是以電解電鍍方式形成該第一金屬層。
本發明的功效在於藉由該等電鍍區的面積趨近相同，而在固定供電電流下，各電鍍區具有趨近相同的電流密度，以達到在相同電鍍時間下，該第一金屬層的電鍍區上分別形成的第二金屬層的厚度都趨近相同，接著移除該第一金屬層的非電鍍區的部分及對應該第二電鍍區的該虛擬電鍍圖案的部分第一、二金屬層，以達到位於該非導電基材上的各電鍍區的第二金屬層的厚度是均勻的。
1‧‧‧第一金屬層
10‧‧‧金屬媒介層
11‧‧‧電鍍區
111‧‧‧第一電鍍區
112‧‧‧第二電鍍區
113‧‧‧實際電鍍圖案
114‧‧‧虛擬電鍍圖案
12‧‧‧非電鍍區
2‧‧‧第二金屬層
310‧‧‧表面粗化步驟
320‧‧‧第一金屬層形成步驟
330‧‧‧第一金屬層圖案化步驟
340‧‧‧非電鍍區金屬層移除步驟
350‧‧‧第二金屬層形成步驟
360‧‧‧虛擬金屬層移除步驟
4‧‧‧導電線路
9‧‧‧非導電基材
91‧‧‧實際電鍍圖案區
本發明之其他的特徵及功效，將於參照圖式的較佳實施例詳細說明中清楚地呈現，其中：圖1是本發明鍍層厚度均勻之電鍍方法的一較佳實施例的流程圖；圖2，是一立體圖，說明本較佳實施例於一非導電基材的表面上所形成之多數實際圖案電鍍區；圖3是一立體圖，說明本較佳實施例由該非導電基材的表面上往上依序形成一金屬媒介層及一第一金屬層；圖4是一立體圖，說明本較佳實施例將該第一金屬層區分成多數電鍍區及一非電鍍區；圖5是一立體圖，說明本較佳實施例將該第一金屬層 的非電鍍區的部分移除；圖6是一立體圖，說明本較佳實施例於各電鍍區上形成一第二金屬層；及圖7是一立體圖，說明本較佳實施例將對應於該電鍍區的一虛擬電鍍圖案的第一、二金屬層移除後即製得一產品。
參閱圖1，本發明金屬鍍層厚度均勻之電鍍方法的一較佳實施例，包含以下步驟：搭配參閱圖2，一表面粗化步驟310：依據所需之電鍍圖案，對於一非導電基材9進行雷射加工處理，以在該非導電基材9的表面形成多數由雷射燒蝕而成的實際電鍍圖案區91。該雷射包含但不限於紅外光脈衝雷射及綠光脈衝雷射，其功率可介於6.0至13.0W之間，脈衝頻率可介於5.0至30.0kHz之間。各實際電鍍圖案區91的表面具有微結構，可增加該非導電基材9表面之粗糙度而提高後續形成於上的金屬層的附著力。較佳地，該非導電基材9可為例如由玻璃、高分子材料、陶瓷等非導電材料所構成之電子產品外殼等。
搭配參閱圖3，一第一金屬層形成步驟320：將該非導電基材9浸泡於一含有金屬離子的活性金屬溶液之中一預定時間(較佳例下反應溫度為70-80度、反應時間為1-2分鐘)，令該金屬離子吸附至非導電基材9的表面以形成一金屬媒介層10，其中該金屬離子包含但不限於鈀、 銠、鉑、銥、鋨、金、鎳、鐵及其組合，接著再以無電解電鍍(electroless plating)方式於該金屬媒介層10上形成一由鎳所構成的第一金屬層1，由於無電解電鍍的製程條件是本技術領域業者所週知，因此，在此不再多加贅述。該第一金屬層1在此作為後續電鍍的晶種層(seed layer)。在此值得一提的是，也可以以濺鍍(sputtering)或蒸鍍(vapor deposition)方式形成該第一金屬層1。另外，該第一金屬層1的材料可依後續電鍍層的材料進行選擇，以達到較佳的電鍍效果。
搭配參閱圖4，一第一金屬層圖案化步驟330：利用雷射同時對於該第一金屬層1及該金屬媒介層10進行部份燒蝕移除，以將該第一金屬層1區分成多數間隔設置的電鍍區11及一位於該等電鍍區11外的非電鍍區12。該等電鍍區11的面積趨近相同，致使後續電鍍製程於該等電鍍區11分別所形成的鍍層厚度趨近相同。該雷射包含但不限於紅外光脈衝雷射及綠光脈衝雷射。該等電鍍區11包括一全為實際電鍍圖案113的第一電鍍區111，及一由一實際電鍍圖案113與一虛擬電鍍圖案114所組成的第二電鍍區112。該等實際電鍍圖案113分別對應該非導電基材9的實際電鍍圖案區91，該虛擬電鍍圖案114並不是最終產品所需的電路圖案，而是用於添補該第二電鍍區112的實際電鍍圖案113與該第一電鍍區111的實際電鍍圖案113的面積差，使得該第二電鍍區112的面積趨近於該第一電鍍區111的面積。其中，各電鍍區11與該非電鍍區12電性絕緣。 較佳地，每兩電鍍區11間的面積差與平均面積的比值小於10%。
搭配參閱圖5，一非電鍍區金屬移除步驟340：同時移除該第一金屬層1的非電鍍區12部分及該金屬媒介層10對應於該非電鍍區12的部分。詳細地說，由於該非導電基材9的表面對應於該第一金屬層1的非電鍍區12部分沒有經過雷射燒蝕，導致該金屬媒介層對應該非電鍍區12的部分與該非導電基材9的表面附著力差，因此僅須浸入化學藥劑中經過一短暫時間，即可移除該部分之金屬媒介層10，同時位於其上的該第一金屬層1的部分隨之移除。
搭配參閱圖6，一第二金屬層形成步驟350：以電鍍方式於該第一金屬層1的該等電鍍區11的表面上分別形成一由第二金屬所構成的第二金屬層2，例如銅的電鍍層。詳細地說，電鍍的陽極件(圖未示)的材質由該第二金屬所組成，而該等電鍍區11分別電連接陰極件(圖未示)，且將陽極件及該非導電基材9浸置於以第二金屬的正離子組成的電解質溶液。通以直流電的電源後，陽極件的第二金屬會釋放電子而變成正離子，溶液中的正離子則在與陰極件電連接的各電鍍區11還原成原子並積聚在各電鍍區11的表面，而形成該等第二金屬層2。由於電鍍的製程條件是本技術領域業者所週知，因此，在此不再多加贅述。
搭配參閱圖7，一虛擬金屬層移除步驟360：同時移除該金屬媒介層10對應於該第二電鍍區112的該虛擬圖案114的部分、該第一金屬層1的該第二電鍍區112的 虛擬電鍍圖案114的部分及對應該第二電鍍區112的該虛擬電鍍圖案114的該第二金屬層2的部分後，從而得到一產品100。詳細地說，由於該非導電基材9對應該第二電鍍區112的該虛擬電鍍圖案114的表面也沒有經過雷射燒蝕，導致於該金屬媒介層10對應於該虛擬電鍍圖案114的部分與該非導電基材9的表面附著力差，因此可以直接用水刀或風力(高壓氣槍)切斷就可以進行上述的移除動作。
參閱圖7，該產品100包含該非導電基材9，及二由存留於該非導電基材9的表面上的該第一金屬層1及該第二金屬層2所組成的導電線路4。值得一提的是，該等導電線路數目不以上述兩個為限，更能為兩個以上的數量組合，且任二導電線路4間的面積差與兩者中面積較小者的比值大於20%，且該等導電線路4間的厚度相同。較佳地，該等導電線路4間的厚度差與兩找中厚度較小者的比值小於10%。
綜上所述，本發明金屬鍍層厚度均勻之電鍍方法藉由該等電鍍區11的面積趨近相同，而在固定供電電流下，各電鍍區11具有趨近相同的電流密度，以達到在相同電鍍時間下，該第一金屬層1的電鍍區11上分別形成的第二金屬層2的厚度都趨近相同，接著移除該第一金屬層1的非電鍍區12的部分及對應該虛擬電鍍圖案114的第一、二金屬層1、2的部分，以達到位於該非導電基材9上的各實際電鍍圖案區91上的第二金屬層2的厚度是均勻的，故確實能達成本發明之目的。
惟以上所述者，僅為本發明之較佳實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。
310‧‧‧表面粗化步驟
320‧‧‧第一金屬層形成步驟
330‧‧‧第一金屬層圖案化步驟
340‧‧‧非電鍍區金屬層移除步驟
350‧‧‧第二金屬層形成步驟
360‧‧‧虛擬金屬層移除步驟

Claims (8)

  1. 一種鍍層厚度均勻之電鍍方法，包含以下步驟：於一非導電基材的表面上形成一第一金屬層；對於該第一金屬層進行加工處理，將該第一金屬層區分成多數間隔設置的電鍍區及一位於該等電鍍區外的非電鍍區，該等電鍍區的面積趨近相同，該等電鍍區包括一全為實際電鍍圖案的第一電鍍區，及一由一實際電鍍圖案與一虛擬電鍍圖案所組成的第二電鍍區；以電鍍方式於該第一金屬層的該等電鍍區上分別形成一第二金屬層；移除該第一金屬層的非電鍍區部分；及移除該第一金屬層的該第二電鍍區的虛擬電鍍圖案的部分及該第二金屬層位於該第二電鍍區的虛擬電鍍圖案的部分。
  2. 如請求項1所述之鍍層厚度均勻之電鍍方法，其中，該第一電鍍區與該第二電鍍區間的面積差與平均面積的比值小於10%。
  3. 如請求項1所述之鍍層厚度均勻之電鍍方法，還包含一步驟：對於該非導電基材進行雷射加工處理，以在該非導電基材的表面形成多數分別對應該第一金屬層的該第一電鍍區及該第二電鍍區的實際電鍍圖案的實際電鍍圖案區。
  4. 如請求項1所述之鍍層厚度均勻之電鍍方法，其中， 是以雷射加工方式對於該第一金屬層進行加工處理。
  5. 如請求項1所述之鍍層厚度均勻之電鍍方法，其中，是以無電解電鍍方式形成該第一金屬層。
  6. 一種利用如請求項1至3任一項所述之電鍍方法所製造之產品，該產品包含該非導電基材，及多數由存留於該非導電基材的表面上的部分該第一金屬層及部分該第二金屬層所組成的導電線路。
  7. 如請求項6所述之產品，其中，任二導電線路間的面積差與兩者中面積較小者的比值大於20%。
  8. 如請求項6所述之產品，其中，任二導電線路間的厚度差與兩者中厚度較小者的比值小於10%。
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