CN104425321A - Apparatus and method for treating substrate, and substrate treating system including the apparatus - Google Patents
Apparatus and method for treating substrate, and substrate treating system including the apparatus Download PDFInfo
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- CN104425321A CN104425321A CN201410437517.7A CN201410437517A CN104425321A CN 104425321 A CN104425321 A CN 104425321A CN 201410437517 A CN201410437517 A CN 201410437517A CN 104425321 A CN104425321 A CN 104425321A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
- G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses an apparatus for treating a substrate, which can improve the developing treating efficiency. The apparatus for treating a substrate comprises a working chamber; a substrate transferring part which is disposed in the working chamber and transfers a substrate in one direction; a first developing liquid supply part which is disposed above the transferring path of the substrate and supplies developing liquid to the substrate for the first time; a fluid supply part which is located behind the first developing liquid supply part in the transferring direction of the substrate, and supplies developing liquid removing fluid to the substrate coated with the developing liquid for the first time; and a second developing liquid supply part which is located behind the fluid supply part in the transferring direction of the substrate and supplies developing liquid to the substrate with the developing liquid removing fluid for the second time.
Description
Technical field
The present invention relates to substrate board treatment, more specifically relate to the substrate board treatment performing developing procedure.
Background technology
Generally speaking, the flat display devices organic light emitting display apparatus (OLED) etc. that can exemplify and utilize the LCD device of liquid crystal (LCD), utilize isoionic plasma display apparatus (PDP), utilize organic illuminating element.
Recently, widely use that power consumption is wherein few, volume is little, can realize low power-actuated LCD device.LCD device comprises in fact for the display pannel of show image.The large-area substrates of display pannel general glass material and form circuit pattern on substrate.For this reason, multiple unit process such as evaporation operation, photo-mask process, developing procedure, etching work procedure etc. are repeatedly performed.
In above-mentioned operation, developing procedure applies developer solution equably on substrate, forms groove (puddle) and remove photoresist during processing.Recently, be formed at the narrowed width of the circuit pattern on substrate, highly uprise, the thickness being thereupon coated on the photoresist on substrate is also thickening.Therefore, photoresist can not be removed completely by developing procedure in the past.
Summary of the invention
The invention provides the substrate board treatment that can improve development treatment efficiency.
Substrate board treatment work chamber according to an embodiment of the invention; Base plate transfer parts, it is configured in above-mentioned work chamber, and to a direction transfer substrate; First developer solution supply part, it is provided in the top in the transfer path of aforesaid substrate, and the aforesaid substrate first time to transfer supplies developer solution; Fluid supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned first developer solution supply part, and fluid removed by the substrate supply developer solution to first time coating developer solution; And the second developer solution supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned fluid supply part, and the substrate second time removing fluid to the above-mentioned developer solution of supply supplies developer solution.
And substrate is transferred continuously in the interval of aforesaid substrate transfer member between above-mentioned first developer solution supply part and above-mentioned second developer solution supply part.
And above-mentioned first developer solution supply part comprises: first jet, and its upper surface for aforesaid substrate sprays developer solution to first direction; Second nozzle, its for aforesaid substrate upper surface to the second direction different from above-mentioned first direction, with above-mentioned first jet spray developer solution simultaneously, above-mentioned second developer solution supply part comprises: the 3rd nozzle, and it sprays developer solution to the direction identical with above-mentioned first jet; 4th nozzle, it sprays developer solution to the direction identical with above-mentioned second nozzle, with above-mentioned 3rd nozzle simultaneously.
And above-mentioned first direction is vertical with the upper surface of aforesaid substrate, above-mentioned second direction tilts relative to the upper surface of aforesaid substrate.
And above-mentioned first developer solution supply part and the above-mentioned second developer solution supply part upper surface comprised respectively for aforesaid substrate vertically sprays the nozzle of developer solution.
And above-mentioned fluid supply part comprises the direction tilted to the transfer direction rightabout with aforesaid substrate and with the upper surface of aforesaid substrate and supplies the fluid supply nozzle that fluid removed by above-mentioned developer solution.
And above-mentioned work chamber comprises: the first chamber; Be laminated in the second chamber of the top of above-mentioned first chamber, aforesaid substrate transfer member is provided in above-mentioned first chamber and above-mentioned second chamber respectively, to a direction transfer substrate, above-mentioned first developer solution supply part, above-mentioned fluid supply part, above-mentioned second developer solution supply part are provided in above-mentioned first chamber and above-mentioned second chamber respectively, provide can be elevated to transmit the Lift Part of substrate to the base plate transfer parts in the base plate transfer parts in above-mentioned first chamber and above-mentioned second chamber in the front of above-mentioned work chamber.
And above-mentioned Lift Part comprises: the mutual also row arrangement of the power transmission shaft be combined with roller, place the power transmission shaft parts of substrate at above-mentioned roller; Above-mentioned power transmission shaft is rotated, with the power transmission shaft drive division making substrate transfer to a direction; Make the lifting drive division of above-mentioned power transmission shaft parts vertically movement.
And above-mentioned Lift Part comprises: supporting substrates, and can the arm of movement in front-rear direction; Support above-mentioned arm, and the cramp bar that can be elevated; And the lifting drive division that above-mentioned cramp bar is elevated.
Base plate processing system according to an embodiment of the invention, is configured with developing apparatus, cleaning device and drying unit successively, and above-mentioned developing apparatus comprises: work chamber; Base plate transfer parts, it is configured in above-mentioned work chamber, and to a direction transfer substrate; First developer solution supply part, the entrance of itself and above-mentioned work chamber is positioned adjacently at the top of aforesaid substrate transfer member, and the substrate first time to transfer supplies developer solution; Fluid supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned first developer solution supply part, and fluid removed by the substrate supply developer solution to first time coating developer solution; And the second developer solution supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned fluid supply part, the substrate second time removing fluid to the above-mentioned developer solution of supply supplies developer solution, and aforesaid substrate is moved continuously in the interval of aforesaid substrate transfer member between the entrance and exit of above-mentioned work chamber.
And above-mentioned first developer solution supply part comprises: first jet, and its upper surface for aforesaid substrate sprays developer solution to first direction; Second nozzle, it is to the second direction different from above-mentioned first direction, spray developer solution with above-mentioned first jet simultaneously, and above-mentioned second developer solution supply part comprises: the 3rd nozzle, and it is to above-mentioned first direction ejection developer solution; 4th nozzle, its to above-mentioned second direction, with above-mentioned 3rd nozzle spray developer solution simultaneously.
And above-mentioned first developer solution supply part and the above-mentioned second developer solution supply part upper surface comprised respectively for aforesaid substrate vertically sprays the nozzle of developer solution.
And above-mentioned fluid supply part comprises the direction tilted to the transfer direction rightabout with aforesaid substrate and with the upper surface of aforesaid substrate and supplies the fluid supply nozzle that fluid removed by above-mentioned developer solution.
And above-mentioned work chamber comprises: the first chamber; Be laminated in the second chamber of the top of above-mentioned first chamber, aforesaid substrate transfer member is provided in above-mentioned first chamber and above-mentioned second chamber respectively, to a direction transfer substrate, above-mentioned first developer solution supply part, above-mentioned fluid supply part, above-mentioned second developer solution supply part are provided in above-mentioned first chamber and above-mentioned second chamber respectively, provide can be elevated to transmit the Lift Part of substrate to the base plate transfer parts in the base plate transfer parts in above-mentioned first chamber and above-mentioned second chamber in the front of above-mentioned work chamber.
Substrate processing method using same according to an embodiment of the invention, upper surface first time for from the substrate to a direction transfer supplies developer solution, fluid removed by the upper surface supply developer solution being applied to the substrate of above-mentioned developer solution first time, and the substrate second time above-mentioned developer solution of supply being removed to fluid supplies developer solution.
And, after developer solution is applied to aforesaid substrate first time to fluid removed by the above-mentioned developer solution of supply, the processing time of aforesaid substrate transfer regulation.
And the first time supply of above-mentioned developer solution is carried out in the direction of the direction vertical with the upper surface of aforesaid substrate and inclination respectively with the second time supply of above-mentioned developer solution simultaneously.
And the first time supply of above-mentioned developer solution is carried out in the direction vertical with the upper surface of aforesaid substrate with the second time supply of above-mentioned developer solution.
And above-mentioned developer solution is removed fluid to the transfer direction rightabout with aforesaid substrate and to be supplied with the direction that the upper surface of the aforesaid substrate of transfer tilts.
And the second time supply of the supply and above-mentioned developer solution that fluid removed by above-mentioned developer solution performs simultaneously.
And upper surface second time being applied to the substrate of above-mentioned developer solution supplies above-mentioned developer solution removal fluid.
And above-mentioned developer solution is removed fluid and is comprised deionized water (DI water) or nitrogen (N
2).
According to the present invention, by performing 2 development treatment, can fully remove the photoresist be coated on substrate.
Accompanying drawing explanation
Fig. 1 is the concise and to the point figure of the base plate processing system 1 represented according to one embodiment of the invention.
Fig. 2 is the concise and to the point figure of the developing apparatus represented according to one embodiment of the invention.
Fig. 3 to Fig. 5 is the sequential chart representing the process of carrying out development treatment according to one embodiment of the invention.
Fig. 6 is the concise and to the point figure of the developing apparatus represented according to another embodiment of the present invention.
Fig. 7 is the concise and to the point figure of the developing apparatus represented according to another embodiment more of the present invention.
Fig. 8 is the figure of the developing cell represented according to another embodiment more of the present invention.
Fig. 9 represents that Lift Part transmits the figure of the process of substrate in the developing cell of Fig. 8.
Figure 10 is the figure of the developing cell represented according to another embodiment more of the present invention.
Figure 11 and Figure 12 represents that substrate is sent to the figure of the process of base plate transfer parts by the arm of Lift Part in the developing cell of Figure 10.
Figure 13 represents that Lift Part transmits the figure of the process of substrate in the developing cell of Figure 10.
Embodiment
Below, with reference to accompanying drawing, embodiments of the invention are described in more detail.Embodiments of the invention can change to various ways, can not be interpreted as scope of the present invention and be defined as following embodiment.These embodiments provide to illustrate in greater detail the present invention to those skilled in the art.Therefore, in order to emphasize explanation definitely, the key element in figure represents turgidly.
Fig. 1 is the concise and to the point figure of the base plate processing system 1 represented according to one embodiment of the invention.
With reference to Fig. 1, base plate processing system 1 comprises box station 10, work station 20 and interface station 30.Box station 10, work station 20 and interface station 30 configure in one direction successively.Box station 10 extracts substrate and is supplied to work station 20 from the box C of storage substrate (Glass, G).The unit performing photo-mask process in work station 20 be row arrange, perform a series of operation process.The direction of interface station 30 conversion baseplate G, is sent to exposure device 40 by substrate G, after exposure-processed, substrate G is provided to work station 20.Below, the direction that box station 10, work station 20 and interface station 30 arrange is called first direction X, the direction vertical with first direction X is called that second direction Y, the direction vertical with second direction Y with first direction X and above-below direction are called third direction Z when observing from top.
Box station 10 comprises box platform 11 and Handling device 12.
Multiple box platform 11 is provided, by second direction Y be one row arrange.Box platform 11 is placed with the box C of multiple substrates of stacked storage G in the vertical direction.Be supplied to the substrate G of operation process in box C storage and complete the substrate G of operation process.
Handling device 12 is provided at the rear of box platform 11.The discrepancy can carrying out the substrate being accommodated in box C is provided at Handling device 12, and substrate G is sent to the conveying robot 13 of work station 20.Conveying robot 13 possesses can the arm 14 of supporting substrates G, can be mobile to the first to third direction (X, Y, Z), and can be that axle rotates with third direction.
The a series of process such as the cleaning in the photo-mask process of the manufacturing process of panel display board, photoresist coating, front baking, development, rear baking can be carried out in work station 20.In work station 20, the planning sheet identical permutation that can perform above-mentioned operation process is individually two operating paths 20a, 20b.Operating path 20a, 20b and first direction X provide abreast.The operation unit of the operation perform exposure-processed in the first operating path 20a before be row arrange, substrate G is transplanted on interface station 30 side from Handling device 12.The operation unit of the operation perform exposure-processed in the second operating path 20b after be row arrange, substrate G is transplanted on Handling device 12 side from interface station 30.
Be arranged with in row successively from Handling device 12 to interface station 30 side in first operating path 20a and move into device 51, clean portion, the first heat treatment portion, coating handling part, the second heat treatment portion.
Move into device 51 and receive untreatment base G from conveying robot 13, substrate G is put into side, clean portion 52.Excimer uv illumination unit 53 can be provided in clean portion 52 successively and clean cleaning unit 54.Adhesion unit 56 and cooling processing unit 57 can be provided successively in first heat treatment portion 55.Photoresist coating element 59 and normal pressure drying unit 60 can be provided successively in coating handling part 58.Front baking unit 62 and cooling unit 63 can be provided successively in second heat treatment portion 61.Traffic element 64 is provided at the end in the second heat treatment portion 61.The substrate G completing operation process in the second heat treatment portion 61 is sent to interface station 30 by traffic element 64.
Developing cell 70, rear baking unit 75, cooling unit 76, inspection unit 77 is arranged with in row successively in the second operating path 20b.There is provided at the end of the second operating path 20b and take out of unit 78.Take out of unit 78 finish receiving the substrate G of operation process and be sent to conveying robot 13.
Interface station 30 comprises the conveying robot 81 transmitting substrate G to the first operating path 20a and the second operating path 20b, exposing unit 40.Rotating platform 82 and peripheral devices 83 is configured with around conveying robot 81.Rotating platform 82 makes substrate G rotate in same plane, and titler TITLER, periphery exposure device EE etc. are such as connected with the second operating path 20b by peripheral devices 83.
Below, the process of substrate G being carried out to operation process in above-mentioned base plate processing system 1 is described.
The conveying robot 13 of box station 10 extracts untreatment base G from the box C box platform 11, the substrate G of extraction is sent to provide in the first operating path 20a of work station 20 move into device 51.Substrate G drops into from moving into device 51 and is transplanted on each handling part of the first operating path 20a.
Substrate G by Excimer uv illumination unit 53 and the scouring cleaning unit 54 in clean portion 52, implements ultraviolet clean and cleans clean successively.Clean cleaning unit 54 and implement brush (Brush) cleaning or (Blow) cleaning and from the pollutant of substrate G surface particle phenomenon, perform afterwards and rinse and baking operation of blowing.The first heat treatment portion 55 is moved to by the substrate G in clean portion 52.
Adhesion unit 56 in the first heat treatment portion 55 implements attachment (adhesion) process, thus the processed surface of substrate G is hydrophobic.After attachment process, substrate G is cooled to set point of temperature in cooling processing unit 57.Coating handling part 58 is transplanted on by the substrate G of cooling processing unit 57.
At the upper surface coating photoresist of substrate G in the photoresist coating element 59 of coating handling part 58, in normal pressure drying unit 60, perform the oven dry being coated on the photoresist of substrate G.The oven dry of photoresist performs at ambient pressure.The second heat treatment portion 61 is transplanted on by the substrate G applying handling part 58.
The front baking unit 62 in the second heat treatment portion 61 performs front baking as the heat treatment after photoresist coating or the heat treatment before exposure.By front baking operation, remain in the solvent evaporation of the photoresist on substrate G, improve the adherence of the photoresist to substrate G.After front baking operation, substrate G is cooled to set point of temperature at cooling unit 63.Afterwards, substrate G is sent to the conveying robot 81 of interface station 30 via traffic element 64.
Be sent to substrate G conversion direction on rotating platform 82 of interface station 30, such as direction changes 90 °, is moved to exposure device 83 around.After exposure-processed being carried out to the photoresist of the surrounding being coated on substrate G in exposure device EE around, be sent to exposure device 40.
In exposure device 40, at the circuit pattern that the photoresist exposure being coated on substrate G specifies.After exposure-processed, substrate G is transplanted on interface station 30, moves into the titler TITLER of peripheral devices 83.In titler TITLER, in the information that a part of regional record of substrate G specifies.Afterwards, substrate G is provided to developing cell 70.
Developing cell 70, during substrate G transfers along a direction, performs development, flushing and drying and processing successively.Developing cell 70 is developing apparatus 71, cleaning device 72, drying unit 73 along the second operating path 20b be one row arrange.Developing apparatus 71 performs developing procedure, cleaning device 72 performs flushing operation, drying unit 73 performs baking operation.
The 3rd heat treatment portion 74 and inspection unit 77 is passed through successively by the substrate G of developing cell 70.Rear baking unit 75 in the 3rd heat treatment portion 74, as the heat treatment after development treatment, dries operation after execution.By rear baking operation, residue in the developer solution of photoresist, cleaning fluid is evaporated and removes.After rear baking operation, substrate G is cooled to the temperature of regulation in cooling unit 76.In inspection unit 77, the photoetching agent pattern on substrate G is performed to the inspection of the inspection of noncontact line width, film quality, film thickness etc.
Take out of unit 78 to be received in and to terminate operation process in the second operating path 20b and the substrate G transferred, be sent to the conveying robot 13 of box station 20.The substrate G of reception is received into box C by conveying robot 13.
Fig. 2 is the concise and to the point figure of the developing apparatus represented according to one embodiment of the invention.
With reference to Fig. 2, developing apparatus 71 comprises work chamber 110, base plate transfer parts 120, first developer solution supply part 130, fluid supply part 140, second developer solution supply part 150.
Work chamber 110 is formed with space in inside, provides the space performing developing procedure.The length of work chamber 110 is longer in one direction.The front of work chamber 110 and rear are formed with opening 111,112 respectively.The opening 111 being formed at the front of work chamber 110, as the entrance moving into substrate G from titler TITLER, is formed at the opening 112 at the rear of work chamber 110 as the outlet taking out of substrate G to cleaning device 72.
Base plate transfer parts 120 are configured in work chamber 110.Base plate transfer parts 120 constantly transfer substrate G at the entrance 111 from work chamber 110 on the direction of outlet 112.Below, the direction of transfer substrate G in work chamber 110 is called transfer direction X2.It is not shown that base plate transfer parts 120 comprise power transmission shaft 121, roller 122 and drive division.
There is provided multiple power transmission shaft 121, along transfer direction X2 and row arrangement.Power transmission shaft 121 is configured to mutual interval and keeps constant.The height of power transmission shaft 121 corresponds to entrance 111 and outlet 112.
Multiple roller 122 is provided, is combined with each power transmission shaft 121.The central shaft of roller 122 is formed porose, power transmission shaft 121 is forcibly inserted hole.Roller 122 with each power transmission shaft 121 at least in conjunction with two, can keep predetermined distance with contiguous roller 122.Roller 122 rotates together with power transmission shaft 121.
Drive division is at least connected with a power transmission shaft 121, and power transmission shaft 121 is rotated.The revolving force of power transmission shaft 121 is delivered to other power transmission shaft 121 by power transmission member not shown such as belt wheel, conveyer belt etc.By the rotation of power transmission shaft 121 and roller 122, substrate G transfers to transfer direction X2.
First developer solution supply part 130 is positioned at the top of base plate transfer parts 120, provides developer solution to the substrate G first time of transfer.First developer solution supply part 130 can be positioned at the position of neighboring entry 111.
According to embodiment, the first developer solution supply part 130 comprises first jet 131 and second nozzle 132.Second nozzle 132 is between first jet 131 and entrance 111.First jet 131 is configured at first direction Z1 relative to the upper surface of the substrate G of transfer, and second nozzle 132 is configured at the second direction Z2 different from first direction Z1.First direction Z1 can be vertical with the upper surface of substrate G, the angle that second direction Z2 can tilt specify relative to the upper surface of substrate G.Second direction Z2 can tilt towards the transfer direction X2 of substrate G.First jet 131 and second nozzle 132 spray developer solution to substrate G simultaneously.First jet 131 can to the identical region ejection developer solution on substrate G with second nozzle 132.
Fluid supply part 140 is positioned at the rear of the first developer solution supply part 130 along the transfer direction X2 of substrate G.Fluid supply part 140 can be positioned at the position relative to the contiguous outlet 112 of entrance 111.Fluid supply part 140 comprises the fluid supply nozzle 141 substrate G of first time coating developer solution d1 being supplied to developer solution removal fluid.Fluid removed by developer solution can comprise deionized water (DI water), inert gas such as nitrogen (N
2).Developer solution is removed fluid and is removed the developer solution d1 being coated on substrate G.According to embodiment, fluid supply nozzle 141 is to the transfer direction X2 rightabout with substrate G and spray developer solution with the direction of the upper surface inclination predetermined angular of substrate G and remove fluid.The emission direction of developer solution removal fluid is contrary mutually with the transfer direction of substrate G, so the impact quantitative change that developer solution removes fluid and substrate G is large.Large by the change of buckles, developer solution d1 can be removed efficiently.And the developer solution d1 that the emission direction cut-out that fluid removed by developer solution is removed from substrate G flows into the second developer solution supply part 150 side.
Second developer solution supply part 150 is positioned at the rear of fluid supply part 140 along the transfer direction X2 of substrate G.Second developer solution supply part 150 can be positioned at the position contiguous with outlet 112.Second developer solution supply part 150 removes the upper surface second time supply developer solution d2 of the substrate G of fluid to supply developer solution.
According to embodiment, the second developer solution supply part 150 comprises the 3rd nozzle 151 and the 4th nozzle 152.3rd nozzle 151 is configured at contiguous outlet 112 compared with the 4th nozzle 152.3rd nozzle 151 is configured at first direction Z1 relative to the upper surface of the substrate G of transfer, and the 4th nozzle 152 is configured at the second direction Z2 different from first direction Z1.First direction Z1 can be vertical with the upper surface of substrate G, the angle that second direction Z2 can tilt specify relative to the upper surface of substrate G.The angle that second direction Z2 can tilt specify towards the transfer direction X2 of substrate G.3rd nozzle 151 and the 4th nozzle 152 spray developer solution to substrate G simultaneously.3rd nozzle 151 can to the identical region ejection developer solution on substrate G with the 4th nozzle 152.
Above-mentioned first developer solution supply nozzle 131,132, fluid supply nozzle 141 and the second developer solution supply nozzle 151,152 can use slotted knife (Puddle Knife).
First developer solution supply nozzle 131,132 and fluid supply nozzle 141 extractor gauge set a distance.After first time coating developer solution d1, substrate G moves to till the place of fluid removed by supply developer solution needs the stipulated time.This time comprise developer solution d1 and photoresist reaction processing time (process time).Distance between first developer solution supply nozzle 131,132 and fluid supply nozzle 141 can set pro rata with the screen of substrate G and processing time.
Fig. 3 to Fig. 5 is the sequential chart representing the process of carrying out development treatment according to one embodiment of the invention.The photoresist R1 be coated on substrate G is removed in developing procedure.Recently, be formed at the narrowed width of the pattern P on substrate G, highly uprise, the thickness being thereupon coated on the photoresist R1 between pattern P is also thickening.Therefore, remove photoresist R1 by a developing procedure to be not easy.According to embodiment, as Fig. 3 first time supply developer solution d1, after the processing time, supply developer solution remove fluid, thus the top of photoresist R1 is removed as shown in Figure 4.Then, second time supply developer solution d2, is removed as shown in Figure 5 at the remainder rinsing photoresist R2 in operation after the processing time.
Fig. 6 is the concise and to the point figure of the developing apparatus represented according to another embodiment of the present invention.
With reference to Fig. 6, the transfer direction X2 along substrate G also provides fluid supply nozzle 161 at the rear of the second developer solution supply part 150.For convenience of explanation, the fluid supply nozzle 141 that the front at the second developer solution supply part 150 provides is called first fluid supply nozzle, the fluid supply nozzle 161 provided in the wings is called second fluid supply nozzle.Second fluid supply nozzle 161 supplies developer solution removal fluid to the substrate G of second time coating developer solution d2.Namely second fluid supply nozzle 161 sprays developer solution with the direction of the upper surface inclination predetermined angular of substrate G and removes fluid to the direction identical with first fluid supply nozzle 141 with the transfer direction rightabout of substrate G.Second fluid supply nozzle 161 and the second developer solution supply part 150 extractor gauge set a distance.After second time coating developer solution d2, substrate G moves to till the place of fluid removed by second time supply developer solution needs the stipulated time.This time comprise developer solution and photoresist reaction processing time.Distance between second developer solution supply part 150 and second fluid supply nozzle 161 can set pro rata with the screen of substrate G and processing time.Distance between second developer solution supply part 150 and second fluid supply nozzle 161 can correspond to the distance between the first developer solution supply part 130 and first fluid supply nozzle 141.Removed the secondary supply of fluid by developer solution, remove the developer solution be coated on substrate G.Substrate G is sent to 72 of cleaning device Fig. 1 under the state being removed developer solution.
Fig. 7 is the concise and to the point figure of the developing apparatus represented according to another embodiment more of the present invention.
With reference to Fig. 7, the first developer solution supply part 130 and the second developer solution supply part 150 respectively possess a nozzle 131,151.Nozzle 131,151 can supply developer solution to the direction that the upper surface of the substrate with transfer is vertical.Different with it, the direction that nozzle 131,151 also can tilt to the upper surface of the substrate with transfer supplies developer solution.
Fig. 8 is the figure of the developing cell represented according to another embodiment more of the present invention.
With reference to Fig. 8, developing cell 70a can provide with lit-par-lit structure.When consuming the more time in development treatment compared with other operations, substrate G can be provided to perform development treatment to each layer.This can prevent substrate G process in developing cell 70a to stagnate.
The work chamber 110 of developing apparatus 71a comprises the first chamber 110a and the second chamber 110b.Second chamber 110b is laminated in the top of the first chamber 110a.First chamber 110a has the structure identical with the work chamber illustrated at Fig. 2 respectively with the second chamber 110b.
Base plate transfer parts 120a, 120b, the first developer solution supply part 130a, 130b, fluid supply part 140a, 140b and second developer solution supply part 150a, 150b are provided respectively in the inside of the first chamber 110a and the second chamber 110b.First developer solution supply part 130a, 130b supplies developer solution to substrate G1, G2 first time transferred towards a direction by base plate transfer parts 120a, 120b, fluid supply part 140a, 140b supply substrate from developer solution removal fluid to first time coating developer solution G1, G2, and substrate G1, G2 second time that second developer solution supply part 150a, 150b gives developer solution removal fluid to confession supplies developer solution.
Lift Part 180 is provided in the front of work chamber 110.Lift Part 180 transmits substrate G respectively to the base plate transfer parts 120b in the base plate transfer parts 120a in the first chamber 110a and the second chamber 110b.Lift Part 180 is the structure that can be elevated, to transmit substrate G to the base plate transfer parts 120b in the second chamber 110b.
According to an embodiment, Lift Part 180 comprises power transmission shaft parts 181, power transmission shaft drive division is not shown and be elevated drive division 191.
Power transmission shaft parts 181 provide with the combination of power transmission shaft 182 and roller 183.Power transmission shaft 182 at predetermined intervals and row arrangement.Roller 183 wherein axle is formed porose, and power transmission shaft 182 is forcibly inserted hole.Roller 183 and each power transmission shaft 182, at least in conjunction with two, rotate together with power transmission shaft 182.Substrate G is placed on roller 183.
Power transmission shaft drive division is at least connected with a power transmission shaft 182, and power transmission shaft 182 is rotated.The revolving force of power transmission shaft 182 is delivered to other power transmission shaft by power transmission member not shown such as belt wheel, conveyer belt etc.
Lifting drive division 191 makes power transmission shaft parts 181 vertically move.Lifting drive division 191 comprises elevating lever 192 and driver 193.Length direction and the above-below direction of elevating lever 192 configure abreast, upper end supporting drive shaft parts 181.Driver 193 makes elevating lever 192 vertically move.
When base plate transfer parts 120a to the first chamber 110a transmits substrate G, power transmission shaft parts 181 are positioned at the height identical with the base plate transfer parts 120a of the first chamber 110a.By the driving of power transmission shaft drive division, power transmission shaft 182 rotates together with roller 183, and substrate G transfers to a direction, is sent to base plate transfer parts 120a.
When base plate transfer parts 120b to the second chamber 110b transmits substrate G, elevating lever 191 as shown in Figure 9, rises to corresponding with the height of the second chamber 110b by driver 193.Power transmission shaft parts 181 are positioned at the height identical with the base plate transfer parts 120b of the second chamber 110b.By the driving of power transmission shaft drive division, power transmission shaft 182 rotates together with roller 183, and substrate G transfers to a direction, is sent to base plate transfer parts 120b.
Picture the present embodiment, when developing apparatus 71a is configured to lit-par-lit structure, cleaning device 72a and drying unit 73a also can be provided as lit-par-lit structure.The substrate G1 completing development treatment at the first chamber 110a is supplied to the cleaning device 72a-1 and drying unit 73a-1 that are positioned at lower floor successively, and the substrate G2 completing development treatment at the second chamber 110b is supplied to the cleaning device 72a-2 and drying unit 73a-2 that are positioned at upper strata successively.
Figure 10 is the figure of the developing cell represented according to another embodiment more of the present invention.
With reference to Figure 10, Lift Part 210 comprises arm 211, cramp bar 215 and lifting drive division 217.
Arm 211 supporting substrates G.The position of the setting of the upper surface of arm 211 provides fulcrum post 212.Substrate G is positioned at the upper end of fulcrum post 212.Arm 211 can advance in front-rear direction and retreat, can with cramp bar 215 for axle rotates.
Length direction and the above-below direction of cramp bar 215 configure abreast, are combined at its upper end with arm 211.Lifting drive division 217 makes cramp bar 215 vertically move.
Figure 11 and Figure 12 represents that substrate is sent to the figure of the process of base plate transfer parts by the arm of Lift Part in the developing cell of Figure 10.
Arm 211 with reference to Figure 11 and Figure 12, supporting substrates G is entered in the first chamber 110a by entrance.Arm 211 stops on the top of base plate transfer parts 120a entering, and moves down together with the decline of cramp bar 215.Arm 211 drops to the position between the upper end of roller 122 and power transmission shaft 121.Arm 121 drops to the region between roller 122 and roller 122, so prevent and the conflicting of roller 122.And the radius of the Thickness Ratio roller 122 of arm 211 is little, drop to the place do not clashed with power transmission shaft 121.In the process that arm 211 declines, substrate G is sent to roller 122.The arm 211 transmitting substrate G is outside back to chamber 110a.
Refer again to Figure 10, when base plate transfer parts 120a from Lift Part 210 to the first chamber 110a transmit substrate G, arm 211 is positioned at the height identical with the base plate transfer parts 120a of the first chamber 110a.Arm 211 enters into the entrance of the first chamber 110a, with the process described in Figure 11 and Figure 12, substrate G is sent to base plate transfer parts 120a.
When transmitting substrate G to the base plate transfer parts 120b of the second chamber 110b, lifting drive division 217 makes cramp bar 215 rise as shown in figure 13, is positioned at the height identical with the base plate transfer parts 120b of the second chamber 110b to make arm 211.Arm 211 enters the entrance of the second chamber 110b, with the process described in Figure 11 and Figure 12, substrate G is sent to base plate transfer parts 120b.
More than illustrate and just illustrate technological thought of the present invention, those skilled in the art can carry out various amendment and distortion in the scope not departing from essential characteristics of the present invention.Therefore, disclosed embodiment is not to limit technological thought of the present invention in the present invention, but in order to be described, can not limit the scope of technological thought of the present invention due to such embodiment.Protection scope of the present invention is explained according to claim, and all technological thoughts that should be interpreted as in equivalency range all belong to interest field of the present invention.
Description of reference numerals
1 base plate processing system; 70 developing cells; 71 developing apparatus; 72 cleaning devices; 73 drying units; 110 work chamber; 120 base plate transfer parts; 130 first developer solution supply parts; 140 fluid supply parts; 150 second developer solution supply parts; 180 Lift Parts; G substrate.
Claims (22)
1. a substrate board treatment, it comprises:
Work chamber;
Base plate transfer parts, it is configured in above-mentioned work chamber, and to a direction transfer substrate;
First developer solution supply part, it is provided in the top in the transfer path of aforesaid substrate, is supplied developer solution to by the aforesaid substrate first time transferred;
Fluid supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned first developer solution supply part, and fluid removed by the substrate supply developer solution to first time coating developer solution; And
Second developer solution supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned fluid supply part, and the substrate second time removing fluid to the above-mentioned developer solution of supply supplies developer solution.
2. substrate board treatment according to claim 1, wherein,
Substrate is transferred continuously in the interval of aforesaid substrate transfer member between above-mentioned first developer solution supply part and above-mentioned second developer solution supply part.
3. substrate board treatment according to claim 1, wherein,
Above-mentioned first developer solution supply part comprises:
First jet, its upper surface for aforesaid substrate sprays developer solution to first direction;
Second nozzle, its upper surface for aforesaid substrate sprays developer solution to the second direction different with above-mentioned first direction from above-mentioned first jet simultaneously,
Above-mentioned second developer solution supply part comprises:
3rd nozzle, it sprays developer solution to the direction identical with above-mentioned first jet;
4th nozzle, it sprays developer solution to the direction identical with above-mentioned second nozzle with above-mentioned 3rd nozzle simultaneously.
4. substrate board treatment according to claim 3, wherein,
Above-mentioned first direction is vertical with the upper surface of aforesaid substrate,
Above-mentioned second direction tilts relative to the upper surface of aforesaid substrate.
5. substrate board treatment according to claim 1, wherein,
Above-mentioned first developer solution supply part and the above-mentioned second developer solution supply part upper surface comprised respectively for aforesaid substrate vertically sprays the nozzle of developer solution.
6. substrate board treatment according to claim 1, wherein,
Above-mentioned fluid supply part comprises the direction tilted to the transfer direction rightabout with aforesaid substrate and with the upper surface of aforesaid substrate and supplies the fluid supply nozzle that fluid removed by above-mentioned developer solution.
7. substrate board treatment according to claim 1, wherein,
Above-mentioned work chamber comprises:
First chamber;
Be laminated in the second chamber of the top of above-mentioned first chamber,
Aforesaid substrate transfer member is provided in above-mentioned first chamber and above-mentioned second chamber respectively, to a direction transfer substrate,
Above-mentioned first developer solution supply part, above-mentioned fluid supply part, above-mentioned second developer solution supply part are provided in above-mentioned first chamber and above-mentioned second chamber respectively,
There is provided in the front of above-mentioned work chamber and can be elevated to transmit the Lift Part of substrate to the base plate transfer parts in the base plate transfer parts in above-mentioned first chamber and above-mentioned second chamber.
8. substrate board treatment according to claim 7, wherein,
Above-mentioned Lift Part comprises:
The mutual also row arrangement of the power transmission shaft be combined with roller, places the power transmission shaft parts of substrate at above-mentioned roller;
Above-mentioned power transmission shaft is rotated, with the power transmission shaft drive division making substrate transfer to a direction; With
Make the lifting drive division of above-mentioned power transmission shaft parts vertically movement.
9. substrate board treatment according to claim 7, wherein,
Above-mentioned Lift Part comprises:
Supporting substrates, and can the arm of movement in front-rear direction;
Support above-mentioned arm, and the cramp bar that can be elevated; And
Make the lifting drive division that above-mentioned cramp bar is elevated.
10. a base plate processing system, is configured with developing apparatus, cleaning device and drying unit successively,
Above-mentioned developing apparatus comprises:
Work chamber;
Base plate transfer parts, it is configured in above-mentioned work chamber, and to a direction transfer substrate;
First developer solution supply part, the entrance of itself and above-mentioned work chamber is positioned adjacently at the top of aforesaid substrate transfer member, and the substrate first time to transfer supplies developer solution;
Fluid supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned first developer solution supply part, and fluid removed by the substrate supply developer solution to first time coating developer solution; And
Second developer solution supply part, its transfer direction along aforesaid substrate is positioned at the rear of above-mentioned fluid supply part, and the substrate second time removing fluid to the above-mentioned developer solution of supply supplies developer solution,
Aforesaid substrate is moved continuously in the interval of aforesaid substrate transfer member between the entrance and outlet of above-mentioned work chamber.
11. base plate processing systems according to claim 10, wherein,
Above-mentioned first developer solution supply part comprises:
First jet, its upper surface for aforesaid substrate sprays developer solution to first direction;
Second nozzle, it sprays developer solution to the second direction different with above-mentioned first direction from above-mentioned first jet simultaneously,
Above-mentioned second developer solution supply part comprises:
3rd nozzle, it is to above-mentioned first direction ejection developer solution;
4th nozzle, itself and above-mentioned 3rd nozzle spray developer solution to above-mentioned second direction simultaneously.
12. base plate processing systems according to claim 10, wherein,
Above-mentioned first developer solution supply part and the above-mentioned second developer solution supply part upper surface comprised respectively for aforesaid substrate vertically sprays the nozzle of developer solution.
13. base plate processing systems according to claim 10, wherein,
Above-mentioned fluid supply part comprises the direction tilted to the transfer direction rightabout with aforesaid substrate and with the upper surface of aforesaid substrate and supplies the fluid supply nozzle that fluid removed by above-mentioned developer solution.
14. base plate processing systems according to claim 10, wherein,
Above-mentioned work chamber comprises:
First chamber;
Be laminated in the second chamber of the top of above-mentioned first chamber,
Aforesaid substrate transfer member is provided in above-mentioned first chamber and above-mentioned second chamber respectively, to a direction transfer substrate,
Above-mentioned first developer solution supply part, above-mentioned fluid supply part, above-mentioned second developer solution supply part are provided in above-mentioned first chamber and above-mentioned second chamber respectively,
There is provided in the front of above-mentioned work chamber and can be elevated to transmit the Lift Part of substrate to the base plate transfer parts in the base plate transfer parts in above-mentioned first chamber and above-mentioned second chamber.
15. 1 kinds of substrate processing method using sames, upper surface first time for from the substrate to a direction transfer supplies developer solution, fluid removed by the upper surface supply developer solution being applied to the substrate of above-mentioned developer solution first time, and the substrate second time above-mentioned developer solution of supply being removed to fluid supplies developer solution.
16. substrate processing method using sames according to claim 15, wherein,
After developer solution is applied to aforesaid substrate first time to fluid removed by the above-mentioned developer solution of supply, the processing time of aforesaid substrate transfer regulation.
17. substrate processing method using sames according to claim 15, wherein,
The first time supply of above-mentioned developer solution is carried out in the direction of the direction vertical with the upper surface of aforesaid substrate and inclination respectively with the second time supply of above-mentioned developer solution simultaneously.
18. substrate processing method using sames according to claim 15, wherein,
The first time supply of above-mentioned developer solution is carried out in the direction vertical with the upper surface of aforesaid substrate with the second time supply of above-mentioned developer solution.
19. substrate processing method using sames according to claim 15, wherein,
Above-mentioned developer solution is removed fluid to the transfer direction rightabout with aforesaid substrate and to be supplied with the direction that the upper surface of the aforesaid substrate of transfer tilts.
20. substrate processing method using sames according to claim 15, wherein,
The second time supply of the supply and above-mentioned developer solution that fluid removed by above-mentioned developer solution performs simultaneously.
21. substrate processing method using sames according to claim 15, wherein,
Upper surface second time being applied to the substrate of above-mentioned developer solution supplies above-mentioned developer solution removal fluid.
22. substrate processing method using sames according to claim 15, wherein,
Above-mentioned developer solution is removed fluid and is comprised deionized water or nitrogen.
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| KR1020130165409A KR101620547B1 (en) | 2013-08-30 | 2013-12-27 | Apparatus and method for treating substrate, and substrate treating system including the apparatus |
| KR10-2013-0165409 | 2013-12-27 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110389501A (en) * | 2018-04-20 | 2019-10-29 | 细美事有限公司 | Substrate board treatment |
| CN110634766A (en) * | 2018-06-22 | 2019-12-31 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate processing method |
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| CN1773674A (en) * | 2004-11-10 | 2006-05-17 | 大日本网目版制造株式会社 | Substrate processing apparatus and substrate processing method |
| CN101388333A (en) * | 2007-09-13 | 2009-03-18 | 株式会社迅动 | Substrate processing device and processing method thereof |
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| CN110389501B (en) * | 2018-04-20 | 2023-02-21 | 细美事有限公司 | Substrate processing apparatus |
| CN110634766A (en) * | 2018-06-22 | 2019-12-31 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate processing method |
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