CN104404575B - Electrolytic etching of metal groove and electrolytic etching of metal technique - Google Patents
Electrolytic etching of metal groove and electrolytic etching of metal technique Download PDFInfo
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- CN104404575B CN104404575B CN201410713935.4A CN201410713935A CN104404575B CN 104404575 B CN104404575 B CN 104404575B CN 201410713935 A CN201410713935 A CN 201410713935A CN 104404575 B CN104404575 B CN 104404575B
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Abstract
The invention discloses a kind of electrolytic etching of metal groove include cell body, positive plate, minus plate and be arranged on the arc drain projection of cell body opposite end, positive plate and minus plate interlaced arrangement are in cell body, cell body is provided with inlet and overfall, the inlet of minus plate both sides is positioned at the same one end of minus plate, the inlet of positive plate both sides lays respectively at positive plate two ends, protruding with the arc drain respectively protruding end in minus plate two ends abuts, and is provided with liquid guide flow cavity between positive plate and arc drain projection.Two adjacent cathode plate form a similar space closed with the positive plate in the middle of it, after electrolyte is quickly injected into this space by the inlet of minus plate one end and the adjacent cathode plate other end, by flowing clockwise or counterclockwise, utilize the kinetic energy that electrolyte self exists, well reduce the concentration difference of metal ion between two-plate, efficiently reduce concentration polarization.The invention also discloses a kind of electrolytic etching of metal technique.
Description
Technical field
The present invention relates to electrolytic etching of metal technical field, particularly to a kind of electrolytic etching of metal groove.The present invention also relates to
And one electrolytic etching of metal technique.
Background technology
Electrolytic etching of metal groove is mainly used in electrolysis and the purification of electrolyte of the metals such as copper, lead, nickel.Such as pass
The smelting of the copper of system is to be obtained after melting, blowing, fire refining step by mineral raw material copper concentrate
Anode copper.Anode copper obtains cathode copper after the electrolytic refining of electrolytic etching of metal groove, and the purity of copper improves.
Electrorefining is the Main Means of refining of metal in nonferrous metallurgical process, is also non-ferrous metal smelting
One final link of refining, the quality whether advanced person of its technology and corollary equipment directly influences metal is good
Badly with production capacity height.In non-ferrous metal, electrolysis or the electrolyte purification process of the metal such as copper, lead and nickel is equal
Based on electrochemical principle, negative electrode and anode are placed in the groove of the solution filling metal ion, after energising
Electrochemical reaction occurs on electrode, and on anode, elemental metals loses electronics and becomes metal ion, by expanding
Dissipate and move to cathode direction；On negative electrode, metal ion constantly separates out, deposits.Due to metals various in solution
The electrode potential of ion determines the order that they react on negative electrode and anode, preferentially separates out on negative electrode
Be the metal that electrode potential is higher, and the electrode potential of each metal is by standard electrode potential and this metal
The concentration of ion determines.
Copper is during aqueous solution electrolysis, and the amount that its electrolysis goes out observes Faraday's law, can use following formula (1)
It is expressed as:
MCu=1.1852 × i × A × t (1)
In formula: mCu is the quality (g) of the metal separated out, and i is electric current density (A/m2), t is the time (s).
By (1) formula it can be seen that on the premise of existing process equipment and technology, to improve production capacity, only
The approach of one improves electric current density exactly.
But in production practices, if simple only improves electric current density, the speed of precipitating metal on negative electrode
Accelerating, this often causes the Ni metal near negative electrode2+Concentration reduces, and i.e. creates concentration polarization, from
And cause the reduction of electrode potential, make main metal preferentially can not separate out on negative electrode, cause impurity gold
The precipitation belonged to, affects product quality.The raising of electric current density on anode, promotes anodic solution too fast,
Make the Cu that anodic solution produces2+Anode-the solution interface that can not speed away spreads to cathode chamber, the most also leads
Cause concentration polarization, by anode region Cu2+Concentration arrive saturated or supersaturation, by produce copper oxide or
The mineralization of slightly solubility, in anode surface, will block anode reaction, and anode potential raises, and causes the most miscellaneous
Matter ion-solubility enters and pollutes electrolyte in electrolyte, even causes anodic passivity, increase time serious
Energy consumption.Therefore, concentration polarization is to cause copper, lead, nickel electric current density in electrolysis or electrolytic deposition process to improve
The main cause being restricted.
In actual production, can reduce between two-plate by improving the circulating load of electrolyte in electrolytic process
Concentration polarization, thus improve electrolytic current density, improve production capacity.But it is real the productions of nearly 200 years
In trampling, although cupric electrolysis technique has had significant progress, electric current density is also by original 250A/m2Improve
Arrive 420A/m2, but owing to by its electrolyte endless form, the most not can solve concentration difference
The impact that polarization problem is brought, electric current density is again without bigger breakthrough, with theoretical electrolytic current density 1000A/
m2Differ greatly.As depicted in figs. 1 and 2, existing electrolytic etching of metal groove include cell body 01, positive plate 03,
Minus plate 04 and busbar 06, wherein positive plate 03 and minus plate 04 interlaced arrangement are in cell body 01,
And positive plate 03 and minus plate 04 two ends are both placed on busbar 06.Cell body 01 top-side is provided with
Overfall 05, cell body 01 bottom is provided with inlet 02, and wherein inlet 02 is positioned at cell body 01 the same side.
Operationally, it is internal that electrolyte is entered cell body 01 by inlet 02 to electrolytic etching of metal groove, and electrolyte leads to
Cross the inlet near minus plate 04 both sides along being parallel to the ejection of minus plate 04 direction, then, ejection
Electrolyte to cell body two end motion, passes through cell body by the gap between pole plate and offside cell body 01 wall afterwards
The overfall at two ends returns to electrolyte circulation system.Electrolyte moves from the bottom to top, eventually through overflow
Mouth 05 is discharged, and wherein electrolyte is during moving upward, and negative electrode and anode are placed in and fill metal ion
Solution groove in, after energising on electrode occur electrochemical reaction, negative electrode has metal constantly separate out,
Deposition.
But, it is unilateral feed liquor owing to inlet 02 is positioned at the same side of cell body, i.e. electrolytic etching of metal groove, electricity
Solve liquid by cell body 01 side when opposite side moves, with inlet 02 opposite side and upper part of the electrolytic cell
Electrolyte flow speed is slower.When electric current density raises, metal ion enhanced dissolution rate on anode,
On negative electrode, metal ion speed of separating out is accelerated, owing to electrolyte circulation rate is the slowest, it is impossible to reduce by two in time
The concentration difference of metal ion between pole plate, causes minus plate Quality Down, tank voltage to raise, seriously can cause
The series of problems such as anodic passivity, not only have impact on normal production, and the rising of tank voltage also substantially increases
Energy consumption.
Meanwhile, prior art uses bottom in and top out endless form so that the same earth of positive pole of electrolyte loop direction
Settle in opposite direction, if improving electrolyte circulating load, anode slime will certainly be affected, can make time serious
Become electrolyte muddy so that being attached on minus plate of a large amount of earth of positive pole machinery, cause product quality to decline.
Therefore, how to reduce concentration polarization, be those skilled in the art's technical problems urgently to be resolved hurrily.
Summary of the invention
It is an object of the invention to provide a kind of electrolytic etching of metal groove, the concentration polarization in this electrolytic etching of metal groove reduces.
It is a further object of the present invention to provide a kind of electrolytic etching of metal technique.
For achieving the above object, the present invention provides a kind of electrolytic etching of metal groove, including cell body, positive plate and the moon
Pole plate, described positive plate and described minus plate interlaced arrangement in described cell body, described cell body be provided with into
Liquid mouth and overfall, also include that the arc drain being arranged on described cell body opposite end is protruding, described negative electrode
The described inlet of plate both sides is positioned at the same one end of described minus plate, the described inlet of described positive plate both sides
Lay respectively at described positive plate two ends, the projection that described minus plate two ends are protruding with described arc drain respectively
End abuts, and is provided with liquid guide flow cavity between described positive plate and described arc drain projection.
Preferably, described inlet is positioned at described cell body top.
Preferably, the radian that described arc drain is protruding is 60 ° to 180 °.
Preferably, the angle that described inlet is downward-sloping is 0 ° to 20 °.
Preferably, the liquid guide flow plate being arranged on described cell body, described liquid guide flow plate and institute are also included
Stating cell body side to seal, described liquid guide flow plate forms overflow ducts, described overflow with described cell body side
Passage two ends connect with described cell body internal cavity and described overfall respectively.
Preferably, described cell body bottom is inclined guide surface, and the bottom of described cell body is provided with leakage fluid dram with clear
Silt mouth, the height of described desilting mouth is less than the height of described leakage fluid dram.
A kind of electrolytic etching of metal technique, including step:
1) electrolyte is entered between minus plate and positive plate by the inlet on cell body top, wherein, and described the moon
The described inlet of pole plate both sides is positioned at the same one end of described minus plate, the described feed liquor of described positive plate both sides
Mouth lays respectively at described positive plate two ends；
2) arranging arc drain at described cell body opposite end protruding, described minus plate two ends are respectively with described
The protruding end abutting that arc drain is protruding, is provided with liquid between described positive plate and described arc drain projection
Water conservancy diversion cavity, electrolyte is around positive plate clockwise or counterclockwise；
3) electrolyte by described cell body flows to by the deflector being arranged in cell body and described cell body side
In the overflow ducts that wall is formed, then discharged by the overfall on described cell body.
Preferably, described minus plate one side flow of electrolyte is 1.0L/min-3.0L/min, electrolyte pressure
At 0.2MPa-0.5MPa.
Preferably, electric current density is 500A/m2～700A/m2。
In technique scheme, the electrolytic etching of metal groove that the present invention provides includes cell body, positive plate, negative electrode
Plate and to be arranged on the arc drain of cell body opposite end protruding, positive plate and minus plate interlaced arrangement are at cell body
In, cell body is provided with inlet and overfall, and the inlet of minus plate both sides is positioned at the same one end of minus plate,
The inlet of positive plate both sides lays respectively at positive plate two ends, and minus plate two ends are protruding with arc drain respectively
Protruding end abut, be provided with liquid guide flow cavity between positive plate and arc drain projection.Retouched by above-mentioned
Stating and understand, the two ends of positive plate are equipped with inlet, and electrolyte turns clockwise and anticlockwise around positive plate
Dynamic, by electrolyte convection current, enhance the flowing velocity of electrolyte around positive plate and minus plate, electrolysis
Liquid flows downward in confined space, flows to cell body two ends respectively in the space bottom pole plate with cell body,
Come back in electrolyte circulation system by overfall afterwards.Two adjacent cathode plate are with the anode in the middle of it
Plate forms a similar space closed, and electrolyte is by minus plate one end and the adjacent cathode plate other end
After inlet is quickly injected into this space, by flowing clockwise or counterclockwise, merit make use of
The kinetic energy that electrolyte self exists, reduces the concentration difference of metal ion between two-plate well, effectively drops
Low concentration polarization.
Accompanying drawing explanation
Fig. 1 is the structural representation of existing electrolytic etching of metal groove；
Fig. 2 is the top view of existing electrolytic etching of metal groove；
The structural representation of the electrolytic etching of metal groove that Fig. 3 is provided by the specific embodiment of the invention；
The cell body that Fig. 4 is provided by the specific embodiment of the invention is protruding with arc drain and liquid guide flow plate
Structural representation；
The top view of the electrolytic etching of metal groove that Fig. 5 is provided by the specific embodiment of the invention；
The cell body that Fig. 6 is provided by the specific embodiment of the invention and the installation site figure of guiding fluid plate.
Wherein in Fig. 1-6: 01-cell body, 02-inlet, 03-positive plate, 04-minus plate, 05-overfall,
06-busbar；
1-cell body, 2-inlet, 3-positive plate, 4-minus plate, 5-overfall, 6-busbar, 7-liquid are led
Stream plate, 8-desilting mouth, 9-leakage fluid dram, 10-inclined guide surface, 11-arc drain are protruding, 12-overflow ducts.
Detailed description of the invention
The core of the present invention is to provide a kind of electrolytic etching of metal groove, and the concentration polarization of this electrolytic etching of metal groove reduces.
Another core of the present invention is to provide a kind of electrolytic etching of metal technique.
In order to make those skilled in the art be more fully understood that technical scheme, below in conjunction with the accompanying drawings
The present invention is described in further detail with embodiment.
Refer to Fig. 3 to Fig. 6, in a kind of detailed description of the invention, the electrolytic etching of metal groove bag that the present invention provides
Include cell body 1, busbar 6, positive plate 3, minus plate 4 and be arranged on the arc of cell body 1 opposite end and lead
Liquid projection 11, concrete, it is preferable that the radian of arc drain projection 11 be 60 ° to 180 °, concrete,
The radian of arc drain projection 11 is 75 °.Minus plate 4 two ends convex with arc drain projection 11 respectively
Origin or beginning abuts, and is provided with liquid guide flow cavity between positive plate 3 and arc drain projection 11.Positive plate 3 He
Minus plate 4 interlaced arrangement is in cell body 1, and positive plate 3 and minus plate 4 are installed on busbar 6.
Minus plate 4 can be stainless steel, and the particular number of positive plate 3 and minus plate 4 is according to the actual requirements
Depending on.Circulate for the ease of electrolyte, it is preferable that positive plate 3 is than minus plate more than 4 one pieces.Cell body 1
Bottom is provided with desilting mouth 8 and leakage fluid dram 9, and concrete, cell body 1 inner bottom surface can be horizontal plane.Cell body
1 is provided with inlet 2 and overfall 5, and inlet 2 may be located at bottom cell body 1, in order to the earth of positive pole
Sedimentation direction is consistent, the beneficially sedimentation of the earth of positive pole, it is to avoid the metal that earth of positive pole pollution catholyte goes out
Situation, it is preferable that inlet 2 is positioned at the top of cell body 1.As it is shown in figure 5, the entering of minus plate 4 both sides
Liquid mouth 2 is positioned at the same one end of minus plate 4, and the inlet 2 of positive plate 3 both sides lays respectively at positive plate 3 liang
End.Wherein inlet 2 can be the vertical gap of one fixed width and length, it is also possible to for circular hole.
The inlet 2 of the every side of minus plate 4 can be multiple, and multiple inlets 2 can laterally be arranged, also
Can longitudinally arrange, owing to the lateral separation between minus plate 4 and positive plate 3 is shorter, it is preferable that feed liquor
Mouth 2 longitudinally arrangement, processes inlet 2 for the ease of staff, it is preferable that inlet 2 is equal diameters
Circular hole.The width of inlet 2, vertically height or number, diameter need according to concrete liquid inlet volume and
Depending on feed liquor speed.Cell body 1 can use resistant material disposably overall cast molding, material selection
Resin mortar, any in preferred epoxy, unsaturated polyester resin or furane resins in resin material
One, is effectively improved the performances such as anticorrosive, the insulation of cell body 1, anti-leakage, and safety and environmental protection.For
It is easy to earth of positive pole rapid subsidence, and is easy to electrolyte and reacts, it is preferable that inlet 2 is downward-sloping
Angle be 0 ° to 20 °, specifically, the downward-sloping angle of inlet 2 is 10 °.
By foregoing description, in the electrolytic etching of metal groove that the specific embodiment of the invention is provided, anode
The two ends of plate 3 are equipped with inlet 2, and electrolyte rotates clockwise and anticlockwise around positive plate 3, passes through
Electrolyte convection current, enhances positive plate 3 and the flowing velocity of minus plate 4 surrounding electrolyte.By arranging
Electrolyte in the similar closing space formed with intake chute by adjacent cathode plate 4 along clockwise or counterclockwise
Flowing in direction, by electrolyte convection current, enhances positive plate 3 and the flowing of minus plate 4 surrounding electrolyte
Speed, reduces concentration polarization.Electrolyte flows downward in confined space, through pole plate and cell body 1
Flowing to cell body 1 two ends respectively in the space of bottom, enters overfall 5 again by overflow ducts 12 afterwards
Return in electrolyte circulation system.Being located closer in minus plate 4 both sides of inlet 2.Two adjacent the moon
Pole plate 4 forms a similar space closed with the positive plate 3 in the middle of it, can be pressurizeed by variable frequency pump
After electrolyte be quickly injected into by the inlet 2 of minus plate 4 one end and adjacent cathode plate 4 other end
After entering this space, by flowing clockwise or counterclockwise, merit make use of electrolyte self to exist
Kinetic energy, it is also possible to well reduce the concentration difference of metal ion between two-plate, enhance positive plate and negative electrode
The diffusion of plate two ends ion, reduces concentration polarization, improves electric current density, adds production capacity, reduces
Energy consumption.Due to, inlet 2 is positioned at the top of cell body 1, consistent with the sedimentation direction of the earth of positive pole, has
It is beneficial to the sedimentation of the earth of positive pole, preferably reduces the earth of positive pole and pollute the possibility of electrolyte.Meanwhile, with biography
The identical situation of cathodic metal electrolysis amount of system, effectively reduces the electrolyte circulating load at inlet 2.
Owing to by electrolyte convection current, enhancing positive plate 3 and the flowing velocity of minus plate 4 surrounding electrolyte,
Electric current density can be improved, and then improve the production efficiency of electrolytic etching of metal groove.
Further, this electrolytic etching of metal groove also includes the liquid guide flow plate 7 being arranged on cell body 1, liquid guide flow
Plate 7 seals with cell body 1 side, and liquid guide flow plate 7 forms overflow ducts 12, overflow with cell body 1 side
Passage 12 two ends connect with cell body 1 internal cavity and overfall 5 respectively.Electrolyte is by downwardly and laterally
After flowing, by the anode slime that carries bottom cell body 1 after, led to by overflow at cell body 1 two ends,
Electrolyte circulation system is back flowed back into after entering overfall 5.
On the basis of above-mentioned each scheme, it is preferable that cell body 1 bottom is inclined guide surface 10, cell body 1
Bottom is provided with leakage fluid dram 9 and desilting mouth 8, and the height of desilting mouth 8 is less than the height of leakage fluid dram 9.Due to clearly
The height of silt mouth 8 is less than the height of leakage fluid dram 9, it is simple to the collection of the earth of positive pole, and avoids discharging cell body 1
During interior liquid, the situation that the earth of positive pole is also drawn off, it is to avoid energy waste.
A kind of electrolytic etching of metal technique that the application provides, including step:
1) electrolyte is entered between minus plate 4 and positive plate 3 by the inlet 2 on cell body 1 top, negative electrode
The inlet 2 of plate 4 both sides is positioned at the same one end of minus plate 4, the inlet 2 of positive plate 3 both sides position respectively
In positive plate 3 two ends.Wherein the unilateral flow of electrolyte of minus plate 4 is 1.0L/min-3.0L/min, it is preferable that
The unilateral liquid inlet volume of minus plate 4 controls copper ion concentration in 2.0L/min, electrolyte and controls at 48g/L-50g/L
Between, electrolyte pressure is at 0.2MPa-0.5MPa.Electric current density is 500A/m2～700A/m2, specifically,
Electric current density can control at 570A/m2.In cell body 1, temperature is 60 DEG C～about 65 DEG C.
2) arc drain is set at cell body 1 opposite end protruding, minus plate 4 two ends respectively with arc drain
The protruding end of protruding 11 abuts, and is provided with liquid guide flow cavity between positive plate 3 and arc drain projection 11,
Electrolyte is around positive plate 3 clockwise or counterclockwise；Preferably, the radian of arc drain projection 11 is
60 ° to 180 °, concrete, the radian of arc drain projection 11 is 75 °.Minus plate 4 two ends are respectively
It is connected with the protruding end of arc drain projection 11, between positive plate 3 and arc drain projection 11, is provided with liquid
Body water conservancy diversion cavity.By arranging electrolyte at the similar closing sky formed with intake chute by adjacent cathode plate 4
In flow clockwise or counterclockwise, by electrolyte convection current, enhance positive plate 3 and negative electrode
The flowing velocity of plate 4 surrounding electrolyte, reduces concentration polarization.
3) electrolyte by cell body 1 flows to by the deflector 7 being arranged in cell body and cell body 1 sidewall
In the overflow ducts 12 formed, then discharged by the overfall 5 on cell body 1.I.e. it is provided with liquid on cell body 1
Body deflector 7, liquid guide flow plate 7 seals with cell body 1 side, liquid guide flow plate 7 and cell body 1 side shape
Becoming overflow ducts 12, overflow ducts 12 two ends connect with cell body 1 internal cavity and overfall 5 respectively.Electricity
Solve liquid by after downwardly and laterally flowing, by the anode slime that carries bottom cell body 1 after, at groove
Overflow ducts 12 is passed through at body 1 two ends, back flows back into electrolyte circulation system after entering overfall 5.
By this electrolytic etching of metal technique, owing to electrolyte is entered cell body 1 inside by cell body 1 top, with sun
Mud sedimentation direction, pole is consistent, the beneficially sedimentation of the earth of positive pole, it is to avoid the earth of positive pole pollutes the gold that catholyte goes out
Situation about belonging to, this electrolytic etching of metal technique can improve the electrolysis precision of cathodic metal.
In this specification, each embodiment uses the mode gone forward one by one to describe, and each embodiment stresses
Being the difference with other embodiments, between each embodiment, identical similar portion sees mutually.
Described above to the disclosed embodiments, makes professional and technical personnel in the field be capable of or uses
The present invention.Multiple amendment to these embodiments will be aobvious and easy for those skilled in the art
See, generic principles defined herein can without departing from the spirit or scope of the present invention,
Realize in other embodiments.Therefore, the present invention is not intended to be limited to the embodiments shown herein,
And it is to fit to the widest scope consistent with principles disclosed herein and features of novelty.
Claims (9)
1. an electrolytic etching of metal groove, including cell body (1), positive plate (3) and minus plate (4),
Described positive plate (3) and described minus plate (4) interlaced arrangement in described cell body (1), institute
State cell body (1) and be provided with inlet (2) and overfall (5), it is characterised in that also include
The arc drain being arranged on described cell body (1) opposite end is protruding (11), described minus plate (4)
The described inlet (2) of both sides is positioned at described minus plate (4) same to one end, described positive plate (3)
The described inlet (2) of both sides lays respectively at described positive plate (3) two ends, described minus plate
(4) protruding end that two ends are protruding with described arc drain (11) respectively abuts, described positive plate
(3) and it is provided with liquid guide flow cavity between described arc drain protruding (11).
Electrolytic etching of metal groove the most according to claim 1, it is characterised in that described feed liquor
Mouth (2) is positioned at described cell body (1) top.
Electrolytic etching of metal groove the most according to claim 1, it is characterised in that described arc
The radian of drain protruding (11) is 60 ° to 180 °.
Electrolytic etching of metal groove the most according to claim 1, it is characterised in that described feed liquor
Mouthful (2) downward-sloping angle is 0 ° to 20 °.
Electrolytic etching of metal groove the most according to claim 1, it is characterised in that also include peace
The liquid guide flow plate (7) being contained on described cell body (1), described liquid guide flow plate (7) and institute
State cell body (1) side to seal, described liquid guide flow plate (7) and described cell body (1) side shape
Becoming overflow ducts (12), described overflow ducts (12) two ends are interior with described cell body (1) respectively
Portion's cavity connects with described overfall (5).
6. according to the electrolytic etching of metal groove according to any one of claim 1-5, it is characterised in that
Described cell body (1) bottom is inclined guide surface (10), and the bottom of described cell body (1) is provided with row
Liquid mouth (9) and desilting mouth (8), the height of described desilting mouth (8) is less than described leakage fluid dram (9)
Height.
7. an electrolytic etching of metal technique, it is characterised in that include step:
1) electrolyte is entered minus plate (4) and sun by the inlet (2) on cell body (1) top
Between pole plate (3), wherein, the described inlet (2) of described minus plate (4) both sides is positioned at
Described minus plate (4) same to one end, the described inlet (2) of described positive plate (3) both sides point
It is not positioned at described positive plate (3) two ends；
2) arc drain is set at described cell body (1) opposite end protruding, described minus plate (4)
Protruding with described arc drain (11) the respectively protruding end in two ends abuts, described positive plate (3)
And described arc drain is provided with liquid guide flow cavity between protruding (11), and electrolyte is around described
Positive plate (3) is clockwise or counterclockwise；
3) electrolyte by described cell body (1) flows to by the deflector being arranged in cell body
(7) in the overflow ducts (12) formed with described cell body (1) sidewall, then by described cell body
(1) overfall (5) on is discharged.
Electrolytic etching of metal technique the most according to claim 7, it is characterised in that described the moon
The unilateral flow of electrolyte of pole plate (4) is 1.0L/min-3.0L/min, and electrolyte pressure is at 0.2MPa
-0.5MPa。
Electrolytic etching of metal technique the most according to claim 7, it is characterised in that electric current is close
Degree is 500A/m2～700A/m2。
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| CN114182300B (en) * | 2021-12-24 | 2023-05-23 | 福建省福联集成电路有限公司 | Equipment for recovering gold through chemical electrolysis and application method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4956053A (en) * | 1988-05-26 | 1990-09-11 | Olin Corporation | Apparatus and process for the production of micro-pore free high ductility metal foil |
| CN2123537U (en) * | 1992-01-17 | 1992-12-02 | 个旧市矿产加工总厂 | Multiple-hole side-in-and side-out electrolytic deposition cell |
| CN102994762A (en) * | 2012-12-21 | 2013-03-27 | 嘉兴科菲冶金科技股份有限公司 | Industrial method for selectively recycling copper and nickel from copper-nickel mud |
| CN103255443A (en) * | 2013-05-06 | 2013-08-21 | 阳谷祥光铜业有限公司 | Ultrahigh current density electrolysis or electro-deposition groove |
| CN103334123A (en) * | 2013-07-24 | 2013-10-02 | 阳谷祥光铜业有限公司 | Copper electrolysis system and running method |
-
2014
- 2014-11-28 CN CN201410713935.4A patent/CN104404575B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4956053A (en) * | 1988-05-26 | 1990-09-11 | Olin Corporation | Apparatus and process for the production of micro-pore free high ductility metal foil |
| CN2123537U (en) * | 1992-01-17 | 1992-12-02 | 个旧市矿产加工总厂 | Multiple-hole side-in-and side-out electrolytic deposition cell |
| CN102994762A (en) * | 2012-12-21 | 2013-03-27 | 嘉兴科菲冶金科技股份有限公司 | Industrial method for selectively recycling copper and nickel from copper-nickel mud |
| CN103255443A (en) * | 2013-05-06 | 2013-08-21 | 阳谷祥光铜业有限公司 | Ultrahigh current density electrolysis or electro-deposition groove |
| CN103334123A (en) * | 2013-07-24 | 2013-10-02 | 阳谷祥光铜业有限公司 | Copper electrolysis system and running method |
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