CN104392877A - Pouring process for trigger of high intensity gas discharge light source - Google Patents

Pouring process for trigger of high intensity gas discharge light source Download PDF

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Publication number
CN104392877A
CN104392877A CN201410629408.5A CN201410629408A CN104392877A CN 104392877 A CN104392877 A CN 104392877A CN 201410629408 A CN201410629408 A CN 201410629408A CN 104392877 A CN104392877 A CN 104392877A
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China
Prior art keywords
light source
trigger
discharge light
pressure discharge
silicon rubber
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CN201410629408.5A
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CN104392877B (en
Inventor
胡海城
邱祚良
毕竞
罗菲
刘娟
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ANHUI HUAXIA DISPLAY TECHNOLOGY Co Ltd
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ANHUI HUAXIA DISPLAY TECHNOLOGY Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/24Manufacture or joining of vessels, leading-in conductors or bases

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses a pouring process for a trigger of a high intensity gas discharge light source. The process comprises the following steps: cleaning a mounting surface of the high intensity gas discharge light source and the trigger; coating a layer of 703 silicon rubber on the mounting surface; then placing in a baking box; mounting a pouring mold and the trigger; coating the 703 silicon rubber on a welding point of the light source and the trigger and then placing in the baking box; finally pouring a defoamed pouring sealant; removing the pouring mold after curing. The mounting surfaces of the light source and the welding point of the light source and the trigger, so that the high intensity insulation performance is effectively increased to meet the requirements on use; the mounting and fixation are performed by using a trigger integral pouring mode, so that the pouring sealant is firmly adhered to a glass shell of the light source and certain flexibility is also realized, and stress is prevented from being produced due to temperature raise of the glass shell during work of the light source; thus the problem of mounting firmness and thermal property are solved.

Description

A kind of high-pressure discharge light source trigger dosing technology
Technical field
The present invention relates to electric light source and make field, be specifically related to a kind of high-pressure discharge light source trigger dosing technology.
Background technology
High-pressure discharge light source is a kind of efficient, long-life novel illumination light source.It utilizes high pressure excited gas to ionize luminescence, in order to obtain instantaneous pressure, needs the trigger matched with light source to carry out the gas of excitation source inside.Considering the problem of electromagnetic compatibility in order to reduce high pressure decay simultaneously, needing afterbody trigger being directly installed on light source.Because the tie point of flip-flop output and light source has high pressure instantaneously starting, need to carry out High-Voltage Insulation process.Joining Technology treatment effect bad in High-Voltage Insulation installed by high-pressure discharge light source used by prior art and trigger, in addition, and light source and trigger also existing defects in connectivity robustness and thermal characteristics etc.
Summary of the invention
For the deficiencies in the prior art, the invention provides a kind of high-pressure discharge light source trigger dosing technology, solve High-Voltage Insulation, fastness and thermal characteristics problem are installed.
The present invention is achieved by the following technical solutions:
A kind of high-pressure discharge light source trigger dosing technology, comprises the following steps:
(1) by clean clean for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, place under natural environment and treat 703 silicon rubber solidifications;
(2) the high-pressure discharge light source being coated with 703 silicon rubber is put into baking oven, take out toast 2h ± 0.5h under 70 DEG C ± 10 DEG C conditions after;
(3) encapsulating die is placed on high-pressure discharge light source, cements with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source;
(4) be placed in encapsulating die by trigger, welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, places and treat 703 silicon rubber solidifications under natural environment;
(5) high-pressure discharge light source, trigger and encapsulating die are put into baking oven, take out toast 2h ± 0.5h under 70 DEG C ± 10 DEG C conditions after;
(6) get appropriate casting glue to stir, put into vacuum defoamation machine and carry out degasification deaeration, inclined heated plate 30min ± 5min;
(7) casting glue of deaeration is poured in encapsulating die, inner space is all filled up, place under natural environment and treat that casting glue solidifies;
(8) remove encapsulating die, the casting glue of high-pressure discharge light source excess surface is removed, and surface wipes is clean, complete embedding work.
As preferably, utilize the installed surface of absolute ethyl alcohol to high-pressure discharge light source and trigger to clean in step (1), in step (8), utilize absolute ethyl alcohol to carry out wiping to high-pressure discharge light source surface.
The time of placing in natural environment in described step (1) and step (4) is not less than 4h.
Casting glue model used in step (6) is ND-313.
The time of placing under natural environment in step (7) is not less than 48h.
The number of times carrying out degasification deaeration in step (6) is 3-5 time.
The invention has the beneficial effects as follows: the bonding wire place coating silicon rubber of light source installed surface of the present invention, trigger and light source, effectively increases High-Voltage Insulation performance, thus meet the requirement used; Adopt the mode of the overall embedding of trigger to carry out installation to fix, the glass bulb strong bond of casting glue and light source has certain pliability again, prevents from producing stress because light source works glass bulb temperature raises, thus solves the problem of installing fastness and thermal characteristics.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
With reference to Fig. 1, details are as follows for the concrete technology of dosing technology of the present invention.
Step (1), by clean clean for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, places and treat 703 silicon rubber solidifications under natural environment.The material used when carrying out clean to the installed surface of light source is preferably absolute ethyl alcohol, and its cleaning effect is good, use safety.703 silicon rubber are that a kind of cementability is good, high strength, and free from corrosion single-component room-temperature-vulsilicone silicone rubber, has excellent electrical insulation capability, sealing property and ageing-resistant performance, can in the scope of-50 DEG C-+250 DEG C Long-Time Service.703 silicon rubber solidification processs be one from surface solidification process internally, within 24 hours, (room temperature and 55% relative humidity) is by the degree of depth of solidification 2 ~ 4mm, if site location is darker, especially the position touching air is being not easy, the completely crued time will extend, if temperature is lower, curing time also will extend.Consider that 703 coated silicon rubber only need thin layer, therefore only need place under natural environment during step (1) solidification and be not less than 4h.
Step (2), puts into baking oven by the high-pressure discharge light source being coated with 703 silicon rubber, takes out after toasting 2h ± 0.5h under 70 DEG C ± 10 DEG C conditions.This step can guarantee that 703 silicon rubber cling on light source surface.
Step (3), is placed on high-pressure discharge light source by encapsulating die, cement with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source.Step (4), is placed on trigger in encapsulating die, and welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, places and treat 703 silicon rubber solidifications under natural environment.Same step (1), 703 silicon rubber are placed and are not less than 4h and solidify to make it under natural environment.After step (3) and (4) complete, light source and trigger complete Primary Location in encapsulating die.
Step (5), puts into baking oven by high-pressure discharge light source, trigger and encapsulating die, takes out after toasting 2h ± 0.5h under 70 DEG C ± 10 DEG C conditions.This step guarantees that 703 silicon rubber at pad place can reliably cement.
Step (6), gets appropriate casting glue and stirs, and puts into vacuum defoamation machine and carries out degasification deaeration, inclined heated plate 30min ± 5min.This step is the stand-by phase of casting glue, and when implementing this step, need to operate according to required casting glue amount, when required amount is larger, this step needs repetition 3-5 time, to reach enough use amounts.In addition, consider to meet that high pressure is fire-retardant, sealing, resistant to elevated temperatures requirement, preferably adopt southern famous model to be the casting glue of ND-313.
Step (7), the casting glue of deaeration is poured in encapsulating die, inner space is all filled up, place under natural environment and treat that casting glue solidifies, time needed for solidification is not less than 48h, and during practical operation, the time of casting glue solidification is subject to the impact of natural environment humidity, humidity is larger, and casting glue is faster for curing time.
Step (8), removes encapsulating die, is removed by the casting glue of high-pressure discharge light source excess surface, and surface wipes is clean, completes embedding work.
Technique of the present invention solves High-Voltage Insulation, installs fastness and thermal characteristics problem, ensure that product reliably working.
Enumerate specific embodiment to be below described technique of the present invention.
Embodiment one
(1) by clean clean with absolute ethyl alcohol for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, and the thickness of silastic-layer is 1mm, under natural environment, place 4h, treats 703 silicon rubber solidifications;
(2) the high-pressure discharge light source being coated with 703 silicon rubber is put into baking oven, take out toast 2h under 70 DEG C of conditions after;
(3) encapsulating die is placed on high-pressure discharge light source, cements with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source;
(4) be placed in encapsulating die by trigger, welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, under natural environment, place 4h, treats 703 silicon rubber solidifications;
(5) high-pressure discharge light source, trigger and encapsulating die are put into baking oven, take out toast 2h under 70 DEG C of conditions after;
(6) get appropriate casting glue to stir, put into vacuum defoamation machine and carry out degasification deaeration, inclined heated plate 30min;
(7) casting glue of deaeration is poured in encapsulating die, inner space is all filled up, under natural environment, place 48h, treat that casting glue solidifies;
(8) remove encapsulating die, the casting glue of high-pressure discharge light source excess surface is removed, and absolute ethyl alcohol wiped clean is used on surface, complete embedding work.
Embodiment two
(1) by clean clean with absolute ethyl alcohol for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, and the thickness of silastic-layer is 1.2mm, under natural environment, place 5h, treats 703 silicon rubber solidifications;
(2) the high-pressure discharge light source being coated with 703 silicon rubber is put into baking oven, take out toast 2.5h under 60 DEG C of conditions after;
(3) encapsulating die is placed on high-pressure discharge light source, cements with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source;
(4) be placed in encapsulating die by trigger, welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, under natural environment, place 5h, treats 703 silicon rubber solidifications;
(5) high-pressure discharge light source, trigger and encapsulating die are put into baking oven, take out toast 2.5h under 60 DEG C of conditions after;
(6) get appropriate casting glue to stir, put into vacuum defoamation machine and carry out degasification deaeration, inclined heated plate 35min;
(7) casting glue of deaeration is poured in encapsulating die, inner space is all filled up, under natural environment, place 55h, treat that casting glue solidifies;
(8) remove encapsulating die, the casting glue of high-pressure discharge light source excess surface is removed, and absolute ethyl alcohol wiped clean is used on surface, complete embedding work.
Embodiment three
(1) by clean clean for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, and silicon rubber thickness is 1.5mm, under natural environment, place 10h, treats 703 silicon rubber solidifications;
(2) the high-pressure discharge light source being coated with 703 silicon rubber is put into baking oven, take out toast 2.5h under 80 DEG C of conditions after;
(3) encapsulating die is placed on high-pressure discharge light source, cements with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source;
(4) be placed in encapsulating die by trigger, welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, under natural environment, place 4h, treats 703 silicon rubber solidifications;
(5) high-pressure discharge light source, trigger and encapsulating die are put into baking oven, take out toast 1.5h under 80 DEG C of conditions after;
(6) get appropriate casting glue to stir, put into vacuum defoamation machine and carry out degasification deaeration, inclined heated plate 25min;
(7) casting glue of deaeration is poured in encapsulating die, inner space is all filled up, under natural environment, place 60h, treat that casting glue solidifies;
(8) remove encapsulating die, the casting glue of high-pressure discharge light source excess surface is removed, and absolute ethyl alcohol wiped clean is used on surface, complete embedding work.
Embodiment four
(1) by clean clean with absolute ethyl alcohol for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, and silicon rubber thickness is 0.8mm, under natural environment, place 4h, treats 703 silicon rubber solidifications;
(2) the high-pressure discharge light source being coated with 703 silicon rubber is put into baking oven, take out toast 1.5h under 70 DEG C of parts after;
(3) encapsulating die is placed on high-pressure discharge light source, cements with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source;
(4) be placed in encapsulating die by trigger, welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, under natural environment, place 4h, treats 703 silicon rubber solidifications;
(5) high-pressure discharge light source, trigger and encapsulating die are put into baking oven, take out toast 2h under 70 DEG C of conditions after;
(6) get appropriate casting glue to stir, put into vacuum defoamation machine and carry out degasification deaeration, inclined heated plate 30min; Repeat this step 3 time, to reach enough casting glue amounts;
(7) casting glue of deaeration is poured in encapsulating die, inner space is all filled up, under natural environment, place 48h, treat that casting glue solidifies;
(8) remove encapsulating die, the casting glue of high-pressure discharge light source excess surface is removed, and absolute ethyl alcohol wiped clean is used on surface, complete embedding work.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (6)

1. a high-pressure discharge light source trigger dosing technology, is characterized in that comprising the following steps:
(1) by clean clean for the installed surface of high-pressure discharge light source and trigger, installed surface applies one deck 703 silicon rubber, place under natural environment and treat 703 silicon rubber solidifications;
(2) the high-pressure discharge light source being coated with 703 silicon rubber is put into baking oven, take out toast 2h ± 0.5h under 70 DEG C ± 10 DEG C conditions after;
(3) encapsulating die is placed on high-pressure discharge light source, cements with the outer contacting face position of pressure sensitive adhesive tape at encapsulating die and high-pressure discharge light source;
(4) be placed in encapsulating die by trigger, welded with the extraction electrode silk scolding tin of high-pressure discharge light source by the output line of trigger, pad place applies 703 silicon rubber, places and treat 703 silicon rubber solidifications under natural environment;
(5) high-pressure discharge light source, trigger and encapsulating die are put into baking oven, take out toast 2h ± 0.5h under 70 DEG C ± 10 DEG C conditions after;
(6) get appropriate casting glue to stir, put into vacuum defoamation machine and carry out degasification deaeration, inclined heated plate 30min ± 5min;
(7) casting glue of deaeration is poured in encapsulating die, inner space is all filled up, place under natural environment and treat that casting glue solidifies;
(8) remove encapsulating die, the casting glue of high-pressure discharge light source excess surface is removed, and surface wipes is clean, complete embedding work.
2. a kind of high-pressure discharge light source trigger dosing technology according to claim 1, it is characterized in that: utilize the installed surface of absolute ethyl alcohol to high-pressure discharge light source and trigger to clean in step (1), in step (8), utilize absolute ethyl alcohol to carry out wiping to high-pressure discharge light source surface.
3. a kind of high-pressure discharge light source trigger dosing technology according to claim 1, is characterized in that: the time of placing in natural environment in described step (1) and step (4) is not less than 4h.
4. a kind of high-pressure discharge light source trigger dosing technology according to claim 1, is characterized in that: casting glue model used in step (6) is ND-313.
5. a kind of high-pressure discharge light source trigger dosing technology according to claim 1, is characterized in that: the time of placing under natural environment in step (7) is not less than 48h.
6. a kind of high-pressure discharge light source trigger dosing technology according to claim 1, is characterized in that: the number of times carrying out degasification deaeration in step (6) is 3-5 time.
CN201410629408.5A 2014-11-10 2014-11-10 A kind of high-pressure discharge light source trigger dosing technology Active CN104392877B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106102397A (en) * 2016-08-01 2016-11-09 安徽贝莱电子科技有限公司 A kind of dosing technology of electronic module

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041491A1 (en) * 1997-12-16 2001-11-15 Shouji Nishida Flash discharge tube and method for producing the same
CN101593620A (en) * 2009-03-23 2009-12-02 佛山市南海展晴玩具有限公司 A kind of method for packing of electronic transformer cores and encapsulation metal molding die
US20100029166A1 (en) * 2008-07-31 2010-02-04 Wellypower Optronics Corporation Fabrication method of discharge lamp
CN203934086U (en) * 2014-07-04 2014-11-05 安徽华夏显示技术股份有限公司 A kind of split type trigger for xenon gaseous discharge light source

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010041491A1 (en) * 1997-12-16 2001-11-15 Shouji Nishida Flash discharge tube and method for producing the same
US20100029166A1 (en) * 2008-07-31 2010-02-04 Wellypower Optronics Corporation Fabrication method of discharge lamp
CN101593620A (en) * 2009-03-23 2009-12-02 佛山市南海展晴玩具有限公司 A kind of method for packing of electronic transformer cores and encapsulation metal molding die
CN203934086U (en) * 2014-07-04 2014-11-05 安徽华夏显示技术股份有限公司 A kind of split type trigger for xenon gaseous discharge light source

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
洪彬: "空间用高压绝缘组件真空灌封技术研究", 《中国博士学位论文全文数据库》 *
范承勇: "真空灌封技术在高压交流真空断路器中的应用", 《电气制造》 *
高华: "某高压电源组件灌封工艺技术分析与研究", 《电子工艺技术》 *
高华等: "灌封技术在电子产品中的应用", 《电子工艺技术》 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106102397A (en) * 2016-08-01 2016-11-09 安徽贝莱电子科技有限公司 A kind of dosing technology of electronic module

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