CN104378932A - 多层pcb板的制作方法及多层pcb板 - Google Patents
多层pcb板的制作方法及多层pcb板 Download PDFInfo
- Publication number
- CN104378932A CN104378932A CN201310354080.6A CN201310354080A CN104378932A CN 104378932 A CN104378932 A CN 104378932A CN 201310354080 A CN201310354080 A CN 201310354080A CN 104378932 A CN104378932 A CN 104378932A
- Authority
- CN
- China
- Prior art keywords
- double layer
- layer substrate
- pcb board
- false
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310354080.6A CN104378932B (zh) | 2013-08-14 | 2013-08-14 | 多层pcb板的制作方法及多层pcb板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310354080.6A CN104378932B (zh) | 2013-08-14 | 2013-08-14 | 多层pcb板的制作方法及多层pcb板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104378932A true CN104378932A (zh) | 2015-02-25 |
CN104378932B CN104378932B (zh) | 2017-10-27 |
Family
ID=52557489
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310354080.6A Active CN104378932B (zh) | 2013-08-14 | 2013-08-14 | 多层pcb板的制作方法及多层pcb板 |
Country Status (1)
Country | Link |
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CN (1) | CN104378932B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105357864A (zh) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | 多层线路板及其制作方法 |
WO2019090497A1 (zh) * | 2017-11-08 | 2019-05-16 | 惠州市兴顺和电子有限公司 | 高特性阻抗多层线路板及制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318541A (ja) * | 2002-04-24 | 2003-11-07 | Kyocera Corp | セラミック多層配線基板の製造方法 |
CN101965105A (zh) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | 一种印刷电路板压合制程工艺 |
CN102348338A (zh) * | 2010-07-30 | 2012-02-08 | 竞陆电子(昆山)有限公司 | 六层线路板对位压合后的防曝板透气孔结构 |
CN103025051A (zh) * | 2012-11-20 | 2013-04-03 | 深圳崇达多层线路板有限公司 | 一种机械背钻孔结构的hdi板及其制作方法 |
-
2013
- 2013-08-14 CN CN201310354080.6A patent/CN104378932B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003318541A (ja) * | 2002-04-24 | 2003-11-07 | Kyocera Corp | セラミック多層配線基板の製造方法 |
CN102348338A (zh) * | 2010-07-30 | 2012-02-08 | 竞陆电子(昆山)有限公司 | 六层线路板对位压合后的防曝板透气孔结构 |
CN101965105A (zh) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | 一种印刷电路板压合制程工艺 |
CN103025051A (zh) * | 2012-11-20 | 2013-04-03 | 深圳崇达多层线路板有限公司 | 一种机械背钻孔结构的hdi板及其制作方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105357864A (zh) * | 2015-11-30 | 2016-02-24 | 珠海方正科技多层电路板有限公司 | 多层线路板及其制作方法 |
WO2019090497A1 (zh) * | 2017-11-08 | 2019-05-16 | 惠州市兴顺和电子有限公司 | 高特性阻抗多层线路板及制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN104378932B (zh) | 2017-10-27 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder |
Address after: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 9 floor Patentee after: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee after: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: FOUNDER INFORMATION INDUSTRY HOLDINGS Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220913 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee after: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 9 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Patentee before: ZHUHAI FOUNDER PCB DEVELOPMENT Co.,Ltd. Patentee before: PKU FOUNDER INFORMATION INDUSTRY GROUP CO.,LTD. |
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TR01 | Transfer of patent right |