CN104361832B - 显示面板及其制造方法 - Google Patents

显示面板及其制造方法 Download PDF

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CN104361832B
CN104361832B CN201410660210.3A CN201410660210A CN104361832B CN 104361832 B CN104361832 B CN 104361832B CN 201410660210 A CN201410660210 A CN 201410660210A CN 104361832 B CN104361832 B CN 104361832B
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electrode
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CN104361832A (zh
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聂诚磊
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US14/407,938 priority patent/US9780118B2/en
Priority to PCT/CN2014/092125 priority patent/WO2016078101A1/zh
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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1248Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0274Optical details, e.g. printed circuits comprising integral optical means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183Components mounted in and supported by recessed areas of the printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/0017Casings, cabinets or drawers for electric apparatus with operator interface units
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10128Display

Abstract

本发明公开了一种显示面板及其制造方法,该显示面板包括相对设置的第一基板和第二基板、设置在第一基板和第二基板之间的像素阵列以及设置在第一基板靠近第二基板的表面上的电极,第二基板与电极对应地设置有通孔,以使得电极经通孔部分外露。通过上述方式,本发明能够实现在显示面板上内嵌功能性组件,进而能够节省安装空间,提高显示面板的屏占比,从而可以提升用户的体验。

Description

显示面板及其制造方法
技术领域
本发明涉及显示技术领域,特别是涉及一种显示面板及其制造方法。
背景技术
目前已有的手机、平板等设备的表面除了主体部分为显示面板之外,还存在许多功能组件,如按键、喇叭、摄像头等等。这些功能组件对于设备的正常运行来说不可或缺,但是却需要设备为之提供额外的放置空间,由于现在手机、平板电脑等设备都追求轻薄化、窄边框,而设备上的安装空间有限,因此会降低了设备的屏占比。
因此,需要提供一种显示面板及其制造方法,以解决上述技术问题。
发明内容
本发明主要解决的技术问题是提供一种显示面板及其制造方法,能够节省安装空间,提高显示面板的屏占比,从而可以提升用户的体验。
为解决上述技术问题,本发明采用的一个技术方案是:提供一种显示面板,显示面板包括相对设置的第一基板和第二基板、设置在第一基板和第二基板之间的像素阵列以及设置在第一基板靠近第二基板的表面上的电极,第二基板与电极对应地设置有通孔,以使得电极经通孔部分外露。
其中,显示面板进一步包括钝化层,钝化层覆盖电极,且在通孔的对应区域外露电极。
其中,第一基板为阵列基板,第二基板为透明盖板,钝化层设置于阵列基板上,像素阵列设置在钝化层上。
其中,第一基板为透明盖板,第二基板为阵列基板,像素阵列设置于阵列基板上,钝化层设置于像素阵列上。
其中,显示面板进一步包括支撑于钝化层与透明盖板之间的支撑层。
其中,显示面板进一步包括功能组件,功能组件容置于通孔内,且与电极电连接。
其中,功能组件为喇叭、摄像头或按键。
其中,显示面板进一步包括沿通孔的边缘设置的第一胶框和沿第一基板和第二基板的边缘设置的第二胶框,第一胶框和第二胶框用于密封第一基板和第二基板,进而形成密封像素阵列的密封结构。
为解决上述技术问题,本发明采用的另一个技术方案是:提供一种显示面板的制造方法,制造方法包括:形成电极;在电极一面形成钝化层,钝化层部分覆盖电极,以使得电极部分外露;在电极另一面形成阵列基板,在钝化层上形成像素阵列;在像素阵列上方形成透明盖板,透明盖板上与电极对应地设有通孔,且钝化层在通孔的对应区域外露电极,以使得电极通过通孔部分外露。
为解决上述技术问题,本发明采用的又一个技术方案是:提供一种显示面板的制造方法,制造方法包括:形成阵列基板,阵列基板上设有通孔;在阵列基板上形成像素阵列;在像素阵列上形成钝化层;在钝化层上形成支撑层;形成透明盖板并在透明盖板上形成电极;将透明盖板设置在支撑层上,钝化层部分覆盖电极,且钝化层在通孔的对应区域外露电极,使得电极通过通孔外露。
本发明的有益效果是:区别于现有技术的情况,本发明通过在显示面板的第一基板上靠近第二基板的表面上设置电极,且第二基板与电极对应设置通孔,使得电极经通孔部分外露,从而使得功能性组件可以安装在通孔中且与电极电连接,从而可以实现在显示面板上内嵌功能性组件,进而能够节省安装空间,提高显示面板的屏占比,从而可以提升用户的体验。
附图说明
图1是本发明第一实施例的显示面板的俯视图;
图2是图1中A-A方向的截面图;
图3是图1中B-B方向的截面图;
图4是本发明第二实施例的显示面板的俯视图;
图5是图4中C-C方向的截面图;
图6是图4中D-D方向的截面图;
图7是本发明显示面板的制造方法第一实施例的流程图;
图8是本发明显示面板的制造方法第二实施例的流程图。
具体实施方式
下面结合附图和实施例对本发明进行详细的说明。
请一并参阅图1、图2以及图3,图1是本发明第一实施例的显示面板的俯视图,图2是图1中A-A方向的截面图,图3是图1中B-B方向的截面图。图1中显示面板最大表面与纸面平行。
在本实施例中,显示面板包括相对设置的第一基板11和第二基板12、设置在第一基板11和第二基板12之间的像素阵列13以及设置在第一基板11靠近第二基板12的表面上的电极14,第二基板12与电极14对应地设置有通孔120,以使得电极14经通孔120部分外露。
优选地,在本实施例中,显示面板还包括钝化层15,钝化层15覆盖电极14,且在通孔120的对应区域外露电极14。即钝化层15未完全覆盖电极14,而是在通孔120的对应区域外露电极14,以使得电极14经通孔120部分外露。
优选地,在本实施例中,第一基板11为阵列基板11,第二基板12为透明盖板12,钝化层15设置于阵列基板11上,像素阵列13设置在钝化层15上。优选地,阵列基板11与透明盖板12为矩形面板,在其他实施例中,阵列基板11与透明盖板12也可以为其他形状。优选地,阵列基板11与透明盖板12相互平行设置,即最大面相互平行设置。
优选地,在本实施例中,显示面板还包括功能组件16,功能组件16容置于通孔120内,且与电极电连接。优选地,功能组件16为喇叭、摄像头或按键。在其他实施例中,功能组件16也可以为其他零件。
优选地,在本实施例中,显示面板还包括沿通孔120的边缘设置的第一胶框17和沿第一基板11和第二基板12的边缘设置的第二胶框18,第一胶框17和第二胶框18用于密封第一基板11和第二基板12,进而形成密封像素阵列13的密封结构。
优选地,通孔120沿第二基板12所在平面上的任意一方向的尺寸均小于第二基板12沿该方向的尺寸的四分之一。将通孔120的尺寸设置为占显示面板较小的比例,从而可以合理的利用显示面板上的空间。
优选地,通孔120为圆形,电极14为条状且数量为两个,两个电极14彼此平行,两个电极14彼此远离的边缘与通孔120的内边缘相切。
优选地,通孔120的边缘与第二基板12的边缘的最近距离小于四分之一的第二基板12的宽度。将通孔120设置在显示面板的边缘,进一步合理分配显示面板上的空间。
优选地,钝化层15的厚度大于像素阵列13的厚度。将钝化层15的厚度设置为大于像素阵列13的厚度,从而可以减小电容耦合影响。
请参阅一并图4、图5以及图6,图4是本发明第二实施例的显示面板的俯视图,图5是图4中C-C方向的截面图,图6是图4中D-D方向的截面图。图4中显示面板最大表面与纸面平行。
在本实施例中,显示面板包括相对设置的第一基板21和第二基板22、设置在第一基板21和第二基板22之间的像素阵列23以及设置在第一基板21靠近第二基板22的表面上的电极24,第二基板22与电极24对应地设置有通孔220,以使得电极24经通孔220部分外露。
优选地,在本实施例中,显示面板还包括钝化层25,钝化层25覆盖电极24,且在通孔220的对应区域外露电极24。即钝化层25未完全覆盖电极24,而是在通孔220的对应区域外露电极24,以使得电极24经通孔220部分外露。
优选地,第一基板21为透明盖板21,第二基板22为阵列基板22,像素阵列23设置于阵列基板22上,钝化层25设置于像素阵列22上。优选地,阵列基板22与透明盖板21为矩形面板,在其他实施例中,阵列基板22与透明盖板21也可以为其他形状。优选地,阵列基板22与透明盖板21相互平行设置,即最大面相互平行设置。
优选地,在本实施例中,显示面板还包括功能组件26,功能组件26容置于通孔220内,且与电极电连接。优选地,功能组件为喇叭、摄像头或按键。在其他实施例中,功能组件26也可以为其他零件。
优选地,在本实施例中,显示面板还包括沿通孔220的边缘设置的第一胶框27和沿第一基板21和第二基板22的边缘设置的第二胶框28,第一胶框27和第二胶框28用于密封第一基板21和第二基板22,进而形成密封像素阵列23的密封结构。
优选地,显示面板还包括支撑于钝化层23与透明盖板21之间的支撑层29。
优选地,通孔220沿第二基板22所在平面上的任意一方向的尺寸均小于第二基板22沿该方向的尺寸的四分之一。将通孔220的尺寸设置为占显示面板较小的比例,从而可以合理的利用显示面板上的空间。
优选地,通孔220为圆形,电极24为条状且数量为两个,两个电极24彼此平行,两个电极24彼此远离的边缘与通孔220的内边缘相切。
优选地,通孔220的边缘与第二基板22的边缘的最近距离小于四分之一的第二基板22的宽度。将通孔220设置在显示面板的边缘,进一步合理分配显示面板上的空间。
优选地,钝化层25的厚度大于像素阵列23的厚度。将钝化层25的厚度设置为大于像素阵列23的厚度,从而可以减小电容耦合影响。
请参阅图7,图7是本发明显示面板的制造方法第一实施例的流程图。在本实施例中,显示面板的制造方法包括以下步骤:
步骤S11:形成电极;
步骤S12:在电极一面形成钝化层,钝化层部分覆盖电极,以使得电极部分外露;
步骤S13:在电极另一面形成阵列基板,在钝化层上形成像素阵列;
步骤S14:在像素阵列上方形成透明盖板,透明盖板上与电极对应地设有通孔,且钝化层在通孔的对应区域外露电极,以使得电极通过通孔部分外露。
在步骤S11~S14中,阵列基板11与透明盖板12为矩形面板,在其他实施例中,阵列基板11与透明盖板12也可以为其他形状。优选地,阵列基板11与透明盖板12相互平行设置,即最大面相互平行设置。在步骤S14之后还可以包括:沿通孔的边缘设置的第一胶框和沿第一基板和第二基板的边缘设置第二胶框,第一胶框和第二胶框用于密封第一基板和第二基板,进而形成密封像素阵列的密封结构。在步骤S14之后还可以包括:在通孔内设置功能组件,功能组件与电极电连接。优选地,功能组件为喇叭、摄像头或按键。在其他实施例中,功能组件也可以为其他零件。优选地,通孔120沿透明盖板12所在平面上的任意一方向的尺寸均小于透明盖板12沿该方向的尺寸的四分之一。将通孔120的尺寸设置为占显示面板较小的比例,从而可以合理的利用显示面板上的空间。优选地,通孔120为圆形,电极14为条状且数量为两个,两个电极14彼此平行,两个电极14彼此远离的边缘与通孔120的内边缘相切。优选地,通孔120的边缘与透明盖板12的边缘的最近距离小于四分之一的透明盖板12的宽度。将通孔120设置在显示面板的边缘,进一步合理分配显示面板上的空间。优选地,钝化层15的厚度大于像素阵列13的厚度。将钝化层15的厚度设置为大于像素阵列13的厚度,从而可以减小电容耦合影响。
请参阅图8,图8是本发明显示面板的制造方法第二实施例的流程图。在本实施例中,显示面板的制造方法包括以下步骤:
步骤S21:形成阵列基板,阵列基板上设有通孔;
步骤S22:在阵列基板上形成像素阵列;
步骤S23:在像素阵列上形成钝化层;在钝化层上形成支撑层;
步骤S24:形成透明盖板并在透明盖板上形成电极;
步骤S25:将透明盖板设置在支撑层上,钝化层部分覆盖电极,且钝化层在通孔的对应区域外露电极,使得电极通过通孔外露。
在步骤S21~S25中,阵列基板22与透明盖板21为矩形面板,在其他实施例中,阵列基板22与透明盖板21也可以为其他形状。优选地,阵列基板22与透明盖板21相互平行设置,即最大面相互平行设置。在步骤S25之后还可以包括:沿通孔的边缘设置的第一胶框和沿第一基板和第二基板的边缘设置第二胶框,第一胶框和第二胶框用于密封第一基板和第二基板,进而形成密封像素阵列的密封结构。在步骤S25之后还可以包括:在通孔内设置功能组件,功能组件与电极电连接。优选地,功能组件为喇叭、摄像头或按键。在其他实施例中,功能组件也可以为其他零件。优选地,通孔220沿阵列基板22所在平面上的任意一方向的尺寸均小于阵列基板22沿该方向的尺寸的四分之一。将通孔120的尺寸设置为占显示面板较小的比例,从而可以合理的利用显示面板上的空间。优选地,通孔220为圆形,电极24为条状且数量为两个,两个电极24彼此平行,两个电极24彼此远离的边缘与通孔220的内边缘相切。优选地,通孔220的边缘与阵列基板22的边缘的最近距离小于四分之一的阵列基板22的宽度。将通孔220设置在显示面板的边缘,进一步合理分配显示面板上的空间。优选地,钝化层25的厚度大于像素阵列23的厚度。将钝化层25的厚度设置为大于像素阵列23的厚度,从而可以减小电容耦合影响。
区别于现有技术,本发明通过在显示面板的第一基板上靠近第二基板的表面上设置电极,且第二基板与电极对应设置通孔,使得电极经通孔部分外露,从而使得功能性组件可以安装在通孔中且与电极电连接,从而可以实现在显示面板上内嵌功能性组件,进而能够节省安装空间,提高显示面板的屏占比,从而可以提升用户的体验。
以上所述仅为本发明的实施方式,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。

Claims (5)

1.一种显示面板,其特征在于,所述显示面板包括相对设置的第一基板和第二基板、设置在所述第一基板和所述第二基板之间的像素阵列以及设置在所述第一基板靠近所述第二基板的表面上的电极,所述第二基板与所述电极对应地设置有通孔,以使得所述电极经所述通孔部分外露,其中,所述显示面板进一步包括钝化层,所述钝化层部分覆盖所述电极,且在所述通孔的对应区域外露所述电极,所述第一基板为透明盖板,所述第二基板为阵列基板,所述像素阵列设置于所述阵列基板上,所述钝化层设置于所述像素阵列上,所述显示面板进一步包括支撑于所述钝化层与所述透明盖板之间的支撑层。
2.根据权利要求1所述的显示面板,其特征在于,所述显示面板进一步包括功能组件,所述功能组件容置于所述通孔内,且与所述电极电连接。
3.根据权利要求2所述的显示面板,其特征在于,所述功能组件为喇叭、摄像头或按键。
4.根据权利要求1所述的显示面板,其特征在于,所述显示面板进一步包括沿所述通孔的边缘设置的第一胶框和沿所述第一基板和所述第二基板的边缘设置的第二胶框,所述第一胶框和所述第二胶框用于密封所述第一基板和第二基板,进而形成密封所述像素阵列的密封结构。
5.一种显示面板的制造方法,其特征在于,所述制造方法包括:
形成阵列基板,所述阵列基板上设有通孔;
在所述阵列基板上形成像素阵列;
在所述像素阵列上形成钝化层;
在所述钝化层上形成支撑层;
形成透明盖板并在所述透明盖板上形成电极;
将所述透明盖板设置在所述支撑层上,所述钝化层部分覆盖所述电极,且所述钝化层在所述通孔的对应区域外露所述电极,使得所述电极通过所述通孔外露。
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