CN104322158B - 热管道系统 - Google Patents

热管道系统 Download PDF

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Publication number
CN104322158B
CN104322158B CN201380025131.9A CN201380025131A CN104322158B CN 104322158 B CN104322158 B CN 104322158B CN 201380025131 A CN201380025131 A CN 201380025131A CN 104322158 B CN104322158 B CN 104322158B
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bottom pipe
channel system
top duct
hot channel
electronic equipment
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CN104322158A (zh
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J·N·弗莱明
T·高德斯贝瑞
M·舒尔海
M·W·希伯纳
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Panduit Corp
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Panduit Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Patch Boards (AREA)

Abstract

提供了一种在电子设备封装体中的用于电子设备的热管道系统。该热管道系统包括顶部管道、与该顶部管道隔开的底部管道、从顶部管道延伸到底部管道并且沿该电子设备的进气侧延伸的侧部管道，以及定位在该侧部管道中的至少一个挡板。

Description

热管道系统
背景技术
本发明涉及热管道系统，并且更具体地涉及具有一个或多个策略性地放置、选择性地穿孔的挡板的热管道系统。
发明内容
提供了一种在电子设备封装体中的用于电子设备的热管道系统。该热管道系统包括顶部管道、与该顶部管道隔开的底部管道、从顶部管道延伸到底部管道并且沿该电子设备的进气侧延伸的侧部管道，以及定位在该侧部管道中的至少一个挡板。
附图说明
图1是示出根据本发明一实施例的热管道系统的前左向分解立体图；
图2是安装在机柜中的、图1所示热管道系统的前右向立体图；
图3是安装在交换机中的、图1所示热管道系统的侧部剖视图；
图3A是图3所示细节3A的放大视图。
具体实施方式
如图1所示，热管道系统100包括顶部管道110、底部管道120、侧部管道130、托架140A-140D以及挡板150。
如图2所示，热管道系统100安装在机柜10中，该机柜例如是泛达公司(Panduit)的网络接入的机柜。例如，为了将热管道系统100安装到机柜10内，将托架140安装到机柜10，并且，更具体地，安装到机柜10的设备导轨12，限定用于接收交换机20的区域14，所述交换机例如是思科公司(Cisco)的Nexus 7009型交换机等。接下来，将侧部管道130安装到顶部右侧的托架140B以及底部右侧的支架140D。优选地，在工厂将挡板150安装在侧部管道130中，但是同样地可以考虑，例如在现场将侧部管道130安装在机柜10中之前将挡板150安装在侧部管道130中。接下来，将顶部管道110安装在顶部左侧托架140A以及顶部右侧托架140B，并且将底部管道120安装在底部左侧托架140C以及底部右侧托架140D。
如图3所示，将交换机20安装在机柜10中。交换机20设置在顶部管道110和底部管道120之间并与侧部管道130相邻的区域14内。交换机20的进气侧与侧部管道130相邻设置。交换机20包括线卡22、矩阵卡(fabric card)24和电源26。
再次参照图2，热管道系统100使冷空气从机柜10的前部行进到交换机20的进气侧。例如，位于机柜10前部中的冷空气行进到顶部管道110和底部管道120中，如箭头A所示。接下来，如箭头B所示，在顶部管道110和底部管道120中的冷空气行进通过侧部管道130并进入交换机20的进气侧。接下来，如箭头C所示，冷空气行进通过交换机20。
再次参照图3，当使冷空气从顶部管道110和底部管道120行进到侧部管道130时，冷空气沿垂直于交换机20进气侧的方向以相对较高的速度移动，并且更具体地沿垂直于线卡22的方向移动，如箭头D所示。相对较高速度的气流具有较大的动量和较低的静压，使得交换机20更难将冷气抽吸到线卡22中，潜在地会引起在线卡22上的不均匀的气流分布。然而，添加一个或多个策略性地放置、选择性地穿孔的挡板150会减小气流速度并增加挡板150上游的静压，从而提高到达位于挡板150上游的线卡22的空气流量。
如图3A所示，挡板150是被选择性地穿孔的。也就是说，挡板150包括穿孔部分152和未穿孔部分154。穿孔部分152允许冷空气穿过挡板150到达线卡22和位于挡板150下游的矩阵卡24。然而，未穿孔部分154不允许冷空气穿过挡板150，使得冷空气停滞，这提高了到达挡板150上游的线卡22的空气流量。
虽然已结合上述示例性实施例描述了本发明，但是，无论已知的还是目前未预测的各种替换、修改、变体和/或改进都可以变得显而易见。因此，如上所阐述的本发明的示例性实施例旨在说明而不是限制。可在不脱离本发明的精神和范围的情况下进行各种变化。

Claims (13)

1.一种在电子设备封装体中的用于电子设备的热管道系统，所述热管道系统包括：
顶部管道；
底部管道，所述底部管道与所述顶部管道隔开，
其中，所述顶部管道和所述底部管道限定用于接收位于所述顶部管道和所述底部管道之间的电子设备的区域，以及
其中，所述顶部管道和所述底部管道与所述电子设备封装体的前部流体连通，使得所述顶部管道和所述底部管道接收来自所述电子设备封装体的所述前部的冷空气；
侧部管道，所述侧部管道从所述顶部管道延伸到所述底部管道并且沿所述电子设备的进气侧延伸，
其中，所述侧部管道与所述顶部管道和所述底部管道流体连通，使得所述侧部管道接收来自所述顶部管道和所述底部管道的冷空气；以及
定位在所述侧部管道中并垂直于所述电子设备的所述进气侧的至少一个挡板，所述至少一个挡板连接到所述侧部管道，
其中，所述至少一个挡板包括穿孔部分和定位在所述穿孔部分和所述进气侧之间的未穿孔部分。
2.如权利要求1所述的热管道系统，其特征在于，所述至少一个挡板包括多个挡板。
3.如权利要求1所述的热管道系统，其特征在于，所述电子设备包括交换机。
4.如权利要求3所述的热管道系统，其特征在于，所述交换机包括电源、矩阵卡和多个线卡。
5.如权利要求4所述的热管道系统，其特征在于，所述至少一个挡板定位在用于所述电源和所述矩阵卡的进气开口之间。
6.如权利要求4所述的热管道系统，其特征在于，所述至少一个挡板定位在用于所述矩阵卡和所述多个线卡之一的进气开口之间。
7.如权利要求4所述的热管道系统，其特征在于，所述至少一个挡板定位在用于所述多个线卡中的两个的进气开口之间。
8.如权利要求1所述的热管道系统，其特征在于，还包括一对顶部托架，所述顶部管道连接到所述一对顶部托架，所述一对顶部托架连接到所述电子设备封装体。
9.如权利要求8所述的热管道系统，其特征在于，还包括一对底部托架，所述底部管道连接到所述一对底部托架，所述一对底部托架连接到所述电子设备封装体。
10.如权利要求9所述的热管道系统，其特征在于，所述侧部管道连接到所述一对顶部托架中的一个，以及所述一对底部托架的一个。
11.如权利要求9所述的热管道系统，其特征在于，所述顶部管道、所述底部管道和所述侧部管道形成将进入所述电子设备的冷空气与退出所述电子设备的热空气隔开的屏障。
12.一种将用于电子设备的热管道系统安装到电子设备封装体中的方法，所述方法包括：
将顶部管道连接到所述电子设备封装体；
将底部管道连接到所述电子设备封装体，所述底部管道与所述顶部管道隔开，
其中，所述顶部管道和所述底部管道限定用于接收所述电子设备的区域，以及
其中，所述顶部管道和所述底部管道都与所述电子设备封装体的前部流体连通，使得所述顶部管道和所述底部管道接收来自所述电子设备封装体的所述前部的冷空气；
将侧部管道连接到所述电子设备封装体，所述侧部管道从所述顶部管道延伸到所述底部管道并且沿所述电子设备的进气侧延伸，
其中，所述侧部管道与所述顶部管道和所述底部管道流体连通，使得所述侧部管道接收来自所述顶部管道和所述底部管道的冷空气；以及
将至少一个挡板定位在所述侧部管道中并垂直于所述电子设备的所述进气侧，所述至少一个挡板连接到所述侧部管道，
其中，所述至少一个挡板包括穿孔部分和定位在所述穿孔部分和交换机的所述进气侧之间的未穿孔部分。
13.如权利要求12所述的方法，其特征在于，在将所述侧部管道连接到所述电子设备封装体之前将所述至少一个挡板定位在所述侧部管道中。
CN201380025131.9A 2012-05-16 2013-05-13 热管道系统 Active CN104322158B (zh)

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US201261647557P 2012-05-16 2012-05-16
US61/647,557 2012-05-16
US13/891,351 US9839155B2 (en) 2012-05-16 2013-05-10 Thermal ducting system
US13/891,351 2013-05-10
PCT/US2013/040717 WO2013173210A2 (en) 2012-05-16 2013-05-13 Thermal ducting system

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US9839155B2 (en) 2017-12-05
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